Patent application number | Description | Published |
20130184406 | RESIN COMPOSITION AND MANUFACTURING PROCESS THEREFOR - A polyamic acid resin composition includes (a) a polyamic acid having structures represented by general formula (1) in an amount of at least 80% of all the repeating units and (b) a solvent. In formula (1), A is a polyamic acid block represented by general formula (2); B is a polyamic acid block represented by general formula (3); and k is a positive integer. In formula (2), Ws are divalent organic groups having two or more carbon atoms, mainly composed of divalent organic groups represented by general formula (4); Xs are tetravalent organic groups having two or more carbon atoms. In formula (3), Ys are divalent organic groups having two or more carbon atoms, exclusive of the groups represented by formula (4); Zs are tetravalent organic groups each having two or more carbon atoms, and are mainly composed of tetravalent organic groups represented by general formula (5) or (6). | 07-18-2013 |
20130260020 | BINDER FOR LITHIUM ION BATTERY ELECTRODE, PASTE FOR LITHIUM ION BATTERY NEGATIVE ELECTRODE, AND METHOD FOR PRODUCING LITHIUM ION BATTERY NEGATIVE ELECTRODE - The present invention is directed to a binder for a lithium ion battery electrode, comprising a polyimide precursor having a tetracarboxylic acid residue and a diamine residue and/or a polyimide, the polyimide precursor having a residue of a tetracarboxylic dianhydride selected from those represented by the following general formulas (1) and (2) as the tetracarboxylic acid residue, and a residue of a diamine selected from those represented by the following general formulas (3) and (4) as the diamine residue, the content of the acid residue being from 0.90 to 0.95 moles based on 1 mole of the diamine residue. | 10-03-2013 |
20130289202 | POLYAMIC ACID RESIN COMPOSITION AND METHOD OF PRODUCING THE SAME - The disclosed polyamic acid resin composition contains (a) a polyamic acid represented by general formula (1) or (2), and (b) a solvent. (A, A′, C, C′ are end-capped polyamic acid blocks comprising diaminobenzanilide and pyromellitic dianhydride or benzophenone tetracarboxylic dianhydride, and B, or D, is a polyamic acid block comprising a repeating unit other than A, A′, or C, C′. | 10-31-2013 |
20140005318 | EPOXY RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND SEMICONDUCTOR DEVICE USING SAME | 01-02-2014 |
20140191222 | RESIN COMPOSITION AND DISPLAY DEVICE USING THE SAME - The resin composition of the present invention is a resin composition characterized by including (a) a polyimide, a polybenzoxazole, a polyimide precursor or a polybenzoxazole precursor, (b) 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, or 2,3-dihydroxynaphthalene, and (c) a thermal cross-linking agent having a specific structure. By the use of the resin composition of the present invention, it is possible to reduce the transmittance in the visible region of a cured film while maintaining the transmittance of a resin film before curing. | 07-10-2014 |
20150017534 | RESIN COMPOSITION FOR LITHIUM ION CELL POSITIVE ELECTRODE - Disclosed is a resin composition for positive electrodes of lithium ion cells, which imparts strong adhesiveness and electrolyte injectability and shows good discharge and charge characteristics and input-output characteristics with smaller amount of a binder. The resin composition for positive electrodes of lithium ion cells is a resin composition for positive electrodes of lithium ion cells, which comprises a polyimide precursor whose average thermal linear expansion coefficient in the range of 20° C. to 200° C. after being imidized is 3 to 50 ppm, and/or a polyimide whose average thermal linear expansion coefficient in the range of 20° C. to 200° C. is 3 to 50 ppm, and a positive electrode active compound, wherein the positive electrode active compound is one obtained by coating the surface of a composite oxide containing lithium with a lithium ion conductive material. | 01-15-2015 |
20150045502 | POLYAMIDE ACID AND RESIN COMPOSITION CONTAINING SAME - The invention aims to provide polyamic acid that can form a varnish with a low viscosity and serves to produce, through curing, coat film with good mechanical characteristics and further aims to produce cured coat film with good mechanical characteristics regardless of whether the molar concentration of the acid anhydride group in the acid dianhydride monomer and that of the amino group in the multivalent amine compound or diamine compound are identical to or different from each other. This objective is met by polyamic acid including a structure as represented by chemical formula (1) given below: (In chemical formula (1), δ represents an oxygen or sulfur atom and W represents an electron-withdrawing group, and R | 02-12-2015 |
