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Abare
Amber C. Abare, Durham, NC US
| Patent application number | Description | Published |
|---|---|---|
| 20120068198 | HIGH DENSITY MULTI-CHIP LED DEVICES - High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption. | 03-22-2012 |
Charles A. Abare, Athens, AL US
| Patent application number | Description | Published |
|---|---|---|
| 20100061053 | Ruggedized Computer Capable of Operating in High-Temperature Environments - Illustrative embodiments of the present invention are directed to a computer that has a housing with walls that form a substantially sealed interior cavity from an exterior environment. The computer includes a plurality of computer components within the interior cavity. The computer also includes at least one heat sink for dissipating thermal energy into the exterior environment. A cooling element is thermally coupled to the heat sink and at least one of the computer components to transfer thermal energy from the computer component into the heat sink and the exterior environment. | 03-11-2010 |
| 20110304980 | Ruggedized Computer Capable of Operating in High Temperature Environments - Illustrative embodiments of the present invention are directed to a computer that has a housing with walls that form a substantially sealed interior cavity from an exterior environment. The computer includes a plurality of computer components within the interior cavity. The computer also includes at least one heat sink for dissipating thermal energy into the exterior environment. A cooling element is thermally coupled to the heat sink and at least one of the computer components to transfer thermal energy from the computer component into the heat sink and the exterior environment. | 12-15-2011 |
Dave Abare, Plaistow, NH US
| Patent application number | Description | Published |
|---|---|---|
| 20100050374 | GROMMET AND METHOD OF PRODUCTION - A device, system, and method for producing a flexible grommet for use against edges of an aperture. The exemplary method may involve producing a straight piece of flexible material with a U-shaped profile having two wall portions coupled by a central portion wherein an interior U-shaped profile is sized to produce a frictional fit with the edge of the aperture. Multiple slits may be produced in the wall portions at location of curves when the grommet is positioned within the aperture. The straight piece of flexible material may be bent along the slits. The grommet may be positioned within the aperture. | 03-04-2010 |
Dave Abare, Haverhill, MA US
| Patent application number | Description | Published |
|---|---|---|
| 20090139598 | COVER ASSEMBLY - A system, method, and device for an assembly cover positioning on an end piece is disclosed. The exemplary device may have a sidewall portion made of a ring of material with an aperture in the center wherein the aperture is sized to produce a frictional fit on the end piece. The exemplary device also has a cover portion coupled to a top portion of the sidewall portion. | 06-04-2009 |