Patent application number | Description | Published |
20130092951 | GALLIUM NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A gallium nitride-based semiconductor device includes a composite substrate and a gallium nitride layer. The composite substrate includes a silicon substrate and a filler. The silicon substrate includes a first surface and a second surface opposite to the first surface, and the first surface defines a number of grooves therein. The filler is filled into the number of grooves on the first surface of the silicon substrate. A thermal expansion coefficient of the filler is bigger than that of the silicon substrate. The gallium nitride layer is formed on the second surface of the silicon substrate. | 04-18-2013 |
20130122618 | LED PACKAGE AND MOLD OF MANUFACTURING THE SAME - A light emitting diode package includes a base having a first surface, an electrode portion attached to the base, a pair of inner electrodes disposed on the first surface, a pair of outer electrodes, a pair of conductive pillars, a light emitting diode die, and a cap layer. Each outer electrode includes an end surface section and a side surface section. The end surface sections are disposed, corresponding to the inner electrodes, on the second surface. Each side surface section extends onto the side surface of the electrode portion. The conductive pillar penetrates between the inner electrode and the outer electrode. The light emitting diode die is on the first surface, electrically connecting the inner electrode file cap layer covers the light emitting diode die. | 05-16-2013 |
20130168716 | LIGHT EMITTING DIODE ASSEMBLY HAVING A DEFORMABLE LENS - A light emitting diode assembly includes a base, a light emitting chip mounted on the base, an elastic lens covering the light emitting chip, two rotation members rotatably arranged on the base, and two stopper poles fixed on the base. The two rotation members are capable of driving the elastic lens to rotate with respect to the two stopper poles. The stopper poles compress the elastic lens to cause the elastic lens to deform resiliently when the elastic lens is rotated by the rotation members to engage with the stopper poles. | 07-04-2013 |
20130175498 | LIGHT EMITTING DIODE - A light emitting diode and a light emitting diode (LED) manufacturing method are disclosed. The LED comprises a substrate; a first n-type GaN layer; a second n-type GaN layer; an active layer; and a p-type GaN layer formed on the substrate in sequence; the second n-type GaN layers has a bottom surface interfacing with the first n-type GaN layer, a rim of the bottom surface has a roughened exposed portion, and Ga-N bonds on the bottom surface has an N-face polarity. | 07-11-2013 |
20130175555 | LIGHT EMITTING DIODE PACKAGE HAVING INTERCONNECTION STRUCTURES - A light emitting diode (LED) package includes a substrate, a first LED chip and a second LED chip. The substrate includes first to fourth electrodes, and an interconnection electrode. A mounting area is defined at center of a top surface of the substrate. The first to fourth electrodes are respectively in four corners of the substrate out of the mounting area. The first interconnection electrode is embedded in the substrate to electrically connect the first and the third electrodes. The first LED chip and the second LED chip are arranged in the mounting area. Each LED chip includes an anode pad and a cathode pad. The first to fourth electrodes are respectively connected to the four pads of the first and the second LED chips via a plurality of metal wires, and no metal wire connection is formed between the first and the second LED chips. | 07-11-2013 |
Patent application number | Description | Published |
20130223097 | BACKLIGHT MODULE - An exemplary illuminating apparatus includes a light guiding plate, a light source facing a light input surface of the light guiding plate, and a complementary color element adjacent to the light source. The light source comprises a number of LEDs which emit light with at least two wavelengths. The at least two wavelengths light mix with each other to gain a white light. The complementary color element is configured for receiving light emitted from adjacent, outmost LED and converting the light into white light. The white light is reflected by the complementary color element and emits from the light guiding plate through the light output surface. The complementary color element includes a plurality of first and second complementary color zones arranged alternatively and in a line. | 08-29-2013 |
20130229822 | BACKLIGHT MODULE HAVING OPTCIAL FIBER - A backlight module includes a back cover, a light source located on the back cover, an optical fiber located on the back cover and over the light source and having a light-incident hole facing the light source and a plurality of light-emergent windows opposite to the light-incident hole. A plurality of light shutters correspondingly covers the light-emergent windows. A controlling device is provided for controlling the open and close of the light shutters. Light emitted from the light source and entering the optical fiber is permitted to leave the optical fiber from the light-emergent windows whose light shutters are opened. The light is not permitted to leave the optical fiber from the light-emergent windows whose light shutters are closed. | 09-05-2013 |
