Patent application number | Description | Published |
20120217628 | METAL BUMPS FOR COOLING DEVICE CONNECTION - The mechanisms for forming metal bumps to connect to a cooling device (or a heat sink) described herein enable substrates with devices to dissipate heat generated more efficiently. In addition, the metal bumps allow customization of bump designs to meet the needs of different chips. Further, the usage of metal bumps between the semiconductor chip and cooling device enables advanced cooling by passing a cooling fluid between the bumps. | 08-30-2012 |
20140272717 | System and Method for Lithography Exposure with Correction of Overlay Shift Induced by Mask Heating - A method of exposing a wafer substrate includes receiving an integrated circuit (IC) design layout defining a pattern; determining a temperature profile of a mask based on the IC design layout, the pattern being formed on the mask; calculating a pre-corrected overlay shift for the mask based on the calculated temperature profile; and exposing a resist layer coated on a substrate using the mask with overlay compensation based on the pre-corrected overlay shift. | 09-18-2014 |
20150125998 | METAL BUMPS FOR COOLING DEVICE CONNECTION - A method of preparing a semiconductor substrate with metal bumps on both sides of the substrate includes depositing a first-side UBM layer on a first surface of the substrate, and forming a plurality of first-side metal bumps on the first surface of the substrate after the first-side UBM layer is deposited. The method includes forming a second-side UBM layer on a second side of the substrate, and the first surface and the second surface are opposite of each other. The method includes forming a plurality of second-side metal bumps on the second surface of the substrate after the second-side UBM layer is deposited. The method includes removing exposed first-side UBM layer and exposed second-side UBM layer after the plurality of first-side metal bumps and the plurality of second-side metal bumps are formed. The method includes reflowing the plurality of first-side metal bumps and the plurality of second side metal bumps. | 05-07-2015 |
20150262846 | PACKAGE STRUCTURE AND MANUFACTURING METHOD - A package structure and a manufacturing method are provided. The package structure includes a semiconductor substrate and a first conductive feature over the semiconductor substrate. The package structure also includes a substrate and a second conductive feature over the substrate. The second conductive feature is bonded with the first conductive feature through a bonding structure. The package structure further includes a protection material surrounding the bonding structure, and the protection material is in direct contact with a side surface of the first conductive feature. | 09-17-2015 |
20150262951 | BUMP STRUCTURE AND METHOD FOR FORMING THE SAME - A semiconductor structure is provided. The semiconductor structure includes a first substrate and a metal pad formed over the first substrate. The semiconductor structure further includes a modified conductive pillar having a top portion and a bottom portion formed over the metal pad and a solder layer formed over the modified conductive pillar. In addition, the top portion of the modified conductive pillar has a first sidewall in a first direction and a bottom portion of the modified conductive pillar has a second sidewall in a second direction different from the first direction. | 09-17-2015 |
20150262952 | BUMP STRUCTURE AND METHOD FOR FORMING THE SAME - A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a first substrate and a metal pad formed over the first substrate. The semiconductor structure further includes a seed layer formed over the metal pad and a conductive pillar formed over the seed layer. In addition, the seed layer has a sidewall and a bottom surface, and an angle between the sidewall and the bottom surface of the seed layer is in a range from about 20° to about 90°. | 09-17-2015 |
20150262953 | SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD - A semiconductor device structure and a manufacturing method are provided. The method includes forming a conductive pillar over a semiconductor substrate. The method also includes forming a solder layer over the conductive pillar. The method further includes forming a water-soluble flux over the solder layer. In addition, the method includes reflowing the solder layer to form a solder bump over the conductive pillar and form a sidewall protection layer over a sidewall of the conductive pillar during the solder layer is reflowed. | 09-17-2015 |
20150262954 | SOLDER STUD STRUCTURE AND METHOD OF FABRICATING THE SAME - A semiconductor structure is provided. The semiconductor structure includes a first substrate and a metal pad formed over the first substrate. The semiconductor structure further includes a solder stud formed over the metal pad, and the solder stud has a flat top surface parallel to a top surface of the first substrate. | 09-17-2015 |
