Seoung Hyun
Seoung Hyun Kang, Ichon-Si KR
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20110128800 | SEMICONDUCTOR MEMORY APPARATUS - A semiconductor memory apparatus is provided. The semiconductor memory apparatus includes: an address pad; an address pad buffer section configured to selectively receive a signal of the address pad; a data input buffer section configured to selectively receive the signal of the address pad; and a signal control section configured to selectively provide a path of the signal of the address pad to the address buffer section and the data input buffer section. | 06-02-2011 |
Seoung Hyun Kim, Pocheon-Goon KR
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20080217722 | Image Sensor and Method for Manufacturing the Same - Disclosed are an image sensor and a method for manufacturing the same. The image sensor includes a substrate provided with a transistor circuit, first and second interconnections separated from each other on the substrate, a first conductive-type conductive layer formed at side surfaces of the first interconnection, a second conductive-type conductive layer formed at side surfaces of the second interconnection, and an intrinsic layer formed between the first and second conductive-type conductive layers thereby forming a P-I-N structure. | 09-11-2008 |
20090283849 | IMAGE SENSOR AND METHOD FOR MANUFACTURING THE SAME - Disclosed are an image sensor and a method for manufacturing the same. The image sensor includes a substrate provided with a transistor circuit, first and second interconnections separated from each other on the substrate, a first conductive-type conductive layer formed at side surfaces of the first interconnection, a second conductive-type conductive layer formed at side surfaces of the second interconnection, and an intrinsic layer formed between the first and second conductive-type conductive layers thereby forming a P-I-N structure. | 11-19-2009 |
Seoung Hyun Kim, Gyeonggi-Do KR
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20100117178 | IMAGE SENSOR AND METHOD FOR MANUFACTURING THE SAME - An image sensor is disclosed that includes a first substrate including an electric junction region, a transistor, and a metal line connected to the electric junction region or the transistor; and a photodiode formed on the first substrate. The first substrate is formed at an upper portion thereof with a reflective layer to reflect light back to the photodiode. | 05-13-2010 |
20100117179 | IMAGE SENSOR AND METHOD FOR MANUFACTURING THE SAME - Provided are an image sensor and a method for manufacturing the same. The image sensor comprises a substrate, a bonding silicon, an interlayer dielectric, a first contact plug, a second contact plug, a second metal interconnection, and a color filter layer and a microlens. The substrate comprises a first metal interconnection. The bonding silicon is formed on the substrate, and comprises a plurality of impurity regions. The interlayer dielectric is formed on the bonding silicon. The first contact plug penetrates the bonding silicon and is electrically connected to the first metal interconnection. The second contact plug penetrates the interlayer dielectric and is connected to a surface of the bonding silicon. The second metal interconnection is formed on the interlayer dielectric, and is connected to the second contact plug. The color filter layer and a microlens are formed over the second metal interconnection. | 05-13-2010 |
Seoung Hyun Kim, Pocheon-City KR
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20080224193 | CMOS image sensor and method for fabricating the same - A CMOS image sensor and method for fabricating the same improve image characteristics by eliminating the thickness of a planarization layer. The CMOS image sensor includes a semiconductor substrate; a plurality of active devices, provided in a predetermined surface of the semiconductor substrate, for generating electrical charges according to an amount of incident light; an insulating interlayer formed on an entire surface of the semiconductor substrate including the plurality of active devices; a color filter layer formed on the insulating interlayer, the color filter layer comprised of red, green, and blue color filter patterns for respectively filtering light according to wavelength, the color filter patterns arranged to correspond to the plurality of active devices; and a plurality of microlenses formed on the color filter layer, wherein the color filter layer is planarized so that each color filter pattern of the color filter layer is imparted with an equal height for receiving the plurality of microlenses. | 09-18-2008 |
Seoung-Hyun Kim, Pocheon-Si KR
