Patent application number | Description | Published |
20110079926 | Method of manufacturing substrate for flip chip and substrate for flip chip manufactured using the same - There is provided a method of manufacturing a substrate for flip chip, and a substrate for flip chip manufactured using the same. The method includes providing a base substrate including at least one conductive pad, forming a solder resist layer on the base substrate, the solder resist layer including a first opening exposing the conductive pad, forming a dry film on the solder resist layer, the dry film including a second opening connected with the first opening, forming a metal post in the first opening and a part of the second opening, filling the second opening above the metal post with solder paste, forming a solder cap by performing a reflow process on the filled solder paste, planarizing a surface of the solder cap, and removing the dry film. Accordingly, fine pitches and improve reliability can be achieved. | 04-07-2011 |
20110133332 | Package substrate and method of fabricating the same - There is provided a package substrate allowing for enhanced reliability by improving the structure of a solder bump and a method of fabricating the same. The package substrate includes: a substrate having at least one conductive pad; an insulating layer provided on the substrate and having an opening to expose the conductive pad; a post terminal provided on the conductive pad inside the opening; and a solder bump provided on the post terminal and having an angle between a bottom surface and a side surface thereof ranging from 80° to 120°. | 06-09-2011 |
20110186991 | Package substrate and method of fabricating the same - There is provided a package substrate capable of controlling the degree of warpage thereof by improving the composition and formation of a post terminal and a method of fabricating the same. The package substrate includes a substrate having at least one conductive pad; an insulating layer provided on the substrate and having an opening to expose the conductive pad; a separation barrier layer provided on the conductive pad inside the opening and formed to be higher than the upper surface of the insulating layer along the side walls thereof; a post terminal provided on the separation barrier layer; and a solder bump provided on the post terminal. | 08-04-2011 |
20130237049 | METHOD OF FABRICATING A PACKAGE SUBSTRATE - A method of fabricating a package substrate including preparing a substrate having at least one conductive pad, forming an insulating layer having an opening to expose the conductive pad on the substrate, forming a separation barrier layer on the conductive pad inside the opening to be higher than the upper surface of the insulating layer along the side walls thereof, forming a post terminal on the separation barrier layer, and forming a solder bump on the post terminal. | 09-12-2013 |
Patent application number | Description | Published |
20090087950 | Wafer packaging method - A wafer packaging method is disclosed. | 04-02-2009 |
20090205854 | Printed circuit board for a package and manufacturing method thereof - A printed circuit board for use in a package and to a method of manufacturing the printed circuit board. The method of manufacturing the printed circuit board can include: providing a substrate, on one side of which at least one solder pad and at least one guide pad are formed; forming a solder resist layer over the one side of the substrate; uncovering at least one portion of the solder resist layer such that the guide pad is exposed; applying a surface treatment on the exposed guide pad; uncovering at least one portion of the solder resist layer such that the solder pad is exposed; and forming a solder bump on the exposed solder pad. With this method, the amount of surface treatment applied can be minimized, for reduced costs, and the occurrence of undiffused layers can be avoided, for improved reliability in the final product. | 08-20-2009 |
20100044084 | Printed circuit board and method of manufacturing the same - Provided is a printed circuit board (PCB) including a substrate that has a pad formed thereon; solder resist that is disposed on the substrate so as to expose the pad; a post that is disposed on the post; a surface-treatment layer that is disposed on the post; and a bump that is disposed on the surface-treatment layer. | 02-25-2010 |
20100270067 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A printed circuit board and a method of manufacturing the printed circuit board are disclosed. In accordance with an embodiment of the present invention, the method includes providing a substrate having a pad formed thereon, forming a resist on the substrate, in which the resist has an opening formed therein such that the pad is exposed, forming a metal post inside the opening such that the metal post is electrically connected to the pad, forming a through-hole in the resist by removing a portion of the resist such that the through-hole surrounds the metal post, and forming a solder layer inside the through-hole and on an upper surface of the metal post so as to cover an exposed surface of the metal post. | 10-28-2010 |
