Patent application number | Description | Published |
20100036265 | APPARATUS AND METHOD FOR MEASURING BLOOD PRESSURE - A method of measuring blood pressure includes measuring a characteristic of body fat of a measured body part, detecting a sphygmus wave and a pressure of a blood vessel of the measured body part, detecting a base blood pressure of the measured body part based on a result of the detecting the sphygmus wave and the pressure of the blood vessel of the measured body part, and detecting a continuous blood pressure using a blood pressure calibration. The blood pressure calibration uses the base blood pressure and a blood pressure calculation regression equation including the characteristic of the body fat. | 02-11-2010 |
20100125212 | METHOD AND APPARATUS FOR TESTING ACCURACY OF BLOOD PRESSURE MONITORING APPARATUS - A method for testing accuracy of blood pressure measurement in a blood pressure monitoring apparatus includes calculating a difference between measured blood pressures of a user measured at two or more measurement points, calculating a difference between hydrostatic pressures of blood estimated at the two or more measurement points, and calculating an error of the measured blood pressures. | 05-20-2010 |
20100274143 | METHOD AND APPARATUS FOR ESTIMATING BLOOD PRESSURE - A method for estimating blood pressure includes: sensing a value of a first sphygmus wave in a region of a user's body while pressurizing the region with a first pressure; sensing a value of a second sphygmus wave in the region while pressurizing the region a second pressure; and estimating blood pressure of the region based on the sensed values of the first sphygmus wave and the second sphygmus wave. The first pressure and the second pressure are each either a variable pressure or a constant pressure. A height of the region, relative to the user's body, is different for the sensing the value of the first sphygmus wave than for the sensing the value of the second sphygmus wave. | 10-28-2010 |
20100286538 | APPARATUS AND METHOD FOR MEASURING BLOOD PRESSURE - A blood pressure measuring apparatus includes a sensing unit including a plurality of sensors sensing sphygmus waves at a measurement site, a selection unit selecting one sensor of the plurality of sensors based on the sphygmus waves sensed by the plurality of sensors, and a blood pressure estimation unit estimating blood pressure of the measurement site based on a sphygmus wave sensed by the selected sensor. | 11-11-2010 |
20100298721 | APPARATUS AND METHOD FOR ESTIMATING BLOOD PRESSURE BY USING VARIABLE CHARACTERISTIC RATIO - A method of estimating blood pressure includes obtaining a pressure wave detected at a measurement body part of a subject, calculating a characteristic ratio of the subject according to a shape of the detected pressure wave based on a correlation between the characteristic ratio used to determine blood pressure at a measurement body part and the shape of the pressure wave detected at the measurement body part, and estimating blood pressure at the measurement body part of the subject is estimated using the calculated characteristic ratio. | 11-25-2010 |
20100298726 | LOW-PRESSURIZATION BLOOD PRESSURE MONITORING APPARATUS AND METHOD - A blood pressure monitoring apparatus including a pressing unit which presses a measurement body part of a subject, a sensing unit which senses a sphygmus wave at the measurement body part while the measurement body part is being pressed, a control unit controlling a point of time of stopping the pressing based on an amplitude of the sensed sphygmus wave, and an estimation unit which estimates a blood pressure of the subject based on the sphygmus wave sensed before the pressing performed by the pressing unit is stopped. | 11-25-2010 |
20120184822 | HEALTH CARE SYSTEM, AND APPARATUS AND METHOD FOR CONTROLLING HEALTH CARE - An apparatus for controlling health care in a health care system is provided. The apparatus for controlling health care in a health care system includes a communication unit configured to transmit and/or receive a sensed biological signal, a determination unit configured to determine whether the health care system comprises, in addition to a first gateway through which the sensed biological signal is transmitted and/or received, at least one second gateway through which the sensed biological signal can be transmitted and/or received, and determine which gateway the sensed biological signal is to be transmitted and/or received through in response to the health care system comprising the second gateway, and a communication control unit configured to control a transmitting and/or receiving function of each gateway according to a result of the determining. | 07-19-2012 |
Patent application number | Description | Published |
20100113947 | APPARATUS AND METHOD OF MEASURING BLOOD PRESSURE - Provided is a blood pressure measuring apparatus including: a pressurizing unit applying pressure to a blood vessel according to a first condition or a second condition; a pressure sensor sensing a sphygmus wave and a pressure of the blood vessel from the blood vessel under the first condition or the second condition; a standard blood pressure calculating unit for calculating a systolic standard blood pressure and a diastolic standard blood pressure; a continuous blood pressure calculating unit for calculating continuous blood pressure; and a repressurizing determining unit for determining whether pressure is applied to the blood vessel under the second condition during measuring of continuous blood pressure. | 05-06-2010 |
20100274142 | METHOD AND APPARATUS FOR CORRECTING ERROR IN BLOOD PRESSURE MEASUREMENT - Provided are a method and apparatus for correcting an error in blood pressure measurement. In a method of correcting an error in a measured blood pressure, the error in the measured blood pressure, which is measured at a first site of a first body is calculated based on a correlation between a shape of a sphygmogram measured at a first body part and a difference between blood pressure measured at a first body part and blood pressure measured at a second body part, and the blood pressure measured at a first site of a first body is corrected using a calculated error. | 10-28-2010 |
