Patent application number | Description | Published |
20100027088 | SPACE SCANNER FOR SELF-CONTROL MOVING OBJECT - Provided is a space scanner for a self-control moving object. The space scanner has a structure in which a reflective mirror is rotated and tilted. Thus, the space scanner can scan a moving object in horizontal and vertical directions to secure spatial-data, thereby performing a self-control movement. | 02-04-2010 |
20100073749 | SPACE SCANNER FOR AUTONOMOUS MOBILE DEVICE - A space scanner for an autonomous mobile device can obtain spatial data by scanning not only in the horizontal direction but also in the vertical direction of the mobile device using a mirror configured to rotate as well as to tilt and thereby can ensure autonomous driving. | 03-25-2010 |
20100097598 | DISTANCE MEASUING APPARATUS - A distance measuring apparatus includes a light source unit generating reference light for distance measuring, a light receiving device receiving light reflected from an object to be measured, which has received the reference light, a mirror controlling a path of the reference light, and controlling a path of light, reflected from the object to be measured, toward the light receiving device, and a sensor lens focusing the light reflected from the mirror on the light receiving device. The sensor lens includes a lens portion refracting light, a flange portion provided around the circumference of the lens portion and including a coupling portion for fixing the sensor lens, and a light passing portion formed at the lens portion. | 04-22-2010 |
20100118362 | THREE-DIMENSIONAL SPACE SCANNER - A three-dimensional space scanner is configured so that a reflecting mirror is rotated and tilted so as to scan a mobile object in a horizontal as well as vertical direction, thereby obtaining spatial data. | 05-13-2010 |
20100118364 | THREE-DIMENSIONAL SPACE SCANNER - A Three Dimensional (3D) space scanner can obtain spatial data by scanning a mobile object not only in the horizontal direction but also in the vertical direction using a mirror that is driven to rotate as well as to tilt. | 05-13-2010 |
20100245799 | DISTANCE MEASURING APPARATUS - A distance measuring apparatus according to an aspect of the invention may include: a light source irradiating reference light to measure a distance; a lower reflective mirror reflecting the reference light to irradiate the reference light onto a peripheral obstacle, and reflecting reflected light, rebounded from an obstacle, so that the reflected light moves in an opposite direction along the same optical path as the reference light; a sensor lens arranged above the lower reflective mirror, converting the reference light into parallel light beams and focusing the reflected light; an upper reflective mirror arranged above the sensor lens and switching an optical path of the reflected light; and an optical sensor receiving the reflected light having the optical path thereof switched by the upper reflective mirror, wherein the upper reflective mirror reflects back the reflected light, focused after passing through the sensor lens, in an opposite direction to a moving direction thereof so that a focus of the reflected light is formed between the lower reflective mirror and the upper reflective mirror. | 09-30-2010 |
Patent application number | Description | Published |
20090040626 | Subminature imaging optical system - There is provided a subminiature imaging optical system subminiature imaging optical system including: a first lens element having a convex object-side surface; a second lens element having an object-side surface in contact with an image-side surface of the first lens element; and a third lens element having an object-side surface in contact with an image-side surface of the second lens element, wherein the object-side surface of the first lens element and an image-side surface of the third lens element are aspherical, and the third lens element has a point of inflection formed within an effective aperture thereof such that the image-side surface is convexed toward an image plane at a central portion to have positive refractive power and concaved toward the image plane at a peripheral portion to have negative refractive power. | 02-12-2009 |
20090086339 | Subminiature optical system - There is provided a subminiature optical system mounted in a mobile communication terminal and a personal digital assistant (PDA) or used for a monitoring camera and a digital camera. The subminiature optical system includes: a first lens entirely having a positive refractive power and comprising a first lens element having an object-side surface convex toward the object on an optical axis; a second lens element having an object-side surface in contact with an image-side surface of the first lens element; and a third lens element having an object-side surface in contact with an image-side surface of the second lens element and an image-side surface concave toward an image on the optical axis; and a second lens entirely having a positive refractive power and comprising a fourth lens element having an object-side surface convex toward the object on the optical axis; and a fifth lens element having an object-side surface in contact with an image-side surface of the fourth lens element and an image-side surface formed of a plane. | 04-02-2009 |
20090147368 | Method for manufacturing wafer scale lens assembly and wafer scale lens assembly manufactured by the same - A method for manufacturing a wafer scale lens assembly, and a wafer scale lens assembly manufactured by the same are disclosed. The method includes forming a plurality of transmissive regions and a plurality of non-transmissive regions on an object-side surface or an image-side surface of each of first and second lens substrates, forming a plurality of lens elements having refractive power on at least one of the object-side surface and the image-side surface of each of the first and second lens substrates, and stacking the first and second lens substrates, with a spacer interposed between the first lens substrate and the second lens substrate. Accordingly, image quality is improved by preventing undesired light from forming an image on an image plane of an image sensor. The process time is reduced to reduce a manufacturing cost. | 06-11-2009 |