20110014827 | Lead pin for package substrate - Disclosed herein is a lead pin for a package substrate. | 01-20-2011 |
20130067941 | AIR CONDITIONER - An air conditioner having an indoor unit and an outdoor unit, at least one of which includes a communication unit, a switching unit turned on when communication lines are connected to the communication unit, turned off in a standby mode, and turned on when the standby mode is released, a voltage distribution unit distributing voltage applied to the communication unit when the switching unit is turned off, a voltage adjustment unit adjusting the voltage applied to the communication unit and transmitting the adjusted voltage to the communication unit, and a control unit turning the switching unit on when driving voltage is input to the control unit, turning the switching unit off when the at least one of the indoor unit and the outdoor unit enters the standby mode, and turning the switching unit on based on the voltage distributed by the voltage distribution unit in the standby mode. | 03-21-2013 |
20140017486 | CERAMIC LAMINATE SHEET WITH FLEXIBILITY AND PREPARATION METHOD THEREOF - Disclosed is a ceramic laminate sheet comprising a ceramic sheet having a plurality of cracks and a polymer resin layer disposed on one side or both sides of the ceramic sheet, wherein the plurality of cracks pass through the ceramic sheet from one side to the other side thereof, the cracks divide the ceramic sheet into a plurality of pieces, grooves for formation of the cracks are not provided in one side and the other side of the ceramic sheet. | 01-16-2014 |
20140327420 | POWER SUPPLY AND DC-DC CONVERTER THEREIN - A power supply includes a rectifier circuit to rectify power, a smoothing circuit unit to smoothen a voltage of the rectified power, and a voltage drop circuit unit to drop the smoothened voltage. The voltage drop circuit unit includes an electric charge storage circuit to output the voltage-dropped voltage, a resonance circuit to receive first current from the smoothing circuit unit and to supply second current to the electric charge storage circuit, and a current interruption circuit to control the first current and the second current using zero current switching for performing switching when current does not flow using a resonance circuit. | 11-06-2014 |
20150017395 | CUT-OUT LAMINATED SHEET AND PREPARATION METHOD THEREOF - A cut-out laminated sheet can be prepared by laminating a protection sheet on a base sheet, followed by a simple two-step shearing process. The cut-out laminated sheet thus prepared features a protruding section that helps improving productivity by making the removal of the protection sheet easy; and thus, can be effectively used in a wide range of industrial applications such as a brittle sheet and a flexible sheet. | 01-15-2015 |
Patent application number | Description | Published |
20120145060 | SEWING MACHINE AND METHOD OF CONTROLLING OPERATION OF THE SAME - A sewing machine is provided, which includes a table, support posts, upper and lower frames, a head unit, a bed unit, an X-axial head-unit-transport means and an X-axial bed-unit-transport means. An object is placed on the table. The support posts are provided on opposite sides of the table. The upper and lower frames connect the support posts to each other. The head unit is provided on the upper frame so as to be movable in an X-axis direction. The head unit has a head-unit-rotating means for rotating a sewing head. The bed unit is provided on the lower frame so as to be movable in the X-axis direction. The bed unit has a bed-unit-rotating means for rotating a sewing bed. The X-axial head-unit-transport means moves the head unit on the upper frame horizontally. The X-axial bed-unit-transport means moves the bed unit on the upper frame horizontally. | 06-14-2012 |
20120145061 | SEWING MACHINE AND METHOD OF CONTROLLING OPERATION OF THE SAME - A head unit fixed sewing machine is provided, which includes a table, support posts, an upper beam, a head unit and a bed unit. An object is placed on the table. The support posts are provided on opposite sides of the table. The upper beam connects the support posts to each other and is coupled to upper ends of the support posts. The head unit is fastened to the upper beam and has a head-unit-rotating means for rotating a sewing head within a predetermined range. The bed unit is provided below the head unit and has a bed-unit-rotating means for rotating a sewing bed within a predetermined range. Because the head unit and the bed unit can be rotated while sewing, the orientation of a sewn thread can be maintained constant. Hence, a perfect stitch can be realized over the entirety of the object. | 06-14-2012 |