20120004563 | METHOD AND APPARATUS FOR MEASURING A BIOLOGICAL SIGNAL - Provided is an apparatus and method for analyzing a biological signal. The apparatus may measure the biological signal, detect a noise signal influencing the electrical characteristics of the measured biological signal, and display the measured biological signal by distinguishing a normal section of the measured biological signal from an abnormal section of the biological signal. | 01-05-2012 |
20150327814 | METHOD AND APPARATUS FOR MEASURING A BIOLOGICAL SIGNAL - Provided is an apparatus and method for analyzing a biological signal. The apparatus may measure the biological signal, detect a noise signal influencing the electrical characteristics of the measured biological signal, and display the measured biological signal by distinguishing a normal section of the measured biological signal from an abnormal section of the biological signal. | 11-19-2015 |
Patent application number | Description | Published |
20090026628 | ELECTRICAL CONNECTIONS FOR MULTICHIP MODULES - A semiconductor package includes a first semiconductor chip mounted on a substrate and a second semiconductor chip mounted on top of the first semiconductor chip. A plurality of metal lines is deposited on the top of the first chip, and the metal lines are isolated from circuitry in the first chip. Wire bonds connect pads on the second chip to metal lines on the first chip. Additional wired bonds connect the metal lines on the first chip to terminals on the substrate. Conductive through-silicon vias or solder bumps may replace the wire bonds, and additional chips may be included in the package. | 01-29-2009 |
20090108425 | Stacked package and method of manufacturing the same - In one embodiment, the stacked package includes a first chip disposed over a package substrate. The first chip has at least one first chip dummy pad, and the first chip dummy pad is not electrically connected to circuits of the first chip. A first dummy bonding wire is connected to the first chip dummy pad and the package substrate. A second chip is disposed over at least a portion of the first chip, and the second chip has at least one second chip bonding pad. A first bonding wire is electrically connected to the second chip bonding pad and the first dummy bonding wire. | 04-30-2009 |
20100019397 | ELECTRICAL CONNECTIONS FOR MULTICHIP MODULES - Conductive lines are formed on a wafer containing multiple circuits. The conductive lines are isolated from the circuits formed within the wafer. Chips are mounted on the wafer and have their chip pads connected to the conductive lines of the wafer. The wafer may then be protected with a packaging resin and singulated | 01-28-2010 |
20110084396 | ELECTRICAL CONNECTION FOR MULTICHIP MODULES - A semiconductor package includes a first semiconductor chip mounted on a substrate and a second semiconductor chip mounted on top of the first semiconductor chip. A plurality of metal lines is deposited on the top of the first chip, and the metal lines are isolated from circuitry in the first chip. Wire bonds connect pads on the second chip to metal lines on the first chip. Additional wired bonds connect the metal lines on the first chip to terminals on the substrate. Conductive through-silicon vias or solder bumps may replace the wire bonds, and additional chips may be included in the package. | 04-14-2011 |
20110285034 | ELECTRICAL CONNECTIONS FOR MULTICHIP MODULES - Conductive lines are formed on a wafer containing multiple circuits. The conductive lines are isolated from the circuits formed within the wafer. Chips are mounted on the wafer and have their chip pads connected to the conductive lines of the wafer. The wafer may then be protected with a packaging resin and singulated | 11-24-2011 |
20110312130 | STACKED PACKAGE AND METHOD OF MANUFACTURING THE SAME - In one embodiment, the stacked package includes a first chip disposed over a package substrate. The first chip has at least one first chip dummy pad, and the first chip dummy pad is not electrically connected to circuits of the first chip. A first dummy bonding wire is connected to the first chip dummy pad and the package substrate. A second chip is disposed over at least a portion of the first chip, and the second chip has at least one second chip bonding pad. A first bonding wire is electrically connected to the second chip bonding pad and the first dummy bonding wire. | 12-22-2011 |
20120246329 | METHOD FOR SETTING PLURALITY OF SESSIONS AND NODE USING SAME - Disclosed are a method for setting a plurality of sessions and a method for transmitting/receiving data using the same. According to an exemplary embodiment of the present invention, at least some of the data including attribute information of the data are received through initial sessions, the number of additional sessions for receiving the data is calculated by using the attribute information of the data, and the additional sessions are set as many as the calculated number of additional sessions. According to the exemplary embodiments of the present invention, various and complicated states of the communication network can be reflected to session setting as the configuration of the communication network becomes more and more complicated and the sessions depending on the state of the communication network can be set, thereby transmitting data more effectively. | 09-27-2012 |
20120319290 | ELECTRICAL CONNECTION FOR MULTICHIP MODULES - A semiconductor chip is provided. The semiconductor chip includes a semiconductor substrate, a circuit on the substrate, an insulating layer formed on the circuit, and a plurality of electrically floating conductor lines formed on the insulating layer, at a major surface of the semiconductor chip. | 12-20-2012 |