20150262955 | SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD - A semiconductor device structure and a manufacturing method are provided. The semiconductor device structure includes a semiconductor substrate and a dielectric layer over the semiconductor substrate. The semiconductor device structure also includes a conductive trace over the dielectric layer. The semiconductor device structure further includes a conductive feature over the conductive trace, and a width of the conductive feature is substantially equal to or larger than a maximum width of the conductive trace. In addition, the semiconductor device structure includes a conductive bump over the conductive feature. | 09-17-2015 |
20150316861 | System and Method for Lithography Exposure With Correction of Overlay Shift Induced By Mask Heating - A method of exposing a wafer substrate includes receiving an integrated circuit (IC) design layout defining a pattern; determining a temperature profile of a mask based on the IC design layout, the pattern being formed on the mask; calculating a pre-corrected overlay shift for the mask based on the calculated temperature profile; and exposing a resist layer coated on a substrate using the mask with overlay compensation based on the pre-corrected overlay shift. | 11-05-2015 |
Patent application number | Description | Published |
20130156947 | Track Spin Wafer Chuck - The present disclosure relates to a wafer chuck configured to provide a uniform photoresist layer on a workpiece. In some embodiments, the wafer chuck comprises a plurality of vacuum holes. The plurality of vacuum holes (i.e., more than one) are in fluid communication with a cavity that continuously extends along the top surface between the vacuum holes. A vacuum source, connected to each vacuum hole, is configured to remove gas molecules from the cavity located below the workpiece leaving behind a low pressure vacuum. The use of a plurality of vacuum holes increase the uniformity of the vacuum, thereby preventing the formation of high vacuum areas in close proximity to any specific vacuum hole. The reduction of high vacuum areas reduces wafer bending associated with the high vacuum areas. | 06-20-2013 |
20130258339 | WAFER ALIGNMENT MARK SCHEME - A wafer alignment apparatus includes a light source, a light detection device, and a rotation device configured to rotate a wafer. The light source is configured to provide light directed to a backside of the wafer. The light detection device is configured to detect reflected light intensity from the backside of the wafer to find a position of at least one wafer alignment mark formed on the back side of the wafer. | 10-03-2013 |
20150219448 | WAFER ALIGNMENT MARK SCHEME - A wafer alignment apparatus includes a light source, a light detection device, and a rotation device configured to rotate a first wafer and a second wafer. The light source is configured to provide a first light directed to the first wafer and a second light directed to the second wafer. The light detection device is configured to detect reflected light intensity from the first wafer to find a position of at least one wafer alignment mark of the first wafer and to detect reflected light intensity from the second wafer to find a position of at least one wafer alignment mark of the second wafer. | 08-06-2015 |
Patent application number | Description | Published |
20100116304 | SAFELY OPERABLE HANDLE DEVICE FOR AN AUTOMATIC FOLDABLE UMBRELLA - A safely operable handle device includes a grip shell coupled to a telescopic central shaft unit, a retained block releasably blocked so as to hold the umbrella in an opened state, a reel member rotatably mounted in the grip shell and biased by a coil spring, a cord reelable on the reel member and coupled to one of a top notch and the retained block, an actuator, and a unidirectional retaining mechanism. Upon application of a pressing force to telescopically fold the central shaft unit, and upon movement of the actuator in response to a stroke movement of a push button, the reel member turns in a counterclockwise direction to reel in the cord, and is prevented from turning in a clockwise direction so as to hold the central shaft unit in position to thereby avoid undesirable extension of the central shaft unit. | 05-13-2010 |
