Patent application number | Description | Published |
20080242549 | SUPERCONDUCTING FILTER DEVICE - A superconducting filter device is disclosed that includes a dielectric base substrate; a patch-type resonator pattern formed of a superconducting material on the base substrate; and a feeder extending in the vicinity of the resonator pattern. The feeder includes a transmission line part for signal inputting or signal outputting, the transmission line part extending toward the resonator pattern; a facing part bent from the transmission line part to face the resonator pattern; and an end part bent from the facing part in a direction away from the resonator pattern. | 10-02-2008 |
20080257487 | Interposer and electronic device fabrication method - An interposer | 10-23-2008 |
20080258191 | CAPACITOR DEVICE PROVIDING SUFFICIENT RELIABILITY - A capacitor device includes a dielectric layer configured to have a composition represented as (Ba | 10-23-2008 |
20080305607 | Thin film capacitor and fabrication method thereof - A thin film capacitor comprising a top electrode, a bottom electrode, and a dielectric film held between the top and bottom electrodes. The dielectric film is composed of at least cations Ba, Sr, and Ti and anion O. The concentration of Sr, Ti, and O ions are uniform along the growth direction of the dielectric film while the concentration of the Ba cation is non-uniform along the growth direction such that a reduced Ba-I region in which the average concentration of perovskite type Ba cations (Ba-I) is less than the average concentration of non-perovskite type Ba cations (Ba-II) exists at or near the boundary between at least one of the top and bottom electrodes, with ratio R=(atm % Ba-I)/[(atm % Ba-I)+(atm % Ba-II)] within a range of 0.112-11-2008 | |
20080315358 | Capacitive element, method of manufacture of the same, and semiconductor device - A capacitive element is characterized by including: a base ( | 12-25-2008 |
20090057827 | CAPACITOR EMBEDDED IN INTERPOSER, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING CAPACITOR EMBEDDED IN INTERPOSER - As for electrode pads for a semiconductor integrated circuit element, some of electrode pads for signal transmission are coupled to Ti films. Others of the electrode pads for signal transmission are coupled to electrode pads through wiring routed in multilayer wiring. Electrode pads for power supply are coupled to electrode pads to which power lines at potentials different from each other are coupled through wiring. The electrode pads are also coupled to Al foils (anodes). Electrode pads for grounding are coupled to electrode pads to which ground lines are coupled through wiring. The electrode pads are also coupled to conductive polymer films (cathodes). | 03-05-2009 |
20090059545 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME - A semiconductor device includes a semiconductor element, a supporting substrate where the semiconductor element is mounted, and a capacitor provided on the semiconductor element and coupled to the supporting substrate via an outside connection terminal. The capacitor includes a valve metal part, an anodic oxide film formed on a surface of the valve metal part, and a conductive part formed on the anodic oxide film and made of a conductive material. | 03-05-2009 |
20090080119 | HEAD SLIDER, AND METHOD FOR MANUFACTURING HEAD SLIDER - According to an aspect of an embodiment, a head slider includes: a slider substrate; and an operating unit arranged on the slider substrate, the operating unit having a pair of electrodes and a piezoelectric component arranged between the pair of electrodes, the pair of electrodes being constituted by a first electrode and a second electrode, in which the product of the Young's modulus and the thickness of the first electrode in the direction from the first electrode to the second electrode is larger than the product of the Young's modulus and the thickness of the second electrode in the direction from the first electrode to the second electrode. The head slider further includes a magnetic head arranged on the slider substrate with the operating unit, opposite to the slider substrate. | 03-26-2009 |
20090167460 | SUPERCONDUCTING TUNABLE FILTER - A superconducting tunable filter is disclosed that has a center frequency and a bandwidth able to be adjusted separately. The superconducting tunable filter includes a superconducting resonator filter pattern formed on a dielectric substrate; a dielectric or magnetic plate above the resonator filter pattern and having a through-hole; a dielectric or magnetic rod inserted in the through-hole; and a position controller which separately controls the position of the dielectric or magnetic plate and the position of the dielectric or magnetic rod relative to the resonator filter pattern. | 07-02-2009 |
20090219653 | HEAD SLIDER EQUIPPED WITH PIEZOELECTRIC ELEMENT - A head slider includes a slider substrate, an actuator provided in an end portion of the slider substrate and equipped with a piezoelectric element, and a magnetic head disposed on a side opposite to the slider substrate with interposition of the actuator. The piezoelectric element has piezoelectric bodies polarized along a first direction connecting the slider substrate and the magnetic head. The piezoelectric element has electrodes which apply an electric field to the piezoelectric bodies along a second direction intersecting the first direction. | 09-03-2009 |
