Patent application number | Description | Published |
20080277148 | MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD - A metal layer | 11-13-2008 |
20100122840 | MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD - A multi-layer printed circuit board including a core structure including resin layers and conductor circuits sandwiched by the resin layers, the core structure having a first surface and a second surface on an opposite side of the first surface, a first conductor layer including conductor circuits formed on the first surface of the core structure, and a second conductor layer including conductor circuits formed on the second surface of the core structure. The core structure includes a first via hole and a second via hole, the first via hole and the second via hole sandwich one or more conductor circuits in the core substrate and are positioned vertically to form a through hole electrically connecting respective ones of the conductor circuits of the first and the second conductor layers, and the first via hole and the second via hole are deviated from each other in a vertical direction. | 05-20-2010 |
20110024164 | MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD - A multi-layer printed circuit board including a core structure comprising resin layers and conductor circuits sandwiched by the resin layers, the core structure having a first surface and a second surface on an opposite side of the first surface, a first conductor layer including conductor circuits formed on the first surface of the core structure, and a second conductor layer including conductor circuits formed on the second surface of the core structure. The core structure includes a first via hole and a second via hole, and the first via hole and the second via hole include a metal filling up to the respective top of openings formed in the resin layers, respectively, sandwich one or more conductor circuits in the core structure and are positioned vertically to form a through hole electrically connecting respective ones of the conductor circuits of the first and the second conductor layers. | 02-03-2011 |
20110036626 | MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD - A multi-layer printed circuit board including a first insulating layer, a first conductor layer having conductor circuits on one surface of the first insulating layer, a second conductor layer having conductor circuits on the opposite surface of the first insulating layer, a second insulating layer on the second conductor and first insulating layers, and a third conductor layer having conductor circuits on the second insulating layer on the opposite side of the second conductor layer. The first and second insulating layers have first and second via holes which are formed in openings of the first and second insulating layers and made of conductive materials filled to the top of the openings such that conductor circuits in the first and third conductor layers are connected to one or more conductor circuits in the second conductor layer, and the first and second via holes are tapering toward the second conductor layer. | 02-17-2011 |
20110192637 | MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD - A multi-layer printed circuit board includes a core structure including resin layers and conductor circuits sandwiched by the resin layers, the core structure having first and second surfaces, a first conductor layer including conductor circuits on the first surface of the core structure, and a second conductor layer including conductor circuits on the second surface of the core structure. The core structure includes first and via holes, and the first and second via holes include a metal filling up to the respective top of openings in the resin layers, respectively, sandwich one or more conductor circuits in the core structure and are positioned vertically to form a through hole electrically connecting respective ones of the conductor circuits of the first and second conductor layers, and the first and second via holes are deviated from each other in a vertical direction. | 08-11-2011 |
20110252641 | MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD - A method of manufacturing a multi-layer printed circuit board includes the following steps (A) and (B). (A) Providing penetrating openings which are formed into through holes and each of which has a small diameter for a core substrate, and (B) providing penetrating openings which are formed into through holes each having a large diameter for the core substrate. | 10-20-2011 |
20110253306 | MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD - A method of manufacturing a printed circuit board includes the following steps (A) to (D). (A) Laminating a resin insulating layer on each of two sides of a core member to form a core substrate, (B) forming penetrating openings in the core substrate by applying laser beams, (C) forming a rough surface on the core substrate, and (D) providing a metal film for each penetrating opening to form through holes. | 10-20-2011 |
