Patent application number | Description | Published |
20100051939 | NITRIDE BASED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - An interfacial reaction suppressing layer | 03-04-2010 |
20110164641 | OPTICAL SEMICONDUCTOR DEVICE AND PUMPING LIGHT SOURCE FOR OPTICAL FIBER AMPLIFIER - A semiconductor device of the invention is formed so that n-type InP current blocking layers enter the inside of p-type InP cladding layers, i.e., the n-type current blocking layers ride over the upper part of the p-type InP cladding layers, so that a distance between the n-type InP current block layers composing a current blocking region is narrower than a width of the p-type cladding layers contacting with the n-type InP current blocking layers. Thereby, the semiconductor device whose leak current in the current blocking region may be reduced which permits high-output and high-temperature operations may be readily fabricated. | 07-07-2011 |
20110261849 | SEMICONDUCTOR LIGHT EMITTING ELEMENT AND METHOD OF MANUFACTURING THEREOF - A semiconductor light emitting element comprising: a buffer layer that is grown by using a growth substrate including ZnO, the buffer layer being made by using an AlGaInN-based material including In and being configured so that the growth surface thereof has a nitrogen polar plane; and an active layer that is formed on the buffer layer, the active layer being made by using an AlGaInN-based material including In and being configured so that the growth surface thereof has a group-III polar plane. | 10-27-2011 |
20130149804 | OPTICAL SEMICONDUCTOR DEVICE AND PUMPING LIGHT SOURCE FOR OPTICAL FIBER AMPLIFIER - A semiconductor device of the invention is formed so that n-type InP current blocking layers enter the inside of p-type InP cladding layers, i.e., the n-type current blocking layers ride over the upper part of the p-type InP cladding layers, so that a distance between the n-type InP current block layers composing a current blocking region is narrower than a width of the p-type cladding layers contacting with the n-type InP current blocking layers. Thereby, the semiconductor device whose leak current in the current blocking region may be reduced which permits high-output and high-temperature operations may be readily fabricated. | 06-13-2013 |
Patent application number | Description | Published |
20110064937 | COMPOSITION FOR PRECIOUS METAL SINTERING, PROCESS FOR PRODUCING PRECIOUS METAL SINTER AND PRECIOUS METAL SINTER - A composition for precious metal sintering that yields a precious metal sinter for use in jewelry, ornaments, accessories, etc., by sintering, especially that realizes not only production of a precious metal sinter even when the precious metal content per volume of the composition for precious metal sintering is reduced but also in a striking reduction of the weight of the precious metal sinter. Further, there are disclosed a process for producing the precious metal sinter and the precious metal sinter. This composition for precious metal sintering is characterized by comprising a mixture of precious metal powder, hollow glass powder and organic binder solution. | 03-17-2011 |
20120100393 | METHOD FOR PRODUCING DECORATIVE METALLIC ARTICLE HAVING WOODGRAIN METAL PATTERN, AND DECORATIVE METALLIC ARTICLE HAVING WOODGRAIN METAL PATTERN - Provided are a method for producing a decorative metallic article having a wood grain metal pattern and the decorative metallic article having the wood grain metal pattern; the decorative metallic article comprising a sintered copper part produced by sintering a plastic copper containing clay compound, and a sintered silver part produced by sintering a plastic silver containing clay compound. The method comprises: a plate forming step of forming the plastic copper containing clay compound and the plastic silver containing clay compound into plate-like shapes respectively, so as to produce a copperplate and a silver plate; a multi layering and adhesion step of mutually laminating the copper and silver plates one another, and elongating the plates so that a thickness of the laminated plates decreases in 10% or more, thereby to adhesively paste the laminated plates together; a decorative object forming step of forming a multi layered decorative copper-silver object by using the multi layered plate; a multi layered decorative copper-silver object drying step of drying the multi layered decorative copper-silver object; a wood grain metal pattern forming step of cutting or polishing a surface of the dried multi layered decorative copper-silver object to form notches so that the wood grain metal pattern appears on the decorative object; and the sinter producing step of sintering the decorative object on which the notches are formed, thereby to obtain the decorative metallic article ( | 04-26-2012 |
20120107167 | METHOD FOR PRODUCING SINTERED COPPER ARTICLE FOR CRAFT OR DECORATIVE USE, AND PLASTIC COPPER CONTAINING CLAY COMPOUND - A method for producing a sintered copper article for craft or decorative use made of copper or a copper alloy which can be sintered in the air by using a general heating furnace, and a plastic copper containing clay compound are provided. The method for producing the sintered copper article for craft or decorative use of the present invention comprises the steps of forming a shaped copper object using the copper containing clay compound which includes at least one kind of a powder selected from a copper powder or a copper alloy powder that contains copper in 50 wt % or more together with an organic binder, and subsequently sintering the shaped copper object, thereby to obtain a shaped copper sinter. Herein, the mean particle diameter of the powder included in the copper containing clay compound is restricted to 10 μm or less, whereby the shaped copper sinter is obtained by sintering the shaped copper object in the air. | 05-03-2012 |
20120107561 | METHOD FOR PRODUCING DECORATIVE METALLIC ARTICLE WITH WOOD GRAIN METAL PATTERN, AND DECORATIVE METALLIC ARTICLE WITH WOOD GRAIN METAL PATTERN - Provided are a method for producing a decorative metallic article with a wood grain metal pattern and the decorative metallic article with the wood grain metal pattern; the decorative metallic article comprising a sintered copper part produced by sintering a plastic copper containing clay compound, and a sintered silver part produced by sintering a plastic silver containing clay compound. The method comprises: a plate forming step of forming a copper plate and a silver plate; a multi layering and adhesion step of mutually laminating the copper and silver plates one another by applying water to the surfaces of the plates, and elongating the laminated plates so that a thickness thereof decreases in 10% or more, thereby to adhesively paste together; a wood grain metal plate forming step of forming a wood grain pattern by carving the surface of the multi layered plate produced in the multi layering and adhesion step so as to expose at least a part of the plurality of plate layers, and elongating the surface of the multi layered plate to become flat; a decorative object forming step of forming a decorative object by using the prepared wood grain metal plate; a decorative object drying step of drying the decorative object; and a sinter producing step of sintering the decorative object produced in the decorative object drying step, thereby to obtain the decorative metallic article. | 05-03-2012 |
20120164483 | METHOD FOR PRODUCING DECORATIVE METALLIC ARTICLE, AND DECORATIVE METALLIC ARTICLE - Are disclosed a method for producing a decorative metallic article and the decorative metallic article, used in jewelry goods, ornaments, clothing accessories or the like, the decorative metallic article being produced by joining a silver alloy composition for firing which comprises silver or a silver alloy to another composition for firing which comprises copper or a copper alloy. The method for producing a decorative metallic article comprises the steps of: forming a shaped copper sinter by forming a shaped copper object using a plastic copper composition containing an organic binder and at least one kind of a powder metal selected from copper and a copper alloy, and subsequently by firing the shaped copper object to obtain a shaped copper sinter ( | 06-28-2012 |