Chou, Hsin-Chu
Bor-Bin Chou, Hsin-Chu TW
Patent application number | Description | Published |
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20150066211 | DEVICE AND METHOD FOR CONTROLLING A FAN OF A DISPLAY - A device is suitable for controlling a rotation-speed of a fan of a display. The device includes a temperature sensor for sensing a current temperature of the display, a memory for storing the current temperature of the display and a first and a second setting-temperature and a control module coupled to the temperature sensor and the memory and adapted to couple to the fan of the display. The control module compares the current temperature of the display with the first and the second setting-temperatures and judging the variation of the current temperature of the display to control the rotation-speed of the fan. If the control module judges out the current temperature of the display sensed by the temperature sensor rises, the control module raises the rotation-speed of the fan when the rotation-speed of the fan is lower than a maximum rotation-speed. | 03-05-2015 |
Bruce C.s. Chou, Hsin-Chu TW
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20130020718 | MEMS Devices and Methods of Forming Same - The present invention provides a MEMS structure comprising confined sacrificial oxide layer and a bonded Si layer. Polysilicon stack is used to fill aligned oxide openings and MEMS vias on the sacrificial layer and the bonded Si layer respectively. To increase the design flexibility, some conductive polysilicon layer can be further deployed underneath the bonded Si layer to form the functional sensing electrodes or wiring interconnects. The MEMS structure can be further bonded to a metallic layer on top of the Si layer and the polysilicon stack. | 01-24-2013 |
20130277771 | Capacitive Sensors and Methods for Forming the Same - A device includes a semiconductor substrate, and a capacitive sensor having a back-plate, wherein the back-plate forms a first capacitor plate of the capacitive sensor. The back-plate is a portion of the semiconductor substrate. A conductive membrane is spaced apart from the semiconductor substrate by an air-gap. A capacitance of the capacitive sensor is configured to change in response to a movement of the polysilicon membrane. | 10-24-2013 |
20130277777 | MEMS Device Structure and Methods of Forming Same - A microelectromechanical system (MEMS) device may include a MEMS structure above a first substrate. The MEMS structure comprising a central static element, a movable element, and an outer static element. A portion of bonding material between the central static element and the first substrate. A second substrate above the MEMS structure, with a portion of a dielectric layer between the central static element and the second substrate. A supporting post comprises the portion of bonding material, the central static element, and the portion of dielectric material. | 10-24-2013 |
20130307095 | Composite Wafer Semiconductor - A composite wafer semiconductor device includes a first wafer and a second wafer. The first wafer has a first side and a second side, and the second side is substantially opposite the first side. The composite wafer semiconductor device also includes an isolation set is formed on the first side of the first wafer and a free space is etched in the isolation set. The second wafer is bonded to the isolation set. A floating structure, such as an inertia sensing device, is formed in the second wafer over the free space. In an embodiment, a surface mount pad is formed on the second side of the first wafer. Then, the floating structure is electrically coupled to the surface mount pad using a through silicon via (TSV) conductor. | 11-21-2013 |
20140103941 | CAPACITIVE SENSING ARRAY DEVICE WITH HIGH SENSITIVITY AND ELECTRONIC APPARATUS USING THE SAME - A capacitive sensing array device of an electronic apparatus includes sensing electrodes, a shielding conductor layer, a coupling signal source, a constant voltage source and switch modules. The coupling signal source provides a coupling signal coupled to an object. The constant voltage source provides a constant voltage to the shielding conductor layer to form a stable vertical parasitic capacitor between the shielding conductor layer and each sensing electrode. Each switch module is electrically connected to the constant voltage source via the corresponding sensing electrode. When one sensing electrode is selected to perform sensing, the corresponding switch module is configured as an open-circuited state such that the selected sensing electrode is disconnected from the constant voltage source, while the other sensing electrodes are electrically connected to the constant voltage source to form a stable horizontal parasitic capacitor between the selected sensing electrode and the other sensing electrodes. | 04-17-2014 |
20140140588 | BIOMETRICS SENSOR MODULE, ASSEMBLY, MANUFACTURING METHOD AND ELECTRONIC APPARATUS USING SUCH BIOMETRICS SENSOR MODULE - A biometrics sensor module includes a housing, a biometrics sensor and a coupling electrode. The housing has a first surface and a second surface opposite to the first surface. The biometrics sensor has a sensing surface, which is disposed on the first surface of the housing and has sensing members arranged in an array. The coupling electrode is disposed on the first or second surface of the housing. Two regions, projected from the sensing surface and the coupling electrode to the second surface of the housing, do not overlap with each other. A coupling signal is provided to the coupling electrode and directly or indirectly couples the coupling signal to an object, so that the sensing members of the biometrics sensor sense biometrics messages of the object contacting with the second surface of the housing. | 05-22-2014 |
20140151823 | MEMS DEVICES AND METHODS OF FORMING SAME - The present invention provides a MEMS structure comprising confined sacrificial oxide layer and a bonded Si layer. Polysilicon stack is used to fill aligned oxide openings and MEMS vias on the sacrificial layer and the bonded Si layer respectively. To increase the design flexibility, some conductive polysilicon layer can be further deployed underneath the bonded Si layer to form the functional sensing electrodes or wiring interconnects. The MEMS structure can be further bonded to a metallic layer on top of the Si layer and the polysilicon stack. | 06-05-2014 |
20140168121 | ELECTRONIC APPARATUS WITH HIDDEN SENSOR GUIDING INDICATION AND INSTINCTIVE GUIDING METHOD APPLIED TO SUCH APPARATUS - An electronic apparatus with a hidden sensor guiding indication includes a housing, a display, a biometrics sensor and a processor. The display is visually disposed in the housing. The biometrics sensor, hidden in the housing and disposed beside the display, senses a biometrics message of a user. The processor, disposed in the housing and electrically connected to the display and the biometrics sensor, controls operations of the display and the biometrics sensor. In a sensing mode, the processor controls the display to display a guiding message to instinctively guide the user to operate the hidden biometrics sensor, disposed beside the display, to sense the biometrics message. An instinctive guiding method is also disclosed. | 06-19-2014 |
20140168167 | STRAY-LIGHT-COUPLED BIOMETRICS SENSING MODULE AND ELECTRONIC APPARATUS USING THE SAME - A stray-light-coupled biometrics sensing module includes a light-transparent body, a display unit and an optical module. The light-transparent body has a front side and a backside. The front side is configured to support an organic object thereon. The display unit attached to the backside of the light-transparent body displays a frame. The optical module is attached to the backside of the light-transparent body through an adhesive, and is disposed adjacent to the display unit. First light rays of the frame emitted from an eye-viewing screen couple into the organic object through the light-transparent body. After travelling a short distance in the organic object, the first light rays couple out of the organic object and re-enter the light-transparent body as second light rays entering the optical module. The optical module senses the second light rays to generate a biometrics image signal. An electronic apparatus is also disclosed. | 06-19-2014 |
20140213008 | Capacitive Sensors and Methods for Forming the Same - A device includes a semiconductor substrate, and a capacitive sensor having a back-plate, wherein the back-plate forms a first capacitor plate of the capacitive sensor. The back-plate is a portion of the semiconductor substrate. A conductive membrane is spaced apart from the semiconductor substrate by an air-gap. A capacitance of the capacitive sensor is configured to change in response to a movement of the polysilicon membrane. | 07-31-2014 |