20150203631 | POLYAMIC ACID RESIN COMPOSITION, POLYIMIDE FILM USING SAME, AND METHOD FOR PRODUCING SAID POLYIMIDE FILM - An object is to provide a polyamic acid resin composition that can form a varnish with a low viscosity and serves to produce, through curing, coat film with good mechanical characteristics. Another object is to provide a polyamic acid resin composition in which the acid anhydride terminal group is low in reactivity with diamine and which can give a varnish that does not suffer significant precipitation of diamine. These objects can be met by a polyamic acid resin composition that contains: (a) polyamic acid and (b) a compound as represented by chemical formula (1). (In Chemical formula (1), Z is a di- or higher-valent organic group containing 2 or more carbon atoms, V is a structure as represented by chemical formula (2), and k is an integer of 2 or more.) (In In Chemical formula (2), δ represents oxygen or sulfur atom and W represents an electron-withdrawing group, and R | 07-23-2015 |
20150212412 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE INCLUDING CURED FILM USING THE SAME - The present invention provides a positive-type photosensitive resin composition capable of obtaining a cured film which exhibits low warpage, and is also excellent in high sensitivity and high resolution during firing at a lower temperature of 250° C. or lower. Disclosed is a positive-type photosensitive resin composition including (a) a polyimide resin including a structural unit represented by the general formula (1) and a structural unit represented by the general formula (2), and (b) a quinonediazide compound, wherein the polyimide resin including a structural unit represented by the general formula (1) and a structural unit represented by the general formula (2) has an imidation ratio of 85% or more, and also a ratio of the structural unit represented by the general formula (1) to the structural unit represented by the general formula (2) is within a range of 30:70 to 90:10, in which X | 07-30-2015 |
20150219991 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION - Disclosed is a positive-type photosensitive resin composition including (a) an alkali-soluble polyimide, (b) a compound having two or more epoxy groups in a molecule, and (c) a photo acid generator, wherein the content of the compound having two or more epoxy groups in a molecule (b) is within a range of 5 to 50 parts by weight based on 100 parts by weight of the alkali-soluble polyimide (a). The present invention provides a positive-type photosensitive resin composition capable of obtaining a high-resolution cured film which exhibits low warpage and also does not cause pattern embedment by reflow during a heating treatment at a low temperature of 200° C. or lower. | 08-06-2015 |
20160002407 | POLYIMIDE PRECURSOR, POLYIMIDE, FLEXIBLE SUBSTRATE PREPARED THEREWITH, COLOR FILTER AND PRODUCTION METHOD THEREOF, AND FLEXIBLE DISPLAY DEVICE - The present invention is based on a polyimide precursor having unit structures represented by general formula (1) and unit structures represented by general formula (2), provides a polyimide precursor for which film whitening, cracking and bubbling do not occur regardless of film baking conditions, and provides a flexible TFT array, a flexible color filter, and a flexible substrate with a gas barrier layer using the polyimide precursor, and a flexible display device, etc. using same. (In general formulas (1) and (2), X | 01-07-2016 |
Patent application number | Description | Published |
20120186866 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a core substrate having an opening portion and a through hole adjacent to the opening portion, a capacitor positioned in the opening portion, and a through-hole conductor formed in the through hole of the core substrate and having a conductor filling the through hole. The core substrate has a first surface and a second surface on the opposite side of the first surface, the opening portion of the core substrate penetrates from the first surface to the second surface, the through-hole conductor has a first conductive portion and a second conductive portion connected to the first conductive portion in the core substrate, the first conductive portion of the through-hole conductor becomes narrower from the first surface toward the second surface, and the second conductive portion of the through-hole conductor becomes narrower from the second surface toward the first surface. | 07-26-2012 |
20120217607 | WIRING BOARD WITH BUILT-IN IMAGING DEVICE AND METHOD FOR MANUFACTURING SAME - A wiring board with a built-in imaging element includes a substrate having an accommodation portion and a first surface and a second surface on the opposite side of the first surface, an imaging device having a light receiver and positioned in the accommodation portion of the substrate such that the light receiver faces the first surface of the substrate, and a buildup structure formed on the first surface of the substrate and having insulation layers and conductive layers. The buildup structure has an opening portion formed such that the light receiver of the imaging device is exposed from the opening portion of the buildup structure, and the insulation layers in the buildup structure include a first insulation layer formed on the first surface of the substrate. | 08-30-2012 |
