Patent application number | Description | Published |
20100041558 | Electromagnetic radiation detection device and manufacturing process thereof - The electromagnetic radiation detection device comprises at least one absorption membrane for absorbing said radiation. The absorption membrane is formed by an absorption layer made of tungsten nitride (W | 02-18-2010 |
20140191221 | PIEZOELECTRIC PRESSURE SENSOR - A pressure sensor including a lower substrate having two electrodes partially covered with a semiconductor layer and a piezoelectric layer made of a piezoelectric material, and in contact with the semiconductor layer in such a way that semiconductor material is in contact with the piezoelectric material and with the two electrodes, deposited thereon. The electrodes are intended to be connected to a voltage source or to a device for measuring the intensity of a current generated by the displacement of the electric charges in the semiconductor layer between the electrodes, said electric charges being created when a pressure is exerted on the piezoelectric layer. | 07-10-2014 |
20140210076 | FLIP-CHIP HYBRIDIZATION OF MICROELECTRONIC COMPONENTS BY LOCAL HEATING OF CONNECTING ELEMENTS - A method of forming a hybridized device including forming a first component provided with metal bumps, and a second component provided with connection elements, attaching the bumps to the connection elements. The manufacturing of the second component includes forming, on a surface of a substrate, resistive elements at the locations provided for the connection elements; depositing an electric insulator layer at least on the resistive elements; and forming the connection elements, each comprising a metal well having an opening capable of receiving the corresponding metal bump of the first microelectronic component and at least partially filled with a fusible element, particularly indium or an alloy of tin and gold, or with a conductive ink, particularly based on silver or copper. Further, the attachment of the balls to the connection elements comprises applying an electric current through the resistive elements to heat the bumps. | 07-31-2014 |
20140220737 | FLIP-CHIP HYBRIDIZATION OF MICROELECTRONIC COMPONENTS USING SUSPENDED FUSIBLE RESISTIVE CONNECTION ELEMENTS - A method of forming a hybridized device comprising forming a first microelectronic component provided, on a surface, with metal balls, and a second microelectronic component provided, on a surface, with connection elements corresponding to said metal balls, and hybridizing the first and second components to attach the metal balls of the first component to the connection elements of the second component. The manufacturing of the second microelectronic component comprises forming a substrate provided with cavities at the locations provided for the connection elements, and forming resistive elements made of fusible metal respectively suspended above the cavities. The hybridizing of the first and second components comprises transferring the first component onto the second component to have the metal balls rest on the suspended resistive elements, and circulating an electric current through the resistive elements to melt said elements. | 08-07-2014 |
20140321507 | CAPACITIVE TEMPERATURE SENSOR COMPRISING TWO CAPACITORS AS A VOLTAGE DIVIDER BRIDGE - A temperature sensor including a capacitive circuit including an input terminal for the application of an input voltage, an output terminal for the reading of an output voltage of the circuit, and a reference potential terminal, a voltage circuit for applying a predetermined voltage to the input terminal of the circuit and a circuit for reading the voltage at the output terminal of the capacitive circuit and converting the read voltage into a temperature measurement. According to the invention, the capacitive circuit includes a fir capacitor, connected between the input and output terminals, and having a capacitance decreasing according to temperature; and a second capacitor, connected between the input terminal and the terminal at the reference potential, and having a capacitance increasing along with temperature. | 10-30-2014 |
20150049330 | Photosensitive Tactile Sensor - A tactile sensor including a piezoresistive layer having its electric resistance varying according to mechanical stress exerted thereon, the piezoresistive layer being at least partially transparent to light; a photosensitive layer, having its electric resistance varying according to the quantity of incident light thereon, the photosensitive layer being arranged opposite the piezoresistive layer; and electric connection elements electrically connecting in parallel the piezoresistive layer and the photosensitive layer. | 02-19-2015 |
20150053895 | Photosensitive And Heat-Resistant Material, Method For Producing Same And Use Thereof - This tin-based material comprises:
| 02-26-2015 |
20150096878 | Touch-Sensitive Sensor And Method For Producing Such A Sensor - This touch-sensitive sensor includes a layer of piezoelectric material interposed between, on the one hand, first and second electrically-conductive elements and, on the other hand, at least one third conductive element including a surface opposite at least one of the first and second conductors. | 04-09-2015 |