20120291683 | SEWING MACHINE AND CONTROL METHOD FOR DRIVING THE SAME - A sewing machine having a rotatable head portion includes a sewing machine frame shaped in a box using supporting posts and supporting bars to hold the sewing machine; a sewing machine main body mounted on the sewing machine frame; a head portion disposed at the front end of the sewing machine main body and rotatably installed through head portion rotating means; a bed portion rotatably installed under the head portion through bed portion rotating means; X-axis transporting means moving the sewing machine main body mounted on the sewing machine frame in X direction; Y-axis transporting means moving the sewing machine main body mounted on the sewing machine frame in Y direction; and a sewing object fixing frame provided at the front part of the sewing machine frame where the sewing object is held. The head portion and the bed portion are rotated to sew the sewing object. | 11-22-2012 |
Patent application number | Description | Published |
20120257090 | PIXEL, PIXEL ARRAY, METHOD FOR MANUFACTURING THE PIXEL ARRAY AND IMAGE SENSOR INCLUDING THE PIXEL ARRAY - Disclosed are a pixel, a pixel array, a method for manufacturing the pixel array, and an image sensor including the pixel array. The pixel includes a first color filter layer to transmit a visible light and an IR, and a second color filter layer to transmit a light, in which the visible light is blocked, at one side of the first color filter layer. | 10-11-2012 |
20120257092 | PIXEL, PIXEL ARRAY, IMAGE SENSOR INCLUDING THE SAME AND METHOD FOR OPERATING THE IMAGE SENSOR - Disclosed are a pixel, a pixel array, an image sensor including the pixel array and a method for operating the image sensor. The pixel includes a photo-electro conversion unit; a capacitor for storing charges converted by the photo-electro conversion unit; an output switching device for outputting an electric potential of the capacitor; and a removal unit for removing a part of the charges converted by the photo-electro conversion unit. | 10-11-2012 |
20120257093 | PIXEL, PIXEL ARRAY, IMAGE SENSOR INCLUDING THE SAME AND METHOD FOR OPERATING THE IMAGE SENSOR - Disclosed are a pixel, a pixel array, an image sensor including the pixel array and a method for operating the image sensor. The pixel includes a photo-electro conversion unit; a first capacitor for storing a first quantity of charges of the photo-electro conversion unit; a second capacitor for storing a second quantity of charges of the photo-electro conversion unit; and an output unit to output the first and second quantities of the charges. | 10-11-2012 |
20120261549 | PIXEL, PIXEL ARRAY, AND IMAGE SENSOR INCLUDING PIXEL ARRAY - Provided are a pixel, a pixel array, and an image sensor including the pixel array. The pixel includes a photoelectric converter, a capacitor, a variable capacitor, and a switching element. The capacitor accumulates electric charges converted by the photoelectric converter. The variable capacitor is connected to the capacitor, and has capacitance varied according to a potential of the capacitor. The switching element outputs the potential of the capacitor. | 10-18-2012 |
20120267285 | PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF - Disclosed herein are a package substrate and a fabricating method thereof. The package substrate includes a substrate including at least one conductive pad, an insulation layer formed on the substrate and including an opening through which the conductive pad is exposed, a blister prevention layer formed along a top surface of the conductive pad exposed through the opening and a sidewall of the insulation layer, a metal post made of at least one alloy material and formed on the blister prevention layer, and a heat-diffusion prevention film formed on the metal post. | 10-25-2012 |
20150049123 | DISPLAY DEVICE AND DRIVING METHOD THEREOF - A display device includes: a similar gray level block detector configured to detect a pixel data block in which a gray level difference between a plurality of pixel data included in an image signal is smaller than or equal to a threshold; a skin tone detector configured to detect the pixel data block including a skin tone; and a gamma processor configured to apply a first gamma to a plurality of pixel data included in the pixel data block when the pixel data block does not include the skin tone and apply a second gamma to the plurality of pixel data included in the pixel data block when the pixel data block includes the skin tone. | 02-19-2015 |
20150071550 | APPARATUS FOR DETECTING AFTERIMAGE CANDIDATE REGION AND APPARATUS INCLUDING THE SAME FOR PREVENTING AFTERIMAGE - An apparatus for detecting an afterimage candidate region includes: a comparison unit which compares gradation data of an n-th frame with integrated gradation data of an (n−1)-th frame and generates integrated gradation data of the n-th frame, where n is a natural number; a memory which provides the integrated gradation data of the (n−1)-th frame to the comparison unit and stores the integrated gradation data of the n-th frame; and an afterimage candidate region detection unit which detects an afterimage candidate region based on the integrated gradation data of the n-th frame, where each of the integrated gradation data of the n-th frame and the integrated gradation data of the (n−1)-th frame comprises a comparison region and a gradation region. | 03-12-2015 |