20120186867 | MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD - A multi-layer printed circuit board including a first insulating layer, a first conductor layer having circuits on one surface of the first insulating layer, a second conductor layer having circuits on the opposite surface of the first insulating layer, a second insulating layer on the second conductor and first insulating layers, and a third conductor layer having circuits on the second insulating layer on the opposite side of the second conductor layer. The first and second insulating layers have first and second via holes formed in openings of the first and second insulating layers and made of conductive materials filling the openings such that circuits in the first and third conductor layers are connected to one or more circuits in the second conductor layer, and the first and second via holes have bottom ends facing the second conductor layer and top ends larger than the bottom ends. | 07-26-2012 |
Patent application number | Description | Published |
20090289312 | Semiconductor device and method of manufacturing the same - Provided is a semiconductor device including a first region, a source region, a second region, a drain region, a gate insulating layer, a field insulating layer and a gate electrode. The first region is formed in a surface area of a semiconductor substrate. The source region is formed in a surface area of the first region. The second region is formed in a surface area of the semiconductor substrate. The drain region is formed in a surface region of the second region. The gate insulating layer is formed on a front surface of the semiconductor substrate between the source region and the second region. The field insulating layer is formed in a surface area of the semiconductor substrate between the drain region and the gate insulating layer. The gate electrode covers part of the gate insulating layer and part of the field insulating layer. The field insulating layer has, in its portion overlapping the gate electrode, such a step that a portion of the field insulating layer between the step and the gate insulating layer is thinner than the rest of the field insulating layer. | 11-26-2009 |
20120013562 | ELECTRONIC DEVICE, INFORMATION PROCESSING METHOD AND INFORMATION DISPLAY METHOD - An electronic device includes a first display unit which displays information about an active application, which is an application being executed; a touch sensor which is overlapped on the first display unit and which detects a touch thereto; and a control unit which, in a state where information about the active application is being displayed on the first display unit, performs processing on the active application when a touch to the touch sensor is determined as a first touch, and executes, as the active application, another application different from the application being executed when the touch to the touch sensor is determined as a second touch which has a wider region than the first touch. | 01-19-2012 |
20130170514 | LASER MACHINE AND CONTROLLING METHOD OF LASER MACHINE - A laser machine includes a laser oscillator, a cooler for cooling the laser oscillator, and a control unit for controlling the laser oscillator and the cooler. The control unit includes a controller that stops base discharge of the laser oscillator at a time when a specified time has elapsed from a stop of laser light emission by the laser oscillator. According to the laser machine, since base discharge of the laser oscillator is stopped after the specified time has elapsed from the stop of laser light emission, wasteful energy (power) consumption of the laser oscillator in a standby state can be restricted. | 07-04-2013 |
20150325693 | SEMICONDUCTOR DEVICE - A field oxide film lies extending from the underpart of a gate electrode to a drain region. A plurality of projection parts projects from the side face of the gate electrode from a source region side toward a drain region side. The projection parts are arranged side by side along a second direction (direction orthogonal to a first direction along which the source region and the drain region are laid) in plan view. A plurality of openings is formed in the field oxide film. Each of the openings is located between projection parts adjacent to each other when seen from the first direction. The edge of the opening on the drain region side is located closer to the source region than the drain region. The edge of the opening on the source region side is located closer to the drain region than the side face of the gate electrode. | 11-12-2015 |
Patent application number | Description | Published |
20090146714 | DRIVER CIRCUIT - A driver circuit facilitates reducing noises and losses and improving the driving performances thereof without connecting a series circuit of capacitor and a resistor to the gate of IGBT. The driver circuit includes a slope setting circuit that sets the gate voltage waveform of IGBT; and an operational amplifier that includes a non-inverting input terminal, to which an output voltage V* from slope setting circuit is inputted, and an inverting input terminal, to which a divided voltage Vgsf divided by resistors is inputted; and the operational amplifier outputs an output voltage Vout, proportional to the difference between the output voltage V* and the divided voltage Vgsf, to the gate of IGBT. | 06-11-2009 |