20090237841 | MAGNETIC HEAD AND MAGNETIC RECORDING DEVICE - A magnetic head includes a head element recording and reading data on and from a recording medium, a slider having an air bearing surface facing the recording medium, and having the head element forming surface which the head element being present on, and a piezoelectric device attached above the head element forming surface and the head element, and configured to displace a part of the head forming surface in a direction perpendicular to the air bearing surface. | 09-24-2009 |
20090273880 | VARIABLE CAPACITOR AND FILTER CIRCUIT WITH BIAS VOLTAGE - A variable capacitor includes a metal oxide film having a perovskite structure, first and second electrode films having the metal oxide film placed therebetween and to be coupled to an external voltage source, and a bias voltage source configured to provide a bias voltage that is applied in series or parallel to a capacitance of a capacitor including the metal oxide film and the first and second electrode films, wherein the bias voltage applied by the bias voltage source to the capacitance is adapted to maximize a voltage dependency of a relative permittivity of the metal oxide film. | 11-05-2009 |
20100009854 | FILTER WITH DISK-SHAPED ELECTRODE PATTERN - A filter includes a dielectric substrate; an electrode layer continuously formed covering a first side of the dielectric substrate; a disk-shaped electrode pattern provided on a second side of the dielectric substrate, the disk-shaped electrode pattern and the electrode layer holding the dielectric substrate therebetween; a ground slot having an opening that is formed asymmetrically with respect to the center of a circular area included in the electrode layer and exposes the dielectric substrate, the circular area and the disk-shaped electrode pattern holding the dielectric substrate therebetween. | 01-14-2010 |
20100073822 | MAGNETIC HEAD ASSEMBLY AND MAGNETIC DISK DEVICE - A magnetic head assembly includes: a slider; an actuator disposed on an end face of the slider; and a magnetic head unit connected to the actuator. The actuator has a structure in which multiple electrodes are arranged in a piezoelectric body, and is driven in d33 mode. In other words, when a predetermined voltage is applied to the actuator, a portion between the electrodes in the piezoelectric body expands or contracts with respect to a voltage application direction. When the piezoelectric body of the actuator expands or contracts, the magnetic head unit is deformed, and the deformation causes a change of the distance between a magnetic head (recording element and reproducing element) and a magnetic recording medium. | 03-25-2010 |
20100073823 | PIEZOELECTRIC ACTUATOR, HEAD SLIDER AND MAGNETIC DISK DRIVE - A piezoelectric actuator includes a piezoelectric body; a first and a second electrode for applying an electric field to the piezoelectric body in order to polarize the piezoelectric body in a first direction at an elevated temperature, at least one of the first and the second electrode including a material whose resistivity decreases with elevation of the temperature; and a third and a fourth electrode for applying an electric field to the piezoelectric body in a second direction across the first direction of the polarization of the piezoelectric body in order to actuate the piezoelectric body. | 03-25-2010 |
20100105563 | SUPERCONDUCTIVE FILTER WITH PLURALITY OF RESONATOR PATTERNS FORMED ON SURFACE OF DIELECTRIC SUBSTRATE - A superconductive filter includes a superconductive filter substrate having a dielectric substrate and a plurality of resonator patterns formed on a surface of the dielectric substrate, the plurality of resonator patterns including a superconductive material; a package accommodating the superconductive filter substrate; and an intermediate substrate disposed between an inner surface of the package and the superconductive filter substrate, and thermally coupling the package and the superconductive filter substrate wherein a difference between a degree of contraction of the intermediate substrate and the degree of contraction of the dielectric substrate is smaller than a difference between the degree of contraction of the dielectric substrate and the degree of contraction of the package, when the package, the intermediate substrate, and the dielectric substrate are cooled from room temperature to a critical temperature of the resonator patterns. | 04-29-2010 |
20100112775 | PLATING METHOD, SEMICONDUCTOR DEVICE FABRICATION METHOD AND CIRCUIT BOARD FABRICATION METHOD - The plating method comprises the step of forming a resin layer | 05-06-2010 |
20100233359 | METHOD FOR MANUFACTURING CAPACITOR EMBEDDED IN INTERPOSER - As for electrode pads for a semiconductor integrated circuit element, some of electrode pads for signal transmission are coupled to Ti films. Others of the electrode pads for signal transmission are coupled to electrode pads through wiring routed in multilayer wiring. Electrode pads for power supply are coupled to electrode pads to which power lines at potentials different from each other are coupled through wiring. The electrode pads are also coupled to Al foils (anodes). Electrode pads for grounding are coupled to electrode pads to which ground lines are coupled through wiring. The electrode pads are also coupled to conductive polymer films (cathodes). | 09-16-2010 |
