Patent application number | Description | Published |
20160137572 | FLUORINATED AROMATIC COMPOUND, METHOD FOR ITS PRODUCTION, CURABLE MATERIAL, ITS CURED PRODUCT, AND OPTICAL MEMBER - To provide a novel fluorinated aromatic compound having at least two carbon-carbon unsaturated bonds, a method for its production, a curable material comprising the fluorinated aromatic compound, a cured product thereof, and an optical member. The fluorinated aromatic compound is represented by formula (A), wherein n is an integer of 0 to 6, a is an integer of 0 to 5, b is an integer of 0 to 4, c is an integer of 0 to 4, a+c+n is 2 to 6, a+b is 2 to 9, Z is a single bond, —O—, —S—, —CO—, —C(CH | 05-19-2016 |
20160137809 | CROSSLINKABLE FLUORINATED ELASTOMER COMPOSITION AND CROSSLINKED PRODUCT THEREOF - To provide a crosslinkable fluorinated elastomer composition which is excellent in crosslinking reactivity and of which a crosslinked product is excellent in heat resistance and chemical resistance. The crosslinkable fluorinated elastomer composition comprises a fluorinated elastomer (e.g. a tetrafluoroethylene/perfluoro(alkyl vinyl ether) copolymer) and an aromatic compound having at least two crosslinkable unsaturated double bonds (e.g. a compound represented by the formula (A-1)), and the crosslinked product is one obtained by crosslinking the crosslinkable fluorinated elastomer composition. | 05-19-2016 |
Patent application number | Description | Published |
20150184747 | COMBINED OIL CONTROL RING - A combined oil control ring comprising a pair of circular side rails each having a gap, and a spacer expander longitudinally sandwiched by the side rails, which has seating tabs for pushing inner surfaces of the side rails on the inner side, a side rail-pushing surface of each seating tab being provided with one or more grooves extending substantially longitudinally; each of the side rail-pushing surfaces including the grooves being provided with a nitride layer, and the depth d (μm) of the grooves, the surface hardness h (micro-Vickers hardness HV0.1) of the nitride layer, and the thickness t (μm) of the nitride layer having micro-Vickers hardness HV0.1 of 700 or more meeting the relation of the | 07-02-2015 |
20150300493 | COMBINATION OF CYLINDER AND PISTON RING - To provide a combination of a cylinder made of a hypereutectic Al—Si alloy and a hard-carbon-coated piston ring both exhibiting excellent wear resistance, the piston ring is provided with a laminate coating at least on an outer peripheral sliding surface thereof; the laminate coating comprising a metal layer, a metal-containing, hard carbon layer, and a metal-free, hard carbon layer in this order from the substrate side; the laminate coating having Martens' hardness (indentation hardness) HMs of 5-13 GPa, indentation modulus E of 70-200 GPa, and a deformation ratio Rpe of 0.45 or less, which is expressed by a ratio (Wp/We) of plastic deformation energy Wp to elastic deformation energy We; and a ratio (Tmf/Tm) of the thickness Tmf of the metal-free, hard carbon layer to the thickness Tm of the metal-containing, hard carbon layer being 2-8. | 10-22-2015 |
Patent application number | Description | Published |
20090108753 | PLASMA DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - The present invention provides a plasma display device that allows, at a low cost, reliable electrical connection between a film and a conductive member with low impedance as well as prevention of friction between them. This plasma display device includes a transparent substrate, a film attached to the rear surface of the transparent substrate, a back cover, and a conductive member for connecting the film and the back cover electrically. Convex portions are formed at a predetermined distance apart from each other on the facing surface of the conductive member facing the periphery of the film, while a concave portion or concave portions are formed on the rear surface of the transparent substrate. The convex portions are thus fitted in the concave portion or the concave portions with the film interposed therebetween. | 04-30-2009 |
20090115331 | PLASMA DISPLAY DEVICE - The present invention provides a plasma display device capable of maintaining an electromagnetic wave shielding effect. The plasma display device includes an optical filter having a conductive film, a frame supporting the periphery of the optical filter, a conductive member fixed to the frame, and a conductive back cover with the periphery thereof being contacted with the conductive member. Flexible conductive connecting portions are provided on the periphery of the conductive film, and the connecting portions are connected electrically, in a slack state, to the conductive member, and thereby the conductive film and the conductive member are connected electrically to each other. | 05-07-2009 |