20120287586 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a substrate having an opening portion, multiple electronic devices positioned in the opening portion, and an insulation layer formed on the substrate such that the insulation layer covers the electronic devices in the opening portion of the substrate. The substrate has a wall surface defining the opening portion and formed such that the opening portion is partially partitioned and the electronic devices are kept from making contact with each other. | 11-15-2012 |
20130081866 | PRINTED WIRING BOARD - A printed wiring board includes a core substrate having a penetrating hole, a first conductive layer on a first surface of the substrate, a second conductive layer on a second surface of the substrate, a first electronic component having an electrode and accommodated in the hole such that the electrode faces the first surface, a first structure on the first surface and including a pad for mounting a second electronic component on the first structure and a via conductor connected to the electrode, and a second structure on the second surface. The electrode has an upper surface facing toward the first surface, the first layer has an upper surface facing away from the first surface, and the first component is positioned in the hole such that the upper surface of the electrode forms a gap with the upper surface of the first layer. | 04-04-2013 |
20130081870 | MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD - A method for manufacturing a multilayer printed wiring board includes preparing a metal layer having metal member portions and connector portions connecting the metal member portions, forming laminated multilayer structures having electronic components and the metal member portions, respectively, forming cut penetrating holes in the connector portions of the metal layer, respectively, such that the connector portions of the metal layer are cut, and forming interlayer insulation layers on the laminated multilayer structures such that the laminated multilayer structures are interposed between the interlayer insulation layers. The forming of the interlayer insulation layers includes filling the cut penetrating holes with a resin derived from one or more interlayer insulation layers on the laminated multilayer structures. | 04-04-2013 |
20130192884 | PRINTED WIRING BOARD - A printed wiring board includes a core substrate, an electronic component accommodated in the substrate, a first buildup structure formed on surface of the substrate and including an interlayer insulation layer, and a second buildup structure formed on the opposing surface of the substrate and including an interlayer insulation layer. The substrate includes a core material portion including multiple resin layers, a first conductive layer formed on first surface of the core portion and a second conductive layer formed on second surface of the core portion, the core portion has opening through the resin layers and accommodating the component, the insulation layer of the first structure is positioned such that the opening of the core portion is covered on the first surface, and the insulation layer of the second structure is positioned such that the opening of the core portion is covered on the second surface. | 08-01-2013 |
20130256007 | WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a substrate having a cavity, an electronic component positioned in the cavity and having a first-side electrode on one side of the electronic component and a second-side electrode on the opposite side of the electronic component, an insulation layer formed on a surface of the substrate and the electronic component such that the insulation layer covers the electronic component positioned in the substrate, and a conductive layer formed on the surface of the substrate and including linear conductive patterns surrounding an opening of the cavity on the surface of the substrate. The linear conductive patterns include a first linear conductive pattern positioned adjacent to the first-side electrode and a second linear conductive pattern positioned adjacent to the second-side electrode such that the first linear conductive pattern and the second linear conductive pattern are insulated from each other. | 10-03-2013 |
20140153205 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a substrate having an opening portion, multiple electronic devices positioned in the opening portion such that the electronic devices are arrayed in the lateral direction of each of the electronic devices, and an insulation layer formed on the substrate such that the insulation layer covers the electronic devices in the opening portion of the substrate. The substrate has a wall surface defining the opening portion and formed such that the opening portion is partially partitioned and the electronic devices are kept from making contact with each other. | 06-05-2014 |
Patent application number | Description | Published |
