Patent application number | Description | Published |
20080265788 | EL LIGHT EMITTING TOUCH SWITCH - A touch switch is composed of an EL light emitting layer configured by stacking a fluorescent layer and an insulation layer between first electrodes and a second electrode, a judgment means for making a judgment on touch manipulation with the first electrode by an operator and an EL driving unit for driving the EL light emitting layer for light emitting, with each of a plurality of first electrodes, each of plurality of fluorescent layers and each of plurality of insulation layers being provided as a set and the second electrode being provided as a single electrode with respect to the plurality of first electrodes, wherein the judgment means makes a judgment on which of the plurality of first electrodes has been touched by an operator on the basis of a high-frequency component inputted from the second electrode through the first electrode each time the touch switch is touched by an operator. | 10-30-2008 |
20080302649 | Structured touch switch - The present invention relates to a structured touch switch, which is of an electrostatic capacity type. The structured touch switch comprises a substrate made of a material having a non-conductive characteristic, a conductive member made of a material having a conductive characteristic and formed integrally with the substrate so that a portion of the conductive characteristic member appears at a surface of the substrate and a detection electrode positioned at a backside of the substrate and in opposed relation to the conductive member in a state where a space is defined with respect to the conductive member. | 12-11-2008 |
20090073133 | El emittting touch switch - An EL emitting touch switch includes first electrodes, a single second electrode facing the first electrodes, and EL layers each sandwiched between a corresponding one of the first electrodes and the second electrode. A light emission driver applies a driving voltage between the first and second electrodes to cause the EL layers to emit light. A timing signal generator generates a timing signal to control the light emission driver such that the application of the driving voltage is stopped at predetermined intervals. Touch decision units are provided for each first electrode. Each touch decision unit includes a feedback circuit for supplying current to the corresponding first electrode such that the potentials of the first and second electrodes become equal to each other, and detects contact of a human body with the corresponding first electrode based on operation of the feedback circuit while the application of the driving voltage is stopped. | 03-19-2009 |
20100328266 | ELECTROSTATIC CAPACITIVE TOUCH SENSOR DEVICE - An electrostatic capacitive touch sensor device includes sensing electrode provided at a plurality of positions, a high-frequency signal source that applies a high-frequency signal to the sensing electrode through a predetermined impedance element, a wiring portion that connects the sensing electrode and the impedance element, a shield portion provided to embrace the sensing electrodes and the connecting pattern, and a shield signal source that applies a shield signal to the shield portion and has the same phase and amplitude as the high-frequency signal source. | 12-30-2010 |
20100330371 | PANEL DEVICE - A panel device includes a panel section, a first conductive layer that is provided in a side of one surface of the panel section, an insulating layer that is stacked on the first conductive layer and a second conductive layer that is stacked on the insulating layer. The first conductive layer and the second conductive layer are formed by coating an electrically conductive solvent-type substance. The insulating layer is formed by coating an insulating curing-acceleration-type substance. | 12-30-2010 |
Patent application number | Description | Published |
20090095712 | Flattening method and flattening apparatus - A flattening method, by utilizing the advantages of the CARE method and making up for the disadvantages, can perform removal processing of a surface of a workpiece at a sufficient processing rate and can provide a processed surface having enhanced flatness without leaving damage in the processed surface. A flattening method comprises at least two surface removal steps and at least two cleaning steps, the final surface removal step being a catalyst-referred etching step comprising immersing a workpiece in a processing solution containing at least one of hydrohalic acid, hydrogen peroxide water and ozone water, and bringing a surface of a catalyst platen into contact with or close proximity to a surface to be processed of the workpiece to process the surface, said catalyst platen having in a surface a catalyst selected from the group consisting of platinum, gold, a ceramic solid catalyst, a transition metal, glass, and an acidic or basic solid catalyst. | 04-16-2009 |
20090135431 | Ultra Precision Profile Measuring Method - To provide a method for measuring a plane mirror or a curved surface mirror close to plane mirror for condensing hard X-rays or soft X-rays used in a radiation light facility, especially an elliptical or tubular object having a steep profile exceeding 1×10 | 05-28-2009 |
20100002838 | HIGH PRECISION POSTURE CONTROL METHOD OF X-RAY MIRROR - A high precision posture control method for sustaining the posture of an X-ray optical element constantly at 1 μrad or less. A longitudinal condensation mirror ( | 01-07-2010 |
20100147463 | CATALYST-AIDED CHEMICAL PROCESSING METHOD AND APPARATUS - A catalyst-aided chemical processing method can process hard-to-process materials, especially SiC, GaN, etc. whose importance as electronic device materials is increasing these days, with high processing efficiency and high precision even for a space wavelength range of not less than several tens of μm. The catalyst-aided chemical processing method comprises: putting a workpiece in a processing liquid in which halogen-containing molecules are dissolved; and moving the workpiece and a catalyst composed of molybdenum or a molybdenum compound relative to each other while keeping the catalyst in contact with or close proximity to a surface to be processed of the workpiece, thereby processing the surface of the workpiece. | 06-17-2010 |
