Patent application number | Description | Published |
20080241747 | Positive Resist Composition and Method of Forming Resist Pattern - A positive resist composition that exhibits a large exposure margin, and excellent levels of resolution and dry etching resistance, as well as a method of forming a resist pattern that uses the positive resist composition. This resist composition includes a resin component (A), which contains acid dissociable, dissolution inhibiting groups and displays increased alkali solubility under the action of acid, and an acid generator component (B) that generates acid on exposure, wherein the resin component (A) contains a structural unit (a1) represented by a general formula (I) shown below, a structural unit (a2) in which a hydroxyl group within the above general formula (I) has been protected by substituting the hydrogen atom thereof with an acid dissociable, dissolution inhibiting group (II) represented by a general formula (II) shown below, and a structural unit (a3) in which a hydroxyl group within the above general formula (I) has been protected by substituting the hydrogen atom thereof with an acyclic acid dissociable, dissolution inhibiting group (III). | 10-02-2008 |
20080241753 | Negative Resist Composition - The negative resist composition of the present invention comprises a silsesguioxane resin (A) comprising a constituent unit (a1) represented by the following general formula (I) and a constituent unit (a2) represented by the following general formula (II), an acid generator component (B) which generates an acid upon exposure, and a crosslinking agent component (C): | 10-02-2008 |
20090047600 | POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD - Disclosed is a positive resist composition which can provide a positive resist composition and a resist pattern forming method, capable of forming a high resolution pattern with reduce LER, the positive resist composition comprising a resin component (A) which has acid dissociable, dissolution inhibiting groups and exhibits increased alkali solubility under the action of an acid, and an acid generator component (B) which generates an acid under exposure, wherein the resin component (A) contains a polymer compound (A1) having a structural unit (a1) derived from hydroxystyrene and a structural unit (a2) derived from an acrylate ester having acid dissociable, dissolution inhibiting groups, a fluorine atom or a fluorinated lower alkyl group being bonded at the α-position. | 02-19-2009 |
20090075177 | POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD - A positive resist composition having excellent size controllability, and a resist pattern forming method are provided. This positive resist composition contains a resin component (A) comprising an alkali soluble constituent unit (a1) which comprises a constituent unit (a11) derived from (α-methyl)hydroxystyrene, and a constituent unit (a2) which has an acid dissociable dissolution inhibiting group including an acid dissociable dissolution inhibiting group (II) represented by the following general formula (II) and/or a specific chain acid dissociable dissolution inhibiting group (III); an acid generator component (B) which generates an acid upon exposure; and preferably contains an aromatic amine (C). | 03-19-2009 |
20100035192 | METHOD OF FORMING RESIST PATTERN - A method of forming a resist pattern including: forming a resist film on a substrate using a chemically amplified negative resist composition; forming a latent image of a first line and space pattern by subjecting the resist film to first exposure through a photomask; forming a latent image of a second line and space pattern so as to intersect with the latent image of the first line and space pattern by subjecting the resist film to second exposure through a photomask; and subjecting the resist film to developing to form a hole pattern in the resist film. | 02-11-2010 |
20100167217 | METHOD OF FORMING RESIST PATTERN - A method of forming a resist pattern that includes: applying a positive chemically amplified resist composition to a support to form a first resist film, exposing a region on a portion of the first resist film, performing a post exposure bake treatment and then performing developing to form a first resist pattern, and applying a negative chemically amplified resist composition to the support having the first resist pattern formed thereon, thereby forming a second resist film, exposing a region of the second resist film that includes the positions in which the first resist pattern has been formed, performing a post exposure bake treatment at a bake temperature that increases the solubility of the first resist film in an alkali developing solution and decreases the solubility of the second resist film in an alkali developing solution, and then performing developing to form a resist pattern. | 07-01-2010 |
20110065878 | Norbornene-Type Polymers, Compositions Thereof And Lithographic Processes Using Such Compositions - Embodiments of the present invention relate generally to non-self imagable and imagable norbornene-type polymers useful for immersion lithographic processes, methods of making such polymers, compositions employing such polymers and the immersion lithographic processes that make use of such compositions. More specifically the embodiments of the present invention are related to norbornene-type polymers useful for forming imaging layer and top-coat layers for overlying such imaging layers in immersion lithographic process and the process thereof. | 03-17-2011 |
20120141940 | CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTORESIST COMPOSITION FOR THICK FILM, AND METHOD FOR PRODUCING THICK FILM RESIST PATTERN - A chemically amplified positive-type photoresist composition for a thick film capable of forming a thick film resist pattern having superior resolving ability and controllability of dimensions, and being favorable in rectangularity, as well as a method for producing a thick film resist pattern using such a composition. The photoresist composition comprises an acid generator including a cationic moiety and an anionic moiety, and a resin whose alkali solubility increases by the action of an acid. | 06-07-2012 |
