Patent application number | Description | Published |
20120131474 | Switching of Emails in a Conversation Thread - A method is disclosed for rendering messages in an email application on a client computer. A plurality of email messages is received from a server computer, including a first email message, a second email message and a third email message. The first email message is rendered on the client computer with a first conversation icon that identifies the first email message as being part of an email conversation thread. When the first conversation icon is selected on the first email message, a view is rendered showing one or more email messages in the conversation thread. When the second email message is selected, the second email message is rendered on the client computer with a second conversation icon. When the second conversation icon is selected on the second email message, the view showing the one or more email messages in the conversation thread is rendered. | 05-24-2012 |
20120167009 | COMBINING TIMING AND GEOMETRY INFORMATION FOR TYPING CORRECTION - Techniques to automatically correct or complete text are disclosed. A string and keystroke timing information associated with entry of the string, for example via an input device such as a keyboard, are received. A word to suggest as a correction or completion of the string is determined based at least in part on the keystroke timing information. | 06-28-2012 |
20130209974 | Exemplar Descriptions of Homophones to Assist Visually Impaired Users - The disclosed implementations provide systems, methods and computer program products that provide computer accessibility for visually impaired users by audibly presenting exemplary descriptions of homophones. Commonly used characters can be described by using a common multi-character word that includes the character. Rarely used characters can be described using an Ideographic Description Sequence (IDS) that splits characters into individual components. Each component can then be read aloud individually as a description of the homophone character. | 08-15-2013 |
20140363083 | MANAGING REAL-TIME HANDWRITING RECOGNITION - Methods, systems, and computer-readable media related to a technique for providing handwriting input functionality on a user device. A handwriting recognition module is trained to have a repertoire comprising multiple non-overlapping scripts and capable of recognizing tens of thousands of characters using a single handwriting recognition model. The handwriting input module provides real-time, stroke-order and stroke-direction independent handwriting recognition for multi-character handwriting input. In particular, real-time, stroke-order and stroke-direction independent handwriting recognition is provided for multi-character, or sentence level Chinese handwriting recognition. User interfaces for providing the handwriting input functionality are also disclosed. | 12-11-2014 |
20140365949 | MANAGING REAL-TIME HANDWRITING RECOGNITION - Methods, systems, and computer-readable media related to a technique for providing handwriting input functionality on a user device. A handwriting recognition module is trained to have a repertoire comprising multiple non-overlapping scripts and capable of recognizing tens of thousands of characters using a single handwriting recognition model. The handwriting input module provides real-time, stroke-order and stroke-direction independent handwriting recognition for multi-character handwriting input. In particular, real-time, stroke-order and stroke-direction independent handwriting recognition is provided for multi-character, or sentence level Chinese handwriting recognition. User interfaces for providing the handwriting input functionality are also disclosed. | 12-11-2014 |
Patent application number | Description | Published |
20120043023 | SYMMETRIC VHF SOURCE FOR A PLASMA REACTOR - The disclosure pertains to a capactively coupled plasma source in which VHF power is applied through an impedance-matching coaxial resonator having a folded structure and symmetrical power distribution. | 02-23-2012 |
20130098551 | ELECTRON BEAM PLASMA SOURCE WITH ARRAYED PLASMA SOURCES FOR UNIFORM PLASMA GENERATION - A plasma reactor that generates plasma in workpiece processing chamber by a electron beam, has an electron beam source chamber and an array of plasma sources facing the electron beam source chamber for affecting plasma electron density in different portions of the processing chamber. In another embodiment, an array of separately controlled electron beam source chambers is provided. | 04-25-2013 |
20130098552 | E-BEAM PLASMA SOURCE WITH PROFILED E-BEAM EXTRACTION GRID FOR UNIFORM PLASMA GENERATION - A plasma, reactor that relies on an electron beam as a plasma source employs a profiled electron beam extraction grid in an electron beam source to improve uniformity. | 04-25-2013 |
20130098872 | SWITCHED ELECTRON BEAM PLASMA SOURCE ARRAY FOR UNIFORM PLASMA PRODUCTION - An array of electron beam sources surrounding a processing region of a plasma reactor is periodically switched to change electron beam propagation direction and remove or reduce non-uniformities. | 04-25-2013 |
