Patent application number | Description | Published |
20090152242 | PLASMA TREATMENT APPARATUS AND PLASMA TREATMENT METHOD - The invention provides a plasma treatment apparatus or a plasma treatment method having a high productivity while maintaining a stable treatment performance. In a plasma treatment apparatus feeding a plurality of gases fed into the treatment chamber and treating a sample arranged within the treatment chamber by a plasma formed by using the plurality of gases, the plasma treatment apparatus has a plurality of feeding gas lines in which the plurality of gases respectively pass, a plurality of gas flow rate regulators respectively arranged on the feeding gas lines and respectively regulating flow rates of the plurality of gases, and a testing gas flow path coupled to the gas line so as to be arranged outside the treatment chamber and arranging a tester testing a flow rate of a gas from a gas flow rate controller therein, and the plasma treatment apparatus tests the gas flow rate regulator on a gas line corresponding to the gas which is not used for the treatment in the plurality of gases in parallel with the treatment. | 06-18-2009 |
20110144792 | SEMICONDUCTOR PROCESSING SYSTEM AND PROGRAM - In a processing system of a linear tool in which plural carrying robots are arranged in carrying mechanical units to which processing modules are coupled and a processing target is delivered and received between the plural carrying robots, in the case where there are plural carrying routes on which the processing target is carried, the present invention provides a technique for determining the carrying route on which the highest throughput can be obtained. | 06-16-2011 |
20110217148 | VACUUM PROCESSING APPARATUS AND PROGRAM - The present invention provides an efficient transferring control method in a vacuum processing apparatus of a linear tool in which plural vacuum robots are arranged in transferring mechanical units to which process chambers are connected and processing-target members are passed and received among the plural vacuum robots. In addition, the present invention provides a vacuum processing apparatus in which there are provided plural controlling methods, and a unit which determines whether rates of the transferring robots are to be controlled or rates of the process chambers are to be controlled on the basis of processing time of each processing-target member and switches the controlling method in accordance with a site whose rate is controlled. | 09-08-2011 |
20110218662 | VACUUM PROCESSING APPARATUS AND PROGRAM - Provided is a method for controlling efficient transferring operations in a vacuum processing apparatus with a linear tool. In the apparatus, plural transferring robots are arranged in transferring mechanism units in which plural process chambers are connected with each other, and to-be-processed wafers are received and passed between plural transferring robots. As the transferring robots is far from the load lock, the number of transferring operations to the process chambers is set larger, the number of times of continuous transferring operations to the process chambers is set as small as possible, and an odd number of times of continuous transferring operations to buffer rooms is set, by a destination determination unit and operation control rules. Further, transferring operations are performed based on the destination determination unit and the operation control rules. | 09-08-2011 |
20110229289 | VACUUM PROCESSING APPARATUS - The apparatus includes a load lock adapted to store the workpiece inside and to be switched between atmosphere and vacuum; vacuum transport chambers connected to the load lock and to the corresponding process chambers in a state where the load lock and each of the process chambers are isolated mutually; transfer means for transferring the workpiece between each of the process chambers and the load lock via the corresponding vacuum transport chamber; load lock valves adapted to switch between interrupt and opening at a position between the load lock and the corresponding vacuum transport chambers; process chamber valves adapted to switch between interrupt and opening at a position between the process chambers and the corresponding vacuum transport chambers; and control means for controlling timing of the opening and closing of the valves whose timings are controlled in synchronization with the transfer of the workpieces. | 09-22-2011 |
20110318143 | VACUUM PROCESSING APPARATUS - A vacuum processing apparatus includes a first lock chamber and a second lock chamber coupled to a back face side of the atmospheric transfer chamber in parallel, a first transfer chamber coupled to a rear side of the first lock chamber, a second transfer chamber coupled, on the rear side of the first transfer chamber, a third transfer chamber coupled to the rear side of the second lock chamber, a first and a second relay chamber disposed between the first transfer chamber/the second transfer chamber and the first transfer chamber/the third transfer chamber to transfer a wafer between these chambers, and a plurality of processing chambers coupled to either the first, the second or the third transfer chamber, in addition, the number of the processing chambers coupled to the second transfer chamber is greater than that of the processing chambers coupled to either the first or the third transfer chamber, and the wafer alone processed in the processing chamber coupled to either the first or the second transfer chamber is transferred to the third robot in the second relay chamber. | 12-29-2011 |
20120027542 | Vacuum processor - A vacuum processor includes a first transfer vessel that is connected on the back of a lock chamber connected on the back of an atmospheric transfer vessel and has a first robot; a second transfer vessel that is arranged at the back of this first transfer vessel, connected to the first transfer vessel, and has a second robot; a repeating vessel that connects the transfer vessels, and has a storage section in which the wafer is transferred between the robots; and a processing vessel that is connected, on an almost perpendicular side, to the repeating vessel around the second transfer vessel and in which the wafer is processed at a processing chamber, wherein the first robot has two arms that are expanded and contracted to both directions across a pivot axis, and the second robot has two arms that are expanded and contracted to the same direction around the pivot axis. | 02-02-2012 |
