Patent application number | Description | Published |
20140154465 | SUBSTRATE SUPPORT ASSEMBLY HAVING A PLASMA RESISTANT PROTECTIVE LAYER - A substrate support assembly comprises a ceramic body and a thermally conductive base bonded to a lower surface of the ceramic body. The substrate support assembly further comprises a protective layer covering an upper surface of the ceramic body, wherein the protective layer comprises at least one of yttrium aluminum garnet (YAG) or a ceramic compound comprising Y | 06-05-2014 |
20140377504 | PLASMA EROSION RESISTANT RARE-EARTH OXIDE BASED THIN FILM COATINGS - An article comprises a body and at least one protective layer on at least one surface of the body. The at least one protective layer is a thin film having a thickness of less than approximately 20 microns that comprises a ceramic selected from a group consisting of Y | 12-25-2014 |
20150021324 | ION ASSISTED DEPOSITION FOR RARE-EARTH OXIDE BASED COATINGS ON LIDS AND NOZZLES - A method of manufacturing an article comprises providing a lid or nozzle for an etch reactor. Ion assisted deposition (IAD) is then performed to deposit a protective layer on at least one surface of the lid or nozzle, wherein the protective layer is a plasma resistant rare earth oxide film having a thickness of less than 300 μm and an average surface roughness of 10 micro-inches or less. | 01-22-2015 |
20150024155 | ION ASSISTED DEPOSITION FOR RARE-EARTH OXIDE BASED THIN FILM COATINGS ON PROCESS RINGS - A method of manufacturing an article comprises providing a ring for an etch reactor. Ion assisted deposition (IAD) is then performed to deposit a protective layer on at least one surface of the ring, wherein the protective layer is a plasma resistant rare earth oxide film having a thickness of less than 300 μm and an average surface roughness of less than 6 micro-inches. | 01-22-2015 |
20150107618 | OXYGEN CONTAINING PLASMA CLEANING TO REMOVE CONTAMINATION FROM ELECTRONIC DEVICE COMPONENTS - A gas comprising oxygen is supplied to a plasma source. A plasma jet comprising oxygen plasma particles is generated from the gas. A contaminant is removed from the component using the oxygen plasma particles. | 04-23-2015 |
20150129574 | SMART DEVICE FABRICATION VIA PRECISION PATTERNING - Embodiments involve smart device fabrication for semiconductor processing tools via precision patterning. In one embodiment, a method of manufacturing a semiconductor processing tool component includes providing a substrate of the semiconductor processing tool component, patterning the substrate to form a sensor directly on the substrate, and depositing a top layer over the sensor. The sensor may include, for example, a temperature or strain sensor. The method can also include patterning the substrate to form one or more of: heaters, thermistors, and electrodes on the substrate. In one embodiment, the method involves patterning a surface of the component oriented towards a plasma region inside of the semiconductor processing tool. | 05-14-2015 |
20150132602 | HIGH PURITY METALLIC TOP COAT FOR SEMICONDUCTOR MANUFACTURING COMPONENTS - A method for coating a component for use in a semiconductor chamber for plasma etching includes providing a component for use in a semiconductor manufacturing chamber, loading the component into a deposition chamber, cold spray coating a metal powder onto the component to form a coating on the component, and anodizing the coating to form an anodization layer. | 05-14-2015 |
20150158775 | ION BEAM SPUTTERING WITH ION ASSISTED DEPOSITION FOR COATINGS ON CHAMBER COMPONENTS - A method of manufacturing an article includes providing a component for an etch reactor. Ion beam sputtering with ion assisted deposition (IBS-IAD) is then performed to deposit a protective layer on at least one surface of the component, wherein the protective layer is a plasma resistant film having a thickness of less than 1000 μm. | 06-11-2015 |
20150307982 | PLASMA EROSION RESISTANT THIN FILM COATING FOR HIGH TEMPERATURE APPLICATION - An article such as a susceptor includes a body of a thermally conductive material coated by a first protective layer and a second protective layer over a surface of the body. The first protective layer is a thermally conductive ceramic. The second protective layer covers the first protective layer and is a plasma resistant ceramic thin film that is resistant to cracking at temperatures of 650 degrees Celsius. | 10-29-2015 |
20150311043 | CHAMBER COMPONENT WITH FLUORINATED THIN FILM COATING - A chamber component comprises a body and a fluorinated thin film protective layer over at least one surface of the body. The fluorinated thin film protective layer does not react with process gasses having Fluorine based chemistry. The fluorinated thin film protective layer may be a YF | 10-29-2015 |