20140217604 | Package Structure and Methods of Forming Same - A semiconductor device includes a first die having a first active surface and a first backside surface opposite the first active surface, a second die having a second active surface and a second backside surface opposite the second active surface, and an interposer, the first active surface of the first die being electrically coupled to a first side of the interposer, the second active surface of the second die being electrically coupled to a second side of the interposer. The semiconductor device also includes a first connector over the interposer, a first encapsulating material surrounding the second die, the first encapsulating material having a first surface over the interposer, and a via electrically coupling the first connector and the interposer. A first end of the via is substantially coplanar with the first surface of the first encapsulating material. | 08-07-2014 |
20140264698 | Image Sensor Device and Method - A system and method for blocking heat from reaching an image sensor in a three dimensional stack with a semiconductor device. In an embodiment a heat sink is formed in a back end of line process either on the semiconductor device or else on the image sensor itself when the image sensor is in a backside illuminated configuration. The heat sink may be a grid in either a single layer or in two layers, a zig-zag pattern, or in an interleaved fingers configuration. | 09-18-2014 |
20140264948 | Air Trench in Packages Incorporating Hybrid Bonding - A package component includes a surface dielectric layer including a planar top surface, a metal pad in the surface dielectric layer and including a second planar top surface level with the planar top surface, and an air trench on a side of the metal pad. The sidewall of the metal pad is exposed to the air trench. | 09-18-2014 |
20140306341 | 3D Packages and Methods for Forming the Same - Embodiments of the present disclosure include a semiconductor device and methods of forming a semiconductor device. An embodiment is a method of forming a semiconductor device, the method comprising forming a conductive pad in a first substrate, forming an interconnecting structure over the conductive pad and the first substrate, the interconnecting structure comprising a plurality of metal layers disposed in a plurality of dielectric layers, bonding a die to a first side of the interconnecting structure, and etching the first substrate from a second side of the interconnecting structure, the etching exposing a portion of the conductive pad. | 10-16-2014 |
20150162220 | Package Structure and Methods of Forming Same - A semiconductor device includes a first die having a first active surface and a first backside surface opposite the first active surface, a second die having a second active surface and a second backside surface opposite the second active surface, and an interposer, the first active surface of the first die being electrically coupled to a first side of the interposer, the second active surface of the second die being electrically coupled to a second side of the interposer. The semiconductor device also includes a first connector over the interposer, a first encapsulating material surrounding the second die, the first encapsulating material having a first surface over the interposer, and a via electrically coupling the first connector and the interposer. A first end of the via is substantially coplanar with the first surface of the first encapsulating material. | 06-11-2015 |
20150233989 | CAPACITIVE SENSING ARRAY DEVICE WITH HIGH SENSITIVITY AND HIGH FRAME RATE AND ELECTRONIC APPARATUS USING THE SAME - In a capacitive sensing array device and an electronic apparatus, a coupling signal source provides a coupling signal to an object, a constant voltage source provides a constant voltage to a shielding conductor group, and a vertical parasitic capacitor is formed between the shielding conductor group and each sensing electrode. Each sensing electrode is electrically connected to the constant voltage source via one corresponding switch module. When one sensing electrode is selected to perform sensing, the corresponding switch module is set as an open state such that the selected sensing electrode is disconnected from the constant voltage source, while the other sensing electrodes are electrically connected to the constant voltage source via their corresponding switch modules configured as short-circuit states, so that a horizontal parasitic capacitor is formed between the selected sensing electrode and the other sensing electrodes. The shielding conductor group comprises shielding conductor layers on shielding planes. | 08-20-2015 |
20150262958 | 3D Packages and Methods for Forming the Same - Embodiments of the present disclosure include a semiconductor device and methods of forming a semiconductor device. An embodiment is a method of forming a semiconductor device, the method comprising forming a conductive pad in a first substrate, forming an interconnecting structure over the conductive pad and the first substrate, the interconnecting structure comprising a plurality of metal layers disposed in a plurality of dielectric layers, bonding a die to a first side of the interconnecting structure, and etching the first substrate from a second side of the interconnecting structure, the etching exposing a portion of the conductive pad. | 09-17-2015 |
20150269407 | ALL-FLAT SENSOR WITH EXPOSED COLORFUL MEMBER AND ELECTRONIC DEVICE USING SUCH SENSOR - An all-flat sensor includes a coupling substrate; a sensing chip, which is disposed on the coupling substrate, has first electrodes arranged in an array and a first dielectric layer covering over the first electrodes, and is electrically connected to the coupling substrate; and a second dielectric layer covering over the sensing chip and providing an outlook color. An electronic device using the all-flat sensor is also provided. | 09-24-2015 |
20150344297 | Capacitive Sensors and Methods for Forming the Same - A device includes a semiconductor substrate, and a capacitive sensor having a back-plate, wherein the back-plate forms a first capacitor plate of the capacitive sensor. The back-plate is a portion of the semiconductor substrate. A conductive membrane is spaced apart from the semiconductor substrate by an air-gap. A capacitance of the capacitive sensor is configured to change in response to a movement of the polysilicon membrane. | 12-03-2015 |
20160035771 | Image Sensor Device and Method - A system and method for blocking heat from reaching an image sensor in a three dimensional stack with a semiconductor device. In an embodiment a heat sink is formed in a back end of line process either on the semiconductor device or else on the image sensor itself when the image sensor is in a backside illuminated configuration. The heat sink may be a grid in either a single layer or in two layers, a zig-zag pattern, or in an interleaved fingers configuration. | 02-04-2016 |
Chen-Cheng Chou, Hsin-Chu TW
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20130002654 | THREE-DIMENSIONAL GLASSES AND METHOD FOR OPERATING THE SAME - A three-dimensional (3D) glasses and a method for operating the same are provided. The 3D glasses includes a first lens, a second lens, an infrared receiver and a control unit. The infrared receiver receives an infrared signal to output a digital control signal. The control unit is coupled to the infrared receiver. The control unit controls a first state of the first lens and a second state of the second lens according to a first pulse of the digital control signal, where at least one of the first state and the second state is an OFF state. | 01-03-2013 |
Cheng-Wei Chou, Hsin-Chu TW
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20150214248 | PIXEL STRUCTURE AND METHOD OF FABRICATING THE SAME - A pixel structure includes a thin film transistor device. The thin film transistor device includes a first connection electrode, a second connection electrode, an oxide semiconductor channel layer, a gate insulation layer, a gate electrode, a dielectric layer, a source electrode and a drain electrode. The oxide semiconductor channel layer at least partially covers a top surface of the first connection electrode and a top surface of the second connection electrode. The gate electrode is disposed on the gate insulation layer. The dielectric layer is disposed on the gate electrode and the gate insulation layer. The gate insulation layer and the dielectric layer have a first contact hole at least partially exposing the top surface of the first connection electrode and a second contact hole at least partially exposing the top surface of the second connection electrode. The source electrode is electrically connected to the first connection electrode via the first contact hole, and the drain electrode is electrically connected to the second connection electrode via the second contact hole. | 07-30-2015 |
Cheng-Ying Chou, Hsin-Chu TW
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20140016077 | Display Apparatus - A display apparatus is disclosed. The display apparatus includes a display panel. The display panel includes an upper substrate, a lower substrate, a main sealant, and at least one supporting sealant. The display panel includes an active area and a peripheral circuit area adjacent to the active area. The main sealant is disposed between the upper substrate and the lower substrate. The main sealant is disposed out of the active area to form a sealed area. The sealed area covers the active area and a part of the peripheral circuit area. The at least one supporting sealant is disposed in the sealed area and out of the active area. The distance between at least one side of the main sealant and the active area is different from the distances between the other sides of the main sealant and the active area. | 01-16-2014 |
