| Patent application number | Description | Published |
|---|
| 20090027657 | METHOD AND APPARATUS FOR VERIFYING PROPER SUBSTRATE POSITIONING - Embodiments of methods and apparatus for detecting the proper position of a substrate in a chamber are provided herein. In some embodiments, a substrate position detection apparatus includes a substrate support having a plurality of lift pins for supporting a substrate in an elevated position thereover; a light source for directing a beam of light upon a reflective upper surface of the substrate; and a light sensor for detecting a reflected beam of light from the upper surface of the substrate upon the substrate being aligned in a predetermined elevated position. | 01-29-2009 |
| 20090041443 | Backside Rapid Thermal Processing of Patterned Wafers - Apparatus and methods of thermally treating a wafer or other substrate, such as rapid thermal processing (RTP) apparatus and methods are disclosed. An array of radiant lamps directs radiation to the back side of a wafer to heat the wafer. In one or more embodiments, the front side of the wafer on which the patterned integrated circuits are being formed faces a radiant reflector. In one or more embodiments, the wafer is thermally monitored for temperature and reflectivity from the side of the reflector. | 02-12-2009 |
| 20090274454 | SYSTEM FOR NON RADIAL TEMPERATURE CONTROL FOR ROTATING SUBSTRATES - Embodiments of the present invention provide apparatus and method for reducing non uniformity during thermal processing. One embodiment provides an apparatus for processing a substrate comprising a chamber body defining a processing volume, a substrate support disposed in the processing volume, wherein the substrate support is configured to rotate the substrate, a sensor assembly configured to measure temperature of the substrate at a plurality of locations, and one or more pulse heating elements configured to provide pulsed energy towards the processing volume. | 11-05-2009 |
| 20090277894 | METHOD FOR REDUCING STRAY LIGHT IN A RAPID THERMAL PROCESSING CHAMBER BY POLARIZATION - Embodiments of the present invention provide apparatus and method for reducing noises in temperature measurement during thermal processing. One embodiment of the present invention provides a chamber for processing a substrate comprising a chamber enclosure defining a processing volume, an energy source configured to direct radiant energy toward the processing volume, a spectral device configured to treat the radiant energy directed from the energy source towards the processing volume, a substrate support disposed in the processing volume and configured to support the substrate during processing, and a sensor assembly configured to measure temperature of the substrate being processed by sensing radiation from the substrate within a selected spectrum. | 11-12-2009 |
| 20090311880 | Method of Annealing Using Two Wavelengths of Continuous Wave Laser Radiation - A thermal processing apparatus and method in which a first laser source, for example, a CO | 12-17-2009 |
| 20100003020 | APPARATUS AND METHOD FOR MEASURING RADIATION ENERGY DURING THERMAL PROCESSING - Embodiments of the present invention provide apparatus and method for reducing heating source radiation influence in temperature measurement during thermal processing. In one embodiment of the present invention, background radiant energy, such as an energy source of a thermal processing chamber, is marked within a selected spectrum, a characteristic of the background is then determined by measuring radiant energy at a reference wavelength within the selected spectrum and a comparing wavelength just outside the selected spectrum. | 01-07-2010 |
| 20100065547 | MANAGING THERMAL BUDGET IN ANNEALING OF SUBSTRATES - A method and apparatus are provided for treating a substrate. The substrate is positioned on a support in a thermal treatment chamber. Electromagnetic radiation is directed toward the substrate to anneal a portion of the substrate. Other electromagnetic radiation is directed toward the substrate to preheat a portion of the substrate. The preheating reduces thermal stresses at the boundary between the preheat region and the anneal region. Any number of anneal and preheat regions are contemplated, with varying shapes and temperature profiles, as needed for specific embodiments. Any convenient source of electromagnetic radiation may be used, such as lasers, heat lamps, white light lamps, or flash lamps. | 03-18-2010 |
| 20100068898 | MANAGING THERMAL BUDGET IN ANNEALING OF SUBSTRATES - A method and apparatus are provided for treating a substrate. The substrate is positioned on a support in a thermal treatment chamber. Electromagnetic radiation is directed toward the substrate to anneal a portion of the substrate. Other electromagnetic radiation is directed toward the substrate to preheat a portion of the substrate. The preheating reduces thermal stresses at the boundary between the preheat region and the anneal region. Any number of anneal and preheat regions are contemplated, with varying shapes and temperature profiles, as needed for specific embodiments. Any convenient source of electromagnetic radiation may be used, such as lasers, heat lamps, white light lamps, or flash lamps. | 03-18-2010 |
| 20100264123 | Annealing apparatus using two wavelengths of continuous wave laser radiation - A thermal processing apparatus and method in which a first laser source, for example, a CO | 10-21-2010 |