20150311044 | ION ASSISTED DEPOSITION TOP COAT OF RARE-EARTH OXIDE - A method of manufacturing an article comprises providing an article such as a chamber component for an etch reactor. A plasma spray deposition process is performed for deposit a first protective layer over at least one surface of the chamber component. The first protective layer is a plasma resistant ceramic having a thickness of greater than approximately 50 microns and a plurality of cracks and pores. An ion assisted deposition (IAD) process is then performed to deposit a second protective layer over the first protective layer. The second protective layer is a plasma resistant rare earth oxide having a thickness of less than 50 microns and a porosity of less than 1%. The second protective layer seals the plurality of cracks and pores of the first protective layer. | 10-29-2015 |
20150321964 | SLURRY PLASMA SPRAY OF PLASMA RESISTANT CERAMIC COATING - Disclosed herein are methods for producing an ultra-dense and ultra-smooth ceramic coating. A method includes feeding a slurry of ceramic particles into a plasma sprayer. The plasma sprayer generates a stream of particles directed toward the substrate, forming a ceramic coating on the substrate upon contact. | 11-12-2015 |
20150375358 | CHAMBER COMPONENTS WITH POLISHED INTERNAL APERTURES - Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles. | 12-31-2015 |
Patent application number | Description | Published |
20100182135 | PORTABLE ELECTRONIC DEVICE INCLUDING TACTILE TOUCH-SENSITIVE DISPLAY - An electronic device including a base, a touch-sensitive display comprising a display device and a touch-sensitive overlay connected to a controller and disposed on the display device for detecting a touch event thereon, the touch-sensitive display connected to and moveable relative to the base, an actuating arrangement including a pad disposed between the touch-sensitive display and the base, the pad having an expandable region for expanding as a result of compression of the pad due to movement of the touch-sensitive display toward the base, a switch in communication with the expandable region for actuating as a result of expansion of the expandable region, and operational components comprising a processor connected to the controller for operation of the electronic device. | 07-22-2010 |
20100214225 | METHOD FOR AND APPARATUS FOR DISPLAY SCROLLING - An electronic device comprising a display for displaying an image that exceeds the dimensions of the display, a multi-directional input device for navigating the image on the display, at least one button input device on each of opposite sides of the multi-directional input, a touch sensor adjacent and underlying the multi-directional input device and the button input devices for sensing touch adjacent the multi-directional input device and the button input devices and in response generating an output signal, and a processor for receiving the output signal and scrolling the image responsive to the touch sensor sensing touch that commences adjacent the multi-directional input device and moves toward the button input device. | 08-26-2010 |
20100215187 | PUBLIC ADDRESS SYSTEM USING WIRELESS MOBILE COMMUNICATION DEVICES - A public address system is set forth, comprising at least one wireless mobile communication device; a sound system; and a back-end system for selectively receiving a wireless signal from the wireless mobile communication device and transmitting the signal to the sound system for broadcast. | 08-26-2010 |
20100225585 | METHOD FOR NAVIGATING AND SELECTING ITEMS WITH A RETURN-TO-CENTER NAVIGATION COMPONENT - A user interface for a portable electronic device and associated method, wherein the device includes a display for displaying a plurality of selectable items circumscribing a center portion and a multi-directional user input device, such as a joystick, having a return-to-center mechanism for biasing the device toward a center position. The method comprises displaying the plurality of selectable items, shifting display focus to any one of the selectable items responsive to lateral movement of the user input device away from the center position toward the selectable item, and moving the selectable item to the center portion while maintaining focus responsive to the user input device returning to its center position. | 09-09-2010 |