20090140953 | PLASMA DISPLAY PANEL DISPLAY DEVICE - The present invention sufficiently reduces unwanted radiation in a plasma display panel (PDP) display device. The display device includes a PDP having a pair of electrodes, a first, a second, and a third conductive member, and a pair of driving circuits used to apply a voltage to their respective electrodes. Each conductive member has substantially the same width and height as the PDP, and the first, second, third conductive members are disposed on the rear surface of the PDP, in this order on the rear side of the PDP. The PDP and the conductive members are connected electrically to one another in the end portions of these elements, either directly or via the driving circuits, so that the direction of the current flowing in the PDP during driving and discharge coincides with the direction of the current flowing in the third conductive member, and is opposite from the direction of the current flowing in the first conductive member and the second conductive member. | 06-04-2009 |
20090141470 | SHIELD STRUCTURE FOR ELECTRONIC DEVICE - The present invention provides a shield structure for an electronic device allowing conductive members to be connected electrically to each other at low impedance while preventing the leakage of electromagnetic waves effectively. The first conductive member and the second conductive member for enclosing the electronic device respectively have laid portions that are laid one on the other and fastened to each other at plural positions by means of screw members. Through-holes into which the screw members are to be inserted are formed on both of the laid portions. Protruding portions, which protrude toward the laid portion of the second conductive member, each are formed between the adjacent through-holes on the laid portion of the first conductive member. The protruding portions each have a shape extending in the direction connecting the adjacent through-holes and bulging from both ends toward the center thereof in a smooth curve. | 06-04-2009 |
20090231238 | Plasma display device - A plasma display device includes a plasma display module having a plasma display panel provided with a plurality of parallel electrodes, a circuit board for applying a voltage to the electrodes, and a chassis conductor configured to hold the plasma display panel and to which a ground of a circuit board is coupled, and further includes a cylindrical conductor portion configured to surround the plasma display module. | 09-17-2009 |
20090237907 | Plasma display device - A plasma display device capable of reducing an electromagnetic interference wave due to a driving current flowing in a plasma display panel is provided. The plasma display device includes a plasma display panel having electrodes that are parallel to each other, a driver circuit board for applying a voltage to the electrodes, a chassis conductor holding the plasma display panel and to which a ground of the driver circuit board is connected, and a first additional conductor plate provided to the chassis conductor via an insulating layer and to which grounds of at least one circuit board in circuit boards other than the driver circuit board are attached. | 09-24-2009 |
20090251390 | PLASMA DISPLAY DEVICE - A plasma display device including a plasma display panel having electrodes through which a driving current flows; a chassis conductor holding the plasma display panel and provided with a return circuit of the driving current; a conductive case enclosing the plasma display panel and the chassis conductor; and a binding portion for binding the chassis conductor and the conductive case to each other and having a connection state different depending upon a frequency of flowing current. The binding portion has a connection state in which an amount of flowing current is less than a half of that in a short-circuited state and a connection state in which the amount is not less than a half of that in a short-circuited state. | 10-08-2009 |
20140185822 | BONE CONDUCTION SPEAKER AND BONE CONDUCTION HEADPHONE DEVICE - When sound signals are transmitted to a coil in a vibration driver, a magnet vibrates according to change in magnetic field caused by the coil. A diaphragm vibrates up and down together with the coil, due to magnetic effects of the coil with respect to the magnet. A vibration plate which closes an opening of the vibration driver converts air vibrations generated by the up and down vibrations of the diaphragm into mechanical vibrations, and transmits the mechanical vibrations as high frequency vibrations. A housing which accommodates the magnet transmits the vibrations of the magnet to the outside via a spring as low frequency vibrations. | 07-03-2014 |
20140185837 | BONE CONDUCTION SPEAKER AND BONE CONDUCTION HEADPHONE DEVICE - When sound signals are input to a vibration driver through signal wires, the vibration driver converts the sound signals into mechanical vibrations. A second elastic member transmits the mechanical vibrations of the vibration driver to a user. On the other hand, air vibrations are generated by the vibration driver in a space formed by the vibration driver and a first elastic member. The air vibrations are converted into mechanical vibrations by the first elastic member, and are transmitted to the second elastic member. The second elastic member also transmits the mechanical vibrations transmitted from the first elastic member, to the user. | 07-03-2014 |
20150146893 | BODY-SENSITIVE VIBRATION HEADPHONE - There is provided a body-sensitive vibration headphone for suppressing resonance that occurs when a vibrator that generates body-sensitive vibration vibrates. The body-sensitive vibration headphone includes electroacoustic transducer ( | 05-28-2015 |