20130098882 | ELECTRON BEAM PLASMA SOURCE WITH SEGMENTED BEAM DUMP FOR UNIFORM PLASMA GENERATION - A plasma reactor that generates plasma in a workpiece processing chamber by an electron beam, has an electron beam source and segmented beam dump that is profiled to promote uniformity in the electron beam-produced plasma. | 04-25-2013 |
20130118686 | TEMPERATURE CONTROLLED CHAMBER LINER - A liner for a semiconductor processing chamber and a semiconductor processing chamber are provided. In one embodiment, a liner for a semiconductor processing chamber includes a body having an outwardly extending flange. A plurality of protrusions extend from a bottom surface of the flange. The protrusions have a bottom surface defining a contact area that is asymmetrically distributed around the bottom surface of the flange. | 05-16-2013 |
20130277333 | PLASMA PROCESSING USING RF RETURN PATH VARIABLE IMPEDANCE CONTROLLER WITH TWO-DIMENSIONAL TUNING SPACE - In a plasma reactor having a driven electrode and a counter electrode, an impedance controller connected between the counter electrode and ground includes both series sand parallel variable impedance elements that facilitate two-dimensional movement of a ground path input impedance in a complex impedance space to control spatial distribution of a plasma process parameter. | 10-24-2013 |
20140034239 | DIFFERENTIAL COUNTER ELECTRODE TUNING IN A PLASMA REACTOR WITH AN RF-DRIVEN WORKPIECE SUPPORT ELECTRODE - A plasma reactor includes an RF-driven wafer support electrode underlying a process zone and two (or more) counter electrodes overlying the process zone and facing different portions of the process zones, two (or more) variable reactances connected between respective ones of the counter electrodes and ground, and a controller governing the variable reactances to control distribution of a plasma parameter such as plasma ion density or ion energy. | 02-06-2014 |
20140034612 | METHOD OF DIFFERENTIAL COUNTER ELECTRODE TUNING IN AN RF PLASMA REACTOR - A method of controlling distribution of a plasma parameter in a plasma reactor having an RF-driven electrode and two (or more) counter electrodes opposite the RF driven electrode and facing different portions of the process zones. The method includes providing two (or more) variable reactances connected between respective ones of the counter electrodes and ground, and governing the variable reactances to change distribution of a plasma parameter such as plasma ion density or ion energy. | 02-06-2014 |
20140035458 | PLASMA REACTOR WITH ELECTRON BEAM PLASMA SOURCE HAVING A UNIFORM MAGNETIC FIELD - Electron beam-confining electromagnets of an electron beam generator are aligned with an electron beam axis, each of the electromagnets being folded to define a main section and a pair of angled wing sections disposed at respective angles relative to said main section, and a conductor wound around the edge. | 02-06-2014 |
20140069584 | DIFFERENTIAL COUNTER ELECTRODE TUNING IN A PLASMA REACTOR WITH AN RF-DRIVEN CEILING ELECTRODE - A plasma reactor includes an RF-driven ceiling electrode overlying a process zone and two (or more) counter electrodes underlying the process zone and facing different portions of the process zones, two (or more) variable reactances connected between respective ones of the counter electrodes and ground, and a controller governing the variable reactances to control distribution of a plasma parameter such as plasma ion density or ion energy. | 03-13-2014 |
20140265855 | ELECTRON BEAM PLASMA SOURCE WITH SEGMENTED SUPPRESSION ELECTRODE FOR UNIFORM PLASMA GENERATION - A plasma reactor that generates plasma in a workpiece processing chamber by an electron beam, has an electron beam source and segmented suppression electrode with individually biased segments to control electron beam density distribution. | 09-18-2014 |
20140338835 | ELECTRON BEAM PLASMA SOURCE WITH REDUCED METAL CONTAMINATION - In a plasma reactor for processing a workpiece, an electron beam is employed as the plasma source, and sputtered metal atoms are removed from the electron beam to reduce contamination. | 11-20-2014 |
Patent application number | Description | Published |
20130118546 | High Efficiency Multijunction Solar Cells - Multijunction solar cells having at least four subcells are disclosed, in which at least one of the subcells comprises a base layer formed of an alloy of one or more elements from group III on the periodic table, nitrogen, arsenic, and at least one element selected from the group consisting of Sb and Bi, and each of the subcells is substantially lattice matched. Methods of manufacturing solar cells and photovoltaic systems comprising at least one of the multijunction solar cells are also disclosed. | 05-16-2013 |
20130118566 | HIGH EFFICIENCY MULTIJUNCTION SOLAR CELLS - Multijunction solar cells having at least four subcells are disclosed, in which at least one of the subcells comprises a base layer formed of an alloy of one or more elements from group III on the periodic table, nitrogen, arsenic, and at least one element selected from the group consisting of Sb and Bi, and each of the subcells is substantially lattice matched. Methods of manufacturing solar cells and photovoltaic systems comprising at least one of the multijunction solar cells are also disclosed. | 05-16-2013 |