20100183122 | X-RAY CONDENSING METHOD AND ITS DEVICE USING PHASE RESTORATION METHOD - An X-ray condensing method and its device are provided with an X-ray mirror that has a wavefront adjustable function to finely adjust a wavefront of a reflecting X-ray, measure an X-ray intensity distribution in the vicinity of a focus, measure an X-ray intensity distribution in the vicinity of the X-ray mirror or use a known X-ray intensity distribution of an incident X-ray, calculate a complex amplitude distribution at the reflective surface by using a phase restoration method from the X-ray intensity distribution in the vicinity of the focus and the X-ray intensity distribution in the vicinity of the reflective surface, calculate a wavefront aberration of an X-ray condensing optical system from the complex amplitude distribution, and control the reflective surface of the X-ray mirror with the wavefront adjustable function so that the wavefront aberration is minimized. | 07-22-2010 |
20110305317 | METHOD AND APPARATUS OF PRECISELY MEASURING INTENSITY PROFILE OF X-RAY NANOBEAM - Provided are a method and an apparatus of precisely measuring the intensity profile of an x-ray nanobeam, which can measure x-rays having different wavelengths with one knife edge and can perform optimal measurements corresponding to the depth of focus of an x-ray beam and the conditions of other measurement devices, using a dark field measurement method which enables precise measurements of the profile of an x-ray beam using a knife edge and using diffracted and transmitted x-rays. The knife edge ( | 12-15-2011 |
20120001193 | Polishing method, polishing apparatus and GaN wafer - A polishing method can process and flatten, in a practical processing time and with high surface accuracy, a surface of a substrate of a Ga element-containing compound semiconductor. The polishing method includes: bringing a Ga element-containing compound semiconductor substrate ( | 01-05-2012 |
20120244649 | POLISHING METHOD, POLISHING APPARATUS AND POLISHING TOOL - A polishing method and a polishing apparatus particularly suitable for finishing a surface of a substrate of a compound semiconductor containing an element such as Ga or the like to a desired level of flatness, so that a surface of a substrate of a compound semiconductor containing an element of Ga can be flattened with high surface accuracy within a practical processing time. In the presence of water ( | 09-27-2012 |
20140231011 | FLATTENING METHOD AND FLATTENING APPARATUS - A flattening method, by utilizing the advantages of the CARE method and making up for the disadvantages, can perform removal processing of a surface of a workpiece at a sufficient processing rate and can provide a processed surface having enhanced flatness without leaving damage in the processed surface. A flattening method comprises at least two surface removal steps and at least two cleaning steps, the final surface removal step being a catalyst-referred etching step comprising immersing a workpiece in a processing solution containing at least one of hydrohalic acid, hydrogen peroxide water and ozone water, and bringing a surface of a catalyst platen into contact with or close proximity to a surface to be processed of the workpiece to process the surface, said catalyst platen having in a surface a catalyst selected from the group consisting of platinum, gold, a ceramic solid catalyst, a transition metal, glass, and an acidic or basic solid catalyst. | 08-21-2014 |
20150068680 | POLISHING METHOD, POLISHING APPARATUS AND POLISHING TOOL - A polishing method and a polishing apparatus finish a surface of a substrate of a compound semiconductor containing an element such as Ga or the like to a desired level of flatness, so that the surface can be flattened with high surface accuracy within a practical processing time. In the presence of water, such as weak acid water, water with air dissolved therein, or electrolytic ion water, the surface of the substrate made of a compound semiconductor containing either one of Ga, Al, and In and a surface of a polishing pad having an electrically conductive member in an area of the surface which is held in contact with the substrate) are relatively moved while being held in contact with each other, thereby polishing the surface of the substrate. | 03-12-2015 |
Patent application number | Description | Published |
20120276474 | METHOD OF CLEANING SUBSTRATE - The present invention is a method of cleaning a substrate, comprising cleaning at least one surface of a substrate located in a liquid by injecting pressurized cleaning liquid containing bubbles or cleaning particles from a injection nozzle to at least one surface of the substrate. | 11-01-2012 |
20130010929 | REFLECTIVE SURFACE SHAPE CONTROLLABLE MIRROR DEVICE, AND METHOD FOR MANUFACTURING REFLECTIVE SURFACE SHAPE CONTROLLABLE MIRROR - The device is configured from: a reflective surface shape controllable mirror in which a band-shaped X-ray reflective surface | 01-10-2013 |
20140230848 | METHOD OF CLEANING SUBSTRATE - The present invention is a method of cleaning a substrate, comprising cleaning at least one surface of a substrate located in a liquid by injecting pressurized cleaning liquid containing bubbles or cleaning particles from a injection nozzle to at least one surface of the substrate. | 08-21-2014 |
20140326612 | METHOD FOR MANUFACTURING SOLID OXIDE AND DEVICE THEREFOR - Provided is a method for manufacturing a solid oxide and a device therefor, capable of manufacturing a solid oxide used as an optical material without introducing damaged layers caused by machining, which does not use any polishing agent or abrasive grains including rare earth elements, or does not use any solution, such as hydrogen fluoride, for which handling is difficult and which imposes a heavy environmental burden. In the presence of water 1, a solid oxide in which one or more kinds of elements are bonded through oxygen is used as an object to be manufactured; a catalyst substance, which cuts a backbond between an oxygen element and another element, forming the solid oxide, by dissociation of a water molecule, and adsorbs it, and helps production of a decomposition product by hydrolysis, is used as a machining reference surface ( | 11-06-2014 |