20130203347 | MOBILE COMMUNICATIONS DEVICE PROVIDING NEAR FIELD COMMUNICATION (NFC) LOW POWER OPERATING FEATURES AND RELATED METHODS - A mobile communications device may include a near field communication (NFC) transceiver capable of operating in a first mode and a second mode, where the NFC transceiver has a load threshold level associated therewith. The mobile communications device may further include a controller coupled with the NFC transceiver. The controller may be capable of switching the NFC transceiver to the first mode when a load detected by the NFC transceiver is below the load threshold level, and switching the NFC transceiver to the second mode when the load detected by the NFC transceiver reaches the load threshold level. | 08-08-2013 |
20140023204 | PUBLIC ADDRESS SYSTEM USING WIRELESS MOBILE COMMUNICATION DEVICES - A public address system is set forth, comprising at least one wireless mobile communication device; a sound system; and a back-end system for selectively receiving a wireless signal from the wireless mobile communication device and transmitting the signal to the sound system for broadcast. | 01-23-2014 |
Patent application number | Description | Published |
20120197570 | Measurement of Parameters Within an Integrated Circuit Chip Using a Nano-Probe - At least a method and a system are described for monitoring and measuring one or more parameters in an integrated circuit chip by way of receiving a first voltage, a second voltage, and a control signal. In a representative embodiment, the first voltage is used for powering a probe and the second voltage is used as a voltage reference for voltage measurement within the integrated circuit chip. In one or more representative embodiments, the one or more parameters measured comprise minimum and maximum voltage levels of a signal, sampled voltage levels of a signal, a period of a signal, a duty cycle of a clock signal, a jitter of a clock signal, and/or a temperature at a location within the integrated circuit chip. | 08-02-2012 |
20130278796 | METHODS AND SYSTEMS FOR EMBEDDING CAMERA INFORMATION IN IMAGES - The present invention is related to providing, in association with an image, information related to the image capture device used to capture the image. In one embodiment, information related to a first static camera characteristic and camera setting information related to a first captured digitized image is embedded in the first captured digitized image using a watermark. The watermarked information may be used to identify the source or owner of the picture, and/or to aid in the more accurate reproduction of the image. | 10-24-2013 |
Patent application number | Description | Published |
20130223482 | SYSTEM AND METHOD FOR INCREASING MAXIMUM PAYLOAD SIZE - A method and apparatus for increasing, at a transmitter, a payload size of a communication channel having orthogonal groups, the method referencing a base orthogonal sequence set comprising orthogonal sequences that are mutually orthogonal, the orthogonal sequence set having subsets that are sub-block orthogonal with a length of four; and selecting a spreading sequence set from a plurality of spreading sequence sets, each of the plurality of spreading sequence sets comprising an orthogonal sequence set subset combined with an imaginary orthogonal sequence set subset, wherein the selecting increases payload size. | 08-29-2013 |
20140233407 | Interference Measurement Methods for Advanced Receiver in LTE/LTE-A - A method for receiving a PDCH is provided. The method comprises: receiving, by a UE, information identifying a plurality of resource elements that are transmitted with zero power in a resource block containing the PDCH; receiving, by the UE, a first DMRS on a first DMRS port transmitted from a first cell; and receiving, by the UE, the PDCH that is transmitted on the first DMRS port. | 08-21-2014 |
20140233466 | Methods of Interference Measurement for Advanced Receiver in LTE/LTE-A - A method for communication in a wireless communications network is provided. The method comprises: transmitting, by a network element in a first cell, a first DMRS on a first DMRS port; transmitting, by the network element, a first PDSCH on the first DMRS port; and transmitting, by the network, information indicating that the first DMRS port is used to transmit the first PDSCH, and information about a second DMRS port that is not used to transmit the first PDSCH but is used to transmit a second DMRS, wherein the first DMRS and the second DMRS are orthogonal to one another. | 08-21-2014 |
20140243002 | Methods of Inter-Cell Resource Sharing - A method for communication in a wireless telecommunication network is provided. The method comprises transmitting, by a first cell, to a first UE, a first signal on a resource block configured to be shared by more than one cell; and transmitting, by a second cell, to a second UE, a second signal on the same resource block, wherein a specification of a location of the resource block is included in configuration information available to the first cell and the second cell. | 08-28-2014 |