20120013370 | GATE DRIVING CIRCUIT FOR POWER SEMICONDUCTOR ELEMENT - A gate driving circuit for driving a power semiconductor element can include a MSINK that is an n-channel metal-oxide silicon field-effect transistor (MOSFET) with a low resistance value for rapidly drawing out the charges accumulated on the gate of an insulated gate bipolar transistor (IGBT), and a MSOFT that is an n-channel MOSFET with a high resistance value for slowly drawing out the charges. By shifting the time for turning ON of these MOSFETs, soft interruption can be performed rapidly and surely when overcurrent or short circuit current flows in the IGBT. Therefore, device breakdown is minimized or avoided and noise generation is suppressed. | 01-19-2012 |
20130285732 | POWER TRANSISTOR DRIVE CIRCUIT - Aspects of the invention include a constant current source that generates a constant current, apart from a constant current circuit, and a temperature detection zener diode (a temperature detection element). The input side of the constant current source can be connected to a power source. The output side of the constant current source can be connected to the anode of the temperature detection diode. The anode of the temperature detection zener diode can also be connected to one end of a resistor provided in the constant current circuit. Further, the cathode of the temperature detection zener diode can be connected to a GND. Further, the temperature detection zener diode can be incorporated in the same semiconductor substrate as a semiconductor substrate into which an IGBT is built. | 10-31-2013 |
20140320297 | ALARM SIGNAL GENERATOR CIRCUIT AND ALARM SIGNAL GENERATION METHOD - With regard to an instrument wherein a plurality of phase operations are carried out, the type of failure or the phase in which the failure has occurred is determined and, in accordance with the result of the determination, an alarm signal is generated. Provided that the failure details and the phase in which the failure has occurred can be determined from the generated alarm signal, it is possible, using a configuration wherein an alarm signal having a pulse number corresponding to the phase in which a failure has occurred is generated, or a configuration wherein an alarm signal having a pulse width corresponding to the phase in which a failure has occurred is generated, to determine the type of failure that has occurred and the phase in which the failure has occurred from the pulse number and pulse width. | 10-30-2014 |
20150180453 | INSULATED GATE SEMICONDUCTOR ELEMENT DRIVE DEVICE - A drive circuit includes a constant current circuit which supplies a constant current to the gate of an IGBT and on-operates the IGBT; a discharge circuit which grounds the gate of the IGBT and off-operates the IGBT; and a switch circuit which operates one of the constant current circuit or discharge circuit in accordance with a control signal and turns on or off the IGBT. In particular, the drive circuit includes a current detection circuit which detects a current flowing through the IGBT when the IGBT is turned on; and a current regulation circuit which feeds the current detected by the current detection circuit back to the constant current circuit and controls an output current of the constant current circuit in accordance with the turn-on characteristics of the IGBT. | 06-25-2015 |
Patent application number | Description | Published |
20110198641 | Semiconductor light-emitting element - A semiconductor light-emitting element includes a semiconductor laminated structure including a light-emitting layer sandwiched between first and second conductivity type layers for extracting an emitted light from the light-emitting layer on a side of the second conductivity type layer, a transparent electrode in ohmic contact with the second conductivity type layer, an insulation layer formed on the transparent electrode, an upper electrode for wire bonding formed on the insulation layer, a lower electrode that penetrates the insulation layer, is in ohmic contact with the transparent electrode and the electrode for wire bonding, and has an area smaller than that of the upper electrode in top view, and a reflective portion for reflecting at least a portion of light transmitted through a region of the transparent electrode not in contact with the lower electrode. | 08-18-2011 |
20140077219 | GROUP-III NITRIDE COMPOUND SEMICONDUCTOR LIGHT EMITTING ELEMENT, MANUFACTURING METHOD THEREFOR AND SEMICONDUCTOR LIGHT EMITTING DEVICE - A group-III nitride compound semiconductor light emitting element includes a substrate that has a main face on which an concave and convex portion is formed, a group-III nitride compound semiconductor layer that is formed on the main face of the substrate, and a clearance that is formed between the substrate and the group-III nitride compound semiconductor layer at a first region of the semiconductor light emitting element. In the first region, a portion of the group-III nitride compound semiconductor layer and a portion of the clearance are disposed in a concave of the concave and convex portion on a section through two adjacent top portions of the concave and convex portion and a bottom portion located between the adjacent top portions. | 03-20-2014 |
