Patent application number | Description | Published |
20080217050 | MULTI-LAYERED INTERCONNECT STRUCTURE USING LIQUID CRYSTALLINE POLYMER DIELECTRIC - A multi-layered interconnect structure and method of formation. In a first embodiment, first and second liquid crystal polymer (LCP) dielectric layers are directly bonded, respectively, to first and second opposing surface of a thermally conductive layer, with no extrinsic adhesive material bonding the thermally conductive layer with either the first or second LCP dielectric layer. In a second embodiment, first and second 2S1P substructures are directly bonded, respectively, to first and second opposing surfaces of a LCP dielectric joining layer, with no extrinsic adhesive material bonding the LCP dielectric joining layer with either the first or second 2S1P substructures. | 09-11-2008 |
20100218891 | MULTI-LAYERED INTERCONNECT STRUCTURE USING LIQUID CRYSTALLINE POLYMER DIELECTRIC - A multi-layered interconnect structure and method of formation. In a first embodiment, first and second liquid crystal polymer (LCP) dielectric layers are directly bonded, respectively, to first and second opposing surface of a thermally conductive layer, with no extrinsic adhesive material bonding the thermally conductive layer with either the first or second LCP dielectric layer. In a second embodiment, first and second 2S1P substructures are directly bonded, respectively, to first and second opposing surfaces of a LCP dielectric joining layer, with no extrinsic adhesive material bonding the LCP dielectric joining layer with either the first or second 2S1P substructures. | 09-02-2010 |
Patent application number | Description | Published |
20100148661 | ENCAPSULATION STRUCTURE AND METHOD OF ORGANIC ELECTROLUMINESCENCE DEVICE - An encapsulation structure comprises a first barrier layer, and an electroluminescence device configured to be coupled to the first barrier layer and comprising a substrate and an electroluminescence element both defining a lateral side. The electroluminescence element comprises a first electrode disposed on the substrate, a second electrode, and an organic light-emitting layer disposed between the first and second electrodes. Further, the encapsulation structure comprises a second barrier layer configured to be coupled to the electroluminescence device, and an adhesive configured to locate between and connect the first and second barrier layers, and at least to be coupled to the lateral side of the electroluminescence device to seal the electroluminescence device between the first and second barrier layers. An encapsulation method is also presented. | 06-17-2010 |
20100148665 | ENCAPSULATED OPTOELECTRONIC DEVICE AND METHOD FOR MAKING THE SAME - An encapsulated optoelectronic device includes: a first barrier layer; an electroluminescence device configured to be coupled to the first barrier layer, and comprising a substrate and an electroluminescence element both defining a lateral side, and the electroluminescence element comprising a first electrode disposed on the substrate, a second electrode, and an optoelectronically active layer disposed between the first and second electrodes; a second barrier layer configured to be coupled to the electroluminescence device; and an adhesive configured to locate between and connect the first and second barrier layers, and at least to be coupled to the lateral side of the electroluminescence device to seal the electroluminescence device between the first and second barrier layers; a first conductive area disposed on the first barrier layer, located between the first and second barrier layers, and configured to be electrically coupled to the first electrode and electrically insulated from the second electrode and a second conductive area; the second conductive area disposed on the first barrier layer, located between the first and second barrier layers, and configured to be electrically coupled to the second electrode and electrically insulated from the first electrode and the first conductive area. A method for making the encapsulated optoelectronic device is also presented. | 06-17-2010 |
20100294526 | HERMETIC ELECTRICAL PACKAGE - A hermetic electrical package includes a first transparent barrier layer; a second barrier layer bonded to the first barrier layer, and defining a plurality of feedthrough apertures; an optoelectronic device sandwiched between the first and second barrier layers, the optoelectronic device comprising an anode, a photoelectrically active layer, and a cathode; and a conductive patch electrically coupled to the cathode or anode and disposed across at least one feedthrough aperture. | 11-25-2010 |
20100295443 | OLED LIGHTING DEVICES INCLUDING ELECTRODES WITH MAGNETIC MATERIAL - An article of manufacture comprises a thin film solid state lighting device, such as an organic light emitting diode (OLED) device, having a planar light emitting side and an opposite planar mounting side and including electrodes disposed on the planar mounting side of the thin film solid state lighting device, the electrodes including a magnetic material configured to conductively convey electrical drive current to drive the thin film solid state lighting device to emit light at the planar light emitting principal side. The article of manufacture may further comprise a fixture having a planar surface with magnets arranged to mate with the electrodes to magnetically secure the thin film solid state lighting device with the fixture and to concurrently form electrically conductive paths including the magnetic material of the electrodes configured to conductively convey electrical drive current. Thus this magnetic connection provides both mechanical support and electrical conduction path. | 11-25-2010 |
20110025196 | HERMETIC PACKAGE WITH GETTER MATERIALS - Organic light emitting devices include a transparent substrate, a first transparent electrode disposed on the transparent substrate, a second electrode, an electroluminescent layer sandwiched between the electrodes, and a getter layer disposed on a light emitting surface of the substrate opposite the first transparent electrode, and comprising a metal selected from beryllium, magnesium, calcium, strontium, barium, radium and titanium. | 02-03-2011 |
20110074281 | MONOLITHIC PARALLEL INTERCONNECT STRUCTURE - An optoelectronic device having a monolithic interconnect structure includes a continuous anode layer, a discontinuous cathode layer, and an electroactive layer sandwiched between the continuous anode layer and the discontinuous cathode layer. | 03-31-2011 |
20110186866 | OPTOELECTRONIC DEVICE ARRAY - An optoelectonice device array includes a plurality of packages, each enclosing an optoelectronic device, and positioned in at least one row. Each package overlaps at least one adjacent package, and may be hermetically sealed. | 08-04-2011 |
20130154471 | OLED DEVICES - An organic electroluminescent device includes a transparent substrate having a conductive coating, a plurality of electroactive layers, a cathode layer, and a protective wax layer. The wax layer may be disposed directly on an electrode, particularly a cathode. The wax layer alone protects the cathode and no getter material is required to exclude oxygen and/or moisture. An OLED lighting device capable of emitting light from front and back surfaces, wherein an adhesive layer, particularly a wax layer, is disposed between cathodes of two organic electroluminescent devices positioned back to back. | 06-20-2013 |