20140369390 | SYSTEM AND METHOD FOR INCREASING MAXIMUM PAYLOAD SIZE - A method and apparatus for increasing, at a transmitter, a payload size of a communication channel having orthogonal groups, the method referencing a base orthogonal sequence set comprising orthogonal sequences that are mutually orthogonal, the orthogonal sequence set having subsets that are sub-block orthogonal with a length of four; and selecting a spreading sequence set from a plurality of spreading sequence sets, each of the plurality of spreading sequence sets comprising an orthogonal sequence set subset combined with an imaginary orthogonal sequence set subset, wherein the selecting increases payload size. | 12-18-2014 |
20150049649 | WIRELESS ACCESS NETWORK NODE HAVING AN OFF STATE - A wireless access network node receives a configuration for a discovery signal for transmission by the wireless access network when in an off state. The wireless access network node in the off state transmits the discovery signal according to the configuration for detection by a user equipment (UE). | 02-19-2015 |
20150085677 | SYSTEMS AND METHODS FOR BAND-LIMITED SUBFRAMES IN WIRELESS NETWORKS - Systems, methods, and apparatuses for using band-limited subframes in wireless communication networks are provided. During the band-limited subframes, the macro cell base station may mute its transmission or transmit at a low power over some frequency sub-band, while transmitting at a normal or higher power over other frequency sub-band. Correspondingly, the small cell base station may communicate with UEs within its coverage at the frequency sub-band that the macro cell base station transmits at a low power. The band-limited subframe enables the small cell base station to communicate with the UE with reduced interference, and in the meantime, increases the throughput of macro cell base station as it does not require the macro cell base station to completely mute its transmission during the band-limited subframe. | 03-26-2015 |
Patent application number | Description | Published |
20100234483 | FOAM SEAL FORMULATION - Molded polyurethane foams are provided which are useful as seals and have an ultimate elongation of at least about 300%. The foams may be formed from a first composition including a polyol, a chain extender, optional surfactants, catalysts, and blowing agents, in combination with a second composition including a polyol and an isocyanate. | 09-16-2010 |
20130274401 | ADHESIVE COMPOSITIONS AND METHODS - The present invention encompasses polyurethane adhesive compositions comprising aliphatic polycarbonate chains. In one aspect, the present invention encompasses polyurethane adhesives derived from aliphatic polycarbonate polyols and polyisocyanates wherein the polyol chains contain a primary repeating unit having a structure: | 10-17-2013 |
20140171535 | POLYOLS FROM BIOMASS AND POLYMERIC PRODUCTS PRODUCED THEREFROM - Polyol compositions containing methane linkages derived from amino acids. The polyols are obtained from the reaction of the carbonate with the cadres in the amino acids. Individual amino acids or mixtures of amino acids that are prepared from the hydrolysis of the proteins can be used. | 06-19-2014 |
20150299372 | HIGH STRENGTH POLYURETHANE FOAM COMPOSITIONS AND METHODS - Disclosed are high strength polyurethane foam compositions and methods of making them. In one aspect, the inventive polyurethane foams include strength enhancing additives comprising one or more polycarbonate polyols derived from the copolymerization of CO | 10-22-2015 |
20150344751 | ADHESIVE COMPOSITIONS AND METHODS - The present invention encompasses polyurethane adhesive compositions comprising aliphatic polycarbonate chains. In one aspect, the present invention encompasses polyurethane adhesives derived from aliphatic polycarbonate polyols and polyisocyanates wherein the polyol chains contain a primary repeating unit having a structure: | 12-03-2015 |
Patent application number | Description | Published |
20130250757 | Reducing Headroom - The various embodiments of the invention provide mechanisms to reduce headroom size while minimizing dropped packets. In general, this is done by using a shared headroom space between all ports, and providing a randomized delay in transmitting a flow-control message. | 09-26-2013 |