Chia-Cheng Chou, Hsin-Chu TW
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20160086865 | Automatically Adjusting Baking Process for Low-k Dielectric Material - A method includes etching a low-k dielectric layer on a wafer to form an opening in the low-k dielectric layer. An amount of a detrimental substance in the wafer is measured to obtain a measurement result. Process conditions for baking the wafer are determined in response to the measurement result. The wafer is baked using the determined process conditions. | 03-24-2016 |
Chia-Ling Chou, Hsin-Chu TW
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20110241735 | DRIVING CIRCUIT AND DRIVING METHOD FOR CURRENT-DRIVEN DEVICE - A driving circuit and a driving method for drive a current-driven device having a first terminal and a second terminal are provided. The first terminal is coupled to a first power source potential. The driving circuit includes a switching module, a first capacitor and a second capacitor. The switch module is coupled to a data line, the second terminal and a second voltage source and further is for determining whether to allow a current to flow through the current-driven device. A first end and a second end of the first capacitor are respectively coupled to different nodes in the switch module. The first end of the first capacitor receives a potential on the data line in a particular time period. A first end and a second end of the second capacitor are respectively coupled to the second end of the first capacitor and a second power source potential. | 10-06-2011 |
Chih-Neng Chou, Hsin-Chu TW
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20100218837 | PIPE UNIT - A pipe unit includes a pipe body, first and second flanges, and an adjusting structure. The first flange and the second flange are respectively disposed on opposite first and second ends of the pipe body. The adjusted structure is disposed between the first and second flanges and serves to adjust the length of the pipe unit. | 09-02-2010 |
20120279604 | PIPE UNIT - A pipe unit includes a pipe body, first and second flanges, and an adjusting structure. The first flange and the second flange are respectively disposed on opposite first and second ends of the pipe body. The adjusted structure is disposed between the first and second flanges and serves to adjust the length of the pipe unit. | 11-08-2012 |
Chih-Shen Chou, Hsin-Chu TW
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20140203973 | COUPLED FEED MICROSTRIP ANTENNA - The present invention is related to a microstrip antenna including an insulating substrate, a first conducting layer and a second conducting layer respectively located at two opposing surfaces of the insulating substrate, a non-conductive isolation zone defined in the second conducting layer, and a feed-in unit located within the con-conductive isolation zone. Thus, the non-conductive isolation zone separates the second conducting layer and the feed-in unit. During application, the feed-in unit is connected with a signal feed-in terminal, enabling the microstrip antenna to receive and transmit wireless signals. During fabrication of the microstrip antenna, it does not need to make a through hole on the insulating substrate, reducing the microstrip antenna process steps and material consumption and lowering the microstrip antenna fabrication cost. | 07-24-2014 |
Chi-Wei Chou, Hsin-Chu TW
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20130134425 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF - A manufacturing method of an array substrate includes the following steps. A gate electrode and a gate insulator layer are successively formed on a substrate. A semiconductor layer, an etching stop layer, a hard mask layer, and a second patterned photoresist are successively formed on the gate insulator layer. The second patterned photoresist is employed for performing an over etching process to the hard mask layer to form a patterned hard mask layer. The second patterned photoresist is employed for performing a first etching process to the etching stop layer. The second patterned photoresist is then employed for performing a second etching process to the semiconductor layer to form a patterned semiconductor layer. The etching stop layer uncovered by the patterned hard mask layer is then removed for forming a patterned etching stop layer. | 05-30-2013 |
20130161625 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF - A manufacturing method of an array substrate includes the following steps. A first conductive layer, a gate insulating layer, a semiconductor layer, an etching stop layer, and a first patterned photoresist are successively formed on a substrate. The etching stop layer and the semiconductor layer uncovered by the first patterned photoresist are then removed by a first etching process. A patterned gate insulating layer and a patterned etching stop layer are then formed through a second etching process. The first conductive layer uncovered by the patterned gate insulating layer is then removed to form a gate electrode. The semiconductor layer uncovered by the patterned etching stop layer is then removed to form a patterned semiconductor layer and partially expose the patterned gate insulating layer. | 06-27-2013 |
20140127844 | MANUFACTURING METHOD OF ARRAY SUBSTRATE - A manufacturing method of an array substrate includes the following steps. A first conductive layer, a gate insulating layer, a semiconductor layer, an etching stop layer, and a first patterned photoresist are successively formed on a substrate. The etching stop layer and the semiconductor layer uncovered by the first patterned photoresist are then removed by a first etching process. A patterned gate insulating layer and a patterned etching stop layer are then formed through a second etching process. The first conductive layer uncovered by the patterned gate insulating layer is then removed to form a gate electrode. The semiconductor layer uncovered by the patterned etching stop layer is then removed to form a patterned semiconductor layer and partially expose the patterned gate insulating layer. | 05-08-2014 |
20150123128 | ARRAY SUBSTRATE - The array substrate includes a substrate, a thin film transistor (TFT) and a pixel electrode. The TFT is disposed on the substrate and includes a gate electrode, a gate insulating layer, a patterned semiconductor layer, a patterned etching stop layer, a patterned hard mask layer, a source electrode and a drain electrode. The patterned gate insulating layer is disposed on the gate electrode. The patterned semiconductor layer is disposed on the patterned gate insulating layer. The patterned etching stop layer is disposed on the patterned semiconductor layer. The source and the drain electrodes are disposed on the patterned etching stop layer and the patterned semiconductor layer. The patterned hard mask layer is disposed between the source electrode and the patterned etching stop layer and disposed between the drain electrode and the patterned etching stop layer. The pixel electrode is disposed on the substrate and electrically connected to the TFT. | 05-07-2015 |
20150126006 | MANUFACTURING METHOD OF ARRAY SUBSTRATE - A manufacturing method of an array substrate includes following steps. A first photolithography process is performed to form a gate electrode on a substrate. A gate insulating layer is formed to cover the substrate and the gate electrode. A second photolithography process is performed to form a patterned semiconductor layer and a patterned etching stop layer. A semiconductor layer and an etching stop layer are successively formed on the gate insulating layer, and a second patterned photoresist is formed on the etching stop layer. The etching stop layer uncovered by the second patterned photoresist is removed. The semiconductor layer uncovered by the second patterned photoresist is removed for forming the patterned semiconductor on the gate insulating layer. A patterned etching stop layer is formed on the patterned semiconductor layer by etching the second patterned photoresist and the etching stop layer. | 05-07-2015 |
Chung-Yen Chou, Hsin-Chu TW
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20150031176 | Semiconductor Device Containing HEMT and MISFET and Method of Forming the Same - A semiconductor structure with a MISFET and a HEMT region includes a first III-V compound layer. A second III-V compound layer is disposed on the first III-V compound layer and is different from the first III-V compound layer in composition. A third III-V compound layer is disposed on the second III-V compound layer is different from the second III-V compound layer in composition. A source feature and a drain feature are disposed in each of the MISFET and HEMT regions on the third III-V compound layer. A gate electrode is disposed over the second III-V compound layer between the source feature and the drain feature. A gate dielectric layer is disposed under the gate electrode in the MISFET region but above the top surface of the third III-V compound layer. | 01-29-2015 |