20100233796 | FUEL CELL SYSTEM AND METHOD OF CONTROLLING SAME - A fuel cell system includes a fuel cell configured to generate electric power with a fuel gas and an oxygen gas fed to the fuel cell and to discharge exhaust gas including CO | 09-16-2010 |
20100264951 | INTERCONNECTION CARD FOR INSPECTION, MANUFACTURE METHOD FOR INTERCONNECTION CARD, AND INSPECTION METHOD USING INTERCONNECTION CARD - Recesses are formed on one surface of a substrate. A conductive film covers an inner surface of each of the recesses. This conductive film contacts a bump of a semiconductor device to be inspected and is electrically connected to the bump. It is therefore possible to prevent damages of the bump to be caused by contact of a probe pin. | 10-21-2010 |
20100321911 | CAPACITOR AND ELECTRONIC SUBSTRATE INCLUDING THE SAME - A capacitor including a substrate; a conductive layer provided on the substrate and containing conductive particles; a valve metal sheet having a dielectric part formed throughout an entire surface of the conductive layer; a protection layer covering the valve metal sheet; a first electrode terminal electrically connected to the conductive layer and partially exposed from an external surface of the protection layer; and a second electrode terminal electrically connected to a surface of the valve metal sheet which is opposite to a surface of the valve metal sheet on which the dielectric part is provided, and the second electrode terminal partially exposed from the external surface of the protection layer; wherein the dielectric part is made of an oxide of a metallic material of the valve metal sheet, the dielectric part is formed with a corrugated surface on the conductive layer, and the conductive particles of the conductive layer are in contact with the corrugated surface of the dielectric part. | 12-23-2010 |
20110056068 | Interposer and method for manufacturing the same - The interposer includes a glass substrate | 03-10-2011 |
20110168564 | PLATING METHOD, SEMICONDUCTOR DEVICE FABRICATION METHOD AND CIRCUIT BOARD FABRICATION METHOD - The plating method comprises the step of forming a resin layer | 07-14-2011 |
20110171500 | POWER GENERATING SYSTEM AND CONTROL METHOD FOR THE SAME - A power generating system includes: a plurality of cells forming a fuel cell battery for generating power; a cell temperature measuring unit provided for each cell; a thermoelectric converter provided for each cell; a heating unit which heats the plurality of cells; a first control unit which controls the heating unit; and a second control unit, provided for each thermoelectric converter, for controlling the thermoelectric converter, wherein the first control unit controls the heating unit so as to bring the temperature of the heating unit to within a predetermined control temperature range, and the second control unit performs control so that if the temperature of the cell lies outside a predetermined operating temperature range, the thermoelectric converter is switched to the thermal transfer mode and is controlled so as to bring the temperature of the cell to within the predetermined operating temperature range, and if the temperature of the cell lies within the predetermined operating temperature range, the thermoelectric converter is switched to the power generation mode. | 07-14-2011 |
20110226303 | METHOD OF MANUFACTURING THERMOELECTRIC CONVERSION ELEMENT AND THERMOELECTRIC CONVERSION ELEMENT - P-type semiconductor sheets and n-type semiconductor sheets formed by mixing a powder of semiconductor material, a binder resin, a plasticizer, and a surfactant are prepared. In addition, separator sheets formed by mixing a resin such as PMMA and a plasticizer are prepared. Through holes are formed in each of the separator sheets and then filled with a conductive material. Thereafter, the p-type semiconductor sheet, the separator sheet, the n-type semiconductor sheet and the separator sheet are stacked. The resultant laminated body is cut into a predetermined size and then subjected to a baking process. | 09-22-2011 |
20110294265 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME - A semiconductor device includes a semiconductor element, a supporting substrate where the semiconductor element is mounted, and a capacitor provided on the semiconductor element and coupled to the supporting substrate via an outside connection terminal. The capacitor includes a valve metal part, an anodic oxide film formed on a surface of the valve metal part, and a conductive part formed on the anodic oxide film and made of a conductive material. | 12-01-2011 |
