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Agari

Hideki Agari, Ikeda-Shi JP

Patent application numberDescriptionPublished
20090206813POWER SUPPLY CIRCUIT - A power supply circuit includes a first voltage regulator, a second voltage regulator, and a voltage comparator. The first voltage regulator is connected to a direct current power supply, and regulates a direct current supply voltage down to a first voltage level to output a first voltage at a first output terminal. The second voltage regulator is connected to the first voltage regulator, and regulates the first output voltage down to a constant, second voltage level to output a second voltage at a second output terminal. The voltage comparator is connected to the first and second voltage regulators, compares the first output voltage against a given threshold level greater than the second voltage level, and deactivates the second voltage regulator until the first output voltage exceeds the given threshold level upon startup of the power supply circuit.08-20-2009

Hideki Agari, Tokyo JP

Patent application numberDescriptionPublished
20120104577SEMICONDUCTOR PACKAGE AND ELECTRONIC COMPONENT PACKAGE - A semiconductor package includes an IC chip including a pad array having at least four pads, the pads including a voltage input pad and a voltage output pad disposed at edges of the pad array, a driver transistor disposed between the voltage input pad and the voltage output pad to receive an input voltage from the voltage input pad and output an output voltage to the voltage output pad, disposed in contact with an outer edge of the element arrangement region; and at least four leads on which the IC chip is mounted by flip chip bonding, disposed corresponding to the pads, formed in a lead array, the leads including a voltage input lead electrically connected to the voltage input pad and a voltage output lead electrically connected to the voltage output pad, disposed at edges of the lead array.05-03-2012

Hideki Agari, Osaka JP

Patent application numberDescriptionPublished
20080218136Power supply circuit - A disclosed power supply circuit (09-11-2008

Patent applications by Hideki Agari, Osaka JP

Hironobu Agari, Osaka JP

Patent application numberDescriptionPublished
20120104577SEMICONDUCTOR PACKAGE AND ELECTRONIC COMPONENT PACKAGE - A semiconductor package includes an IC chip including a pad array having at least four pads, the pads including a voltage input pad and a voltage output pad disposed at edges of the pad array, a driver transistor disposed between the voltage input pad and the voltage output pad to receive an input voltage from the voltage input pad and output an output voltage to the voltage output pad, disposed in contact with an outer edge of the element arrangement region; and at least four leads on which the IC chip is mounted by flip chip bonding, disposed corresponding to the pads, formed in a lead array, the leads including a voltage input lead electrically connected to the voltage input pad and a voltage output lead electrically connected to the voltage output pad, disposed at edges of the lead array.05-03-2012

Hiroshi Agari, Odawara-Shi JP

Patent application numberDescriptionPublished
20110149429FLOATING HEAD DEVICE FOR FLOATING A HEAD ON A MAGNETIC DISK AND METHODS OF MANUFACTURING A MAGNETIC DISK - In one embodiment, a method of manufacturing a magnetic disk includes rotating a magnetic disk, supporting a floating head on the rotating magnetic disk, the floating head having a slider body and an element unit formed on a trailing edge of the slider body, contacting a floating surface of the slider body with the magnetic disk, and protruding a portion of the floating head toward the magnetic disk due to application of power to a heater element within the element unit, wherein the element unit is positioned away from the magnetic disk. In another embodiment, a floating head includes a slider body comprising AlTiC, an element unit positioned on a trailing edge of the slider body, the element unit having an initial recess amount of at least about 4 nm, and a heater element positioned within an alumina protective film of the element unit.06-23-2011

