Hong, Chungcheongnam-Do
Doo Pyo Hong, Chungcheongnam-Do KR
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20100162562 | METHOD OF MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD - A method of manufacturing a rigid-flexible printed circuit board, including providing a base substrate in which coverlays are respectively formed on two sides of a flexible copper foil laminate on both sides of which inner circuit patterns are respectively formed; layering insulation layers and copper foil layers on portions of coverlays which are to be a rigid region of the flexible copper foil laminate; forming a via hole in the rigid region, and, simultaneously, forming first windows in the coverlays in a flexible region; forming outer circuit patterns including areas adjacent to the first windows; and applying solder resist in the rigid region to expose portions of the external circuit patterns, where the outer circuit patterns formed in the areas adjacent to the first windows include additional plating portions for covering portions of the coverlays. | 07-01-2010 |
Gyuseog Hong, Chungcheongnam-Do KR
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20120238832 | GUIDING EXERCISE BASED ON FAT OXIDATION RATE - Disclosed is An exercise guide apparatus comprising: a sensing unit configured to obtain a heart rate of a subject; a strength determining unit configured to determine a maximal oxygen uptake of the subject; an exercise intensity measurement unit configured to determine a current exercise intensity of the subject based on the heart rate obtained by the sensing unit; and an exercise guide unit configured to estimate a fat oxidation rate of the subject, determine whether or not fat oxidation of the subject occurs, generate guide information according to a result of the determination of the occurrence of fat oxidation, and display the guide information generated, wherein the fat oxidation rate is estimated based on a ratio of fat being oxidized at the current exercise intensity to the maximal oxygen uptake, and wherein the occurrence of fat oxidation is determined by checking whether or not the fat oxidation rate estimated is greater than a threshold. | 09-20-2012 |
20130143188 | METHOD AND TERMINAL FOR PROVIDING EXERCISE PROGRAM - A method for providing an exercise program according to one embodiment of the present invention relates to a method for enabling a terminal to provide an exercise program, including the steps of: obtaining a trainer information list filtered according to one or more determination elements from a trainer information list received from a server and displaying the filtered trainer information list on a display of the terminal; determining at least one trainer from the filtered trainer information list by an input signal inputted into the terminal; and displaying the exercise program associated with the information of the determined trainer on the display of the terminal, the filtered trainer information list obtained by selecting elements associated with one or more determination elements from the trainer information list or by transmitting the information for one or more determination elements and receiving the filtered list transmitted from the server on the basis of one or more determination elements. | 06-06-2013 |
Ki-Ha Hong, Chungcheongnam-Do KR
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20100271112 | SPIN TRANSISTOR AND METHOD OF OPERATING THE SAME - Disclosed are a spin transistor and a method of operating the spin transistor. The disclosed spin transistor includes a channel formed of a magnetic material selectively passing a spin-polarized electron having a specific direction, a source formed of a magnetic material, a drain, and a gate electrode. When a predetermined voltage is applied to the gate electrode, the channel selectively passes a spin-polarized electron having a specific direction and thus, the spin transistor is selectively turned on. | 10-28-2010 |
Min-Gi Hong, Chungcheongnam-Do KR
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20100127381 | Integrated Circuit Devices Having Printed Circuit Boards Therein With Staggered Bond Fingers That Support Improved Electrical Isolation - An integrated circuit substrate includes an integrated circuit chip having a plurality of electrically conductive pads on a surface thereof and a printed circuit board mounted to the integrated circuit chip. The printed circuit board includes an alternating arrangement of first and second electrically conductive bond fingers. These first and second bond fingers are elevated at first and second different heights, respectively, relative to the plurality of electrically conductive pads. The printed circuit board also includes a first plurality of electrically insulating pedestals supporting respective ones of the first electrically conductive bond fingers at elevated heights relative to the second electrically conductive bond fingers. First and second pluralities of electrical interconnects (e.g., wires, beam leads) are also provided. The first plurality of electrical interconnects operate to electrically connect first ones of the plurality of electrically conductive pads to respective ones of the first electrically conductive bond fingers. The second plurality of electrical interconnects electrically connect second ones of the plurality of electrically conductive pads to respective ones of the second electrically conductive bond fingers. | 05-27-2010 |
Sungbok Hong, Chungcheongnam-Do KR
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20130200514 | SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME - A semiconductor package comprises a board including a board pad, a plurality of semiconductor chips mounted on the board, the semiconductor chips including chip pads. Bumps are disposed on the chip pads, respectively, and a wire is disposed between the chip pads and the bumps. The wire electrically connects the chip pads of the plurality of semiconductor chips and the board pad to each other. | 08-08-2013 |
20130256186 | MAGAZINE FOR LOADING A LEAD FRAME - A strip member loading magazine, which may load strip members such as semiconductor integrated circuit lead frames, for example, may include a bottom plate, a plurality of first slot plates provided at opposite sides of the bottom plate, a top plate fixed to a top portion of the first slot plates to be parallel to the bottom plate, second slot plates disposed to face each other between the first slot plates and be able to be moved, and locking units fastening the second slot plates to at least the top or bottom plate, the second slot plates being fastened parallel to the first slot plates. | 10-03-2013 |
20150125996 | SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME - A semiconductor package comprises a board including a board pad, a plurality of semiconductor chips mounted on the board, the semiconductor chips including chip pads. Bumps are disposed on the chip pads, respectively, and a wire is disposed between the chip pads and the bumps. The wire electrically connects the chip pads of the plurality of semiconductor chips and the board pad to each other. | 05-07-2015 |
Sung Hawn Hong, Chungcheongnam-Do KR
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20130284093 | SUBSTRATE TREATING APPARATUS - Provided is a substrate treating apparatus. The substrate treating apparatus includes a process chamber providing an inner space in which a substrate is treated, a substrate support member disposed within the process chamber to support the substrate, a showerhead disposed to face the substrate support member and partitioning the inner space into an upper space and a lower space, the showerhead having a plasma supply hole through which the upper space and the lower space communicate with each other, an excitation gas supply unit supplying an excitation gas into the upper space, a process gas supply unit supplying a process gas into the lower space, and a microwave apply unit applying a microwave into the upper space. | 10-31-2013 |
Sung Hwan Hong, Chungcheongnam-Do KR
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20150380216 | SUBSTRATE TREATING APPARATUS - The inventive concepts provide a substrate treating apparatus. The apparatus includes a process chamber, a substrate support unit, a gas supply unit, a microwave applying unit, an antenna plate, a slow-wave plate, a dielectric plate, and an exhaust baffle, and a liner. The liner includes a body having a ring shape facing an inner sidewall of the process chamber, and a flange extending from the body into a wall portion of the process chamber. The flange prevents an electric field of a microwave and a process gas from being provided into a gap between the process chamber and the body. Thus, it is possible to inhibit particles from being generated by damage of the inner sidewall of the process chamber by plasma, and drift distances of the particles can be reduced to inhibit the particles from reaching a substrate. | 12-31-2015 |