20150035021 | MISFET Device and Method of Forming the Same - Embodiments of the present disclosure include a method for forming a semiconductor device, a method for forming a MISFET device, and a MISFET device. An embodiment is a method for forming a semiconductor device, the method including forming a source/drain over a substrate, forming a first etch stop layer on the source/drain, and forming a gate dielectric layer on the first etch stop layer and along the substrate. The method further includes forming a gate electrode on the gate dielectric layer, forming a second etch stop layer on the gate electrode, and removing the gate dielectric layer from over the source/drain. | 02-05-2015 |
Han-Tang Chou, Hsin-Chu TW
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20110155234 | METHOD OF FORMING THIN FILM SOLAR CELL AND STRUCTURE THEREOF - A method of forming thin film solar cell includes the following steps. A substrate is provided, and a plurality of first electrodes are formed on the substrate. A printing process is performed to print a light-absorbing material on the substrate and the first electrodes to form a plurality of light-absorbing patterns. Each of the light-absorbing patterns corresponds to two adjacent first electrodes, partially covers the two adjacent first electrodes, and partially exposes the two adjacent first electrodes. A plurality of second electrodes are formed on the light-absorbing patterns. | 06-30-2011 |
Hung-Wen Chou, Hsin-Chu TW
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20120169630 | TOUCH PANEL - A touch panel includes a substrate, scan lines, data output lines, a signal processing unit and touch sensing units. Each touch sensing unit includes a sensing electrode, a reference capacitor, an output circuit and a reset circuit. The sensing electrode is disposed in a breach of the sensing electrode. The reference capacitor, the output circuit and the reset circuit are disposed on the substrate and in the breach. The output circuit, the reset circuit, the reference capacitor and the sensing electrode are electrically coupled to a reference point. The output circuit is configured to output touch signals to the corresponding data output line. The signal processing unit is configured to obtain electric potential of the data output line and perform a corresponding processing step. When the touch sensing unit is out of working, the reference point is reset to a predetermined electric potential. | 07-05-2012 |
Kuang-Ting Chou, Hsin-Chu TW
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20110155234 | METHOD OF FORMING THIN FILM SOLAR CELL AND STRUCTURE THEREOF - A method of forming thin film solar cell includes the following steps. A substrate is provided, and a plurality of first electrodes are formed on the substrate. A printing process is performed to print a light-absorbing material on the substrate and the first electrodes to form a plurality of light-absorbing patterns. Each of the light-absorbing patterns corresponds to two adjacent first electrodes, partially covers the two adjacent first electrodes, and partially exposes the two adjacent first electrodes. A plurality of second electrodes are formed on the light-absorbing patterns. | 06-30-2011 |
Mao-Hsuan Chou, Hsin-Chu TW
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20100141346 | Phase-Locked Loop with Start-Up Circuit - A circuit includes a voltage-controlled oscillator (VCO), which includes a voltage input node having an input voltage; and a start-up circuit. The start-up circuit includes a first current path and a second current path. The first current path has a first current and is configured so that the first current increases in response to a decrease in the input voltage and decreases in response to an increase in the input voltage. The second current path has a second current and is configured so that the second current decreases in response to the decrease in the input voltage and decreases in response to the increase in the input voltage. The VCO further includes a third current path combining a first proportion of the first current and a second proportion of the second current into a combined current; and a current-controlled oscillator (CCO) including an input receiving the combined current and outputting an AC signal. | 06-10-2010 |
Min-Chun Chou, Hsin-Chu TW
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20150078034 | PLANAR LIGHT SOURCE - A planar light source including an LGP and first and second light sources are provided. The LGP has a first surface and a second surface opposite to each other and a first groove and a second groove. The first groove and the second groove are respectively located on the first surface and the second surface, and are respectively located at two sides of a center line of the LGP, where the center line equally divides the first surface and the second surface. The first groove has a first side surface and a first light incident surface, and the second groove has a second side surface and a second light incident surface, where the light sources are disposed in the grooves. The light sources are suitable for respectively providing a light beam entering the LGP through the corresponding light incident surface. | 03-19-2015 |
20150226901 | BACKLIGHT MODULE - A backlight module includes a light guide plate having a bottom surface, a light emitting surface, a first light incident surface, and microstructures. Each microstructure recesses into or protrudes from the bottom surface and has a first and a second surfaces. The first and the second surfaces of at least one of the microstructures are located on two sides of a first reference plane parallel to the first light incident surface. A section-line of each first surface on a second reference plane perpendicular to the first light incident surface and perpendicular to the light emitting surface is a straight line. A first angle between each first surface and a third reference plane parallel to the light emitting surface in the light guide plate is between 0 degrees and 20 degrees, and a thickness of each microstructure is between 0 micrometers and 20 micrometers. | 08-13-2015 |
20150268404 | BACKLIGHT MODULE - A backlight module including an LGP, an optical film, a first light source is provided. The LGP has a bottom surface, a light emitting surface, a first light incident surface, and microstructures. Each microstructure is recessed into or protrudes out of the bottom surface and includes at least two structural units. A section line of each structural unit on a first reference plane is a curve, and the curve has a peak point. A distance between two peak points of two adjacent structural units along a first direction is greater than 0 and smaller than a half of a total width of the two structural units along the first direction. Each microstructure has a symmetric plane perpendicular to the light emitting surface and the first light incident surface. The optical film is located on the light emitting surface. The first light source is located beside the first light incident surface. | 09-24-2015 |
Ming-Chen Chou, Hsin-Chu TW
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20100085938 | WiFi network system for performing a high-speed handover of voice and multimedia data and method applied to the same - A WiFi network system for performing a high-speed handover of voice and multimedia data includes a wireless station (STA), a network router for connecting to the Internet; first and second smart base stations respectively connected with the Internet through the network router, wherein the second smart base station is adjacent to the first smart base station. Each of the smart base stations covers an area in order to register the STA located in the area and connect the STA with the Internet through the first or a second smart base station and the network router. | 04-08-2010 |
20100091741 | WiFi system and method with high-speed mobile voice and video data communication - A WiFi system with high-speed mobile voice and video data communication includes a plurality of mobile devices and a WiFi base station connected to a WiFi network. The WiFi base station transmits and receives packets to/from a mobile device within a time frame. The time frame is repeated at a predetermined period of time and divided into a plurality of variable-size time slots, each slot being assigned to a mobile device. The WiFi base station is based on an IEEE 802.11 standard to transmit/receive the packets respectively. Accordingly, all the WiFi base stations can use a single channel such that the handover between the WiFi base stations can be performed at high speed. | 04-15-2010 |