20150319526 | BONE CONDUCTION SPEAKER AND BONE CONDUCTION HEADPHONE DEVICE - A bone conduction speaker includes a vibration driver configured to generate mechanical vibrations and air vibrations from an audio signal, a first elastic member configured to cover a portion of the vibration driver to form a space, and convert the air vibrations emitted by the vibration driver into the space, into mechanical vibrations, a second elastic member configured to be in contact with the vibration driver, and transfer the mechanical vibrations generated by the vibration driver and the mechanical vibrations received from the first elastic member, to a user, and an adjustment screw configured to act on the first elastic member to adjust at least one of the volume of the space and the distance between vibration nodes of the first elastic member. | 11-05-2015 |
Patent application number | Description | Published |
20120038996 | PHOTORESIST COMPOSITIONS - The present invention relates to a radically polymerizable composition comprising a hydroxylamine ester used to manufacture color filters. The invention further relates to novel hydroxylamine esters. The invention further relates to the use of hydroxylamine esters in all liquid crystal display components requiring post-baking. The present invention relates to a radically polymerizable composition comprising: (a) at least one alkaline developable resin; (b) at least one acrylate monomer; (c) at least a photoinitiator; (d) at least one hydroxylamine ester compound of formula (I) wherein R | 02-16-2012 |
20130188270 | OXIME ESTER - Compounds of the formula (I), wherein R | 07-25-2013 |
20130308219 | POLYMERIZABLE COMPOSITION COMPRISING AN OXIME SULFONATE AS THERMAL CURING AGENT - The present invention relates to a polymerizable composition comprising at least one ethylenically unsaturated, polymerizable compound and at least one oxime sulfonate compound of the formula (I) QA | 11-21-2013 |
20140005301 | SULFONIUM SULFATES, THEIR PREPARATION AND USE | 01-02-2014 |
20140334027 | OXIME ESTER PHOTOINITIATORS - Oxime ester compounds of formula (I), wherein R | 11-13-2014 |
20150044509 | SULFONIUM COMPOUNDS, THEIR PREPARATION AND USE - Compounds of the formula (I), (Ia) or (Ib) wherein A | 02-12-2015 |
20150064624 | OXIME ESTER PHOTOINITIATORS - Oxime ester compounds of the formula I, II, III, IV or V, wherein Z is for example (formula A); Z | 03-05-2015 |
20160060214 | POLYMERIZABLE COMPOSITION COMPRISING AN OXIME SULFONATE AS THERMAL CURING AGENT - The present invention relates to a polymerizable composition comprising at least one ethylenically unsaturated, polymerizable compound and at least one oxime sulfonate compound of the formula I | 03-03-2016 |
Patent application number | Description | Published |
20120255140 | ELECTRIC VACUUM CLEANER - An electric vacuum cleaner includes electric blower for generating a suction force; dust separating unit, installed on an upstream side of the electric blower, for separating dust from air containing the dust suctioned by electric blower; dust collecting chamber for accumulating the dust separated by dust separating unit opened to dust collecting chamber; and humidifying unit, communicating to humidifying port, for generating air of high humidity; wherein humidifying unit supplies the air of high humidity from humidifying port to the dust accumulated in dust collecting chamber. | 10-11-2012 |
20150288342 | MICROWAVE PROCESSING DEVICE - A microwave processing device includes: a periodic structure body which forms a surface-wave transmission line to transmit surface waves of microwaves; an oscillator which generates microwave power; and a transmitting part which transmits the microwave power generated by the oscillator to the periodic structure body, wherein a matching part is provided at a connecting portion between the periodic structure body and the transmitting part, and an impedance of the matching part is set to a value between an impedance of the periodic structure body and an impedance of the transmitting part. | 10-08-2015 |
20160088690 | MICROWAVE HEATING APPARATUS - A microwave heating apparatus includes: a heating chamber which houses a heating object; a microwave generating unit which generates a microwave; a transmitting unit which transmits the microwave generated by the microwave generating unit; a waveguide-structure antenna which radiates to the heating chamber the microwave transmitted from the transmitting unit; and a rotation driving unit which drives the waveguide-structure antenna to rotate, wherein the waveguide-structure antenna has a microwave sucking-out opening in a wall surface forming a waveguide structure of the waveguide-structure antenna. | 03-24-2016 |
Patent application number | Description | Published |
20100093244 | MIXED-FIBER NONWOVEN FABRIC LAMINATE - An object of the present invention is to develop a mixed-fiber nonwoven fabric laminate being excellent in strechability, flexibility, touch feeling, and formability and being less sticky. | 04-15-2010 |
20100105273 | NON-WOVEN FABRIC LAMINATE - An object of the present invention is to develop a non-woven fabric laminate that is excellent in stretchability, flexibility, and bulkiness, and that is less sticky and is suitable for a mechanical fastening female material. | 04-29-2010 |
