Ables
Billy D. Ables, Richardson, TX US
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20090110265 | System for Forming Patterns on a Multi-Curved Surface - According to one embodiment, a pattern forming system includes a patterning tool, a multi-axis robot, and a simulation tool that are coupled to a pattern forming tool that is executed on a suitable computing system. The pattern forming tool receives a contour measurement from the patterning tool and transmits the measured contour to the simulation tool to model the electrical characteristics of a conductive pattern or a dielectric pattern on the measured contour. Upon receipt of the modeled characteristics, the pattern forming system may adjust one or more dimensions of the pattern according to the model, and subsequently create, using the patterning tool, the corrected pattern on the surface. | 04-30-2009 |
20100300734 | Method and Apparatus for Building Multilayer Circuits - An method for building multi-layer circuits without post process via fills is disclosed. The method includes aligning a first contact on a first substrate layer with a second contact on a second substrate layer; and fusion bonding the first contact to the second contact. A multilayer circuit is also disclosed. The multilayer circuit includes a first substrate layer including a first contact. The multilayer circuit also includes a second substrate layer including a second contact that is fusion bonded to the first contact such that the first and second contacts are aligned. | 12-02-2010 |
20110097845 | Method and Apparatus for Packaging Circuit Devices - A hermetically sealed package includes a lid ( | 04-28-2011 |
20110113619 | PROCESS FOR FABRICATING A THREE DIMENSIONAL MOLDED FEED STRUCTURE - A process for fabricating a three dimensional molded feed structure is provided. In one embodiment, the invention relates to a process for fabricating a three dimensional radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a first preselected pattern of channels in the flexible circuit substrate, depositing a conductive layer on the formed flexible substrate, and removing portions of the conductive layer to form a plurality of conductive traces. | 05-19-2011 |
Bryan Ables, New Braunfels, TX US
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20130025237 | TAKE-UP FASTENER FOR RESISTING UPLIFT LOADS IN LIGHT FRAMED CONSTRUCTION - A take-up fastener is disclosed for fastening a level in a frame construction to the level below so as to resist upward forces generated by wind and other sources on the framed construction. The take-up fastener in general includes a take-up plate, or washer, fastened to a portion of the upper level and a take-up screw fit through the take-up plate and fastened to the adjacent level below. Once the take-up fastener is fully assembled, the take-up plate includes a pair of tabs which are capable of engaging threads on a take-up screw in a way that allows one-way motion of the take-up screw relative to the take-up plate. In particular, the take-up plate can move downward relative to the take-up screw, for example on constricting of the wooden members to which the take-up plate is affixed. However, the engagement between the take-up plate and take-up screw prevents movement of the take-up plate upward with respect to the take-up screw, for example upon an upward load due to wind or other external force. | 01-31-2013 |
20130039699 | TAKE-UP FASTENER FOR RESISTING UPLIFT LOADS IN LIGHT FRAMED CONSTRUCTION - A take-up fastener is disclosed for fastening a level in a frame construction to the level below so as to resist upward forces generated by wind and other sources on the framed construction. The take-up fastener in general includes a take-up plate, or washer, fastened to a portion of the upper level and a take-up screw fit through the take-up plate and fastened to the adjacent level below. Once the take-up fastener is fully assembled, the take-up plate includes a pair of tabs which are capable of engaging threads on a take-up screw in a way that allows one-way motion of the take-up screw relative to the take-up plate. In particular, the take-up plate can move downward relative to the take-up screw, for example on constricting of the wooden members to which the take-up plate is affixed. However, the engagement between the take-up plate and take-up screw prevents movement of the take-up plate upward with respect to the take-up screw, for example upon an upward load due to wind or other external force. | 02-14-2013 |
David Ables, Los Angeles, CA US
Patent application number | Description | Published |
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20100004566 | INTELLIGENT ORTHOTIC INSOLES - An intelligent insole for generating time sensitive information about the pressure on the foot. The insole includes a custom-made, semi-custom or generically sized orthotic component. The orthotic is laminated with a top cover and an intermediate pressure sensor having an array of capacitive pressure sensors. Signal processing equipment may be embedded in the insole or placed locally with the insole as on the side of a shoe. The processor also can connect to a wireless transmitter for relaying the information to a remote site. | 01-07-2010 |
20110275956 | Intelligent Orthotic Insoles - An intelligent insole for generating time sensitive information about the pressure on the foot. The insole includes a custom-made, semi-custom or generically sized orthotic component. The orthotic is laminated with a top cover and an intermediate pressure sensor having an array of capacitive pressure sensors. Signal processing equipment may be embedded in the insole or placed locally with the insole as on the side of a shoe. The processor also can connect to a wireless transmitter for relaying the information to a remote site. | 11-10-2011 |
David Ables, Venice, CA US