20100128670 | Base station interference-free antenna module and WiFi base station mesh network system using the antenna module - A base station interference-free antenna module includes a plurality of high frequency transceivers respectively facing different directions, and an antenna controller electrically coupled to the high frequency transceivers. The antenna controller is electrically coupled to a signal processor in order to receive a signal transmitting/receiving request output by the signal processor to accordingly select a high frequency transceiver to transmit or receive a circularly polarized high frequency signal. The system includes two WiFi base stations, each having the base station interference-free antenna module and a signal processor, and the high frequency signals wirelessly transmitted between the WiFi base stations in the system are circularly polarized. | 05-27-2010 |
20100128671 | Interference-free antenna module and WiFi network system using the antenna module - An interference-free antenna module includes a WiFi interference-free antenna module having a plurality of high frequency transceivers respectively facing different directions, and an antenna controller electrically coupled to the high frequency transceivers respectively. The antenna controller receives a signal transmitting/receiving request output by a signal processor to accordingly select one of the high frequency transceivers to transmit or receive a circularly polarized high frequency signal. The antenna module also includes a consumer equipment interference-free antenna module having a circular polarization antenna unit. The WiFi network system includes a WiFi base station and a consumer equipment. | 05-27-2010 |
Pao-Hung Chou, Hsin-Chu TW
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20080245551 | CIRCUIT BOARD STRUCTURE FOR EMBEDDING SEMICONDUCTOR CHIP THEREIN AND METHOD FOR FABRICATING THE SAME - A semiconductor chip-embedded circuit board and a fabrication method thereof are provided, including: a core board having first and second surfaces with first and second circuit layers thereon respectively, the first surface having a chip-receiving area (CRA); a laminated layer formed on the first and second surfaces and formed with an opening for exposing the CRA; third and fourth circuit layers formed on the laminated layer, the third circuit layer having first and second conductive pads, the fourth circuit layer having third conductive pads; a first insulating protective layer formed on the third circuit layer and formed with a plurality of first openings for exposing the first conductive pads and the CRA and a plurality of second openings for exposing the second conductive pads; and a second insulating protective layer formed on the fourth circuit layer and formed with third openings for exposing the third conductive pads. Mounting a semiconductor chip on the CRA reduces package height. | 10-09-2008 |
20090014865 | HEAT-CONDUCTIVE PACKAGE STRUCTURE - A heat-conductive package structure includes a carrier board having a first surface and an opposing second surface and formed with a through opening passing the carrier board; a first heat-conductive structure including a heat-conductive hole in the through opening, a first heat-conductive sheet on the carrier board, and a second heat-conductive sheet on the carrier board, wherein the first and second heat-conductive sheets are conductively connected by the heat-conductive hole; a first dielectric layer formed on the first surface of the carrier board and formed with a first opening for exposing the first heat-conductive sheet; a second dielectric layer formed on the second surface of the carrier board and formed with at least a second opening for exposing a portion of the second heat-conductive sheet; and a second heat-conductive structure formed in the second opening and mounted on the second heat-conductive sheet. | 01-15-2009 |
Shen-Hong Chou, Hsin-Chu TW
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20090058876 | DYNAMIC COLOR GAMUT OF LED BACKLIGHT - A backlight unit usable in an LCD for dynamically expanding color gamut of the LCD. In one embodiment, the backlight unit has a plurality of light emitting elements, and a control unit electrically coupled with the plurality of light emitting elements for controlling intensity of light emitting from each of the plurality of light emitting elements in response to a frame of image data applied to the plurality of pixels, wherein the control unit is configured such that when the frame of image data applied to the plurality of pixels is in a red color, a green color, or a blue color, the intensity of light from the red color, the green color, or the blue color emitting from each of the plurality of light emitting elements is adjusted to its corresponding maximal value so as to expand the red, the green, or the blue area of the color gamut of the LCD panel accordingly. | 03-05-2009 |
Shih-Hsiang Chou, Hsin-Chu TW
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20100225570 | LIQUID CRYSTAL DEVICE WITH MULTI-DOT INVERSION - An LCD device includes a plurality of data lines, a plurality gate lines, a pixel matrix, and a source driver. The pixel matrix includes an mth pixel column and an (m+1)th pixel column. The odd-numbered pixels of the mth pixel column are coupled to an mth data line and corresponding odd-numbered gate lines. The even-numbered pixels of the mth pixel column is coupled to an (m+1)th data line and corresponding even-numbered gate lines. The odd-numbered pixels of the (m+1)th pixel column is coupled to the (m+1)th data line and corresponding odd-numbered gate lines. The even-numbered pixels of the (m+1)th pixel column is coupled to an (m+2)th data line and corresponding even-numbered gate lines. The gate driver outputs the data driving signals having a first polarity to the odd-numbered data lines, and outputs the data driving signals having a second polarity to the even-numbered data lines. | 09-09-2010 |
20130135284 | DISPLAY PANEL AND GATE DRIVER THEREIN - A gate driver includes cascade-connected driving stages. Each of the driving stages includes a first shift register circuit and a second shift register circuit. The first shift register circuit is configured for outputting a present stage driving signal and a next stage driving signal. The second shift register circuit is electrically coupled to the first shift register circuit and configured for outputting a present stage gate signal, a first next stage gate signal, and a second next stage gate signal. Furthermore, a display panel is also provided herein. | 05-30-2013 |
Shih-Liang Chou, Hsin-Chu TW
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20100154878 | Electrode Structure and Fabrication of the Dye-Sensitized Solar Cell - The electrode according to the invention comprises a substrate, an indium tin oxide film and a semiconductor layer and is produced under a processing condition that the substrate is subjected to ITO sputtering in a sputter chamber at a temperature of less than 200° C., preferably without being treated with heat, and then undergoes a high temperature treatment so as to form a stable ITO film. By this way, a semiconductor layer could be also formed on the indium tin oxide film. The electrode structure so produced is resistant to high temperature and has a reduced resistance change ratio. The electrode structure is especially suited for being used in a dye-sensitized solar cell to enhance the photoelectric conversion efficiency thereof. | 06-24-2010 |
20100214230 | ITO layer manufacturing process & application structure - A two-stage manufacturing process for preparation of an ITO layer includes having first a transparent substrate, e.g., a glass or plastic substrate going through treatment without preheating; the substrate is then sputtering processed in a sputtering chamber under process conditions without heating up to form a amorphous state ITO film on the surface of the transparent substrate; followed with a thermal treatment at a preset temperature to turn the ITO layer into a crystalline state without compromising strength of the glass or the plastic substrate while delivering a durable ITO layer and a structure of ITO layer provided with a specific sheet resistance and/or thickness. The ITO layer produced using the present invention particularly fits to be applied in a touch screen structure. | 08-26-2010 |
20110001721 | Digital Capacitive Touch Panel Structure - The present invention discloses a touch panel structure formed by an anti-scratch surface layer and a capacitive sensor layer, and a transparent lamination layer is used for pasting the two into a panel. The capacitive sensor layer includes an X-axis first transparent conductive layer and a Y-axis second transparent conductive layer formed on both sides of a transparent plastic carrier to provide a touch panel structure having the advantages of a relatively low material cost, a light weight, an easy manufacturing and molding, a better lamination yield and a flexible and break-free feature. | 01-06-2011 |
Shih-Ping Chou, Hsin-Chu TW
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20080308894 | Electro-Optical Apparatus and a Circuit Bonding Detection Device and Detection Method Thereof - This invention provides a circuit bonding detection device, a detection method thereof and an electro-optical apparatus incorporating the circuit bonding detection device. The circuit bonding detection device includes a substrate, a circuit module, a set of sensors, and a detection unit. A plurality of contact pads is disposed on the substrate. The circuit module includes a plurality of conductive bumps corresponding to the contact pads. The sensors are disposed on two sides of at least one of contact pads or of the corresponding conductive bumps. The detection unit is electrically coupled with the set of sensors and transmits a fault signal when at least one of the contact pads and the corresponding conductive bumps deforms and contacts the sensors. | 12-18-2008 |