20110092936 | MIXED FIBER SPUN BONDED NONWOVEN FABRIC AND USE THEREOF - The object of the present invention is to provide a mixed fiber spun bonded nonwoven fabric which has excellent bulkiness, initial hydrophilicity, long-lasting hydrophilicity, flexibility, resistance to fluff, stretchability and touch and low stickiness, and is suitable for a surface sheet for absorbent articles such as sanitary napkins, panty liners, incontinence pads, disposable diapers and other absorbent articles. | 04-21-2011 |
Patent application number | Description | Published |
20080243280 | Mixing signal processing apparatus and mixing signal processing integrated circuit - User is allowed to designate a desired mode defining the respective numbers of channels and mixing buses, and processing for mixing input signals of the number of channels corresponding to the designated mode is performed repetitively to generate signals for the individual buses. The time of arrival of the last step in the mixing processing for the number of channels, corresponding to the designated mode, is detected to output an accumulation result obtained at the last step, and new accumulation is started with a digital audio signal inputted at a step following the last step. Digital audio signals processed by a first signal processing circuit are stored into a memory and transmitted to a second signal processing circuit via a cascade-connection. The second signal processing circuit adds the audio signal, processed for each of the steps, to audio signals input via the cascade-connection and writes added signal into the memory. | 10-02-2008 |
20100242710 | TONE SIGNAL CREATING APPARATUS AND METHOD - In the case where an automatic reading file composed of plural kinds of detailed parameters stored in a transportable storage device whose attachment is detected has been already read in an apparatus, it is determined whether update, to a currently-read automatic reading file, of an automatic reading file stored in a storage section is carried out or not in accordance with a user's instruction, and is controlled so as to carry out a process. Namely, in the case where an automatic reading file has not been read yet, the automatic reading file stored in the storage section is updated to the currently-read automatic reading file without any condition. On the other hand, if an automatic reading file has been already read, the automatic reading file stored in the storage section may be edited on the basis of it. | 09-30-2010 |
20110094368 | MUSICAL TONE SIGNAL GENERATING APPARATUS - A waveform memory WM stores fast decay waveform data representative of fast decay waveforms of different levels of strength and slow decay waveform data representative of a slow decay waveform of a strong strength. A CPU | 04-28-2011 |
20120027232 | MIXING SIGNAL PROCESSING APPARATUS AND MIXING SIGNAL PROCESSING INTEGRATED CIRCUIT - User is allowed to designate a desired mode defining the respective numbers of channels and mixing buses, and processing for mixing input signals of the number of channels corresponding to the designated mode is performed repetitively to generate signals for the individual buses. The time of arrival of the last step in the mixing processing for the number of channels, corresponding to the designated mode, is detected to output an accumulation result obtained at the last step, and new accumulation is started with a digital audio signal inputted at a step following the last step. Digital audio signals processed by a first signal processing circuit are stored into a memory and transmitted to a second signal processing circuit via a cascade-connection. The second signal processing circuit adds the audio signal, processed for each of the steps, to audio signals input via the cascade-connection and writes added signal into the memory. | 02-02-2012 |
Patent application number | Description | Published |
20100120204 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A chip is bonded onto a flat face of a first support through a first bonding layer with a terminal surface of the chip turned toward the flat face of the first support. A second support is bonded onto the chip through a second bonding layer. The first support is peeled from the chip to expose the terminal surface of the chip. An insulating layer from which the terminal surface of the chip is exposed is formed on the second support. | 05-13-2010 |
20100123239 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A plurality of semiconductor devices having different thicknesses from each other and having respective electrode terminals are fixed on a surface of the support plate through a resin layer in such a manner that terminal surfaces of the electrode terminals are on the level with each other. An insulating layer covers terminal forming surfaces of the semiconductor devices. At least one tapered bump having a tip surface formed in a smaller area than an area of the terminal surface of the electrode terminal of the semiconductor device is formed on one of the terminal surfaces of the electrode terminals and penetrates the insulating layer in such a manner that the tip surface of the tapered bump is exposed to a surface of the insulating layer. A wiring pattern is formed on the surface of the insulating layer and connected to the tip surface of the tapered bump. | 05-20-2010 |