20140219087 | Packet Marking For Flow Management, Including Deadline Aware Flow Management - Network devices facilitate flow management through packet marking. The network devices may be switches, routers, bridges, hubs, or any other network device. The packet marking may include analyzing received packets to determine when the received packets meet a marking criterion, and then applying a configurable marking function to mark the packets in a particular way. The marking capability may facilitate deadline aware end-to-end flow management, as one specific example. More generally, the marking capability may facilitate traffic management actions such as visibility actions and flow management actions. | 08-07-2014 |
20140254357 | FACILITATING NETWORK FLOWS - Disclosed are various embodiments for facilitating network flows in a networked environment. In various embodiments, a switch transmits data using an egress port that comprises an egress queue. The switch sets a congestion notification threshold for the egress queue. The switch generates a drain rate metric based at least in part on a drain rate for the egress queue, and the congestion notification threshold is adjusted based at least in part on the drain rate metric. | 09-11-2014 |
20140254385 | FACILITATING NETWORK FLOWS - In various embodiments, a system includes a switch comprising a resource that is shared between multiple objects. The switch comprises circuitry that determines a congestion metric for the switch in response to an amount of used of the resource by the objects. The circuitry determines a feedback parameter that is responsive to the congestion metric. The circuitry generates a congestion notification message that comprises a congestion feedback value responsive to the feedback parameter. | 09-11-2014 |
20150138970 | FACILITATING NETWORK FLOWS - In various embodiments, a system includes a switch comprising a resource that is shared between multiple objects. The switch comprises circuitry that determines a congestion metric for the switch in response to an amount of used of the resource by the objects. The circuitry determines a feedback parameter that is responsive to the congestion metric. The circuitry generates a congestion notification message that comprises a congestion feedback value responsive to the feedback parameter. In further embodiments, a system includes a switch that processes data for a first data link layer access network. The switch includes circuitry that identifies whether a received packet originated from a source device that shares the same network layer access layer as the switch. If the source device shares the same network layer access network as the switch, the circuitry generates a congestion notification message comprising a congestion feedback value for the switch. | 05-21-2015 |
Patent application number | Description | Published |
20090261065 | COMPONENTS FOR USE IN A PLASMA CHAMBER HAVING REDUCED PARTICLE GENERATION AND METHOD OF MAKING - Components entirely of ceramic with etched surfaces wherein the etched surface has a surface roughness value or at least about 100 microinches (about 2.54 microns) Ra, and methods of forming such. | 10-22-2009 |
20110097902 | METHOD AND APPARATUS OF HALOGEN REMOVAL - A wafer is provided into an entrance load lock chamber. A vacuum is created in the entrance load lock chamber. The wafer is transported to a processing tool. The wafer is processed in a process chamber to provide a processed wafer, wherein the processing forms halogen residue. A degas step is provided in the process chamber after processing the wafer. The processed wafer is transferred into a degas chamber. The processed wafer is treated in the degas chamber with UV light and a flow of gas comprising at least one of ozone, oxygen, or H | 04-28-2011 |
20110143462 | ADJUSTING SUBSTRATE TEMPERATURE TO IMPROVE CD UNIFORMITY - A plasma etching system having a substrate support assembly with multiple independently controllable heater zones. The plasma etching system is configured to control etching temperature of predetermined locations so that pre-etch and/or post-etch non-uniformity of critical device parameters can be compensated for. | 06-16-2011 |
20140110060 | ADJUSTING SUBSTRATE TEMPERATURE TO IMPROVE CD UNIFORMITY - A plasma etching system having a substrate support assembly with multiple independently controllable heater zones. The plasma etching system is configured to control etching temperature of predetermined locations so that pre-etch and/or post-etch non-uniformity of critical device parameters can be compensated for. | 04-24-2014 |
20150200106 | HIGH ASPECT RATIO ETCH WITH COMBINATION MASK - A method for etching features in a stack is provided. A combination hardmask is formed by forming a first hardmask layer comprising carbon or silicon oxide over the stack, forming a second hardmask layer comprising metal over the first hardmask layer, and patterning the first and second hardmask layers. The stack is etched through the combination hardmask. | 07-16-2015 |
