Patent application number | Description | Published |
20090237814 | POSITIONING APPARATUS FOR AN OPTICAL ELEMENT - The present invention relates to a positioning apparatus ( | 09-24-2009 |
20120081669 | EYESIGHT TESTING APPARATUS - An eyesight testing apparatus includes an imaging device for virtual imaging a test object located within a focal length of the imaging device and imaged at different distances into eyes of a subject located in a focal point of the imaging device, an optical deflection device arranged in a beam path between the imaging device and the test object to deflect the beam path by 180°, wherein the deflection device is displaceable in the direction of the beam path and the test object is not, a monitor device that generates the test object and that comprises a single monitor, optical components lying in the beam path sized so that both eyes are able to take part in a test, and so a partial beam path is formed for each eye, and a blocking device arranged in the beam path, which comprises two LCD blocking elements for the partial beam paths. | 04-05-2012 |
20120327370 | POSITIONING UNIT AND MONITORING DEVICE - A positioning unit ( | 12-27-2012 |
20130003170 | POSITIONING UNIT AND MONITORING DEVICE - A positioning unit for positioning an optical unit ( | 01-03-2013 |
20130229706 | POSITIONING UNIT AND MONITORING DEVICE - A positioning unit for positioning an optical unit ( | 09-05-2013 |
20140125948 | Positioning Unit And Observation Device - A positioning unit for positioning an optical unit in an optical path of a microscope between a microscope lens and in front of an eye to be examined includes a connection device and a positioning device. The connection device couples the positioning unit to the microscope. The positioning device moves the optical element relative to the microscope in a longitudinal direction of the optical path. The positioning unit is predominantly formed from aluminum free metal. | 05-08-2014 |
Patent application number | Description | Published |
20100127377 | Method for Producing a MEMS Package - A carrier substrate has a mounting location with a number of electrical connection pads on a top side and external contacts connected thereto on an underside. A metal frame encloses the connection pads of the mounting location. A MEMS chip has electrical contacts on an underside. The MEMS chip is placed on the mounting location of the carrier substrate in such a way that the MEMS chip is seated with an edge region of its underside on the metal frame. Using a flip-chip process, the electrical contacts of the MEMS chip are connected to the connection pads of the carrier substrate by means of bumps the metal frame is connected to the MEMS chip such that a closed cavity is formed between MEMS chip and carrier substrate. | 05-27-2010 |
20100272302 | Arrangement Comprising a Microphone - An arrangement includes a circuit carrier and a housed microphone. A mounting side of the housed microphone is mounted on a top side of the circuit carrier. The housed microphone includes solderable contacts on the mounting side and a sound entry opening facing the circuit carrier. An acoustic channel connects the sound entry opening and surroundings above the circuit carrier. | 10-28-2010 |
20110018076 | MEMS Component, Method for Producing a MEMS Component, and Method for Handling a MEMS Component - A MEMS component includes a substrate in which at least one cavity is present. The cavity is closed off toward an active side of the substrate. An inactive side is arranged opposite the active side of the substrate, and the substrate is covered with a covering film on the inactive side. | 01-27-2011 |
20110180885 | METHOD FOR ENCAPSULATING AN MEMS COMPONENT - Method for producing an MST device, and MST device | 07-28-2011 |
20110233690 | SEMICONDUCTOR CHIP ARRANGEMENT WITH SENSOR CHIP AND MANUFACTURING METHOD - On a carrier ( | 09-29-2011 |
20110298064 | SENSOR MODULE AND METHOD FOR PRODUCING SENSOR MODULES - Sensor module, comprising a carrier, at least one sensor chip and at least one evaluation chip which is electrically coupled to the sensor chip. The carrier has a cutout, in which the sensor chip is at least partly situated. The evaluation chip is arranged on the carrier and at least partly covers the cutout. | 12-08-2011 |
20120093346 | MEMS MICROPHONE - A microphone package wherein an MEMS microphone chip (MIC) is mounted on a substrate (SUB) and is sealed with a cover (ABD) with respect to the substrate. The membrane (MMB) of the microphone chip is connected to a sound entry opening (SEO) in the substrate via an acoustic channel. As a result of defined dimensioning of, in particular, the cross section and length of sound entry opening and channel, an acoustic low-pass filter is formed, the −3 dB attenuation point of which is significantly below the natural resonance of microphone membrane and package. | 04-19-2012 |
20130119492 | Miniaturized Electrical Component Comprising an MEMS and an ASIC and Production Method - The invention relates to a miniaturized electrical component comprising an MEMS chip and an ASIC chip. The MEMS chip and the ASIC chip are disposed on top of each other; an internal mounting of MEMS chip and ASIC chip is connected to external electrical terminals of the electrical component by means of vias through the MEMS chip or the ASIC chip. | 05-16-2013 |
20130140656 | MEMS Microphone And Method For Producing The MEMS Microphone - The invention relates to a method for producing a microphone, in which a transducer element (WE) is mounted on a carrier (TR); a cover is arranged over the transducer element (WE) and the carrier (TR) such that the transducer element (WE) is enclosed between the cover and the carrier (TR); a first sound inlet opening (SO | 06-06-2013 |