Patent application number | Description | Published |
20090006048 | METHOD FOR SIMULATING THERMAL RESISTANCE VALUE OF THERMAL TEST DIE - A method for simulating a thermal resistance value of a thermal test die is provided to estimate a relationship between the thermal resistance value of a heating block and the thermal resistance value of the thermal test die, and to find out a size of the heating block that matches an actual thermal situation of the thermal test die. In addition, after being tested by the heating block, the reliability of the testing result may be improved by verifying whether the relationship of a transient response of thermal resistance of the heating block and a steady-state response of thermal resistance of the thermal test die is within a range of a setting variation. | 01-01-2009 |
20090016020 | HEAT-DISSIPATING MODULE AND ELECTRONIC APPARATUS - A heat-dissipating module suitable for dissipating heat generated by a heat-generating element is provided. The heat-dissipating module includes a first heat-conducting plate, a first heat-dissipating tube, and a fan. The first heat-conducting plate is thermally coupled to the heat-generating element. The first heat-dissipating tube has a first opening and a second opening opposite to the first opening. The first heat-conducting plate is connected to the first heat-dissipating tube and located at an outside of the first heat-dissipating tube. The fan is disposed adjacent to the first opening and corresponding to first opening. The fan is adapted for generating an air current flowing in the first heat-dissipating tube. The heat-dissipating module can transfer the heat generated by the heat-generating element during operation to an external environment. | 01-15-2009 |
20140083655 | ELECTRONIC DEVICE - An electronic device includes a case, a heat source, a radiator, and an air stream generator. The case has an air ventilation hole and an opening. The radiator is disposed in the case and in thermal contact with the heat source. The radiator includes a main body having a first, a second, and a third side surface. A first air inlet, an air outlet, and a second air inlet are disposed on the first side surface, the second side surface, and the third side surface, respectively. The third side surface and the case are separated by a distance from each other. The second air inlet is disposed between a geometric middle plane of fins of the main body and the second side surface. The distance between the second air inlet and the first side surface is greater than that between the air ventilation hole and the first side surface. | 03-27-2014 |
20140085819 | ELECTRONIC DEVICE - An electronic device comprises a case having an air ventilation hole and an opening, a heat source, a radiator disposed inside the case and in thermal contact with the heat source, and an air current generator. The radiator comprises a body having a first and second lateral sides, and a third lateral side disposed therebetween. A first air inlet is disposed on the first lateral side. An air outlet exposed by the opening is disposed on the second lateral side, and a second air inlet is disposed on the third lateral side. The body comprising fins and a geometrical middle side of the fins is between the first and second lateral sides. The second air inlet corresponding to the air ventilation hole is between the geometrical middle side and the first lateral side. An air exhausting hole of the air current generator faces the first air inlet. | 03-27-2014 |
20140118928 | ELECTRONIC DEVICE - An electronic device comprises a case, a heat source and a radiator. The heat source is disposed inside the case. The radiator is disposed on the case and the radiator is kept away from the heat source at a distance. The radiator comprises a case body. A plurality of cellular compartments formed by a plurality of partition plates is disposed inside the case body. The cellular compartments are filled with a heat dissipation material. The radiator absorbs the heat of the heat source through thermal radiation. | 05-01-2014 |
20140118942 | ELECTRONIC DEVICE - An electronic device includes a housing, a heat source located in the housing, and a heat dissipation device disposed in the housing. The heat dissipation device thermally contacts the heat source. The heat dissipation device includes a casing. A heat dissipation material is disposed in the casing. The heat dissipation material includes 15 to 30 percent volume of multiple copper materials, 50 to 85 percent volume of a phase change material and 15 to 20 percent volume of air. The heat dissipation device has a surface thermally contacting the heat source. A central area and an outer ring area are defined on the surface. The outer ring area surrounds the central area. A geometric midpoint of the central area overlaps that of the surface. The heat source is located in the outer ring area. The heat dissipation device absorbs heat from the heat source through thermal conduction. | 05-01-2014 |
20140118943 | ELECTRONIC DEVICE - An electronic device includes a housing, a heat source in the housing, and a heat dissipation device in the housing and separated from the heat source by a distance. The heat dissipation device includes a casing. A heat dissipation material is disposed in the casing. The heat dissipation material includes 15 to 30 percent volume of multiple copper materials, 50 to 85 percent volume of a phase change material, and 15 to 20 percent volume of air. The heat dissipation device has a surface facing the heat source. A central area and an outer ring area are defined on the surface. The outer ring area surrounds the central area. A geometric midpoint of the central area overlaps that of the surface. An orthographic projection region on the surface is in the outer ring area. The heat dissipation device absorbs heat from the heat source through thermal radiation. | 05-01-2014 |
