Patent application number | Description | Published |
20130309814 | LID ATTACH PROCESS - Various methods of attaching a lid to an integrated circuit substrate are provided. In one aspect, a method of attaching a lid to a substrate that has an integrated circuit positioned thereon is provided. An adhesive is applied to the substrate and an indium film is applied to the integrated circuit. The lid is positioned on the adhesive. The adhesive is partially hardened and the indium film is reflowed. The adhesive is cured. | 11-21-2013 |
20140131000 | Metal Alloy Injection Molding Protrusions - Metal alloy injection molding techniques are described. In one or more implementations, these techniques may also include adjustment of injection pressure, configuration of runners, and/or use of vacuum pressure, and so on to encourage flow of the metal alloy through a mold. Techniques are also described that utilize protrusions to counteract thermal expansion and subsequent contraction of the metal alloy upon cooling. Further, techniques are described in which a radius of edges of a feature is configured to encourage flow and reduce voids. A variety of other techniques are also described herein. | 05-15-2014 |
20140150982 | Metal Alloy Injection Techniques - Metal alloy injection molding techniques are described. In one or more implementations, these techniques may also include adjustment of injection pressure, configuration of runners, and/or use of vacuum pressure, and so on to encourage flow of the metal alloy through a mold. Techniques are also described that utilize protrusions to counteract thermal expansion and subsequent contraction of the metal alloy upon cooling. Further, techniques are described in which a radius of edges of a feature is configured to encourage flow and reduce voids. A variety of other techniques are also described herein. | 06-05-2014 |
20140154523 | Metal Alloy Injection Molding Protrusions - Metal alloy injection molding techniques are described. In one or more implementations, these techniques may also include adjustment of injection pressure, configuration of runners, and/or use of vacuum pressure, and so on to encourage flow of the metal alloy through a mold. Techniques are also described that utilize protrusions to counteract thermal expansion and subsequent contraction of the metal alloy upon cooling. Further, techniques are described in which a radius of edges of a feature is configured to encourage flow and reduce voids. A variety of other techniques are also described herein. | 06-05-2014 |
20140158317 | Metal Alloy Injection Molding - Metal alloy injection molding techniques are described. In one or more implementations, these techniques may also include adjustment of injection pressure, configuration of runners, and/or use of vacuum pressure, and so on to encourage flow of the metal alloy through a mold. Techniques are also described that utilize protrusions to counteract thermal expansion and subsequent contraction of the metal alloy upon cooling. Further, techniques are described in which a radius of edges of a feature is configured to encourage flow and reduce voids. A variety of other techniques are also described herein. | 06-12-2014 |
20140166227 | Metal Alloy Injection Molding Overflows - Metal alloy injection molding techniques are described. In one or more implementations, these techniques may also include adjustment of injection pressure, configuration of runners, and/or use of vacuum pressure, and so on to encourage flow of the metal alloy through a mold. Techniques are also described that utilize protrusions to counteract thermal expansion and subsequent contraction of the metal alloy upon cooling. Further, techniques are described in which a radius of edges of a feature is configured to encourage flow and reduce voids. A variety of other techniques are also described herein. | 06-19-2014 |
Patent application number | Description | Published |
20080227310 | Integrated Circuit Socket - Various sockets for packaged integrated circuits and methods of making the same are provided. In one aspect, a method of mounting a semiconductor chip is provided that includes providing a package that has a base substrate with a first side and a second side opposite the first side. The second side has a central region. The package includes a semiconductor chip and a lid coupled to the first side. A socket is provided for receiving the base substrate. The socket includes a mound that projects toward the second side of the base substrate when the base substrate is seated in the socket to provide support for the central region of the base substrate. The package is mounted in the socket. The mound provides support for the central region of the base substrate. | 09-18-2008 |
20080230893 | Integrated Circuit with Package Lid - Various integrated circuit packages, lids therefor and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes providing an integrated circuit package lid that has a surface adapted to face towards an integrated circuit, and forming a wetting film on the surface. The wetting film has at least one void where the surface of the lid is exposed. The void inhibits bonding so that a stress reduction site is produced. | 09-25-2008 |
20080242001 | Lid Attachment Mechanism - Apparatus and methods for assembling semiconductor chips packages are provided. In one aspect, a method of manufacturing is provided that includes placing a first set of semiconductor chip package substrates in a first group of receptacles of a first processing station. Each of the first set of semiconductor chip package substrates has a first footprint. The receptacles of the first group being dimensioned to accommodate the first footprint. A second set of semiconductor chip package substrates is placed in a second group of receptacles of the first processing station. Each of the second set of semiconductor chip package substrates has a second footprint larger than the first footprint. The receptacles of the second group being dimensioned to accommodate the second footprint. A first set of lids is placed on the first set of semiconductor chip package substrates and a second group of lids is placed on the second set of semiconductor chip package substrates. | 10-02-2008 |
20090057884 | Multi-Chip Package - Various semiconductor chip packages and package lids are disclosed. In one aspect, a method of manufacturing is provided that includes forming a semiconductor chip package lid with a peripheral wall that defines a first interior space. A first bridge structure is formed in the first interior space. The first bridge structure is adapted to engage a surface of a substrate. | 03-05-2009 |
20100117222 | Void Reduction in Indium Thermal Interface Material - Thermal interface materials and method of using the same in packaging are provided. In one aspect, a thermal interface material is provided that includes an indium preform that has a first surface and a second surface opposite to the first surface, an interior portion and a peripheral boundary. The indium preform has a channel extending from the peripheral boundary towards the interior portion. The channel enables flux to liberate during thermal cycling. | 05-13-2010 |