20130122653 | Stacked Package And Method Of Manufacturing The Same - In one embodiment, the method includes disposing a first chip over a package substrate. The first chip has at least one first chip pad. The method further includes forming a first bonding wire connected to the first chip pad and the package substrate, and disposing a second chip over at least a portion of the first chip. The second chip has at least one second chip bonding pad. A first bonding wire is formed electrically connected to the second chip bonding pad and the first bonding wire. | 05-16-2013 |
20160087931 | METHOD AND APPARATUS FOR CALCULATING DISTANCE IN CONTENTS DELIVERY NETWORK - Disclosed are a method and an apparatus for calculating a distance in a contents delivery network. According to one preferred embodiment of the present invention, when a domain name resolution request is received from an LDNS, an identifier is added to a domain name requested to be resolved so as to create a CNAMEd domain name response, the CNAMEd domain name response is transmitted to a probe server, the CNAMEd domain name response transmitted to the probe server is transmitted to the LDNS after a source IP address thereof has changed into an address of a name server in the probe server, the name server receives a resolution request to the CNAMEd domain name response from the LDNS, and the name server determines, as a distance between the LDNS and a point of presence (POP), a value obtained by subtracting a distance between the name server and the LDNS and a distance between the name server and the probe server from an interval between a time for transmitting the CNAMEd domain name response from the name server to the probe server and a time for receiving, by the name server, the resolution request to the CNAMEd domain name response from the LDNS. According to the present invention, even when the probe server cannot calculate a distance to the LDNS, a distance between the LDNS and the POP can be calculated, and thus it is possible to improve and stabilize the quality of a contents delivery network service. | 03-24-2016 |
Patent application number | Description | Published |
20110176280 | STACKED SEMICONDUCTOR PACKAGE - A stacked semiconductor package including a first printed circuit board and a second printed circuit board is provided. The first printed circuit board may include a first surface upon which a first semiconductor chip is mounted and a second surface upon which at least one connecting structure is attached. The first printed circuit board may further include at least one thermal via and a heat sink and the at least one thermal via and the heat sink may be disposed under the first semiconductor chip with the heat sink being disposed between the first surface and the second surface. The second printed circuit board may include a third surface upon which a second semiconductor chip is mounted. The second printed circuit board may be disposed under the first printed circuit board with the at least one connecting structure connecting the first printed circuit board to the second printed circuit board. | 07-21-2011 |
20110260309 | SEMICONDUCTOR PACKAGE, TEST SOCKET AND RELATED METHODS - Provided are a socket, a semiconductor package, a test device and a method of manufacturing a semiconductor package. A socket to test a semiconductor package comprising a housing, a trench receiving a semiconductor package in the housing, at least one probe connected to the semiconductor package at a bottom of the trench, and at least one connector electrically connecting a plurality of contact points exposed at a side of the semiconductor package when the semiconductor package is inserted into the trench. A semiconductor package with contacts exposed from a side of a package substrate, and a method of manufacturing such a semiconductor package are also disclosed. | 10-27-2011 |
20130161788 | Semiconductor Package Including Stacked Semiconductor Chips and a Redistribution Layer - Semiconductor packages including stacked semiconductor chips are provided. The semiconductor packages may include first semiconductor chips and a second semiconductor chip that are stacked sequentially on a board. The semiconductor packages may also include a wiring layer on the memory chips and the wiring layer may include redistribution patterns and redistribution pads. Each of the memory chips may include a data pad. The data pads of the first semiconductor chips may be electrically connected to the board via the second semiconductor chip, some of redistribution patterns, and some of redistribution pads. | 06-27-2013 |
20150115438 | STACKED SEMICONDUCTOR PACKAGE - A semiconductor package comprising: a base substrate; a first semiconductor chip unit attached to the base substrate and including at least one first semiconductor chip; a second semiconductor chip unit stacked on the first semiconductor chip unit and including at least one second semiconductor chip; at least one third semiconductor chip disposed between the first semiconductor chip unit and the second semiconductor chip unit and having an area smaller than that of the at least one first semiconductor chip and that of the at least one second semiconductor chip; and an insulating material layer disposed between the first semiconductor chip unit and the second semiconductor chip unit to surround at least a portion of the at least one third semiconductor chip and having a thickness larger than that of the third semiconductor chip. | 04-30-2015 |
20160049977 | CARD SOCKET DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SAME - Disclosed are a card socket device and an electronic apparatus including the same. The card socket device includes a seat portion configured to receive an attachable card; and one or more connection terminal portions formed in the seat portion and configured to form an electrical connection with one or more connection pads formed in a bottom surface of the attachable card, wherein the seat portion is configured such that a space accommodating the attachable card is upwardly opened. | 02-18-2016 |