20130122638 | High Efficiency Multijunction Solar Cells - Multijunction solar cells having at least four subcells are disclosed, in which at least one of the subcells comprises a base layer formed of an alloy of one or more elements from group III on the periodic table, nitrogen, arsenic, and at least one element selected from the group consisting of Sb and Bi, and each of the subcells is substantially lattice matched. Methods of manufacturing solar cells and photovoltaic systems comprising at least one of the multijunction solar cells are also disclosed. | 05-16-2013 |
20150027520 | LATTICE MATCHABLE ALLOY FOR SOLAR CELLS - An alloy composition for a subcell of a solar cell is provided that has a bandgap of at least 0.9 eV, namely, Ga | 01-29-2015 |
Patent application number | Description | Published |
20100017188 | Specification Files For Call Translation And Trace - A method and apparatus for storing a function specification file is described. In an exemplary method, the function specification field is capable for providing other software to facilitate execution of an application in a second operating system with the presence of a first operating system and the application is compiled for the first operating system. In another exemplary method, a preprocessor receives the function specification file comprising function definition data for a library function. The preprocessor processes the function definition data to generate header information and function code for the function. In another exemplary method, the preprocessor generates an automatic logging framework for the interposing library based on the function definition data. Further, a function in an interposing library logs calls to a corresponding library function. | 01-21-2010 |
20130117340 | MANAGING FILE SYSTEMS - A path request is generated by a secondary platform application, such as a word processor, and is received by invention. The path request may contain the location of a library required for the application to function, or a document saved previously by a user. The path request comprises a complete path for the requested file. The complete path is formatted for a file system and file structure for expected by the application. | 05-09-2013 |
20130290922 | SPECIFICATION FILES FOR CALL TRANSLATION AND TRACE - A method and apparatus for storing a function specification file is described. In an exemplary method, the function specification field is capable for providing other software to facilitate execution of an application in a second operating system with the presence of a first operating system and the application is compiled for the first operating system. In another exemplary method, a preprocessor receives the function specification file comprising function definition data for a library function. The preprocessor processes the function definition data to generate header information and function code for the function. In another exemplary method, the preprocessor generates an automatic logging framework for the interposing library based on the function definition data. Further, a function in an interposing library logs calls to a corresponding library function. | 10-31-2013 |
Patent application number | Description | Published |
20120185435 | ORGANIZING VERSIONING ACCORDING TO PERMISSIONS - Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for storing data according to permissions. In general, one aspect of the subject matter described in this specification can be embodied in methods that include the actions of identifying a version of a data item to be stored; determining permissions associated with the version of the data item; and storing the version of the data item at a storage location that is based on the determined permissions. | 07-19-2012 |
20120204015 | Sharing a Data Buffer - A computer-program product may have instructions that, when executed, cause a processor to perform operations including managing execution of application functions that access data in a shared buffer; determining if a first instruction that is stored at a first memory location causes, upon execution, data to be read from or written to the shared buffer; and when it is determined that the first instruction causes data to be read from or written to the shared buffer, 1) identify one or more replacement instructions to execute in place of the first instruction; 2) store the one or more replacement instructions; and 3) replace the first instruction at the first memory location with a second instruction that, when executed, causes the stored one or more replacement instructions to be executed. | 08-09-2012 |
20130132439 | ORGANIZING VERSIONING ACCORDING TO PERMISSIONS - Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for storing data according to permissions. In general, one aspect of the subject matter described in this specification can be embodied in methods that include the actions of identifying a version of a data item to be stored; determining permissions associated with the version of the data item; and storing the version of the data item at a storage location that is based on the determined permissions. | 05-23-2013 |