20120012140 | Semi-automatic umbrella with an automatically retractable central shaft - A semi-automatic umbrella includes a telescopic central shaft, a handle, and a runner slidable along the shaft. A first pull cord is placed in a tensed state when the shaft is extended, which causes an upward biased movement of an actuating member to thrust a spring-biased runner-retaining member to disengage from the shaft once the first pull cord is released. A tension spring body coupled to a second pull cord is stretchable to acquire an urging force. The stretched tension spring body enables an upward movement of the runner for spreading the umbrella. Once the urging force is released, a downward movement of the runner causes collapse of the umbrella and disengagement of a spring-biased shaft-retaining member from the shaft, thereby permitting folding of the shaft and closing the umbrella. | 01-19-2012 |
20120138112 | SAFELY OPERABLE HANDLE DEVICE FOR AN AUTOMATIC FOLDABLE UMBRELLA - A safely operable handle device for an automatic foldable umbrella includes a grip shell coupled with a telescopic central shaft unit, a retained block releasably blocked to hold the umbrella in an opened state, a reel member rotatably mounted in the grip shell and biased to reel in a force transmission cord to restrict extending movement of the central shaft unit, a pawl member movable to engage or disengage from a ratchet tooth of the reel member, and a force-transmitting mechanism urged to move from a lower position to an upper position, and having a camming surface mated with a cammed surface of the pawl member to move the pawl member to engage the ratchet tooth so as to prevent undesirable unfolding of the central shaft unit as a result of accidental slip-off during folding. | 06-07-2012 |
Patent application number | Description | Published |
20100135320 | RATE ADAPTATION METHOD FOR COMMUNICATION SYSTEMS - A rate adaptation method comprises the steps of: updating the probability density function of the SNR of a transmitted signal according to the receiving status of the transmitted signal and the probability density function before update; and updating the transmission rate of the transmitted signal according the updated probability density function. | 06-03-2010 |
20100142459 | METHOD FOR SELECTING MODULATION AND CODING SCHEME - A method for selecting a modulation and coding scheme (MCS) applied to a multiple-antenna system. The method calculates the throughout of a plurality of MCSs based on the signal to noise ratio of the multiple-antenna system and selects a MCS from the plurality of MCSs accordingly. | 06-10-2010 |
20100178891 | METHOD AND CIRCUIT FOR CALIBRATING ANALOG CIRCUIT COMPONENTS - A method for calibrating an analog circuit component comprises the steps of: generating a first signal with a baseband frequency; generating a second signal by processing the first signal via the analog component to be calibrated; generating a third signal by processing the second signal via a power amplifier, wherein the power amplifier operates in a nonlinear region; generating a fourth signal by processing the third signal via a low-pass filter; and defining the adjustment for the In-phase-Quadrature-phase imbalance (IQ imbalance) of the analog component and then re-executing the step of generating the first signal, if the fourth signal shows an IQ imbalance mismatch. | 07-15-2010 |
20100179975 | METHOD FOR DECOMPOSING BARREL SHIFTER, DECOMPOSED CIRCUIT AND CONTROL METHOD THEREOF - A method for decomposing a barrel shifter decomposes N, the number of digits of input word, into N | 07-15-2010 |
20100182198 | SYSTEM AND METHOD FOR BEAMFORMING IN A WIRELESS COMMUNICATION SYSTEM - The method for beamforming in a wireless communication system comprises the steps of: receiving a sounding packet so as to estimate channel state information between a transmitter and a receiver; generating a beamforming matrix in accordance with the channel state information; generating a beamforming steering matrix by multiplying the beamforming matrix by a rotation matrix; and feeding back the beamforming steering matrix. | 07-22-2010 |
20100185913 | METHOD FOR DECODING LDPC CODE AND THE CIRCUIT THEREOF - A method for decoding LDPC code comprises the steps of: marking non-zero sub-matrices of a parity-check matrix of an LDPC code as 1 and zero sub-matrices of the parity-check matrix as 0 to form a simplified matrix; rearranging the sequence of rows of the simplified matrix according to the dependency between these rows; and updating the LDPC code in accordance with the sequence of the rows. | 07-22-2010 |
Patent application number | Description | Published |
20100008665 | Optical access system for dual service network - The present invention relates to an optical access system for dual service network, which mainly comprises an optical modulation device which is used to receive on-off keying (OOK) signal from cable network and radio frequency (RF) signal from wireless network, the optical modulation device then modulates the OOK signal and the RF signal to an optical signal and send out an output optical signal. Lastly, the output optical signal is being delivered to an optical receiving device through an optical fiber transmission channel, and the optical receiving device can access the OOK signal and RF signal from the output optical signal. In addition, the present invention does not require remote nodes (receiver side) to use any optical filter to discern on-off keying signal from cable network and RF signal from wireless network. The present invention can also apply to the field of wavelength-division multiplexing system. | 01-14-2010 |