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20120105367 | METHODS OF USING TACTILE FORCE SENSING FOR INTUITIVE USER INTERFACE - Described are novel methods of user interface for electronic devices using proportional force information. The new user interface is more intuitive, easier to use and requires less finger manipulations. The input device itself is configured for detecting at least one location of touch and measuring a force of touch at this location as in a capacitance sensing tactile pressure array. At least two events defining an output event of the input device are provided for a particular location. Selection of one event or the other is done based on a force of touch being either above or below a predetermined force of touch threshold. More than one force of touch threshold may be provided for one or more locations, along with a corresponding number of events—to further increase the functionality of the input device. The invention may be used in particular with laptop, tablet computers and smartphones. | 05-03-2012 |
Jesse Taylor Ables, Las Vegas, NV US
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20140158736 | Backpack Frame Extender - One embodiment of a backpack frame extender for augmenting the length of an external backpack frame to provide longitudinally elevated connection fittings for a backpack frame load lifter straps. The backpack frame extender includes a plurality of stays and straps for attachment to a backpack frame, with a means for releasably connecting the backpack frame load lifter straps to the backpack frame extender. The attachment straps allow the backpack frame extender to be releasably attached to the backpack frame and positioned at various heights as determined by a user's torso length and personal preference. Other embodiments are described and shown. | 06-12-2014 |
Larry Monroe Ables, Ridgeland, MS US
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20090097292 | ON-BOARD VEHICLE POWER - A modular vehicle power system for a vehicle, the modular vehicle power system obtaining DC power the vehicle and producing AC power and method therefore. A plurality of power modules, each of the plurality of power modules receiving the DC power from the vehicle and producing the AC power, wherein each of the plurality of power modules are independent and interchangeable. | 04-16-2009 |
Russell A. Ables, Duluth, GA US
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20140083889 | PACKAGING OF PERSONAL ARTICLES BY BANDING BUNDLES - Diaper packaging having a reduced manufacturing cost may be created by bagging stacks of diapers and bundling the bags. Bands may be applied circumscribing the bundled bags of diapers. One band may be applied along a first direction perpendicular with the length of the stacked diapers. A second band may applied in a second direction parallel with the length of the stacked diapers. The bags of diapers may include several stacks of diapers, and the bundles may include several bags of diapers. For certain bundle configurations of packaged diapers, additional bands may be placed circumscribing the bundles for improved stability. Packaging by banding bundles of diapers may also be used to package other personal care articles and absorbent articles. | 03-27-2014 |
Wallace H. Ables, Georgetown, TX US
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20150241504 | SYSTEM AND METHOD TO MONITOR CONTACT JOINT INTEGRITY - Methods and systems for monitoring contact joint integrity in an information handling system may include precisely monitoring a change in resistance of a resistive element associated with a contact joint. The change in resistance of the resistive element may be indicative of the integrity of the contact joint. The resistance may be measured using a modulated current source and by demodulating a voltage signal resulting from the modulated current flowing across the resistive element. | 08-27-2015 |
Wallace Huson Ables, Georgetown, TX US
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20150195910 | BALL GRID ARRAY SYSTEM - Systems and methods for providing a ball grid array connection include providing a circuit board having a circuit board surface including a plurality of pads. A ball grid array component includes a plurality of solder balls. The ball grid array component is coupled to the circuit board to position each of the plurality of solder balls adjacent a respective one of the plurality of pads. A solder reflow process is then performed to produce a plurality of soldered connections from each of the plurality of solder balls and a respective one of the plurality of pads. At least one spacer member is provided between the ball grid array component and the circuit board during the solder reflow process to provide a mechanical stop between the ball grid array component and the circuit board and a minimum height for each of the plurality of soldered connections. | 07-09-2015 |
William Colt Ables, Duncan, OK US
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20140008071 | Wellbore Servicing Assemblies and Methods of Using the Same - An apparatus for servicing a wellbore comprising a housing defining an axial flowbore and comprising high-pressure ports, high-volume ports, and a mandrel slidably positioned within the housing, the mandrel defining a mandrel axial flowbore and being alternatingly movable from a first position to a second position and to a third position, wherein, when the mandrel is in the second position, a route of fluid communication via the high-pressure ports is provided and a route of fluid communication via the high-volume ports is obstructed, wherein, when the mandrel is in the third, position, a route of fluid communication via the high-volume ports is provided, and wherein the apparatus is transitionable from the second position to the third position without communicating an obturating member to the apparatus, without removing an obturating member from the apparatus, or combinations thereof. | 01-09-2014 |