20100147561 | WIRING BOARD WITH LEAD PINS AND METHOD OF PRODUCING THE SAME - A wiring board with lead pins includes: connection pads formed on a wiring board, and lead pins bonded through a conductive material to the connection pads, wherein each of the lead pins has a head portion that is formed in one end of a shaft portion to be larger in diameter than the shaft portion, the head portions are bonded to the connection pads by the conductive material, a face of the wiring board on which the connection pads are formed is resin-sealed by a first resin to be thicker than the head portions, except portions to which the head portions are bonded, and sides of faces of the head portions to which the shaft portions are connected are sealed to be in close contact with the first resin by a second resin. | 06-17-2010 |
20100155126 | FINE WIRING PACKAGE AND METHOD OF MANUFACTURING THE SAME - At least one electronic component having a plurality of terminals on one of surfaces is temporarily fixed to a surface of a first support with a first adhesive layer in such a manner that the terminal side of the electronic component faces the first support. A second support having a second adhesive layer is fixed to the electronic component in order to interpose the electronic component between the first support and the second support. The first support and the first adhesive layer are peeled. The electronic component on the second support is sealed with a sealing resin in such a manner that at least a part of the terminals of the electronic component is exposed. An insulating resin layer and a wiring layer to be electrically connected to the terminal of the electronic component are stacked on the electronic component and the sealing resin. | 06-24-2010 |
20100155925 | RESIN-SEALED PACKAGE AND METHOD OF PRODUCING THE SAME - A method of producing a resin-sealed package is provided with: providing an electronic component which has a plurality of terminals on one face, a first support member and a second support member; temporarily fixing said electronic component to a surface of said first support member by a first adhesive agent layer, to face said terminals with said first support member; fixing said second support member having a second adhesive agent layer to said electronic component while interposing said electronic component between said first support member and said second support member to face said second adhesive agent layer with a back face side of said electronic component; resin sealing said electronic component between said first support member and said second support member; peeling said first support member and said first adhesive agent layer from said electronic component and a sealing resin; and stacking an insulating resin layer and a wiring layer which is electrically connected to said terminals of said electronic component, on said electronic component and said sealing resin. | 06-24-2010 |
20100219522 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS - A first sealing resin seals a side surface of an electronic component and a side surface of a conductive member. A second sealing resin is provided on the first sealing resin, and seals an electrode pad and an electrode pad forming surface of the electronic component and a part of the conductive member. A multilayer wiring structure includes a plurality of stacked insulating layers and a wiring pattern and is provided on a surface of the second sealing resin from which a connecting surface of the electrode pad and a first connecting surface of the conductive member are exposed. The wiring pattern is connected to the connecting surface of the electrode pad and the first connecting surface of the conductive member. | 09-02-2010 |
20110256662 | CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME - A method of producing a chip embedded substrate is disclosed. This method comprises a first step of mounting a semiconductor chip on a first substrate on which a first wiring is formed; and a second step of joining the first substrate with a second substrate on which a second wiring is formed. In the second step, the semiconductor chip is encapsulated between the first substrate and the second substrate and electrical connection is made between the first wiring and the second wiring so as to form multilayered wirings connected to the semiconductor chip. | 10-20-2011 |
20130069251 | WIRING SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE - A wiring substrate includes: a substrate layer made of glass or silicon and including: a first surface formed with a first hole; and a second surface formed with a second hole and being opposite to the first surface, wherein the first hole is communicated with the second hole; a connection pad formed in the second hole; a first wiring layer formed in the first hole and electrically connected to the connection pad; a first insulation layer formed on the first surface of the substrate layer to cover the first wiring layer; and a second wiring layer formed on the first insulation layer and electrically connected to the first wiring layer. A diameter of the first hole is gradually decreased from the first surface toward the second surface, and a diameter of the second hole is gradually decreased from the second surface toward the first surface. | 03-21-2013 |
20140313681 | CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME - An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part. | 10-23-2014 |