20100008680 | Optical modulating device with frequency multiplying technique for electrical signals - The present invention relates to an optical modulating device with frequency multiplying technique for electrical signals, which primary comprises a mixer, which generates a mixed data signal from a first electrical signal and a second electrical signal. The mixed data signal is then received by a first phase shift device to have its phase shifted and becomes a first shifted signal. The first electrical signal is further received by a second phase shift device to have its phase shifted and becomes a second shifted signal. The present invention further comprises an integrated electro-optic modulator (Mach-Zehnder modulator), which is used to receive an input optical signal, the mixed data signal, the first shifted signal, the second shifted signal and the first electrical signal mentioned above, the integrated electro-optic modulator will then modulates the input optical signal into a frequency multiplying output optical signal that carries the first electrical signal and the second electrical signal. The present invention can carry and transmit amplitude shift keying signals and vector modulation signals, thereby provides a more advanced optical communication transmission service. | 01-14-2010 |
Patent application number | Description | Published |
20090214213 | MODULATION DEVICE FOR GENERATING OPTICAL SIGNAL WITH QUADRUPLE FREQUENCY AND METHOD THEREOF - The present invention discloses a modulation device for generating an optical signal with quadruple frequency and the modulation method thereof. The modulation device in the present invention utilizes a commercial integrated modulator, a RF signal generator and a phase shifter to generate an optical signal with quadruple frequency. When the RF signal generator generates a first modulation signal, and the phase shifter shifts the first modulation signal by 90 degrees to generate a second modulation signal, the integrated modulator is biased to transmit the optical signal in maximum value and to modulate the first and second modulation signal so as to generate a output optical signal with quadruple frequency. | 08-27-2009 |
20100073763 | Adjustable optical signal delay module and method thereof - The present invention relates to an adjustable optical signal delay module, particularly to a module, which adjusts power of an amplified spontaneous emission generated by a semiconductor optical amplifier and reversely feeds the adjusted amplified spontaneous emission back to the semiconductor optical amplifier to vary a group refractive index of the semiconductor optical amplifier and delay the timing of an optical signal, whereby the present invention can replace the pump laser conventionally required by a CPO mechanism. In the present invention, the feedback optical loop comprises a variable optical attenuator, an optical filter, and optical circulators. An user can control the delay timing of optical signals via adjusting optical power in the feedback optical loop. The present invention can decrease the fabrication cost of an optical signal delay module and reduce the volume thereof. | 03-25-2010 |
20100104294 | Optical modulation device - The present invention discloses an optical modulation device, which comprises an electric signal generator generating an electric signal carrying a data signal; a first sinusoidal signal generator generating a first sinusoidal signal; an optical signal generator generating an input source optical signal; and an optoelectronic modulator(Mach-Zehnder modulator) receiving the input source optical signal, the electric signal and the first sinusoidal signal, biased to modify a transmission performance of the input source optical signal, modulating the input source optical signal with the electric signal and the first sinusoidal signal, and then sending out an output source optical signal carrying the electric signal and the first sinusoidal signal. The present invention realizes frequency multiplication, enables an optical signal to carry vector signals, and promotes the efficiency of broadband systems. | 04-29-2010 |
Patent application number | Description | Published |