Patent application number | Description | Published |
20080207100 | Customized polishing pads for CMP and methods of fabrication and use thereof - The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior thermo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads. In addition, these pads can be designed to tune the coefficient of friction by surface engineering, through the addition of solid lubricants, and creating low shear integral pads having multiple layers of polymeric material which form an interface parallel to the polishing surface. The pads can also have controlled porosity, embedded abrasive, novel grooves on the polishing surface, for slurry transport, which are produced in situ, and a transparent region for endpoint detection. | 08-28-2008 |
20090053976 | Customized Polishing Pads for CMP and Methods of Fabrication and Use Thereof - The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior thermo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads. In addition, these pads can be designed to tune the coefficient of friction by surface engineering, through the addition of solid lubricants, and creating low shear integral pads having multiple layers of polymeric material which form an interface parallel to the polishing surface. The pads can also have controlled porosity, embedded abrasive, novel grooves on the polishing surface, for slurry transport, which are produced in situ, and a transparent region for endpoint detection. | 02-26-2009 |
20090311955 | Grooved CMP pad - CMP pads having novel groove configurations are described. For example, described herein are CMP pads comprising primary grooves, secondary grooves, a groove pattern center, and an optional terminal groove. The CMP pads may be made from polyurethane or poly (urethane-urea), and the grooves produced therein may be made by a method from the group consisting of molding, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof. | 12-17-2009 |
20090318063 | Polishing systems - Described herein are polishing apparatus, polishing formulations, and polymeric substrates for use in polishing surfaces, and related methods. The apparatus, formulations, substrates, and methods may each be used in applications involving the polishing of metal and/or metal-containing surfaces such as semiconductor wafers. The apparatus, formulations, polymeric substrates, and related methods described herein may be used without abrasives, and in some instances, without mechanical friction of a pad surface against the surface to be polished. Therefore, defects on a polished surface due to such mechanical polishing processes may be reduced. | 12-24-2009 |
20100273398 | CUSTOMIZED POLISH PADS FOR CHEMICAL MECHANICAL PLANARIZATION - A polishing pad for chemical mechanical planarization of a film on a substrate is customized by obtaining one or more characteristics of a structure on a substrate. For example, when the structure is a chip formed on a semiconductor wafer, the one or more characteristics of the structure can include chip size, pattern density, chip architecture, film material, film topography, and the like. Based on the one or more characteristics of the structure, a value for the one or more chemical or physical properties of the pad is selected. For example, the one or more chemical or physical properties of the pad can include pad material hardness, thickness, surface grooving, pore size, porosity, Youngs modulus, compressibility, asperity, and the like. | 10-28-2010 |
20130149945 | POLISHING SYSTEMS - Described herein are polishing apparatus, polishing formulations, and polymeric substrates for use in polishing surfaces, and related methods. The apparatus, formulations, substrates, and methods may each be used in applications involving the polishing of metal and/or metal-containing surfaces such as semiconductor wafers. The apparatus, formulations, polymeric substrates, and related methods described herein may be used without abrasives, and in some instances, without mechanical friction of a pad surface against the surface to be polished. Therefore, defects on a polished surface due to such mechanical polishing processes may be reduced. | 06-13-2013 |
20150065020 | CUSTOMIZED POLISHING PADS FOR CMP AND METHODS OF FABRICATION AND USE THEREOF - The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior themo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads. In addition, these pads can be designed to tune the coefficient of friction by surface engineering, through the addition of solid lubricants, and creating low shear integral pads having multiple layers of polymeric material which form an interface parallel to the polishing surface. The pads can also have controlled porosity, embedded abrasive, novel grooves on the polishing surface, for slurry transport, which are produced in situ, and a transparent region for endpoint detection. | 03-05-2015 |