20100013415 | LAMP DETECTION DRIVING SYSTEM AND RELATED DETECTION DRIVING METHOD - A lamp detection driving system is disclosed for performing adaptive lamp driving and related detection operations based on a recipe. The system includes a micro-controller, a driver, a defect detection module and a feedback circuit. The micro-controller provides a modulation signal and a plurality of reference signals based on the recipe. The driver generates at least one driving signal for driving at least one lamp based on the modulation signal. The feedback circuit generates a plurality of feedback signals based on lamp currents or lamp voltages. The defect detection module generates a plurality of detection signals based on the reference signals and the feedback signals. Furthermore, disclosed is a lamp detection driving method including downloading the recipe, generating at least one driving signal for driving at least one lamp based on the recipe, and providing at least one reference signal for performing defect detection processes based on the recipe. | 01-21-2010 |
Shih-Po Chou, Hsin-Chu TW
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20110148780 | TOUCH PANEL AND FABRICATING METHOD THEREOF - A method of fabricating touch panel includes the following steps. A base is provided. A first transparent conductive layer is formed on the base. A first screen printing process is performed to form a first patterned sacrificial layer on the first transparent conductive layer, and the first patterned sacrificial layer is used to pattern the first transparent conductive layer to form a patterned sensing pad layer. A second screen printing process is carried out to form a patterned insulating layer. A second transparent conductive layer is formed on the base. A third screen printing process is performed to form a second patterned sacrificial layer, and the second patterned sacrificial layer is used to pattern the second transparent conductive layer to form a patterned bridge line layer. | 06-23-2011 |
20140133046 | DISPLAY DEVICE - A display device includes a substrate, a light shielding layer, at least one fading pattern and a display module. The display module is disposed on the substrate and has a display area. The light shielding layer is disposed on a periphery of the substrate and has a first side and a second side, wherein the first side is opposite to the second side. The at least one fading pattern is disposed on the substrate, is adjacent to at least one side of the first side and the second side of the light shielding layer, and does not overlap the display area of the display module. Each fading pattern includes N light transmissible areas, the N light transmissible areas are adjacent to each other, and transmittances of the N light transmissible areas are different from each other, wherein N is a positive integer larger than one. | 05-15-2014 |
20140333854 | TOUCH PANEL - A touch panel includes a substrate, a light-shielding layer, a patterned transparent layer, a reflecting layer, at least one first sensing series, and at least one second sensing series. The substrate has a touch sensing region and a peripheral region. The light-shielding layer is disposed in the periphery region. The light-shielding layer has a patterned opening and a sidewall adjacent to the patterned opening. The patterned opening is configured to provide a mark identifiable by human eyes. The patterned transparent layer is disposed in the peripheral region, and the patterned transparent layer covers a portion of the patterned opening. The patterned transparent layer has an inclined sidewall positioned in the patterned opening. The reflecting layer covers the inclined sidewall and the patterned opening. The first sensing series and the second sensing series are arranged in the touch sensing region to detect a position of a touch point. | 11-13-2014 |
20140340364 | TOUCH DISPLAY PANEL - A touch display panel includes a substrate, touch sensing elements, a light-shielding layer, a first patterned light-shielding layer, and a display module. The substrate has a display zone and a non-display zone. The non-display zone includes at least one first patterned transparent region. The touch sensing elements is disposed in the display zone. The light-shielding layer covers the first patterned transparent region and has a first transmittance rate. The first patterned light-shielding layer partially covers the light-shielding layer and is not disposed in the first patterned transparent region. The first patterned light-shielding layer has a second transmittance rate. The second transmittance rate is substantially less than the first transmittance rate. | 11-20-2014 |
Shun-Chin Chou, Hsin-Chu TW
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20130049706 | CIRCUIT FOR DISCHARGING AN X CAPACITOR - A circuit for discharging an X capacitor includes an AC detection unit, a reset unit, a counter, and a discharging unit. The AC detection unit is coupled to two terminals of the X capacitor through a pin. The AC detection unit has a plurality of reference levels for detecting a DC voltage level according to the plurality of reference levels, and outputting a detection signal. The reset unit is coupled to the AC detection unit for generating a reset signal according to the detection signal. The counter is coupled to the reset unit for being reset according to the reset signal. When the counter does not receive the reset signal within a first predetermined time, the counter generates a turning-on signal. The discharging unit is coupled to the counter for discharging the X capacitor according to the turning-on signal. | 02-28-2013 |
20130187621 | Power control circuits and methods - Power control circuits and methods are disclosed, suitable for a power supplier. A power control circuit has a clock generator, a phase controller and a power limiter. The clock generator provides a clock signal, substantially determining switching cycles of a power supply. The phase controller outputs a burst signal based on a group reference signal and a burst initiation signal, and makes a burst period corresponding to a burst signal not less than a group reference period corresponding to the group reference signal. The burst signal is capable of switching the power supplier between a switching state and a non-switching state. The power limiter limits the power transferred by the power supply in every switching cycle, during a burst-up duration after the power supply is switched from the non-switching state to the switching state. The burst initiation signal correlates to an output voltage of the power supplier. | 07-25-2013 |
20140043874 | CIRCUIT FOR CONTROLLING A LATCH MODE OF A PULSE WIDTH MODULATION CIRCUIT AND METHOD THEREOF - A circuit for controlling a latch mode of a pulse width modulation circuit includes a D flip-flop, a voltage generation unit, a comparator, and a logic unit. The D flip-flop generates a switch control signal according to a latch enable signal. The voltage generation unit generates a discharge current, and a voltage divider resistor group included in the voltage generation unit generates a first voltage when the voltage generation unit is turned on according to the switch control signal. A voltage of a predetermined pin of the pulse width modulation circuit is equal to a predetermined voltage when the discharge current is equal to the charge current. The comparator compares a reference voltage with the first voltage to generate a comparison signal. The logic unit generates a clear signal according to the comparison signal. The D flip-flop clears the switch control signal according to the clear signal. | 02-13-2014 |
Shu-Yu Chou, Hsin-Chu TW
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20130134449 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF - A display panel includes a substrate, a plurality of bottom electrodes, an isolation layer, a plurality of light emitting layers, a top electrode, and at least one first auxiliary electrode. The bottom electrodes and the isolation layer are disposed on the substrate. The isolation layer has a plurality of pixel region openings and at least one buffer region. Each of the pixel region openings respectively exposes the corresponding bottom electrode. The buffer region is disposed between two adjacent pixel region openings. The light emitting layers are respectively disposed on the corresponding bottom electrodes. The top electrode covers the light emitting layers, the isolation layer, and the buffer region. The first auxiliary electrode is disposed in the buffer region. | 05-30-2013 |
Tsung Pat Chou, Hsin-Chu TW