20160111309 | EQUIPMENT FRONT END MODULE FOR TRANSFERRING WAFERS AND METHOD OF TRANSFERRING WAFERS - An EFEM useful for transferring wafers to and from wafer processing modules comprises an enclosure having a controlled environment therein bounded by a front wall, a back wall, first and second side walls, a top wall, and a bottom wall. The first side wall and the second side wall include two or more wafer load ports wherein each wafer load port is adapted to receive a FOUP. The front wall includes wafer ports configured to attach to respective load locks operable to allow a wafer to be transferred to a front wall cluster processing tool. The back wall includes a wafer port adapted to be in operational relationship with a back wall cluster processing tool. A robot in the EFEM enclosure is operable to transfer wafers through the wafer load ports, the first front wall wafer port, the second front wall wafer port, and the back wall wafer port. | 04-21-2016 |
Patent application number | Description | Published |
20100041238 | TUNABLE MULTI-ZONE GAS INJECTION SYSTEM - A tunable multi-zone injection system for a plasma processing system for plasma processing of substrates such as semiconductor wafers. The system includes a plasma processing chamber, a substrate support for supporting a substrate within the processing chamber, a dielectric member having an interior surface facing the substrate support, the dielectric member forming a wall of the processing chamber, a gas injector fixed to part of or removably mounted in an opening in the dielectric window, the gas injector including a plurality of gas outlets supplying process gas at adjustable flow rates to multiple zones of the chamber, and an RF energy source such as a planar or non-planar spiral coil which inductively couples RF energy through the dielectric member and into the chamber to energize the process gas into a plasma state. The injector can include an on-axis outlet supplying process gas at a first flow rate to a central zone and off-axis outlets supplying the same process gas at a second flow rate to an annular zone surrounding the central zone. The arrangement permits modification of gas delivery to meet the needs of a particular processing regime by allowing independent adjustment of the gas flow to multiple zones in the chamber. In addition, compared to consumable showerhead arrangements, a removably mounted gas injector can be replaced more easily and economically. | 02-18-2010 |
20140302680 | INTERNAL PLASMA GRID FOR SEMICONDUCTOR FABRICATION - The embodiments disclosed herein pertain to improved methods and apparatus for etching a semiconductor substrate. A plasma grid assembly is positioned in a reaction chamber to divide the chamber into upper and lower sub-chambers. The plasma grid assembly may include one or more plasma grids having slots of a particular aspect ratio, which allow certain species to pass through from the upper sub-chamber to the lower sub-chamber. Where multiple plasma grids are used, one or more of the grids may be movable, allowing for tenability of the plasma conditions in at least the lower sub-chamber. In some cases, an electron-ion plasma is generated in the upper sub-chamber. Electrons that make it through the grid to the lower sub-chamber are cooled as they pass through. In some cases, this results in an ion-ion plasma in the lower sub-chamber. | 10-09-2014 |
20140302681 | INTERNAL PLASMA GRID FOR SEMICONDUCTOR FABRICATION - The embodiments disclosed herein pertain to improved methods and apparatus for etching a semiconductor substrate. A plasma grid is positioned in a reaction chamber to divide the chamber into upper and lower sub-chambers. The plasma grid may have slots of a particular aspect ratio which allow certain species to pass through from the upper sub-chamber to the lower sub-chamber. In some cases, an electron-ion plasma is generated in the upper sub-chamber. Electrons that make it through the grid to the lower sub-chamber are cooled as they pass through. In some cases, this results in an ion-ion plasma in the lower sub-chamber. The lower sub-chamber plasma has a lower electron density, lower effective electron temperature, and higher negative ion:positive ion ratio as compared to the upper sub-chamber plasma. The disclosed embodiments may result in an etching process having good center to edge uniformity, selectivity, profile angle, and Iso/Dense loading. | 10-09-2014 |