20160007451 | CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A circuit substrate includes a core substrate having cavity penetrating through the core substrate, a metal block accommodated in the cavity of the core substrate, a first build-up layer including an insulating layer and laminated on first side of the core substrate such that the first build-up layer is covering the cavity on the first side of the core substrate, and a second build-up layer including an insulating layer and laminated on second side of the core substrate such that the second build-up layer is covering the cavity on the second side of the core substrate, and a filling resin filling gap formed between the cavity and block positioned in the cavity of the core substrate. The block has roughened surfaces such that the roughened surfaces are in contact with the insulating layers in the first and second build-up layers on the first and second sides of the core substrate. | 01-07-2016 |
20160007468 | CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A circuit substrate includes a core substrate having cavity, metal blocks in the cavity, first and second build-up layers including insulating layers and laminated on first and second sides of the core substrate such that the insulating layers are covering the cavity, and a filling resin filling gap formed between the cavity and metal blocks in the cavity. The cavity is penetrating through the core substrate, the core substrate has an intracavity projection structure projecting from one or more side surfaces of the cavity such that the projection structure is positioned between the metal blocks and separating the metal blocks from contacting each other in the cavity, the first build-up layer has first conductors connected to the metal blocks such that each first conductor conducts electricity or heat, and the second build-up layer has second conductors connected to the metal blocks such that each second conductor conducts electricity or heat. | 01-07-2016 |
20160105957 | WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A wiring board with a built-in electronic component includes a substrate having a cavity, an interlayer insulating layer formed on the substrate such that the interlayer insulating layer is covering the cavity of the substrate, a conductor layer formed on the interlayer insulating layer, an electronic component accommodated in the cavity of the substrate and including a rectangular cuboid body and three terminal electrodes such that each of the three terminal electrodes has a metal film form formed on an outer surface of the rectangular cuboid body, and via conductors formed in the interlayer insulating layer such that the via conductors are connecting the conductor layer and the three terminal electrodes of the electronic component. The three terminal electrodes are arrayed in parallel on the outer surface of the rectangular cuboid body such that adjacent terminal electrodes have the opposite polarities. | 04-14-2016 |
20160105966 | WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A wiring board with a built-in electronic component includes a substrate having cavity, an insulating layer formed on the substrate such that the insulating layer is covering the cavity, a conductor layer formed on the insulating layer, and an electronic component accommodated in the cavity and including a rectangular cuboid body and terminal electrodes such that each electrode has a metal film form formed on outer surface of the body, and via conductors formed in the insulating layer such that the via conductors are connecting the conductor layer and electrodes. The electrodes are arrayed in a matrix having rows and columns such that adjacent electrodes in row and column directions have the opposite polarities, and the conductor layer includes a line pattern shunting first group of the electrodes in one polarity and a solid pattern shunting second group of the electrodes in the other polarity. | 04-14-2016 |
20160143134 | WIRING BOARD WITH BUILT-IN METAL BLOCK AND METHOD FOR MANUFACTURING THE SAME - A wiring board with built-in metal block includes a substrate having a cavity penetrating through the substrate, a metal block accommodated in the cavity and having first surface, second surface, and side surface connecting outer edges of the first and second surface, filling resin filling gap between inner side surface of the substrate in the cavity and the side surface of the block, a first build-up layer laminated on first surface of the substrate and including an insulating layer such that the first layer is covering the cavity and the first surface of the block, and a second build-up layer laminated on second surface of the substrate and including an insulating layer such that the second layer is covering the cavity and the second surface of the block. The side surface of the block is recessed such that the side surface of the block is forming a groove shape. | 05-19-2016 |
Patent application number | Description | Published |
20130021657 | ELECTROOPTIC DEVICE AND ELECTRONIC APPARATUS - An electrooptic device includes first and second substrates that are disposed opposing each other with an electrooptic material layer therebetween, a sealing material that bonds the first and second substrates, a pixel area, and an ion trap portion between the pixel area and the sealing material. The ion trap portion includes first and second electrodes that are formed in a comb-tooth shape and are disposed so that branch electrodes of the first electrode and branch electrodes of the second electrode are engaged with each other. A direction of the branch electrodes intersects with an orientation direction of the electrooptic material at an interface between the electrooptic material layer and the first substrate. | 01-24-2013 |