20150069419 | Semiconductor Light Emitting Element - A semiconductor light emitting element include a semiconductor layer in which a first semiconductor layer, a second semiconductor layer, and a light emitting layer that is disposed between the first semiconductor layer and the second semiconductor layer are disposed. The first semiconductor layer has a step portion protruding more outwards than the light emitting layer and the second semiconductor layer. A plurality of first recesses is formed on side surfaces of the semiconductor layer not including the light emitting layer along a deposition direction of the semiconductor layer and along a direction intersecting with the deposition direction of the semiconductor layer and a plurality of second recesses is found on side surfaces of the semiconductor layer including the light emitting layer along the deposition direction of the semiconductor layer and along the direction intersecting with the deposition direction of the semiconductor layer. | 03-12-2015 |
Patent application number | Description | Published |
20120001703 | ELECTRONIC COMPONENT - An electronic component includes a laminated body including an insulating material layer made of a first dielectric material and a second insulating material layer made of a second dielectric material having a relative dielectric constant greater than that of the first dielectric material that are laminated to one another. An LC filter is defined by a coil included in the laminated body and a capacitor. The coil includes a coil conductor layer provided on the insulating material layer. The coil conductor layer is provided within a region including the insulating material layer. | 01-05-2012 |
20120032758 | ELECTRONIC COMPONENT - In an electronic component, a first LC resonant circuit includes a first coil including coil portions that extend from a first external electrode to a second external electrode while turning in a first direction. A second LC resonant circuit includes a second coil including coil portions that extend from a third external electrode to a fourth external electrode while turning in the first direction. A third LC resonant circuit includes a third coil and a capacitor. The third coil includes coil portions that extend from the capacitor of the third LC resonant circuit to the second external electrode while turning in a second direction opposite to the first direction around the coil portions of the first coil and the second coil. | 02-09-2012 |
20120169434 | FILTER - A filter includes a multilayer body including a plurality of insulator layers stacked on top of one another. Outer electrodes are provided on surfaces of the multilayer body. A first resonator is connected to a first one of the outer electrodes and includes a first coil. A second resonator is connected to a second one of the outer electrodes and includes a second coil. A third resonator includes a third coil that is magnetically coupled with the first and second coils. The first and second coils are respectively defined by coil conductor layers provided on an insulator layer. The third coil is defined by via hole conductors that penetrate through the insulator layer in a z-axis direction. | 07-05-2012 |
20130106529 | ELECTRONIC COMPONENT | 05-02-2013 |
20130112466 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - An electronic component in which a direction identification mark can be easily formed includes a laminate including a plurality of laminated insulating material layers and a mounting surface parallel or substantially parallel to a z-axis direction. A directional coupler including a main line and a sub-line is included in the laminate. A direction identification mark is provided on an upper surface of the laminate which is parallel or substantially parallel to the mounting surface, and is defined by a via-hole conductor portion, which is obtained by filling a via hole provided in the insulating material layers with a conductor, being exposed from the upper surface. | 05-09-2013 |
20130120076 | DIRECTIONAL COUPLER - In a directional coupler, a laminated body includes a plurality of insulator layers that are laminated to one another. A main line and a sub-line are embedded in the laminated body, include spiral-shaped portions including central axes parallel or substantially parallel to a z-axis direction, and are electromagnetically coupled to each other. The main line and the sub-line have the same or substantially the same shape and are provided within regions coinciding or substantially coinciding with each other in a y-axis direction. | 05-16-2013 |