20130229826 | BACKLIGHT MODULE - A direct-type backlight module includes a light guiding plate, a light source facing a light input surface of the light guiding plate, a complementary color element adjacent to the light source, and an enclosure. The light source comprises a number of LEDs which emit light with at least two wavelengths. The at least two wavelengths light mix with each other to gain a white light. The complementary color element is configured for receiving light emitted from adjacent, outmost LED and converting the light into white light. The white light is reflected by the complementary color element and emits from the light guiding plate through the light output surface. The LEDs are mounted on a base of the enclosure and arranged in an array. | 09-05-2013 |
20130244358 | METHOD OF MANUFACTURING LIGHT EMITTING DIODE - A method of manufacturing a light emitting diode (LED) comprising: providing a porous carrier, a base disposed on the carrier and a plurality of light emitting elements mounted on the base, wherein the carrier defines a plurality of micro through-holes extending through a first face to a second face of the carrier, and the base has electrical structures formed thereon electrically connecting to the light emitting elements, respectively; providing a mold to receive the carrier therein and distributing a phosphor glue on the base to cover the light emitting elements, and the mold defining an air outlet communicated with the through-holes of the carrier; vacuuming the mold via the air outlet to flatten an outer face of the phosphor glue; heating the phosphor glue and removing the mold; and removing the carrier. | 09-19-2013 |
20130270590 | LED MODULE - An LED module comprises an LED and a lens matching with the LED. The lens comprises a light-guiding portion and a plurality of retaining portions protruded from the light-guiding portion. The LED includes a substrate, a first electrode and a second electrode mounted on the substrate. A plurality of through holes is defined in the first electrode and a second electrode, respectively. Each retaining portion includes a rugged portion. The retaining portions are inserted into the through holes correspondingly, and the rugged portion abuts the substrate. Glue is applied between the rugged portion and the substrate. | 10-17-2013 |
20130270595 | LIGHT EMITTING DIODE DIE AND LIGHT EMITTING DIODE PACKAGE INCORPORATING THE SAME - An LED die comprises a substrate and an epitaxial layer formed thereon. The epitaxial layer comprises a first n-type semiconductor layer, an active layer and a p-type semiconductor layer grown on the substrate in sequence. The LED die defines a receiving recess formed in a center of a top face of the p-type semiconductor layer. The receiving recess extends through the p-type semiconductor layer, the active layer and into the n-type semiconductor layer along a top-to-bottom direction of the epitaxial layer. A pair of p-pads are located at two opposite sides of the p-type semiconductor layer, respectively. A first n-pad is received in the receiving recess and located on the n-type layer. | 10-17-2013 |
20130279150 | LED LIGHT EMITTING APPARATUS HAVING A LIGHT GUIDING DEVICE TO ACHIEVE A UNIFORM COLOR DISTRIBUTION - An LED light emitting apparatus includes an LED light source, a light guiding device and an emitting window. The emitting window is covered with a phosphor layer. Light emitted directly from the LED light source is first transmitted to the light guiding device and then guided by the light guiding device towards the emitting window to evenly excite the phosphor layer. | 10-24-2013 |
20130283609 | METHOD FOR MANUFACTURING SUPPORTING BOARDS OF LIGHT EMITTING DIODE MODULES - A method for manufacturing supporting boards of light emitting diode modules comprises the following steps: providing a substrate which defines a plurality of through holes and receiving holes therein; providing an engaging plate which includes a plurality of electrode structures and brackets connecting the electrode structures with a connecting frame, each of the electrode structures forming a receiving cavity and an inserting part; providing a shaping roller assembly whereon the substrate and the engaging plate are wound, stacking the substrate and the engaging plate together, rotating the shaping roller assembly to make the shaping roller assembly press the stacked substrate and engaging plate, such that the through holes of the substrate are received in the receiving cavities of the engaging plate and the inserting parts of the electrode structures are inserted into the receiving holes of the substrate, whereby the supporting boards are formed. | 10-31-2013 |
20130285093 | LIGHT EMITTING DIODE PACKAGE STRUCTURE HAVING A SUBSTRATE INCLUDING CERAMIC FIBERS - An LED package structure includes a substrate and an LED chip formed on the substrate. The substrate has a first electrode and a second electrode formed on an upper surface thereof. The LED chip is formed on the first electrode of the substrate and electrically connected with the first electrode and the second electrode respectively. The substrate is made of a composite including a base material and ceramic fibers mixed in the base material. | 10-31-2013 |