Masafumi Agari, Tokyo JP

Patent application numberDescriptionPublished
20090290113DISPLAY DEVICE AND METHOD OF PRODUCING THE SAME - The display device includes a pair of insulating substrates arranged so as to be opposed, a bonding layer, and a strain suppressing plate. The bonding layer is provided on the outer surface side of one insulating substrate. The strain suppressing plate has rigidity higher than that of the insulating substrate to suppress the strain caused by curving the insulating substrate. The strain suppressing plate is fixed to the insulating substrate by the bonding layer.11-26-2009
20100053759ANTIREFLECTION COATING AND DISPLAY DEVICE - An antireflection coating is formed on a transparent substrate and includes an Al film having a transmittance of lower than 10% at a wavelength of 550 nm with a thickness of 25 nm and predominantly composed of aluminum (Al), and an Al—N film formed in at least one of an upper layer and a lower layer of the Al film, having a transmittance of equal to or higher than 10% at a wavelength of 550 nm with a thickness of 25 nm, predominantly composed of Al and at least containing a nitrogen (N) element as an additive. A specific resistance of the antireflection coating is equal to or lower than 1.0×1003-04-2010
20100060602TOUCH SCREEN, TOUCH PANEL AND DISPLAY DEVICE - Each detection column wiring is constituted by a set of a first metal wiring having a zigzag pattern and a second metal wiring having a structure axisymmetric with the first metal wiring about a column direction as an axis, wherein the first metal wiring is constituted by first sloped portions which are obliquely sloped by an inclination angle of 45 degrees with respect to the column direction, and first parallel portions which are parallel with the column direction and are continuous with the first sloped portions, such that the first sloped portions and the first parallel portions are repeatedly placed in a zigzag shape along the column direction. Each detection row wiring also has the same structure. A sloped portion out of the first sloped portions of the first metal wiring is always orthogonally and spatially intersected, at its middle point, with a sloped portion out of the second sloped portions of the third metal wiring at its middle point. There is also the same orthogonal relationship among the other portions.03-11-2010
20100253647TOUCH PANEL AND DISPLAY DEVICE COMPRISING THE SAME - A touch panel capable of calculating touch position coordinates of an indicator with high accuracy in a desired detection time even if a large number of detection wire groups are provided. An oscillator circuit selects one of detection wires selected by a circuit or the like according to a command from a detection control circuit and oscillates. A circuit counts an output signal from the oscillator circuit up to a first count value. A circuit measures a period of the count. A circuit determines that there is a touch when it detects the detection wire of which the measured period is equal to or higher than a threshold value and sends the detection wire giving a maximum value equal to or higher than the threshold value to a circuit as a touch detection wire. The circuit causes the circuit or the like to select the touch detection wire and the detection wires adjacent thereto on both sides, the circuit counts up until the count value becomes a second count value larger than the first count value, and the circuit measures the count period. The circuit performs interpolation on the basis of the count value obtained by subtracting a background capacitance value from a measured value obtained by the circuit, to thereby determine the touch coordinates.10-07-2010

Patent applications by Masafumi Agari, Tokyo JP

Michaela Agari, Heidelberg DE

Patent application numberDescriptionPublished
20110244143METHOD OF CREATING A FLUID LAYER IN THE SUBMICROMETER RANGE - A method of creating a fluid layer in the micrometer range includes transferring a fluid between substrates and forming a fluid layer. A surface energy of a first substrate releasing the fluid is higher than a surface energy of a fluid on the first substrate to create a first fluid deposit on the first substrate. A surface energy of a second substrate accepting the fluid is lower than a surface energy of a fluid on the second substrate to create a second fluid deposit on the second substrate that is reduced as compared to the first fluid deposit, A surface energy of a third substrate accepting the fluid is higher than a surface energy of a fluid on the third substrate to create a substantially homogeneous third fluid deposit on the third substrate that forms the fluid layer.10-06-2011

Takeshi Agari, Tokyo JP

Patent application numberDescriptionPublished
20090196115SEMICONDUCTOR DEVICE FOR PREVENTING ERRONEOUS WRITE TO MEMORY CELL IN SWITCHING OPERATIONAL MODE BETWEEN NORMAL MODE AND STANDBY MODE - When an operational mode is shifted to a standby mode, a first transistor is brought into a conduction state by a control signal, and a word line is thereby clamped to a ground voltage. Further, a second transistor is brought into a non-conduction state, and supply of an internal power supply voltage to a word line driver is shut off. Subsequently, the supply of the internal power supply voltage is halted for saving electrical power. When the operational mode returns to a normal mode, the supply of the internal power supply voltage is started, and subsequently, the first transistor is brought into the non-conduction state by the control signal, and the second transistor is thereby brought into the conduction state.08-06-2009
20110116321SEMICONDUCTOR DEVICE FOR PREVENTING ERRONEOUS WRITE TO MEMORY CELL IN SWITCHING OPERATIONAL MODE BETWEEN NORMAL MODE AND STANDBY MODE - When an operational mode is shifted to a standby mode, a first transistor is brought into a conduction state by a control signal, and a word line is thereby clamped to a ground voltage. Further, a second transistor is brought into a non-conduction state, and supply of an internal power supply voltage to a word line driver is shut off. Subsequently, the supply of the internal power supply voltage is halted for saving electrical power. When the operational mode returns to a normal mode, the supply of the internal power supply voltage is started, and subsequently, the first transistor is brought into the non-conduction state by the control signal, and the second transistor is thereby brought into the conduction state.05-19-2011