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20090242060 | Fluid transportation device having multiple double-chamber actuating structrures - A fluid transportation device includes a flow-gathering module and multiple double-chamber actuating structures. The flow-gathering module includes two surfaces opposed to each other, multiple first flow paths and multiple second flow paths running through the two surfaces, an inlet channel arranged between the two surfaces and communicated with the multiple first flow paths, and an outlet channel arranged between the two surfaces and communicated with the multiple second flow paths. The multiple double-chamber actuating structures are arranged on the flow-gathering module side by side. Each double-chamber actuating structure includes a first chamber and a second chamber symmetrically arranged on the two surface of the flow-gathering module. Each of the first chamber and the second chamber includes a valve cap arranged over the flow-gathering module, a valve membrane arranged between the flow-gathering module and the valve cap, and an actuating member having a periphery fixed on the valve cap. | 10-01-2009 |
20090242061 | Dual-cavity fluid conveying apparatus - A dual-cavity fluid conveying apparatus includes a flow-converging device, a first cavity body, and a second cavity body. The flow-converging device includes two sides corresponding to each other; a first channel and a second channel both passing through the two sides; and an inlet passage and an outlet passage both arranged between the two sides and communicated with the first channel and the second channel, respectively. The first cavity body and the second cavity body are symmetrically disposed at the two sides of the flow-converging device, wherein the first cavity body and the second cavity body each includes a valve cover disposed on one side of the flow-converging device, a valve membrane interposed between the one side of the flow-converging device and the valve cover, and an actuating device disposed circumferentially on the valve cover so as to define, together with the valve cover, a pressure chamber. | 10-01-2009 |
Wei-Jen Chou, Hsin-Chu TW
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20100127638 | LIGHT SOURCE CONTROL DEVICE AND METHOD - A light source control method and a light source control device are used for controlling a light source. The light source control device includes a position detecting sensor and a microcontroller. The light source control method includes steps of generating a first signal according to an object touching a position of the position detecting sensor, and generating a control signal according to a light source adjustable parameter set corresponding to the first signal for controlling an illuminating status of the light source. The light source adjustable parameter set includes a plurality of color value components. The control signal is generated by the microcontroller according to the color value components. | 05-27-2010 |
20100259572 | Driving Apparatus and Driving Method of Backlight Module - A driving apparatus and a driving method of a backlight module are provided. The backlight module includes multiple LEDs. The driving apparatus includes at least one thermal sensor, an optical sensor, and a processor. The thermal sensor is for detecting a working temperature of the LEDs. The optical sensor is for detecting brightness and color of the backlight module after a calibration function is enabled, to obtain difference values of the detected brightness and color with respect to predetermined brightness and color. The processor is for providing at least one initial thermal compensation table, to determine working currents of the LEDs associated with the working temperature. The processor further is for calibrating a content of the initial thermal compensation table corresponding with a current working temperature of the LEDs and storing the calibrated thermal compensation table as the initial thermal compensation table after the calibration function is enabled. | 10-14-2010 |
Wen-Bin Chou, Hsin-Chu TW
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20090186152 | Light Guide Plate and Manufacturing Method thereof - A manufacturing method of light guide plate (LGP) for manufacturing a LGP has a plurality of colloid dot like micro-optical structures on its surface. The method includes the following processes. First, a substrate with an embossing structure is provided. Then, a plurality of colloid dots are formed on a surface of the substrate by jetting. Afterwards, a drying process is performed to convert the colloid dots into the colloid dots like micro-optical structures. Finally, a LGP is manufactured by the manufacturing method. | 07-23-2009 |
Wen-Cheng Chou, Hsin-Chu TW
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20120211418 | Slurry Concentration System and Method - A system and method for concentrating a slurry is disclosed. A preferred embodiment comprises a filter that is used to filter a slurry into a concentrate and a permeate. A portion of the permeate is used in a backflow operation of the filter once a pressure differential of 0.8 bar is obtained from the filter inlet to the permeate outlet of the filter. | 08-23-2012 |
20130299406 | Slurry Concentration System and Method - A system and method for concentrating a slurry is disclosed. A preferred embodiment comprises a filter that is used to filter a slurry into a concentrate and a permeate. A portion of the permeate is used in a backflow operation of the filter once a pressure differential of 0.8 bar is obtained from the filter inlet to the permeate outlet of the filter. | 11-14-2013 |
Weng-Bing Chou, Hsin-Chu TW
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20100109988 | Display Apparatus - A display apparatus is disclosed, and comprises a display panel and a lens. On the display panel, there are a width-fixed pixel zone, a width-variating pixel zone and a border zone arranged sequentially from the center to the edges of the display panel, wherein there are a plurality of width-fixed pixels disposed in the width-fixed zone, and there are a plurality of width-variating pixel groups disposed in the width-variating pixel zone, and the widths of the width-variating pixel groups are present in a first decreasing sequence. The lens has a focus-length-variating portion and a planar portion, wherein the planar portion is aligned with the width-fixed pixel zone, and the focus-length-variating portion is disposed to correspond to the border zone and the width-variating pixel zone. The focus lengths of the focus-length-variating portion corresponding to the width-variating pixel groups are present in a second decreasing sequence. | 05-06-2010 |
20110074711 | FLAT DISPLAY, TOUCH DEVICE AND TOUCH DETECTING METHOD - A touch device is disposed on a substrate having a plurality of scan lines. The touch device comprises a plurality of readout lines and a plurality of sensors. The readout lines and the scan lines are intersected with each other, and the sensors are electrically coupled to the corresponding scan lines and the corresponding readout lines respectively. A scan signal is introduced into the scan lines in sequence to control whether turning on the sensors, and the scan signal comprises at least one first turn-on pulse and a second turn-on pulse to simultaneously turn on at least two sensors which are electrically coupled to different scan lines. | 03-31-2011 |
Yi-Teh Chou, Hsin-Chu TW
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20160086901 | Bump-on-Trace Structures with High Assembly Yield - A package includes first package component, which further includes a first metal trace at a surface of the first package component, with the first metal trace having a trace width measured in a direction perpendicular to a lengthwise direction of the first metal trace. The first package component further includes a second metal trace at the surface of the first package component. The first metal trace and the second metal trace are parallel to each other. A second package component is overlying the first package component, wherein the second package component includes a metal bump. A solder region bonds the metal bump to the first metal trace, wherein the solder region contacts a top surface and sidewalls of the first portion of the first metal trace. A ratio of a volume of the solder region to the trace width is between about 1,100 μm | 03-24-2016 |
You-Hua Chou, Hsin-Chu TW
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20130328215 | Die Edge Contacts for Semiconductor Devices - A semiconductor device utilizing die edge contacts is provided. An integrated circuit die has a post-passivation layer with a trench filled with a conductive material extending from a contact to a die edge, thereby forming a die edge contact. Optionally, a through substrate via may be positioned along the die edge such that the conductive material in the trench is electrically coupled to the through-substrate via, thereby forming a larger die edge contact. The integrated circuit die may be placed in a multi-die package wherein the multi-die package includes walls having a major surface perpendicular to a major surface of the integrated circuit die. The die edge contacts are electrically coupled to contacts on the walls of the multi-die package. The multi-die package may include edge contacts for connecting to another substrate, such as a printed circuit board, a packaging substrate, a high-density interconnect, or the like. | 12-12-2013 |