20130171572 | METHOD FOR PRODUCING THICK FILM PHOTORESIST PATTERN - A method for producing a thick film photoresist pattern including laminating a thick photoresist layer including a chemically amplified positive-type photoresist composition for thick film on a support; irradiating the thick photoresist layer; and developing the thick photoresist layer to obtain a thick film resist pattern; in which the composition includes an acid generator, a resin whose alkali solubility increases by the action of an acid, and an organic solvent having a boiling point of at least 150° C. and a contact angle on a silicon substrate of no greater than 18°, in an amount of at least 40% by mass with respect to total mass of the organic solvent. | 07-04-2013 |
Patent application number | Description | Published |
20100240862 | METAL THIETANE COMPOUND, POLYMERIZABLE COMPOSITION CONTAINING THE COMPOUND, RESIN AND USE OF THE RESIN - Disclosed is a metal thietane compound represented by the following general formula (120), | 09-23-2010 |
20100280208 | THIETANE COMPOUND, POLYMERIZABLE COMPOSITION COMPRISING THE COMPOUND, AND USE OF THE COMPOSITION - Disclosed is a thietane compound represented by the following general formula (1), | 11-04-2010 |
20100286334 | ADDITIVE FOR POLYMERIZABLE COMPOSITION, POLYMERIZABLE COMPOSITION CONTAINING THE SAME AND USE OF THE POLYMERIZABLE COMPOSITION - The additive for a polymerizable composition according to the present invention contains a compound represented by the general formula (a). In the general formula (a), R represents a saturated hydrocarbon group having 1 to 3 carbon atoms. M represents Sn, Sb, Bi, or Ge. m represents 0 or 1. R and M are not directly bonded when m is 0. n represents an integer of 1 to 3. X represents a monovalent linking group, and a plurality of X may be the same as or different from each other. When two or more linking groups X are bonded with the metal atom M, the linking groups X may combine together to form a ring. | 11-11-2010 |
20110124836 | COMPOSITION, POLYMERIZABLE COMPOSITION, RESIN, OPTICAL COMPONENT, AND METHOD FOR PRODUCING THE COMPOSITION - The composition of the present invention contains a product having a thiol group obtained by reacting an Sb or Bi oxide or an Sb or Bi halide with at least one kind of polythiol compounds selected from compounds having at least two thiol groups in a molecule. | 05-26-2011 |
20110130516 | COMPOUND, POLYMERIZABLE COMPOSITION, RESIN, AND USE OF THE COMPOSITION AND THE RESIN - Disclosed is a compound represented by the following general formula (1), | 06-02-2011 |
20110136977 | METAL COMPOUND, POLYMERIZABLE COMPOSITION CONTAINING THE SAME, RESIN, METHOD FOR PRODUCING THE RESIN, AND USE OF THE RESIN - Disclosed is a metal compound represented by the following formula (0):
| 06-09-2011 |
Patent application number | Description | Published |
20090211517 | CRUCIBLE HOLDING MEMBER AND METHOD FOR PRODUCING THE SAME - A crucible holding member includes a mesh body which includes a plurality of strands woven each including a plurality of carbon fibers. The mesh body has a triaxial weave structure including a plurality of first strands, a plurality of second strands and a plurality of third strands. The plurality of first strands are provided in a first direction inclined at a first angle with respect to a central axis of the mesh body. The plurality of second strands are provided so that the plurality of first strands and the plurality of second strands are substantially symmetrical with respect to the central axis. The plurality of third strands are provided substantially along the central axis. A matrix is filled in interstices between the carbon fibers. | 08-27-2009 |
20090211518 | CRUCIBLE HOLDING MEMBER AND METHOD FOR PRODUCING THE SAME - A crucible holding member includes a hollow mesh body. The hollow mesh body has an upper end opening and a lower end opening, and includes a plurality of strands woven to be arranged diagonally to a central axis of the hollow mesh body. Each of the strands includes a plurality of carbon fibers. A matrix is filled in the interstices between the carbon fibers. | 08-27-2009 |
20120034400 | CARBON FIBER-REINFORCED CARBON COMPOSITE MATERIAL AND METHOD FOR MANUFACTURING THE SAME - A carbon fiber-reinforced carbon composite material and a method for manufacturing the same are provided. The carbon fiber-reinforced carbon composite material includes carbon fibers, and a carbonaceous matrix. The carbon fiber-reinforced carbon composite material is integrally formed. The carbon fibers are a substantially linear fiber existing in a bare-fiber state within the carbonaceous matrix and having an average fiber length of less than about 1.0 mm. The carbon fiber-reinforced carbon composite material has a bulk density of about 1.2 g/cm | 02-09-2012 |
20120034401 | C/C COMPOSITE MATERIAL MOLDED BODY AND METHOD FOR MANUFACTURING THE SAME - A C/C composite material molded body and a method for manufacturing the same are provided. The C/C composite material molded body includes carbon fibers, and a carbonaceous matrix. The C/C composite material molded body has a shell-like structure, an outer surface of which is configured by a three-dimensional curved surface or a combination of a plurality of surfaces, and which is configured by a continuous structure having a uniform composition as a whole. A longitudinal direction of the carbon fibers is oriented along the outer surface. | 02-09-2012 |
20120034415 | CARBON FIBER STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A carbon fiber structure and a manufacturing method of the same are provided. The carbon fiber structure includes a carbon fiber-reinforced carbon composite material having carbon fibers and a carbonaceous matrix. The carbon fibers are configured by a substantially linear fiber. The carbon fibers form thin piece bodies in which a longitudinal direction of the carbon fibers is oriented in parallel to a surface direction of the carbon fiber structure within the carbonaceous matrix. The carbon fiber structure is configured by a laminate having the thin piece bodies laminated therein. | 02-09-2012 |