Patent application number | Description | Published |
20100144167 | Electrical Connector System - High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz. | 06-10-2010 |
20100144168 | Electrical Connector System - High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz. | 06-10-2010 |
20100144169 | ELECTRICAL CONNECTOR SYSTEM - High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz. | 06-10-2010 |
20100144174 | Electrical Connector System - High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz. | 06-10-2010 |
20100144175 | ELECTRICAL CONNECTOR SYSTEM - High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz. | 06-10-2010 |
20100144201 | ELECTRICAL CONNECTOR SYSTEM - High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz. | 06-10-2010 |
20110081809 | PRINTED CIRCUIT HAVING GROUND VIAS BETWEEN SIGNAL VIAS - A printed circuit includes a substrate having a pair of opposite sides. A signal via extends through at least one of the sides and at least partially through the substrate between the sides. Aggressor vias extend through at least one of the sides and at least partially through the substrate between the sides. The aggressor vias are arranged in a pattern around the signal via. Linear paths are defined between the signal via and the aggressor vias. At least some of the aggressor vias are arranged along the substrate directly adjacent the signal contact. Ground vias extend through at least one of the sides and at least partially through the substrate between the sides. The ground vias are arranged around the signal via. At least one ground via is positioned along each linear path between the signal via and each of the aggressor vias that is directly adjacent the signal via. | 04-07-2011 |
20110278057 | ELECTRICAL CONNECTOR SYSTEM - A substrate is disclosed that is configured to receive an electrical component. The substrate comprises a plurality of first vias and a plurality of second vias. The plurality of first vias is arranges in the substrate in a matrix of rows and columns and is configured to provide mounting of the electric component, each first via associated with one of its closest neighbor first via to form a pair. The plurality of second vias is capable of being electrically commoned to one another and is positioned amongst the plurality of first vias such that there is at least one second via positioned directly between each first via and any of the closest non-pair first via neighbors. | 11-17-2011 |
Patent application number | Description | Published |
20150303598 | MEZZANINE HEADER CONNECTOR - A mezzanine header connector includes a contact assembly having a pair of contact modules arranged back-to-back. The contact modules each have a dielectric holder holding a plurality of header contacts. The dielectric holder extends between a mating end and a mounting end and has an inner side and an outer side. The header contacts have mating segments exposed along the outer side at the mating end for termination to corresponding receptacle contacts of a mezzanine receptacle connector. The header contacts have terminating segments extending from the mounting end of the dielectric holder for termination to a circuit board. Each of the header contacts extend along a linear path between the corresponding mating segment and the corresponding terminating segment. The inner sides of the dielectric holders of the pair of contact modules abut against each other such that the header contacts face away from each other. | 10-22-2015 |
20150303599 | MEZZANINE CONNECTOR ASSEMBLY - A mezzanine connector assembly includes a mezzanine receptacle connector having a plurality of receptacle contacts arranged in pairs for carrying differential pair signals and each having a mating interface. The mezzanine receptacle connector has a plurality of receptacle ground shields surrounding each pair of receptacle contacts and providing electrical shielding from each other pair. The mezzanine connector assembly includes a mezzanine header connector having a plurality of header contacts arranged in pairs. Each header contact has a mating segment mated to the mating interface of the corresponding receptacle contact. The mezzanine header connector has a plurality of header ground shields surrounding each pair of header contacts and providing electrical shielding from each other pair of header contacts. The header ground shields are mechanically and electrically connected to associated receptacle ground shields to create shield boxes around the various mated pairs of header and receptacle contacts. | 10-22-2015 |
20150303600 | MEZZANINE RECEPTACLE CONNECTOR - A mezzanine receptacle connector includes a housing having a mating end configured to be mated with a mezzanine header connector and a mounting end configured to be mounted to a circuit board. The mating end is opposite the mounting end and includes a plurality of contact cavities configured to receive associated header contacts of the mezzanine header connector. Receptacle contacts are received in corresponding contact cavities of the housing. Each receptacle contact has a main contact and a sub-contact extending from the main contact. The main contact defines a first mating interface and the sub-contact defines a second mating interface. The first and second mating interfaces of each receptacle contact are configured to directly engage the same header contact of the mezzanine header connector at different points of contact. | 10-22-2015 |
20150303601 | MEZZANINE HEADER CONNECTOR - A mezzanine header connector includes header modules stacked side-by-side having housing frames holding contact assemblies. Each contact assembly includes header contacts held by at least one dielectric holder. The header contacts have mating segments for termination to corresponding receptacle contacts of a mezzanine receptacle connector and terminating segments for termination to a circuit board. Each of the header contacts extend along a linear path between the corresponding mating segment and the corresponding terminating segment. Each housing frame has walls defining pockets receiving corresponding header contacts of the contact assembly. The housing frame is conductive and provides shielding around the associated header contacts of the contact assemblies. The header contacts face associated walls with air separating the header contacts and the walls along a majority of the header contacts. | 10-22-2015 |
20150303624 | MEZZANINE RECEPTACLE CONNECTOR - A mezzanine receptacle connector includes a housing having a mating end mated with a mezzanine header connector and a mounting end mounted to a circuit board. Receptacle contacts are held by the housing having mating ends with deflectable spring beams and terminating ends for termination to the circuit board. A ground lattice is held by the housing that includes longitudinal receptacle ground shields extending longitudinally within the housing generally parallel to a longitudinal axis. The ground lattice includes lateral receptacle ground shields extending laterally within the housing generally perpendicular to the longitudinal axis. The longitudinal receptacle ground shields are mechanically and electrically connected to the lateral receptacle ground shields to form the ground lattice. The ground lattice provides electrical shielding for the receptacle contacts. | 10-22-2015 |