20130328586 | Probe Card for Simultaneously Testing Multiple Dies - In accordance with an embodiment, a probe card comprises a contact pad interface comprising front side contacts and back side contacts electrically coupled together. The front side contacts are arranged to simultaneously electrically couple respective bumps of a plurality of dies on a wafer, and the back side contacts are arranged to electrically couple respective contacts of a testing structure. | 12-12-2013 |
20140054653 | TWO-STEP SHALLOW TRENCH ISOLATION (STI) PROCESS - An integrated circuit device and a process for making the integrated circuit device. The integrated circuit device including a substrate having a trench formed therein, a first layer of isolation material occupying the trench, a second layer of isolation material formed over the first layer of isolation material, an epitaxially-grown silicon layer on the substrate and horizontally adjacent the second layer of isolation material, and a gate structure formed on the epitaxially-grown silicon, the gate structure defining a channel. | 02-27-2014 |
20140179071 | TWO-STEP SHALLOW TRENCH ISOLATION (STI) PROCESS - Methods of making an integrated circuit are disclosed. An embodiment method includes etching a trench in a silicon substrate, depositing a first layer of isolation material in the trench, the first layer of isolation material projecting above surface of the silicon substrate, capping the first layer of isolation material by depositing a second layer of isolation material, the second layer of isolation material extending along at least a portion of sidewalls of the first layer of isolation material, epitaxially-growing a silicon layer upon the silicon substrate, the silicon layer horizontally adjacent to the second layer of isolation material, and forming a gate structure on the silicon layer, the gate structure defining a channel. | 06-26-2014 |
20150179502 | Two-Step Shallow Trench Isolation (STI) Process - Methods of making an integrated circuit are disclosed. An embodiment method includes etching a trench in a silicon substrate, depositing a first layer of isolation material in the trench, the first layer of isolation material projecting above surface of the silicon substrate, capping the first layer of isolation material by depositing a second layer of isolation material, the second layer of isolation material extending along at least a portion of sidewalls of the first layer of isolation material, epitaxially-growing a silicon layer upon the silicon substrate, the silicon layer horizontally adjacent to the second layer of isolation material, and forming a gate structure on the silicon layer, the gate structure defining a channel. | 06-25-2015 |
20150262870 | Barrier Structure for Copper Interconnect - A method for forming an interconnect structure includes forming a dielectric layer overlying a substrate, forming an opening in the dielectric layer, forming a metal-containing layer overlying the opening in the dielectric layer, forming a conformal protective layer overlying the metal-containing layer, filling a conductive layer in the opening, and performing a thermal process to form a metal oxide layer barrier layer underlying the metal-containing layer. | 09-17-2015 |
20150262938 | Barrier Structure for Copper Interconnect - A method for forming an interconnect structure includes forming a dielectric layer overlying a substrate, forming an opening in the dielectric layer, forming a metal-containing layer overlying the opening in the dielectric layer, forming a conformal protective layer overlying the metal-containing layer, filling a conductive layer in the opening, and performing a thermal process to form a metal oxide layer barrier layer underlying the metal-containing layer. | 09-17-2015 |
20150311150 | Metal Contact Structure and Method of Forming the Same - A semiconductor device and method of formation are provided. The semiconductor device comprises a silicide layer over a substrate, a metal plug in an opening defined by a dielectric layer over the substrate, a first metal layer between the metal plug and the dielectric layer and between the metal plug and the silicide layer, a second metal layer over the first metal layer, and an amorphous layer between the first metal layer and the second metal layer. | 10-29-2015 |
20150318243 | Composite Contact Plug Structure and Method of Making Same - An embodiment contact plug includes a bilayer structure and a diffusion barrier layer on a sidewall and a bottom surface of the bilayer structure. The bilayer structure includes a conductive core and a conductive liner on a sidewall and a bottom surface of the conductive core. In the embodiment contact plug, the conductive liner comprises cobalt or ruthenium. | 11-05-2015 |
20150325484 | METAL-SEMICONDUCTOR CONTACT STRUCTURE WITH DOPED INTERLAYER - Disclosed herein is a method of forming a metal-to-semiconductor contact with a doped metal oxide interlayer. An insulating layer is formed on a top surface of a semiconductor substrate with target region at the top surface of the semiconductor substrate. An opening is etched through the insulating layer with the opening exposing a top surface of a portion of the target region. A doped metal oxide interlayer is formed in the opening and contacts the top surface of the target region. The remainder of the opening is filled with a metal plug, the doped metal oxide interlayer disposed between the metal plug and the substrate. The doped metal oxide interlayer is formed from one of tin oxide, titanium oxide or zinc oxide and is doped with fluorine. | 11-12-2015 |
20160005824 | CONTACT STRUCTURES AND METHODS OF FORMING THE SAME - Embodiments of the present disclosure include contact structures and methods of forming the same. An embodiment is a method of forming a semiconductor device, the method including forming a contact region over a substrate, forming a dielectric layer over the contact region and the substrate, and forming an opening through the dielectric layer to expose a portion of the contact region. The method further includes forming a metal-silicide layer on the exposed portion of the contact region and along sidewalls of the opening; and filling the opening with a conductive material to form a conductive plug in the dielectric layer, the conductive plug being electrically coupled to the contact region. | 01-07-2016 |
20160049362 | Interconnect Structure and Method of Forming the Same - An interconnect structure and a method of forming an interconnect structure are disclosed. The interconnect structure includes a contact layer over a substrate; a dielectric layer over the contact layer, wherein the dielectric layer has an opening, the opening exposing a portion of the contact layer; a silicide layer over the exposed portion of the contact layer; a barrier layer along sidewalls of the opening; an alloy layer over the barrier layer; a glue layer over the alloy layer; and a conductive plug over the glue layer. | 02-18-2016 |
Yun-Hsien Chou, Hsin-Chu TW
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20090180052 | LIQUID CRYSTAL DISPLAY DEVICE AND BACK LIGHT UNIT THEREOF - A back light unit adapted to provide light to a liquid crystal display panel includes a housing, at least a light generator, and an optical filter. The light generator is disposed inside the housing for generating white light beams. The optical filter is disposed in an optical path of the white light beams between the light generator and the liquid crystal display panel for filtering the white light beams within a particular wavelength range of visible light. The hue of the white light beams before and after passing through the optical filter are the same. | 07-16-2009 |
20100149836 | BACKLIGHT MODULE - A holder is disposed at a side of a back light module adjacent to a light incident side of a light guide plate (LGP). A light source module is fixed on a wall of the holder that faces the light incident side. A holder engager on a side wall of the LGP engages with an LGP retainer of the holder. When the LGP expands or contracts due to changes of temperature, the holder and the light source module move with the side of the LGP, thereby a gap between the light source module and the light incident side is maintained and the luminance of the backlight module is stabilized. | 06-17-2010 |
Yun-Sheng Chou, Hsin-Chu TW
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20120161664 | DRIVING CIRCUIT AND LIGHTING EQUIPMENT USING THE SAME - A driving circuit and lighting equipment using the same are provided. The driving circuit includes a first power receiving terminal, a second power receiving terminal and a power conversion unit. The first power receiving terminal receives an alternating current (AC) input signal. The second power receiving terminal is electrically coupled to a predetermined potential. The power conversion unit is electrically coupled to the first and second power receiving terminals for transforming the AC input signal into corresponding two AC output signals of different phases, wherein the two AC output signals are with the same current. | 06-28-2012 |