20130300961 | DISPLAY DEVICE - Provided is a liquid crystal panel including a liquid crystal layer interposed between a first substrate and a second substrate, and a peripheral electrode arranged so as to surround a pixel region; a lamp irradiating a liquid crystal layer with light; and a fan increasing the temperature of the liquid crystal panel during an off sequence higher than the temperature of the liquid crystal panel before a falling period. | 11-14-2013 |
20130302921 | METHOD FOR PRODUCING ELECTRO-OPTICAL DEVICE AND SUBSTRATE FOR ELECTRO-OPTICAL DEVICE - Disclosed is a method for producing an electro-optical device, which includes a step of defining sealing materials on either an element substrate side of a mother substrate or an opposing substrate side of the mother substrate, a step of supplying liquid crystal inside the sealing materials, a step of bonding the element substrate side of the mother substrate and the opposing substrate side of the mother substrate together, and a step of hardening the sealing materials in order to apply a predetermined potential to a peripheral electrode provided between a pixel region and sealing materials in at least a portion of the steps. | 11-14-2013 |
20140307190 | DRIVING METHOD FOR LIQUID CRYSTAL DEVICE, LIQUID CRYSTAL DEVICE, AND ELECTRONIC DEVICE - In a liquid crystal device, pixel electrodes and a common electrode that opposes the pixel electrodes on another side of a liquid crystal layer are formed in a display region serving as a first region, and dummy pixel electrodes serving as first electrodes are formed in a dummy pixel region serving as a second region. A driving method for the liquid crystal device applies a voltage that is lower than a threshold voltage at which the transmissibility of liquid crystals changes between the dummy pixel electrodes and the common electrode. Accordingly, the dummy pixel electrodes can function as an electricity parting portion and ionic impurities can be pulled from the display region to the dummy pixel electrodes. | 10-16-2014 |
20140368481 | DRIVING METHOD FOR LIQUID CRYSTAL DEVICE, LIQUID CRYSTAL DEVICE, AND ELECTRONIC DEVICE - A driving method for a liquid crystal device, which has a first electrode, a second electrode, and a third electrode for trapping ions, includes applying AC signals having the same frequency but whose phases in an amount of time corresponding to a single cycle are shifted relative to each other to the first electrode, the second electrode, and the third electrode, respectively, so that the distribution of an electrical field produced between the first electrode, the second electrode, and the third electrode is scrolled from the first electrode to the third electrode over time. | 12-18-2014 |
20150198827 | LIQUID CRYSTAL DEVICE, METHOD OF MANUFACTURING LIQUID CRYSTAL DEVICE, AND ELECTRONIC APPARATUS - There is provided a liquid crystal device including an element substrate, a counter substrate which is arranged to face the element substrate, a liquid crystal layer which is arranged between the element substrate and the counter substrate, and inorganic alignment films which are arranged between the element substrate and the liquid crystal layer and between the counter substrate and the liquid crystal layer. A silane compound film with which a fullerene is modified is arranged to cover the inorganic alignment film. | 07-16-2015 |
20150201172 | PROJECTION TYPE DISPLAY APPARATUS AND LIGHTING DEVICE - In a projection type display apparatus, a lighting device includes two reflection type cutoff filters (first cutoff filter and reflective second cutoff filter) which block out ultraviolet range light on an output optical path from a light source. A cut on wavelength of the second cutoff filter on the front side is longer than that of the first cutoff filter on the rear side. The two cutoff filters are formed on planar-shaped first faces of a first integrator lens and a second integrator lens. For this reason, both input faces of the two cutoff filters are orthogonal to an apparatus optical axis. | 07-16-2015 |
Patent application number | Description | Published |
20100093909 | ROUNDISH FUSED ALUMINA PARTICLES, PRODUCTION PROCESS THEREOF, AND RESIN COMPOSITION CONTAINING THE PARTICLES - A roundish fused alumina particles having a mean particle size of 5 to 4,000 μm and a roundness of 0.85 or more, and a producing method thereof are provided. The method comprises removing edges of fused alumina particles by making the fused alumina particles collide with each other. | 04-15-2010 |
20130305615 | METHOD FOR PRODUCING ALUMINA SINTERED BODY, ALUMINA SINTERED BODY, ABRASIVE GRAINS, AND GRINDSTONE - Provided are a method for producing an alumina sintered compact satisfying the following (1) and (2), which comprises mixing and sintering an ilmenite powder and an alumina powder; the alumina sintered compact obtained according to the production method; and an abrasive grain and a grain stone.