20120007470 | PIEZOELECTRIC GENERATING APPARATUS - A piezoelectric generating apparatus includes a plurality of piezoelectric bodies arranged at intervals via a gap. Each of the plurality of piezoelectric bodies includes a fixed end and a free end. A first surface electrode is formed on one side of each of the plurality of piezoelectric bodies, and a second surface electrode is formed on an opposite side of each of the plurality of piezoelectric bodies. A weight spans the plurality of piezoelectric bodies and attached to the free ends of the plurality of piezoelectric bodies. The plurality of piezoelectric bodies are curved upon application of acceleration to the weight from the outside in a lateral direction. | 01-12-2012 |
20120058041 | GAS GENERATOR AND GAS GENERATION METHOD - A gas generator includes a processing vessel defining a processing space and holding a support body therein, an evacuation system evacuating the processing space; a metal oxide film of a perovskite structure containing oxygen defects formed on the support body, a source gas supplying port supplying a source gas containing molecules of a source compound of carbon dioxide or water into the processing space, a gas outlet port for extracting a product gas containing molecules of a product compound in which oxygen atoms are removed from said source compound, and a heating part heating the support body. | 03-08-2012 |
20120086311 | ACCELERATION SENSOR, VIBRATION POWER GENERATOR DEVICE, AND ACCELERATION SENSOR MANUFACTURING METHOD - An acceleration sensor includes a piezoelectric layer formed on a substrate, and sensing electrodes formed in the piezoelectric layer. In the acceleration sensor, the piezoelectric layer interposing between the sensing electrodes is polarized in a film thickness direction of the piezoelectric layer. | 04-12-2012 |
20120211044 | THERMOELECTRIC CONVERSION MODULE - A thermoelectric conversion module includes: a first substrate having water permeability and thermal conductivity; a thermoelectric conversion element provided on the first substrate; a heat insulator having water permeability provided around the thermoelectric conversion element on the first substrate; and a second substrate disposed on the thermoelectric conversion element and the heat insulator and having water permeability and thermal conductivity. | 08-23-2012 |
20120227780 | THERMOELECTRIC CONVERSION MODULE AND METHOD OF MANUFACTURING SAME - A thermoelectric conversion module includes an insulative substrate, a plurality of thermoelectric conversion material films disposed with a gap therebetween on a first surface of the insulative substrate and made of any one of an n-type thermoelectric conversion material and a p-type thermoelectric conversion material, a first electrode and a second electrode, formed away from each other on each of the thermoelectric conversion material films, a first thermal conduction member disposed on a side of the first surface of the insulative substrate and including a protruding portion in contact with the first, electrodes or the insulative substrate between the first electrodes, and a second thermal conduction member disposed on a side of a second surface of the insulative substrate and including a protruding portion in contact with the second surface of the insulative substrate at an area coinciding with the second electrodes. | 09-13-2012 |
20120298165 | ELECTRIC POWER GENERATION DEVICE, ELECTRIC POWER GENERATION METHOD, AND ELECTRIC POWER GENERATION DEVICE MANUFACTURING METHOD - An electric power generation device equipped with an apparatus which vibrates and generates heat includes a thermoelectric power generation module and a piezoelectric power generation module which are formed integrally. The thermoelectric power generation module has a first surface combining thermally and mechanically with the apparatus's outer surface and a second surface opposite to the first surface, and generates electric power from temperature differences between the first surface and the second surface caused by the apparatus's generating heat. The piezoelectric power generation module has a fixed end combining mechanically with the apparatus's outer surface and a movable end opposite to the fixed end, and generates electric power from displacement of the movable end to the fixed end caused by the apparatus's vibrating. | 11-29-2012 |
20130055567 | INTERCONNECTION CARD FOR INSPECTION, MANUFACTURE METHOD FOR INTERCONNECTION CARD, AND INSPECTION METHOD USING INTERCONNECTION CARD - Recesses are formed on one surface of a substrate. A conductive film covers an inner surface of each of the recesses. This conductive film contacts a bump of a semiconductor device to be inspected and is electrically connected to the bump. It is therefore possible to prevent damages of the bump to be caused by contact of a probe pin. | 03-07-2013 |
20130284229 | METHOD OF MANUFACTURING THERMOELECTRIC CONVERSION ELEMENT AND THERMOELECTRIC CONVERSION ELEMENT - P-type semiconductor sheets and n-type semiconductor sheets formed by mixing a powder of semiconductor material, a binder resin, a plasticizer, and a surfactant are prepared. In addition, separator sheets formed by mixing a resin such as PMMA and a plasticizer are prepared. Through holes are formed in each of the separator sheets and then filled with a conductive material. Thereafter, the p-type semiconductor sheet, the separator sheet, the n-type semiconductor sheet and the separator sheet are stacked. The resultant laminated body is cut into a predetermined size and then subjected to a baking process. | 10-31-2013 |