20100263145 | BOLT BRUSH - A bolt brush includes a housing, a scraper and a ring plate. The housing has a holding space which is provided with an opening at an end and emplaces the scraper, an inner wall of the housing, close to that opening, is surrounded with a ring groove, and a side of the scraper is provided with plural brush hairs. The ring plate is locked in the ring groove, a side of the ring plate is an opening, and more than one pick-up member is formed close to that opening. | 10-21-2010 |
20100296885 | Pushing Structure of a Metal Work Drilling Tool - A pushing structure of a metal work drilling tool includes a drill housing, a drill assembly, a push part and a feed trigger. The drill assembly is constituted by a drill bit, an extension rod and a power device. When drilling needs to be conducted, the feed trigger is pressed to drive the drill assembly forward that the drill bit gently contacts with the object for drilling; next, the drilling tool is activated and the feed trigger is pushed, then drilling force can be controlled effectively to improve a drilling efficiency and reduce a chance that the drill bit is broken due to percussion. | 11-25-2010 |
Patent application number | Description | Published |
20100107040 | APPARATUS AND METHOD FOR DEFECT REPLACEMENT - Apparatuses and methods for defect replacement when an optical storage medium is read are provided. When the defect management is LOW, a pick-up head retrieves a set of data from the optical storage medium; a defect detector detects whether there is a defect in the set; if yes, a processor determines whether a replacement for the defect is in the set; and if yes, an interface transmits the replacement from the set. When the defect management is CRD, a buffer temporarily stores data retrieved from the optical storage medium; a defect detector detects whether there is a set of defects in the data; if yes, a comparator compares a length of the set of defects with a defect threshold length; a pick-up head reads more data from the optical storage medium continuously until the buffer reaches a buffer threshold if the length is compared shorter than the defect threshold length; and the pick-up head reads a set of replacements for the set of defects directly if the length is compared longer than the defect threshold length. | 04-29-2010 |
20110267931 | CONTROLLER FOR RECOVERING DISC MANAGEMENT INFORMATION OF A RECORDING MEDIUM - A controller for recovering disc management information is provided. The controller controls a pickup head unit to search the TDMAs for readable disc management information which is included in an in-use TDMA of the TDMAs; then determines whether a piece of information associated with an inconsistency flag of the readable disc management information is reliable. When the controller detects that the piece of information is unreliable, the controller determines at least a detection condition according to the information which is included in the readable disc management information and the in-use TDMA, and controls the pickup head unit to detect the recording medium to determine an update on the piece of information associated with the inconsistency flag under at least a detection condition. The controller generates update disc management information according to the readable disc management information and the update on the piece of information associated with the inconsistency flag. | 11-03-2011 |
20120233362 | BUFFER MANAGEMENT METHOD AND OPTICAL DISC DRIVE - A buffer management method operates by receiving a read command, wherein the read command comprises a read destination address for designating an associated area of a storage media; receiving write commands, wherein each of the write command comprises a data block and a write destination address for designating an associated location of the storage media to store the data block; buffering the data blocks of the write commands in a buffer; generating a latest list, wherein the latest list comprises a plurality of buffer indexes indicating buffer areas for storing the data blocks associated with the latest certain amount of received write commands; and determining whether the read destination address of the read command is associate with the latest list. | 09-13-2012 |
20130042163 | DRIVING CIRCUIT FOR DRIVING READING OPERATION OF OPTICAL DRIVE AND METHOD FOR READING INFORMATION FROM OPTICAL DATA STORAGE MEDIUM - The invention is directed to a method for reading information from an optical data storage medium, operating by: obtaining at least one coding/decoding unit of the optical data storage medium wherein the coding/decoding unit comprises a plurality of codewords; checking if the coding/decoding unit is reliable; and when the coding/decoding unit is not reliable; selecting at least one spec-defined codeword from the plurality of codewords. The spec-defined codeword includes a plurality of spec-defined fields defined by the specification of the coding/decoding unit; checking whether the spec-defined codeword is reliable; and when the spec-defined codeword is reliable, retrieving information from the spec-defined codeword. | 02-14-2013 |