20150235811 | TUNABLE MULTI-ZONE GAS INJECTION SYSTEM - A tunable multi-zone injection system for a plasma processing system for plasma processing of substrates such as semiconductor wafers. The injector can include an on-axis outlet supplying process gas at a first flow rate to a central zone and off-axis outlets supplying the same process gas at a second flow rate to an annular zone surrounding the central zone. The arrangement permits modification of gas delivery to meet the needs of a particular processing regime by allowing independent adjustment of the gas flow to multiple zones in the chamber. In addition, compared to consumable showerhead arrangements, a removably mounted gas injector can be replaced more easily and economically. | 08-20-2015 |
Patent application number | Description | Published |
20090066382 | Digital Pulse-Width-Modulator with Discretely Adjustable Delay Line - A hybrid digital pulse width modulator (DPWM) with digital delay-locked loops (DLLs) is provided. In this implementation, the digital pulse-width-modulator is synthesizable and includes a digital delay-locked loop around a delay-line to achieve constant frequency clocked operation. In this implementation, the resolution of the modulator is consistent over a wide range of process or temperature variations. The DPWM may implement trailing-edge, leading-edge, triangular, or phase-shift modulation. In an implementation suitable for DC-DC converters with synchronous rectifiers, for example, the DPWM may include two or more outputs for programmable dead-times. In another implementation, a digital pulse-width-modulator with a digital phase-locked loop is also provided. | 03-12-2009 |
20090310385 | METHOD, APPARATUS & SYSTEM FOR EXTENDED SWITCHED-MODE CONTROLLER - An exemplary extended switched-mode controller is provided for controlling the switching of a switched-mode power converter. This exemplary extended switched-mode controller further comprises a standard switched-mode controller and an auxiliary controller configured to receive standard switch control signals from the switched-mode controller and to (1) pass the standard switch control signals to the switched-mode power converter during non-transient operation, and (2) provide auxiliary switch control signals to the switched-mode power converter during transient operation instead of the standard switch control signals. The auxiliary controller is further configured to determine when to provide the auxiliary switch control signals and to determine what control signals to provide at least partially based on an auxiliary feedback input signal comprising at least one of: sensed converter voltages, converter currents, and an error signal. Where the error signal is at least partially based on the difference between a feedback signal and a reference signal. | 12-17-2009 |
20100066574 | Hybrid Analog to Digital Converter Circuit and Method - A hybrid analog to digital converter circuit for a feedback input to a digital controller of a power supply includes a high resolution, analog to digital converter circuit in communication with a voltage error signal. The high resolution analog to digital converter circuit is configured to provide a first correction signal to the digital controller when the voltage error signal is within a first error range. The hybrid analog to digital converter circuit also includes at least one flash analog to digital converter circuit in communication with the voltage error signal. The flash analog to digital converter circuit(s) is configured to provide at least a second correction signal to the digital controller when the voltage error signal is within at least a second error range. | 03-18-2010 |
20140125299 | SWITCHED MODE ASSISTED LINEAR REGULATOR WITH DECOUPLED OUTPUT IMPEDANCE AND SIGNAL PATH BANDWIDTH - The disclosed switched mode assisted linear (SMAL) amplifier/regulator architecture may be configured as a SMAL regulator to supply power to a dynamic load, such as an RF power amplifier. Embodiments of a SMAL regulator include configurations in which a linear amplifier and a switched mode converter (switcher) parallel coupled at a supply node, and configured such that the amplifier sets load voltage, while the amplifier and the switched mode converter are cooperatively controlled to supply load current. In one embodiment, the amplifier includes separate feedback loops: an external relatively lower speed feedback loop may be configured for controlling signal path bandwidth, and an internal relatively higher speed feedback loop may be configured for controlling output impedance bandwidth of the linear amplifier. In another embodiment, the linear amplifier is AC coupled to the supply node, and the switched converter is configured with a capacitive charge control loop that controls the switched converter to effectively control the amplifier to provide capacitive charge control. | 05-08-2014 |