20120163943 | VACUUM PROCESSING APPARATUS - The vacuum processing apparatus is comprised of two vacuum transfer vessels in which a wafer is transferred through; two vacuum process vessels connected to these vacuum transfer vessels respectively; an intermediate chamber vessel capable of storing thereinto the wafer connected between the vacuum transfer vessels; a lock chamber connected to one of the vacuum transfer vessels; and a plurality of valves disposed among the vacuum transfer vessels, the vacuum process vessels, the intermediate chamber vessel, and the lock chamber respectively, for airtightly opening/closing communications among these vessels and the chamber; in which any one of the valves disposed on both sides of the intermediate chamber vessel is closed before the valves disposed between processing chambers of the vacuum process vessels and vacuum transfer chambers of the vacuum transfer vessels is opened. | 06-28-2012 |
20130183121 | VACUUM PROCESSING APPARATUS - In a vacuum processing apparatus having a plurality of vacuum processing chambers at least one of which are coupled to each of a plurality of vacuum transfer chambers which are behind an atmospheric transfer chamber and have vacuum transfer robots in their interior to transfer a wafer, taking out a plurality of wafers in a cassette and transferring successively to the plurality of the vacuum processing chambers, and thereafter returning to the cassette, the wafers are controlled to be transferred to all of the vacuum processing chambers coupled to the backmost vacuum transfer chamber and thereafter a next wafer is transferred to a vacuum processing chamber which becomes possible for the next wafer to be transferred in before they are possible to be transferred out from the vacuum processing chambers coupled to the backmost vacuum transfer chamber and arranged backmost. | 07-18-2013 |
20140044502 | VACUUM PROCESSING APPARATUS AND METHOD OF OPERATING THE SAME - In a vacuum processing apparatus including a plurality of vacuum transfer vessels arranged back and forth at the back of a lock chamber, an intermediate chamber arranged between them and capable of accommodating wafers, and processing units connected to respective vacuum transfer vessels, a wafer processed in a pre-processing vessel out of the processing units connected to the respective vacuum transfer vessels is transferred to a post-processing vessel connected to the same vacuum transfer vessel and post-processing is performed. | 02-13-2014 |
Patent application number | Description | Published |
20110110751 | VACUUM PROCESSING SYSTEM AND VACUUM PROCESSING METHOD OF SEMICONDUCTOR PROCESSING SUBSTRATE - A vacuum processing system of a semiconductor processing substrate and a vacuum processing method using the same comprises an atmospheric transfer chamber having a plurality of cassette stands for transferring a wafer, a lock chamber for storing the wafer transferred from the atmospheric transfer chamber, a first vacuum transfer chamber to which the wafer from the lock chamber is transferred, a transfer intermediate chamber connected to the first vacuum transfer chamber, a second vacuum transfer chamber connected to the transfer intermediate chamber, at least one vacuum processing chamber connected to the first vacuum transfer chamber, and two or more vacuum processing chambers connected to a rear side of the second vacuum transfer chamber, wherein the number of vacuum processing chambers connected to the first vacuum transfer chamber is smaller than the number of vacuum processing chambers connected to the second vacuum transfer chamber, or the number of use of vacuum processing chambers connected to the first vacuum transfer chamber is restricted to one. | 05-12-2011 |
20110110752 | VACUUM PROCESSING SYSTEM AND VACUUM PROCESSING METHOD OF SEMICONDUCTOR PROCESSING SUBSTRATE - The invention provides a vacuum processing system of a semiconductor processing substrate and a vacuum processing method using the same, comprising an atmospheric transfer chamber having a plurality of cassette stands, a lock chamber arranged on a rear side of the atmospheric transfer chamber, and a first vacuum transfer chamber connected to a rear side of the lock chamber, wherein the first vacuum transfer chamber does not have any vacuum processing chamber connected thereto and has transfer intermediate chambers connected thereto, and the transfer intermediate chambers have subsequent vacuum transfer chambers connected thereto, and wherein the wafers are transferred via the lock chamber to the first vacuum transfer chamber to be processed in each of the subsequent vacuum processing chambers, which are further transferred via any of the transfer intermediate chambers connected to the first vacuum transfer chamber to the subsequent vacuum transfer chambers, and the respective wafers transferred to the subsequent vacuum transfer chambers other than the first vacuum transfer chamber are transferred to the respective vacuum processing chambers connected to each of the vacuum processing chambers and processed therein. | 05-12-2011 |
Patent application number | Description | Published |
20130134954 | CONSTANT VOLTAGE CIRCUIT - In a constant voltage circuit including: an error amplifier circuit amplifying a difference voltage between an output voltage and a reference voltage; and an output transistor controlling the output voltage based on an output of the error amplifier circuit, a voltage proportional to a leakage current detected by a monitoring transistor is generated by an oscillation circuit and a charge pump circuit and is supplied to a back gate of the output transistor. | 05-30-2013 |
20130162227 | STEP-DOWN POWER SUPPLY CIRCUIT - A power supply has first and second reference voltage sources; a step-down voltage generator, including a transistor supplied with a first voltage, a resistor string between the transistor and a second voltage, and an op-amp which controls the transistor, and outputting the voltage at a first node among nodes in the resistor string; switches, coupled to the nodes; a comparison circuit, which compares the voltage at a common node the switches coupling in common with the second reference voltage source; and a calibration control circuit, which selects any switch according to a comparison result to calibrate. During calibration, the calibration control circuit couples a second node among the nodes to a non-inverting terminal of the op-amp, and the first reference voltage source to an inverting terminal of the op-amp, and after calibration, couples the common node to the non-inverting terminal, and the second reference voltage source to the inverting terminal. | 06-27-2013 |