20140118945 | ELECTRONIC DEVICE - An electronic device includes a housing, a heat source located in a casing, and a heat dissipation device disposed in a casing. The heat dissipation device is kept apart from the heat source. The heat dissipation device includes a casing having a heat dissipation material including 15 to 30 percent volume of multiple copper materials, 50 to 85 percent volume of a phase change material, and 15 to 20 percent volume of air. The casing has a surface facing the heat source. A central area and an outer ring area are defined on the surface. A geometric midpoint of the central area overlaps a geometric midpoint of the surface. An orthographic projection region of the heat source to the surface is located in the central area. The heat dissipation device absorbs heat generated by the heat source through thermal radiation. | 05-01-2014 |
20140118948 | ELECTRONIC DEVICE - An electronic device includes a housing, a heat source located inside a casing, and a heat dissipation device disposed inside a casing. The heat dissipation device is in thermal contact with the heat source. The heat dissipation device includes a casing having a heat dissipation material. The heat dissipation material includes 15 to 30 volume percent of multiple copper materials, 50 to 85 volume percent of a phase change material, and 15 to 20 volume percent of air. The casing has a surface being in thermal contact with the heat source. A central area and an outer ring area are defined on the surface. The outer ring area surrounds the central area. A geometric midpoint of the central area and a geometric midpoint of the surface are overlapped. The heat dissipation device absorbs heat generated by the heat source located in the central area through thermal conduction. | 05-01-2014 |
20140119906 | FAN - A fan includes a casing and a fan blade. The casing has at least one air inlet and an air outlet. The fan blade is disposed in the casing. An air flow compression area is defined in the casing. An auxiliary air inlet is disposed on the casing at the air flow compression area. Furthermore, another fan includes a casing and a fan blade. The casing has an upper casing, a lower casing and a side casing located between the upper casing and the lower casing. The upper casing or the lower casing has at least one air inlet, and the side casing has an air outlet. The fan blade is disposed in the casing. An internal space of the casing is defined as an air flow compression area. An auxiliary air inlet is disposed on the casing at the air flow compression area. | 05-01-2014 |
20140127022 | FAN BLADE STRUCTURE - A fan blade structure includes a hub, an annular partition surrounding the hub, a first blade group and a second blade group. The hub has a top surface and a flank connected to the top surface. The first blade group, disposed on one side of the annular partition, includes two blade arrays having multiple first and second blades respectively. The clearance between the two adjacent first blades is less than that between the two adjacent second blades. The second blade group, disposed on another side of the annular partition, includes another two blade arrays having a plurality of third and fourth blades respectively. The clearance between the two adjacent third blades is less than that between the two fourth blades adjacent to each other. | 05-08-2014 |
20150104029 | SYSTEM FOR CONTROLLING FAN NOISE - A system for controlling fan noise includes a fin, a fan, a sensor, a signal processing unit, and a speaker. The fin has a front side and a rear side opposite to the front side. The fan is disposed adjacent to the front side and has an airflow outlet, and the airflow outlet faces the front side. The sensor is disposed adjacent to the rear side and is used for receiving a sound signal made by the fan. After the signal processing unit receives the sound signal sent by the sensor, the signal processing unit provides an inversed phase signal by analysis and computation. The speaker is disposed adjacent to the rear side, for receiving and outputting the inversed phase signal provided by the signal processing unit, so as to offset the noise made by the fan. | 04-16-2015 |
20150110283 | SYSTEM FOR CONTROLLING FAN NOISE - A system for controlling fan noise includes a fan, a sensor, a signal processing unit, a net structure, and a piezoelectric element. The fan has an airflow inlet and an airflow outlet. The sensor is disposed near the airflow outlet and is used for receiving a sound signal made by the fan. After the signal processing unit receives the sound signal sent by the sensor, the signal processing unit provides an inversed phase signal by analysis and computation. The net structure is disposed at the airflow inlet. The piezoelectric element is disposed on the net structure. When the piezoelectric element receives the inversed phase signal provided by the signal processing unit, the piezoelectric element vibrates the net structure, so that the net structure generates an inversed phase sound to offset a noise made by the fan. | 04-23-2015 |
20150152858 | HEAT DISSIPATION MODULE - A heat dissipation module includes an electro-magnetic member, an elastic member and a magnetic member. The electro-magnetic member is configured for generating a periodic magnetic field. The elastic member includes a fixed end, a free end and multiple blades for expanding or closing; and the blades are located between the fixed end and the free end. The magnetic member is disposed on the free end and configured for reciprocating due to being magnetically induced by the periodic magnetic field so as to drive the plurality of blades to produce an air current. | 06-04-2015 |
20150156916 | ELECTRONIC DEVICE - An electronic device includes a case, an airflow generator and a support block. The case has an abutting surface located inside the case. The airflow generator is disposed inside the case and includes an axle part and a plurality of blades disposed around the axle part. The support block is disposed on the axle part and protrudes towards the abutting surface, or is disposed on the abutting surface and protrudes towards the axle part. | 06-04-2015 |