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Abela
Andrew L. Abela, Horsley Park AU
| Patent application number | Description | Published |
|---|---|---|
| 20110009925 | TRANSCUTANEOUS RECEIVING ANTENNA DEVICE FOR IMPLANT - An implantable antenna ( | 01-13-2011 |
Andrew Leonard Abela, Horsley Park AU
| Patent application number | Description | Published |
|---|---|---|
| 20090216324 | MALLEABLE IMPLANTABLE MEDICAL DEVICE - A malleable implantable medical device for implanting in a recipient comprising a flexible region of the medical device, one or more structures proximate to the flexible region, wherein the one or more structures is configured to provide a bending force to the flexible region, and one or more hermetically sealed medical components coupled to the flexible region, wherein the one or more medical components is configured to provide a therapeutic effect on the recipient. | 08-27-2009 |
George Abela, East Lansing, MI US
| Patent application number | Description | Published |
|---|---|---|
| 20120107229 | NOVEL NANO-PROBES FOR MOLECULAR IMAGING AND TARGETED THERAPY OF DISEASES - The present inventions relate to compositions and methods for imaging and treating atherosclerotic diseases, pathogen infections, and tumors by administering actively targeting magnetic nanoparticles. In particular, the present inventions provide new types of targeting ligands attached to magnetic nanoparticles for magnetic resonance imaging. The use of these targeted magnetic nanoparticles is contemplated as a means to treat atherosclerotic diseases, including but not limited to inhibiting and removing atherosclerotic plaques. Further, actively targeting magnetic nanoparticles are contemplated for use with multiple labels for use in nuclear medicine imaging, computed tomography (CT) techniques and other types of imaging for medical and research applications. | 05-03-2012 |
Irene Abela, Ennetbaden CH
| Patent application number | Description | Published |
|---|---|---|
| 20100330075 | MONOCLONAL HUMAN TUMOR-SPECIFIC ANTIBODY - Provided are novel human tumor-specific antibodies as well as fragments, derivatives and variants thereof that recognize tumor-associated antigen NY-ESO-1. In addition, pharmaceutical compositions comprising such antibodies and mimics thereof in the treatment of tumors are described. | 12-30-2010 |
| 20110123447 | METHOD OF PROVIDING HUMAN TUMOR-SPECIFIC ANTIBODIES - Provided are novel tumor-specific binding molecules, particularly human antibodies as well as fragments, derivatives and variants thereof that recognize tumor-associated antigens and that are obtained from a tumor patient who shows at least partial clinical response or is symptom-free. In addition, pharmaceutical compositions comprising such binding molecules, antibodies and mimics thereof and methods of screening for novel binding molecules, which may or may not be antibodies as well as targets in the treatment of tumors are described. | 05-26-2011 |
Jonathan Abela, Thielle-Wavre CH
| Patent application number | Description | Published |
|---|---|---|
| 20090162965 | Optical Die-Down Quad Flat Non-Leaded Package - An optical sensor package that includes an optical sensor die is mounted by flip chip interconnect onto a lead frame in a “die-down” orientation, that is, with the active side of the optical sensor die facing the lead frame. An opening is provided in the lead frame die paddle (pad), and light passes from outside the package through the opening in the lead frame die pad onto light collection elements on the active side of the chip. | 06-25-2009 |
Jonathan Abela, Cudrefin CH
| Patent application number | Description | Published |
|---|---|---|
| 20090014893 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WIRE-IN-FILM ISOLATION BARRIER - An integrated circuit package in package system includes: providing a substrate having a first wire-bonded die with an active side mounted above; connecting the active side of the first wire-bonded die to the substrate with a bond-wire; mounting a wire-in-film adhesive having an isolation barrier over the first wire-bonded die; and encapsulating the first wire-bonded die, the bond-wires, and the wire-in-film adhesive with an encapsulation. | 01-15-2009 |
| 20110241223 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WIRE-IN-FILM ISOLATION BARRIER AND METHOD FOR MANUFACTURING THEREOF - A method for manufacturing an integrated circuit package in package system includes: providing a substrate having a first wire-bonded die with an active side mounted above; connecting the active side of the first wire-bonded die to the substrate with a bond-wire; mounting a wire-in-film adhesive having an isolation barrier over the first wire-bonded die; and encapsulating the first wire-bonded die, the bond-wires, and the wire-in-film adhesive with an encapsulation. | 10-06-2011 |