Patent application number | Description | Published |
20080247212 | MEMORY SYSTEM HAVING POINT-TO-POINT (PTP) AND POINT-TO-TWO-POINT (PTTP) LINKS BETWEEN DEVICES - A memory system has first and second primary memories and first and second secondary memories coupled to the first and second primary memories, respectively, the coupling comprising at least one point-to-point connection. A memory module includes at least two of the first and second primary and first and second secondary memories. A first connection element, such as a connector or solder, connects the memory module to a mother board. A second connection element, such as a connector or solder, connects at least one other of the first and second primary and first and second secondary memories to the mother board. At least one of the memories on the first memory module is coupled to at least one of the other memories. The memory system also includes a memory controller which is connected to the primary memories by a point-to-two-point link. | 10-09-2008 |
20080298034 | PRINTED CIRCUIT BOARD AND SEMICONDUCTOR MODULE HAVING THE SAME - A printed circuit board (PCB) includes a substrate having a first group of at least two via holes and a second group of at least two via holes formed therein, a first pad set of terminal pads and a second pad set of terminal pads formed on the substrate, and a first group of conductive connection members and a second group of conductive connection members formed in the substrate. The first group of the via holes are surrounded by the first pad set of the terminal pads and the second group of the via holes are surrounded by the second pad set of the terminal pads. The first and the second groups of conductive connection members fill up the first and second groups of the via holes. The first group of the conductive connection members are connected to the first pad set of the terminal pads and the second group of the conductive connection members are connected to the second pad set of the terminal pads. | 12-04-2008 |
20090184778 | SUBSTRATE HAVING A STRUCTURE FOR SUPPRESSING NOISE GENERATED IN A POWER PLANE AND/OR A GROUND PLANE, AND AN ELECTRONIC SYSTEM INCLUDING THE SAME - A substrate includes a power plane and a ground plane that are placed apart from and are substantially parallel to each other, and at least one signal line that is placed between the power plane and the ground plane. The ground plane includes a first conductive layer having a first conductivity. The power plane includes a second conductive layer having the first conductivity, and the power plane or the ground plane includes a third conductive layer having a second conductivity lower than the first conductivity. The third conductive layer faces the at least one signal line across a dielectric substance. | 07-23-2009 |
20100141289 | PROBE CARD - A probe card to connect a semiconductor device to test equipment includes a Printed Circuit Board (PCB) in which an electrical wiring pattern is formed, a first connector fixed on an upper surface of the PCB to connect the test equipment to the PCB, probe needles connected to electrode pads of the semiconductor device, and a Flexible PCB (FPCB) to connect the PCB to the probe needles. Accordingly, a signal transmission characteristic can be enhanced, test expenses can be reduced, and ground noise can be reduced. | 06-10-2010 |
20100232197 | DATA STORAGE DEVICE - A device to selectively activate memory chips includes a memory unit including n memory chips activated in response to n memory chip activation signals (n is a natural number), a controller to generate m control signals (m is a natural number), and a memory chip activation signal generator to combine m chip enable (CE) signals to generate the n memory chip activation signals. | 09-16-2010 |
20110032740 | MEMORY SYSTEM HAVING IMPROVED SIGNAL INTEGRITY - A memory system having improved signal integrity includes a printed circuit board for use in a memory device, N memory semiconductor packages mounted on the printed circuit board, a first switch mounted on the printed circuit board, a controller mounted on the printed circuit board, N first signal lines connecting the semiconductor packages to the first switch such that the semiconductor packages and the first switch are in an N-to-1 correspondence, a second signal line connecting the first switch to the controller, and N selection lines connecting the semiconductor packages to the first switch such that the semiconductor packages and the first switch are in an N-to-1 correspondence. The N selection lines connect the semiconductor packages to the controller and transmit an enable signal. N is a natural number. | 02-10-2011 |
20110063790 | APPARATUS CAPABLE OF SELECTIVELY USING DIFFERENT TYPES OF CONNECTORS - An apparatus capable of selectively applying different types of connectors to a substrate is disclosed. The memory apparatus includes a substrate having a controller. First and second connector pads may be arranged on edges of top and bottom surfaces of the substrate. A via hole may be arranged between the controller and the first and second connector pads. A first passive device pad may be arranged between the via hole and the first connector pads. A second passive device pad may be arranged between the via hole and the second connector pads. A passive device may be coupled to only one of the first passive device pad or the second passive device pad. | 03-17-2011 |
20120031799 | FOOD STORAGE CONTAINER - Disclosed is a food storage container including a container body including a bottom part and a lateral part to form an interior space, a bottom film attached to the bottom part, and a lateral film forming a first overlapping part where the lateral film overlaps with the bottom film and a second overlapping part where an end portion overlaps with another end portion, and being attached to the lateral part. The food storage container has an improved film structure as compared with a conventional complicated film structure and has a high oxygen barrier performance. | 02-09-2012 |
20120063240 | MEMORY SYSTEM SUPPORTING INPUT/OUTPUT PATH SWAP - A memory system includes a controller having first and second input/output terminals, and first and second memory devices each having first and second input/output terminals. The system includes a path selection mechanism for selectively employing one of the first and second terminals of either the controller or the first memory device for communicating a first input/output signal between the controller and the first memory device, and employing the other one of the first and second terminals for communicating a second input/output signal between the controller and the first memory device. The path selection mechanism selectively employs the first and second terminals in accordance with data indicating which of the first and second terminals of the first memory device is connected to the first terminal of the controller and which of the first and second terminals of the first memory device is connected to the second terminal of the controller. | 03-15-2012 |
20120152884 | BOTTLE COVER ASSEMBLY - The invention relates to a stopper assembly, and more particularly, to an improved stopper to prevent a sloshing of an its liquefied content when a bottle is tilted to allow a predetermined amount of the content to be poured and to allow the content to be easily discharged. | 06-21-2012 |
20120325866 | FLUID STORAGE TANK - A fluid storage tank includes: a tank body in which a fluid is stored; and an ejection outlet that is formed on a top surface of the tank body in order to eject the fluid stored in the tank body, wherein the ejection outlet includes a tapered portion having an inner diameter that is increased upward away from the tank body. Accordingly, the fluid is prevented from being jiggled or splashed when being poured. | 12-27-2012 |
20130148403 | MEMORY SYSTEM HAVING IMPROVED SIGNAL INTEGRITY - A memory system having improved signal integrity includes a printed circuit board for use in a memory device, N memory semiconductor packages mounted on the printed circuit board, a first switch mounted on the printed circuit board, a controller mounted on the printed circuit board, N first signal lines connecting the semiconductor packages to the first switch such that the semiconductor packages and the first switch are in an N-to- | 06-13-2013 |