Patent application number | Description | Published |
20120248688 | DEPINCHING MECHANISM FOR PAPER JAM REMOVAL IN PRINTER - A depinching mechanism including a frame, a star wheel assembly, a limiter arm, a rocker arm and a sensor is provided in present invention. Through the depinching mechanism the star wheel assembly is lifted from the first position to the second position when paper jam occurs, and thus depinched the media the user can clear the paper jam. And after that the star wheel assembly is lowered from the second position to the first position. The star wheel assembly remains in the first position in the normal printing process. Since when paper jam occurs the star wheel assembly is lifted by the depinching mechanism, the user can easily and conveniently remove the jammed paper. And thus, the depinching mechanism can facilitate the user to remove jammed paper when paper jam occurs in printer. Thus, the depinching mechanism can be used in printers to solve the paper jamming problems. | 10-04-2012 |
20120248690 | DEPINCHING MECHANISM FOR PAPER JAM REMOVAL IN PRINTER - A depinching mechanism including a frame, a star wheel assembly, a transmitting device and a sensor is provided in present invention. Through the transmitting device rotating reversely, the star wheel assembly is lifted to the second position when paper jam occurs, thus depinched the media so that user can clear the paper jam. After that the star wheel assembly is lowered to the first position again. The star wheel assembly remains in the first position in normal printing process. Using a one-way clutch and a cam with an outer predetermined profile, the transmitting device rotates forwardly without transmitting any torque during normal printing process, and rotates inversely with transmitting a torque to lift the star wheel assembly up and lower the star wheel assembly down when paper jam occurs. Thus, the depinching mechanism can be used in printers to auto fix the paper jamming problems. | 10-04-2012 |
Patent application number | Description | Published |
20100112911 | METHOD AND DEVICE FOR THE INJECTION OF CMP SLURRY - The present invention comprises an apparatus for injecting slurry between the wafer and the pad in chemical mechanical polishing of semiconductor wafers comprising a solid crescent shaped injector the concave trailing edge of which is fitted to the size and shape of the leading edge of the polishing head with a gap of up to 1 inch, the bottom surface of which faces the pad and rests on it with a light load, and through which CMP slurry or components thereof are introduced through one or more openings in the top of the injector and travel through a channel or reservoir the length of the device to the bottom where it or they exit multiple openings in the bottom of the injector, are spread into a thin film, and are introduced between the surface of the polishing pad and the wafer along the leading edge of the wafer in quantities such that all or most of the slurry is introduced between the wafer and the polishing pad and a method of use therefor. | 05-06-2010 |
20100216373 | METHOD FOR CMP UNIFORMITY CONTROL - A method for injecting slurry between the wafer and the pad in chemical mechanical polishing of semiconductor wafers comprising a solid crescent shaped injector the concave trailing edge of which is fitted to the size and shape of leading edge of the polishing head with a gap of between 0 and 3 inches, the bottom surface facing the pad, which rests on the pad with a light load, and through which CMP slurry or components thereof are introduced through one or more openings in the top of the injector and travel through a channel or reservoir the length of the device to the bottom where it or they exit multiple openings in the bottom of the injector, are spread into a thin film, and are introduced at the junction of the surface of the polishing pad and the wafer along the leading edge of the wafer in quantities small enough that all or most of the slurry is introduced between the wafer and the polishing pad, wherein multiple inlets for the introduction of fluids to different points in the channel or directly to the bottom surface of the injector are utilized and some or all of which inlets are fitted with means for controlling the flow of fluid and adjustment is made to the said flow control means during or after polishing to adjust slurry delivery to the wafer surface to improve uniformity of removal rate at the wafer surface. | 08-26-2010 |
20110076924 | METHOD OF DETERMINING THE LUBRICATION MECHANISM IN CMP - The present invention is a method for obtaining data easily, accurately and effectively that may be used in determination of Sommerfeld Numbers and COF for CMP polishing. Using the Sommerfeld Numbers and COF values thus obtained the lubrication mechanism of CMP polishing with particular materials and under particular conditions can easily and reliably be studied. The method of the present invention is accomplished by use of CMP polishing tools capable of simultaneously measuring shear force and normal force, and rendering a value for the COF while simultaneously enabling the operator to change pressure on and relative velocity of the CMP wafer and CMP polishing pad in real time. Using the said CMP tool, the pressure and relative velocity may be varied separately or together for the desired length of time according to the needs of the operator so that within one CMP process multiple measurements may be taken under the same process conditions. | 03-31-2011 |