20140347146 | FILTER - A filter includes a multilayer body including a plurality of insulator layers stacked on top of one another. Outer electrodes are provided on surfaces of the multilayer body. A first resonator is connected to a first one of the outer electrodes and includes a first coil. A second resonator is connected to a second one of the outer electrodes and includes a second coil. A third resonator includes a third coil that is magnetically coupled with the first and second coils. The first and second coils are respectively defined by coil conductor layers provided on an insulator layer. The third coil is defined by via hole conductors that penetrate through the insulator layer in a z-axis direction. | 11-27-2014 |
Patent application number | Description | Published |
20120162082 | PORTABLE ELECTRONIC APPARATUS - According to an aspect, a portable electronic apparatus includes a first housing, a second housing, touch panel, a display, a connection mechanism, an operation unit, and a control unit. The touch panel is arranged in a first surface of the first housing. The display is arranged in a second surface of the second housing. The connection mechanism connects the first housing and the second housing so as to switch between a closed state where the first housing covers the display and the touch panel is exposed to the outside and an opened state where the touch panel and the display are exposed to the outside while being adjacent to each other. The operation unit is arranged on the second surface at a position adjacent to the display. The control unit controls an operation of each unit. | 06-28-2012 |
20120240589 | POWER PLANT AND POWER PLANT OPERATING METHOD - According to one embodiment, there is provided a power plant operating method. The method includes calculating by a turbine output calculating unit a turbine output based on an exponential value of a steam pressure measured at an arbitrary point downstream from the repeater, calculating by a power generator output calculating unit a power generator output generated by the power generator, detecting by an output deviation detecting unit a deviation between the turbine output and the power generator output, detecting by a power load unbalance detecting unit power load unbalance when the deviation exceeds a preset value, and outputting by a control unit a rapid close command to regulator valves of the steam turbine when the power load unbalance is detected. | 09-27-2012 |
20140000260 | PROTECTION DEVICE FOR TURBINE EXHAUST CHAMBER AND CONDENSER AND MONITORING CONTROLLER FOR TURBINE EXHAUST CHAMBER AND CONDENSER | 01-02-2014 |
Patent application number | Description | Published |
20130141498 | INK JET INK, INK CARTRIDGE, INK JET RECORDING METHOD AND POLYMER PARTICLE - An ink jet ink containing a coloring material and a polymer particle, wherein the polymer particle has a core portion and a shell portion, the shell portion contains a copolymer A having a unit derived from a compound (a1) represented by a general formula (1) of R | 06-06-2013 |
20130141503 | IMAGE RECORDING METHOD, AND SET OF INK JET INK AND LIQUID COMPOSITION - An image recording method including applying an ink containing a coloring material and a polymer particle to a recording medium from a recording head of an ink jet system and applying a liquid composition which destabilizes a dispersed state of the polymer particle in the ink to at least a part of a region of the recording medium where the ink is applied, wherein the polymer particle in the ink has core and shell portions, the shell portion contains a copolymer A having a unit (50-90% mass) derived from a compound (a1) represented by a general formula (1) or (2) and a unit (10-50% mass) derived from an α,β-unsaturated hydrophobic compound (a2), and the core portion contains a polymer of an α,β-unsaturated hydrophobic compound (b). | 06-06-2013 |
20140024763 | PROCESS FOR PRODUCING PIGMENT-ENCAPSULATING RESIN DISPERSION AND INK JET INK - The invention provides a process for producing a pigment-encapsulating polymer dispersion, comprising the steps of dispersing a liquid containing a monomer, a hydrophobe and a polymerization initiator into a water medium with a dispersant to obtain a monomer emulsion, and mixing the monomer emulsion with a pigment dispersion containing a self-dispersible pigment to which a hydrophilic group is bonded directly or through another atomic group and which is dispersed by the hydrophilic group, subjecting the resultant mixture to a shearing treatment and then polymerizing the monomer. | 01-23-2014 |
20150275008 | INK FOR INK-JET RECORDING, INK CARTRIDGE, AND INK-JET RECORDING PROCESS - The present invention provides an ink for ink-jet recording having high storage stability and high discharge stability and providing high abrasion resistance to the resulting image. The ink for ink-jet recording includes polymer particles. The polymer particles each include a first layer, a second layer, and a third layer from the inside to the outside in this order. The first layer is formed of an uncrosslinked first polymer, the second layer is formed of a crosslinked second polymer having ionizable groups, and the third layer is formed of units each having a hydrophilic part and a hydrophobic part. | 10-01-2015 |