| 11-21-2013 |
20130305616 | ALUMINA SINTERED BODY, ABRASIVE GRAINS, AND GRINDSTONE - Provided are an alumina sintered compact containing a titanium compound and an iron compound, wherein FeTiAlO | 11-21-2013 |
20130312336 | ALUMINA SINTERED BODY, ABRASIVE GRAINS, AND GRINDSTONE - Provided are an alumina sintered compact containing a titanium compound and an iron compound, wherein the total amount of the TiO | 11-28-2013 |
Patent application number | Description | Published |
20100111753 | Pb-FREE COPPER-BASED SINTERED SLIDING MATERIAL - [Task] The adhesion resistance of Cu—Bi based or Cu—Sn—Bi based alloy is lower than that of Cu—Sn—Pb based alloy, and also since conformability of the former alloy is low. Therefore, when Bi of the former alloy adheres onto an opposite shaft, seizure of the former alloy is likely to occur as compared with the case of the latter Cu—Sn—Pb based alloy. In is alloyed in the Bi phase of the Cu—Sn—Bi—In based copper alloy. The In-alloyed Bi phase has a considerably low melting point and therefore the sliding properties deteriorate. | 05-06-2010 |
20110020171 | PROCESS FOR PRODUCTION OF SINTERED COPPER ALLOY SLIDING MATERIAL AND SINTERED COPPER ALLOY SLIDING MATERIAL - Seizure resistance and wear resistance of Cu—Bi—In copper-alloy sliding material are enhanced by forming a soft phase of as pure as possible Bi. | 01-27-2011 |
20130022301 | ALUMINUM ALLOY FOR PLAIN BEARING, PLAIN BEARING AND PRODUCTION METHOD FOR THE BEARING - With regard to an Al—Cr—Zr based alloy having annealing temper, a high temperature strength at 180 to 200 degrees C. is ensured. An aluminum alloy for a plain bearing having improved fatigue resistance is to be provided. An aluminum alloy for a plain bearing solving the problems has a composition of 3 to 7 mass % Mg, 0.1 to 0.3 mass % Cr, and 0.1 to 0.3 mass % Zr, with the balance being Al and inevitable impurities. A principal structure of the aluminum alloy consist of an Al matrix containing solute Mg, minute particles of Cr, and Zr. | 01-24-2013 |
20140147326 | PROCESS FOR PRODUCTION OF SINTERED COPPER ALLOY SLIDING MATERIAL AND SINTERED COPPER ALLOY SLIDING MATERIAL - Seizure resistance and wear resistance of Cu—Bi—In copper-alloy sliding material are enhanced by forming a soft phase of as pure as possible Bi. Mixed powder of Cu—In cuprous alloy powder and Cu—Bi containing Cu-based alloy powder is used. A sintering condition is set such that Bi moves outside particles of said Cu—Bi containing Cu-based powder and forms a Bi grain-boundary phase free of In, and In diffuses from said Cu—In containing Cu-based powder to said Cu—Bi containing Cu-based powder. | 05-29-2014 |
20140303050 | SLIDING MEMBER AND SLIDING MATERIAL COMPOSITION - An object of the present invention is to provide a sliding member capable of rapidly wrapping a mating member, and reducing the surface roughness of the mating member after wrapping. The present invention relates to a sliding member for sliding with a mating member subjected to hardening treatment, the sliding member including a coating layer containing a binder resin, molybdenum disulfide, and hard substance particles in massive form. | 10-09-2014 |
20150018255 | SLIDING MEMBER AND SLIDING MATERIAL COMPOSITION - An object of the present invention is to provide a sliding member suitable to a soft mating member low in hardness. The present invention relates to a sliding member for sliding with a mating member having a ferrite phase at least on a surface thereof, the sliding member including a coating layer containing a binder resin, molybdenum disulfide, and hard substance particles. | 01-15-2015 |
20150055899 | SLIDING MEMBER AND METHOD FOR MANUFACTURING SLIDING MEMBER - According to the manufacturing method of a bearing which is a sliding member, a bimetal sintered alloy is formed by sintering a metal powder on a surface of a back metal which is a plate shaped metal member to form a sintered layer. In addition, following this, the sintered alloy is molded as a cylindrical bush and the bush undergoes a heat treatment. Following this, the bearing is formed by press-fitting the bush into a collar which is a cylindrical metal member. | 02-26-2015 |