Hiep
Hiep Huatan, Maidstone GB
Patent application number | Description | Published |
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20140287052 | TREATMENT OF ADRENAL INSUFFICIENCY - The disclosure relates to the treatment of adrenal insufficiency with particular but not limiting application to paediatric treatment regimens, the treatment of the elderly and non-human animals. | 09-25-2014 |
20140370113 | HYDROCORTISONE CONTROLLED RELEASE FORMULATION - The disclosure relates to a pharmaceutical formulation comprising hydrocortisone and its use in the treatment of conditions that would benefit from a delayed release of hydrocortisone, in particular conditions such as adrenal insufficiency, inflammatory conditions and depression. | 12-18-2014 |
20150133417 | LIPID COMPOSITION - We describe lipid based pharmaceutical compositions adapted for oral delivery and optionally delivery in accordance with a circadian rhythm. | 05-14-2015 |
Hiep Huatan, Maidstone Kent GB
Patent application number | Description | Published |
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20110159095 | TREATMENT OF ADRENAL INSUFFICIENCY - The disclosure relates to a pharmaceutical formulation, for example a tablet, adapted for delayed and sustained release of hydrocortisone and a treatment regime that uses said tablet in the treatment of adrenal insufficiency. | 06-30-2011 |
20160081942 | COMPOSITION COMPRISING HYDROCORTISONE - The disclosure relates to pharmaceutical compositions useful in the treatment of adrenal insufficiency in paediatric or elderly subjects. | 03-24-2016 |
Hiep Huatan, Kent GB
Patent application number | Description | Published |
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20100136109 | SUSTAINED RELEASE - We describe a medicament for the treatment of thyroid disorders that typically result from a hypoactive thyroid gland that releases thyroxine and triiodothyronine in a sustained pattern when administered to a subject. | 06-03-2010 |
20110039814 | LIPID COMPOSITION - We describe lipid based pharmaceutical compositions adapted for oral delivery and optionally delivery in accordance with a circadian rhythm. | 02-17-2011 |
Hiep Nghi, San Jose, CA US
Patent application number | Description | Published |
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20160073512 | Process for placing, securing and interconnecting electronic components - A method for fabricating an electronic assembly which enables the assembly and interconnection of surface mount components and/or other electrical, electronic, electro-optical, electro-mechanical and user interface devices with external I/O contacts on a planar surface without the use of solder or otherwise exposing the components to temperatures substantially above ambient. | 03-10-2016 |
Hiep Nguyen, Fort Hill, SC US
Patent application number | Description | Published |
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20120213484 | Two-Piece Spring Push For Fiber Optic Connectors with Large Diameter Fiber Optic Cables - A two-piece spring push includes a main body portion and a cap. The cap is attached to the main body portion through frictional or interference fits of projections and openings in the two-piece spring push. The two-piece spring push allows for the use of the spring push on larger diameter optical cables as the spring push is assembled on the optical fibers after the optical fibers are terminated in an optical ferrule. | 08-23-2012 |
20130243385 | Ribbon Fiber Holder for Large Diameter Cables and Loose Fibers and Associated Methods - A cable holding tool for holding optical fiber ribbons relative one another for preparation has a cable holding portion and an optical fiber holding portion, each having a cover and an opening therein to receive an optical cable and a fiber optic ribbon respectively. The cable holding tool also has at least one channel disposed between the cable holding portion and the optical fiber holding portion to receive and divert at least one optical fiber ribbon from the optical cable disposed in the cable holding portion from the optical fiber holding portion. A spacer is also provided that is movable parallel to the optical fiber groove from a first position to at least one second position to assist in staggering the fiber ribbons. | 09-19-2013 |
20160091671 | Spring Push with Integral Trigger - A spring push with a main body, a crimp portion and two extensions also provides a trigger extending from the main body. The extensions provide engagement with the connector housing and also surfaces to engage the spring. The spring push may be a single component or be comprised of two separate pieces. An adapter is also disclosed with a cut-out portion on a bottom side. | 03-31-2016 |
20160103284 | Enhanced EMI Protection for a Connector System - To increase the protection of a fiber optic connector system from EMI, apertures in the system must be as small as possible. To reduce the size of apertures in the system, the openings are minimized by using electrically conductive fiber optic connector parts, including a connector housing, a fiber optic ferrule disposed within the electrically conductive connector housing, and an electrically conductive heat-shrink attachment securable to the connector housing. An electrically conductive heat shrink may be attached to the heat-shrink attachment to provide more protection. | 04-14-2016 |
Hiep Nguyen, Fort Mill, SC US
Patent application number | Description | Published |
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20110206324 | Multi-Port Shielded Adapter - An inner sleeve has a main body with an opening therein and a front and back end. The back end has projections or extensions to engage corresponding cavities on another inner sleeve to allow for movement of the inner sleeves relative to a outer portion into which the inner sleeves have been inserted. The outer portion may accommodate any number of inner sleeve pairs. | 08-25-2011 |
Hiep Nguyen, Grand Prairie, TX US
Patent application number | Description | Published |
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20160093552 | INTEGRATION OF BACKSIDE HEAT SPREADER FOR THERMAL MANAGEMENT - A microelectronic device includes semiconductor device with a component at a front surface of the semiconductor device and a backside heat spreader layer on a back surface of the semiconductor device. The backside heat spreader layer is 100 nanometers to 3 microns thick, has an in-plane thermal conductivity of at least 150 watts/meter-° K, and an electrical resistivity less than 100 micro-ohm-centimeters. | 03-31-2016 |