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20090065829 | Image Sensor and Method for Manufacturing the Same - Provided are image sensors and a method of manufacturing the same. The image sensor can include a semiconductor substrate having a metal line and a readout circuitry formed thereon; a photodiode on the semiconductor substrate, the photodiode including a first impurity region and a second impurity region horizontally arranged in a crystalline region; and a first contact and a second contact penetrating the photodiode. The first contact can penetrate the first impurity region of the photodiode, and the second contact can penetrate the second impurity region to connect with the metal line. | 03-12-2009 |
20090068784 | Method for Manufacturing of the Image Sensor - Methods for manufacturing an image sensor are provided. A semiconductor substrate having a transistor can be prepared, and a proton layer can be formed in the substrate. A hydrogen gas layer can be formed by performing a heat treatment process on the semiconductor substrate, and a bottom portion of the semiconductor substrate defined by the hydrogen gas layer can be removed. | 03-12-2009 |
20090166695 | IMAGE SENSOR AND METHOD FOR MANUFACTURING THE SENSOR - A method for manufacturing an image sensor having a peripheral circuit unit and a pixel unit includes forming a device isolation layer that defines an active area in the pixel area, on a semiconductor substrate, forming a gate pattern on the active area of the semiconductor substrate, forming a photodiode area at one side of the gate pattern in the semiconductor substrate, vapor-depositing a plurality of dielectric layers on the whole surface of the substrate including the gate pattern, forming a spacer at lateral sides of the gate pattern by removing part of the plurality of dielectric layers by dry etching, and removing the other dielectric layer disposed between the lowermost dielectric layer and the uppermost dielectric layer by wet etching, while leaving a lowermost dielectric layer among the plurality of dielectric layers on the substrate where a floating diffusion area will be formed. | 07-02-2009 |
20090166792 | IMAGE SENSOR AND METHOD FOR MANUFACTURING THE SAME - Embodiments relate to an image sensor and a method of forming an image sensor. According to embodiments, an image sensor may include a first substrate and a photodiode. A circuitry including a metal interconnection may be formed on and/or over the first substrate. The photodiode may be formed over a first substrate, and may contact the metal interconnection. The circuitry of the first substrate may include a first transistor, a second transistor, an electrical junction region, and a first conduction type region. The first and second transistors may be formed over the first substrate. According to embodiments, an electrical junction region may be formed between the first transistor and the second transistor. The first conduction type region may be formed at one side of the second transistor, and may be connected to the metal interconnection. | 07-02-2009 |
Seoung-Hyun Kim, Seoul KR
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20130020463 | IMAGE-SENSING DEVICES AND METHODS OF OPERATING THE SAME - In a method of operating an image sensor, a noise voltage of a floating diffusion region is sampled after a reset voltage is applied to the floating diffusion region. A storage region, in which a photo-charge is stored, is electrically connected to the floating diffusion region after sampling the noise voltage, and a demodulation voltage of the floating diffusion region is sampled after the storage region and the floating diffusion region are electrically-connected. A voltage is determined based on the noise voltage and the demodulation voltage. | 01-24-2013 |
Seoung-Hyun Kim, Hwaseong-Si KR
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20140198183 | SENSING PIXEL AND IMAGE SENSOR INCLUDING SAME - A depth-sensing pixel included in a three-dimensional (3D) image sensor includes: a photoelectric conversion device configured to generate an electrical charge by converting modulated light reflected by a subject; a capture transistor, controlled by a capture signal applied to the gate thereof, the photoelectric conversion device being connected to the drain thereof; and a transfer transistor, controlled by a transfer signal applied to the gate thereof, the source of the capture transistor being connected to the drain thereof, and a floating diffusion region being connected to the source thereof. | 07-17-2014 |
20140253905 | DEPTH PIXEL AND IMAGE PICK-UP APPARATUS INCLUDING THE SAME - A depth pixel of an image sensor includes a depth sensing element configured to generate first charges that are photo-electrically converted from a light reflected from an object, a first floating diffusion node configured to receive the first charges from the depth sensing element, a second floating diffusion node configured to output second charges corresponding to a component of a reflection light where a component of an ambient light is cancelled, and an ambient light cancellation circuit configured to detect the ambient light to control a barrier level of a charge transfer path between the first floating diffusion node and the second floating diffusion node in response to the ambient light. | 09-11-2014 |