Patent application number | Description | Published |
20090287324 | PORTABLE AUDIO ENHANCEMENT AND MEDIA PLAYER DEVICE - A portable audio enhancement and media player device and method are disclosed for enabling an electronic consumer product such as a personal computer, personal digital assistant (PDA), cellular phone or the like, to process and format media having different data formats such “wav” “mp3”, “mov”, “midi” files, and the like. The portable device may be connected to an electronic consumer product via a connector such as universal serial bus (USB), firewire, audio out, audio in, and the like. By connecting the portable device via one of the connectors, the portable device provides the required processors for processing audio/video media data necessary to play such data formats and enable the electronic consumer product with sound card and media player functionality. The portable device with media player functionality enables an electronic product such as a personal computer to obtain an additional secondary functionality such as audio enhancement when connected to the host computer and also aid in processing data when connected to the host computer. | 11-19-2009 |
20110007911 | METHODS FOR LOCATING EITHER AT LEAST ONE SOUND GENERATING OBJECT OR A MICROPHONE USING AUDIO PULSES - In a first aspect, there is provided a method for locating a position of at least one sound generating object using at least one audio pulse, with the at least one audio pulse being detected by a plurality of stationary microphones located at a first position being spaced apart by a pre-determined distance. In a second aspect, there is provided a method for locating a position of a microphone using audio pulses emitted from a plurality of sound generating objects. The at least one audio pulse may preferably be in a form of a logarithmic swept sine (LSS) signal, as the LSS signal is detectable at both low volumes and amidst background noises. | 01-13-2011 |
20110188673 | APPARATUS FOR ENABLING KARAOKE - There is provided an apparatus for enabling karaoke. The apparatus includes a casing for the apparatus; a microphone array incorporated within the casing, the microphone array being concealed from a user by the casing; a controller coupled to the microphone array to at least process audio signals from the user input at the microphone array; a data storage device coupled to the controller, the data storage device being for storing pre-recorded songs used for karaoke, and for storing songs as sung by the user; and an image capturing device coupled to the controller, the image capturing device being for capturing images of the user while the user is singing, with the captured images of the user being stored on the data storage device. | 08-04-2011 |
20110191598 | DOCK FOR A PORTABLE HARD DISK AND A METHOD FOR ACCESSING CONTENT ON A HOST DEVICE USING THE DOCK - There is provided a first dock for a portable hard disk, where the first dock is connectable to a host device. There is also provided a corresponding method for accessing content on the host device during use of the dock. It is advantageous that the host device is able to access content from portable hard disks that are docked with the first dock and a second dock. | 08-04-2011 |
20120026281 | DATA PROCESSING APPARATUS FOR SEGMENTAL PROCESSING OF INPUT DATA, SYSTEMS USING THE APPARATUS AND METHODS FOR DATA TRANSMITTAL - There is provided a data processing apparatus for segmental processing of input data. The apparatus includes a plurality of data processors connected in a series configuration, the plurality of data processors being able to transmit discrete data packets over a video bus to one another, with the plurality of data processors being divided into a plurality of data processing sets; and a central controller coupled to the plurality of data processors for controlling allocation of the input data to the plurality of data processing sets, the central controller being also for controlling transmission of output data from the apparatus. The apparatus incorporates several varying methods for data transmittal amongst data processors and has several applications which will be described. | 02-02-2012 |
20120027215 | EARPHONE SET - An earphone set with a first earphone and a second earphone, the earphone set comprising: a connector for connecting the first earphone and the second earphone; a memory module for storing audio data; and a power management module for preventing short circuit or inductive surge in current arising from connection or disconnection of the first earphone or the second earphone from the connector, the first earphone comprising: a first sound driver for sound production; and a power supply module for powering the earphone set; the second earphone comprising: a second sound driver for sound production; and a processing unit for converting the stored audio data in the memory module into sound producible by the first sound driver and the second sound driver, the power supply module being adapted to provide power to the first sound driver, the memory module, the second sound driver, and the processing unit, the connector enabling a functional connection between the first earphone and the second earphone, the memory module being resided in at least one of the first earphone, the second earphone and the connector, wherein the connector being coupled to at least one controller for manipulating sound produced by the first and second sound drivers and being detachably connected to the first earphone or the second earphone. | 02-02-2012 |
20120033824 | EARPHONE SET - An earphone set with a first earphone and a second earphone, the earphone set comprising: a connector for connecting the first earphone and the second earphone; a memory module for storing audio data; and a power management module for preventing short circuit or inductive surge in current arising from connection or disconnection of the first earphone or the second earphone from the connector, the first earphone comprising: a first sound driver for sound production; and a power supply module for powering the earphone set; the second earphone comprising: a second sound driver for sound production; and a processing unit for converting the stored audio data in the memory module into sound producible by the first sound driver and the second sound driver, the power supply module being adapted to provide power to the first sound driver, the memory module, the second sound driver, and the processing unit, the connector enabling a functional connection between the first earphone and the second earphone, the memory module being resided in at least one of the first earphone, the second earphone and the connector, wherein the connector being coupled to at least one controller for manipulating sound produced by the first and second sound drivers and being detachably connected to the first earphone or the second earphone. | 02-09-2012 |