Patent application number | Description | Published |
20080241760 | PEB EMBEDDED EXPOSURE APPARATUS - The present disclosure provides a lithography apparatus. The apparatus includes an exposure module designed for exposure processing; a baking module embedded in the exposure module and designed for post exposure baking (PEB); and a control module designed to control the exposure module and the baking module. | 10-02-2008 |
20110083496 | SEMICONDUCTOR PROCESSING APPARATUS WITH SIMULTANEOUSLY MOVABLE STAGES - A method and apparatus provide for simultaneously moving multiple semiconductor wafers in opposite directions while simultaneously performing processing operations on each of the wafers. The semiconductor wafers are orientated in coplanar fashion and are disposed on stages that simultaneously translate in opposite directions to produce a net system momentum of zero. The die of the respective semiconductor wafers are processed in the same spatial sequence with respect to a global alignment feature of the semiconductor wafer. A balance mass is not needed to counteract the motion of a stage because the opposite motions of the respective stages cancel each other. | 04-14-2011 |
20110194086 | WAFER EDGE EXPOSURE MODULE - A wafer edge exposure module connected to a semiconductor wafer track system. The wafer edge exposure module includes a wafer spin device, an optical system, a scanner interface module, and a controller. The wafer spin device supports a wafer for processing. The optical system directs exposure light on a respective edge portion of the wafer simultaneously to create a dummy track on the edge of the wafer. The scanner interface module sends and/or receives dummy edge exposure information from a scanner via a computer network. The controller receives the dummy edge exposure information from the scanner interface module and uses the exposure information to control the optical system. | 08-11-2011 |
20120181669 | FRAME CELL FOR SHOT LAYOUT FLEXIBILITY - A method includes establishing an initial shot layout in which a number of shots are arranged in vertically aligned columns and horizontally aligned rows to cover a semiconductor wafer. At least one of a row of shots or a column of shots is shifted relative to an adjacent row or column of shots to establish at least one additional shot layout that differs from the initial shot layout in that shots in the at least one shifted row or column of shots are not aligned with the shots in the adjacent row or column of shots with which they were aligned in the initial shot layout. One of the initial shot layout and the at least one additional shot layout is selected as a final shot layout. The wafer is exposed to light using the final shot layout. | 07-19-2012 |
20140178803 | Multiple-Patterning Photolithographic Mask and Method - A composite mask suitable for multiple-patterning lithographic processes and a multiple-patterning photolithographic process utilizing the mask are disclosed. An exemplary embodiment includes receiving a mask having a plurality of sub-reticles and a substrate having one or more regions. A first sub-reticle of the plurality of sub-reticles is aligned with a first region of the one or more regions. A movement pattern is designated relative to the substrate. A first photolithographic process is performed including exposing the substrate using the mask to form a first exposed area on the substrate. An alignment of the mask relative to the substrate is shifted according to a first direction determined by the movement pattern. A second photolithographic process is performed including exposing the substrate using the mask to form a second exposed area on the substrate such that the second exposed area overlaps the first. | 06-26-2014 |
20150198887 | Multiple-Patterning Photolithographic Mask and Method - A composite mask suitable for multiple-patterning lithographic processes and a multiple-patterning photolithographic process utilizing the mask are disclosed. An exemplary embodiment includes receiving a mask having a plurality of sub-reticles and a substrate having one or more regions. A first sub-reticle of the plurality of sub-reticles is aligned with a first region of the one or more regions. A movement pattern is designated relative to the substrate. A first photolithographic process is performed including exposing the substrate using the mask to form a first exposed area on the substrate. An alignment of the mask relative to the substrate is shifted according to a first direction determined by the movement pattern. A second photolithographic process is performed including exposing the substrate using the mask to form a second exposed area on the substrate such that the second exposed area overlaps the first. | 07-16-2015 |