20150048505 | WIRING SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE - A wiring substrate includes: a substrate layer made of glass or silicon and including: a first surface formed with a first hole; and a second surface formed with a second hole and being opposite to the first surface, wherein the first hole is communicated with the second hole; a connection pad formed in the second hole; a first wiring layer formed in the first hole and electrically connected to the connection pad; a first insulation layer formed on the first surface of the substrate layer to cover the first wiring layer; and a second wiring layer formed on the first insulation layer and electrically connected to the first wiring layer. A diameter of the first hole is gradually decreased from the first surface toward the second surface, and a diameter of the second hole is gradually decreased from the second surface toward the first surface. | 02-19-2015 |
20150053460 | WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING WIRING BOARD - A wiring board includes first and second insulating layers, first and second through holes, a via, a plane layer, and signal wirings. The first insulating layer covers a first wiring layer. The first through hole opens on a surface of the first insulating layer and exposes a surface of the first wiring layer. The via fills the first through hole. The plane layer is connected to the via and is stacked on the first insulating layer. The second through hole opens on a surface of the plane layer and exposes the surface of the first insulating layer. The second insulating layer at least partially fills the second through hole and covers the plane layer. The signal wirings are stacked on the second insulating layer. The first through hole overlaps the signal wirings in a plan view. The second through hole does not overlap the signal wirings in a plan view. | 02-26-2015 |
20150364405 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A wiring substrate includes a first wiring layer including a first wiring part having a first wiring interval and a second wiring part having a second wiring interval wider than the first wiring interval, a metal plane layer formed on a portion of a first insulation layer formed on the first wiring layer, the first wiring part being located below the portion, a second insulation layer formed on the first insulation layer and the metal plane layer and having a first via hole and a second via hole, a second wiring layer formed on the second insulation layer and connected to the first wiring layer via a first via conductor formed in the first via hole, and a third wiring layer formed on the second insulation layer and connected to the metal plane layer via a second via conductor formed in the second via hole. | 12-17-2015 |
Patent application number | Description | Published |
20090008765 | CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME - A method of producing a chip embedded substrate is disclosed. This method comprises a first step of mounting a semiconductor chip on a first substrate on which a first wiring is formed; and a second step of joining the first substrate with a second substrate on which a second wiring is formed. In the second step, the semiconductor chip is encapsulated between the first substrate and the second substrate and electrical connection is made between the first wiring and the second wiring so as to form multilayered wirings connected to the semiconductor chip. | 01-08-2009 |
20110221069 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a semiconductor element having a first surface on which an electrode terminal is formed, and a second surface located opposite to the first surface. The semiconductor device further includes a first insulating layer in which the semiconductor element is buried, and second insulating layers and wiring layers formed in such a manner that at least one insulating layer and at least one wiring layer are formed on each of both surfaces of the first insulating layer. The electrode terminal of the semiconductor element is connected to a first wiring layer located on the first surface side through a first via formed in the first insulating layer, and the first wiring layer is connected to a second wiring layer located on the second surface side through a second via formed in the first insulating layer. | 09-15-2011 |
20130307113 | SEMICONDUCTOR DEVICE - A semiconductor device includes a first insulating layer; a wiring layer formed on a first surface of the first insulating layer and including a first electrode pad; a semiconductor chip; a second insulating layer including a semiconductor chip accommodating portion; a third insulating layer on the second insulating layer; and a passive element including an electrode and formed of an embedded portion and a protruding portion on a second surface of the first insulating layer, wherein an end surface of the embedded portion is coated by the insulating layer, the electrode of the passive element is electrically connected to the wiring layer through a via wiring formed in the insulating layers, the first electrode pad is electrically connected to another semiconductor device through a joining portion, and a protruding amount of the protruding portion is less than a gap between the second surface and the another semiconductor device. | 11-21-2013 |