20130285094 | LIGHT EMITTING DIODE LIGHT SOURCE DEVICE - An LED light source device includes an LED light source, a first translucent structure covering the LED light source and a second translucent structure covering the first translucent structure. An interior of the first translucent structure has light scattering powder distributed therein. The LED light source is embedded in the first translucent structure. The LED light source is covered by the light scattering powder. The second translucent structure has a radius of R and an index of refraction of N | 10-31-2013 |
20130288406 | METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE HAVING LED DIE FIXED BY ANISOTROPIC CONDUCTIVE PASTE - A method for packaging an LED, includes steps: providing a substrate and forming a plurality of pairs of electrodes on the substrate; positioning anisotropic conductive pastes on the substrate and attaching each anisotropic conductive paste to each pair of the electrodes; positioning an LED die on each anisotropic conductive paste and electrically connecting each LED die to each corresponding pair of the electrodes with the anisotropic conductive paste by hot compressing; forming an encapsulation on the substrate to cover the LED dies; and cutting the substrate to obtain individual LED packages. | 10-31-2013 |
20130288407 | METHOD FOR MANUFACTURING LED PACKAGE - A method for manufacturing an LED package includes providing a substrate including an insulating layer inlayed with first and second electrodes. The first and second electrodes define a chip fastening area. An LED chip is fastened on the chip fastening area and electrically connected to the first and second electrodes. A buffer layer including a shelter and grooves is brought to be located over the substrate wherein the shelter covers the chip fastening area and the grooves are located over portions of the substrate beside the first and second electrodes. A reflecting layer is formed in the grooves of the buffer layer by injecting liquid material into the grooves. The buffer layer is removed after the liquid material is solidified and a through hole is defined. An encapsulant is formed to cover the LED chip by injecting the encapsulant into the through hole and the chip fastening area. | 10-31-2013 |
20130288409 | METHOD FOR MANUFACTURING LIGHT EMITTING DIODE - An exemplary method for manufacturing an LED includes steps: providing a substrate with a first electrode and a second electrode; providing an isosceles trapezoidal LED chip and making the LED chip electrically connecting the first electrode and the second electrode; providing a mold with a cavity and setting the mold on the substrate to make the LED chip received in the cavity, an outer periphery of the LED chip spaced from confronting edges of the mold defining the cavity to define a channel therebetween, and a width of the channel being uniform; providing phosphor glue and filling the phosphor glue in the channel to make the phosphor glue enclose the LED chip therein; solidifying the phosphor glue to form a phosphor layer covering the LED chip and removing the mold. | 10-31-2013 |
20130299866 | LIGHT EMITTING DIODE WITH TWO ALTERNATIVE MOUNTING SIDES FOR MOUNTING ON CIRCUIT BOARD - An exemplary light-emitting diode (LED) includes a substrate, a first electrode and a second electrode sandwiching the substrate therebetween, an LED chip electrically connected to the first electrode and the second electrode, a reflector located on the first electrode and the second electrode and surrounding the LED chip, and a first retaining wall mounted on an edge of the first electrode and a second retaining wall mounted on an edge of the second electrode. The first retaining wall and the second retaining wall are made of conductive material. The first retaining wall and the second retaining wall are at a same side of the LED. Outer surfaces of the first retaining wall and the second retaining wall are exposed out of the reflector. | 11-14-2013 |
20130309795 | METHOD FOR MANUFACTURING LED CHIP WITH INCLINED SIDE SURFACE - A method for manufacturing an LED chip is disclosed wherein a substrate is provided. A first semi-conductor layer is formed on the substrate. A photoresist layer with an inverted truncated cone shape and a blocking layer with an inclined inner surface facing and surrounding the photoresist layer are formed on the first semi-conductor layer. The photoresist layer is removed and an epitaxial region surrounded by the blocking layer is defined. A lighting structure is formed inside the epitaxial region. The blocking layer is then removed and the first semi-conductor layer is exposed. Electrodes are formed and respectively electrically connected to the first semi-conductor layer and the lighting structure. | 11-21-2013 |
20140145216 | LED WITH WIRE SUPPORT - An LED includes a base, a first chip and a second chip mounted on the base, a wire support formed on the base, and wires electrically connecting the first chip and the second chip with the base. The base includes a first lead, a second lead and an insulative band connecting the first lead and the second lead. A first wire connects an electrode of the first chip to the wire support, and a second wire connects an electrode of the second chip to the wire support. The first wire and the second wire are electrically connected to each other via a conductive layer formed on the wire support. The wire support in one embodiment is a Zener diode. | 05-29-2014 |