20100053772 | Lens assembly and manufacturing method of the same - There is provided a lens assembly including: a first lens part including a first lens surface as an object-side surface, a second lens surface as an image-side surface, and a peripheral part defining a periphery of the second lens surface; a second lens part disposed at an image side of the first lens part and including at least one lens; a spacer spacing the first lens part and the second lens part from each other; and a light adjustor disposed between the second lens surface and the peripheral part, the light adjustor totally reflecting or refracting light incident at a predetermined angle of view or more. | 03-04-2010 |
20120154923 | LENS AND METHOD OF MANUFACTURING THE SAME - There are provided a lens and a method of manufacturing the same. The lens includes: a first lens member having a lens surface formed thereon; a second lens member having a lens surface formed thereon; and an adhesive member adhering the first and second lens members to each other, wherein the first and second lens members include a ventilation path formed therebetween in order to discharge air therethrough. | 06-21-2012 |
Patent application number | Description | Published |
20090151988 | Flexible printed circuit board and method of manufacturing the same - An FPCB and a method of manufacturing the same, in which an electrical signal-conductive portion of the FPCB is subjected to little stress so as not to be broken by fatigue in spite of repeated bending of the FPCB, thereby increasing the lifetime of the FPCB. | 06-18-2009 |
20100227423 | LED BACKLIGHT UNIT WITHOUT PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a Light Emitting Diode (LED) backlight unit without a Printed Circuit board (PCB). The LED backlight unit includes a chassis, insulating resin layer, and one or more light source modules. The insulating resin layer is formed on the chassis. The circuit patterns are formed on the insulating resin layer. The light source modules are mounted on the insulating resin layer and are electrically connected to the circuit patterns. The insulating resin layer has a thickness of 200 μm or less, and is formed by laminating solid film insulating resin on the chassis or by applying liquid insulating resin to the chassis using a molding method employing spin coating or blade coating. Furthermore, the circuit patterns are formed by filling the engraved circuit patterns of the insulating resin layer with metal material. | 09-09-2010 |
20120111618 | FLAME RETARDANT RESIN COMPOSITION FOR MULTILAYER WIRING BOARD AND MULTILAYER WIRING BOARD INCLUDING THE SAME - There are provided a flame-retardant resin composition for a multilayer wiring board and a multilayer wiring board having the same. The flame-retardant resin composition for a multilayer wiring board according to an exemplary embodiment of the present invention includes a composite epoxy resin including a naphthalene modified epoxy resin, a cresol novolac epoxy resin, a rubber modified epoxy resin and a phosphorous-based epoxy resin, as well as a flame retardant represented by a specific chemical formula. The flame-retardant resin composition for a multilayer wiring board and the multilayer wiring board having the same disclosed herein exhibits excellent flame retardancy, moisture resistance and peel strength. | 05-10-2012 |
20120125667 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board includes a first circuit pattern formed on a core substrate; an insulating layer stacked on the core substrate to cover the first circuit pattern and having a uniform surface roughness on a nano scale; a second circuit pattern formed on the insulating layer; and a via pattern electrically connecting the first circuit pattern to the second circuit pattern and penetrating through the insulating layer. | 05-24-2012 |
20120227888 | METHOD OF MANUFACTURING A FLEXIBLE PRINTED CIRCUIT BOARD - An FPCB and a method of manufacturing the same, in which an electrical signal-conductive portion of the FPCB is subjected to little stress so as not to be broken by fatigue in spite of repeated bending of the FPCB, thereby increasing the lifetime of the FPCB. | 09-13-2012 |
20120291272 | METHOD OF MANUFACTURING A FLEXIBLE PRINTED CIRCUIT BOARD - An FPCB and a method of manufacturing the same, in which an electrical signal-conductive portion of the FPCB is subjected to little stress so as not to be broken by fatigue in spite of repeated bending of the FPCB, thereby increasing the lifetime of the FPCB. | 11-22-2012 |
20130064994 | APPARATUS AND METHOD FOR MANUFACTURING SUBSTRATE - Disclosed herein is an apparatus for manufacturing a substrate, including: a first chamber supplying an insulation layer; a second chamber including a roughening roller roughening at least one side of the insulation layer supplied from the first chamber, an evaporator depositing a metal layer on the roughened insulation layer, and a pressing roller pressing the insulation layer and the metal layer; and a third chamber storing the insulation layer including the metal layer formed thereon, the insulation layer being taken out from the second chamber. The apparatus for manufacturing a substrate is advantageous in that substrates are continuously produced, thus increasing the productivity of the substrates and preventing the substrates from being contaminated by the air. | 03-14-2013 |
20130284505 | ADHESIVE MEMBER FOR MANUFACTURING PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are an adhesive member for manufacturing a printed circuit board, a printed circuit board, and a method of manufacturing the same. The printed circuit board includes a base substrate, an insulating layer formed on the base substrate, a primer layer formed on the insulating layer, and a circuit layer formed on the primer layer. | 10-31-2013 |
20140014402 | EPOXY RESIN COMPOSITION FOR BUILD-UP INSULATING FILM, INSULATING FILM FORMED THEREFROM, AND MULTILAYER PRINTED CIRCUIT BOARD HAVING THE SAME - This invention relates to an epoxy resin composition, an insulating film formed therefrom, and a printed circuit board, and more particularly to an epoxy resin composition including an epoxy resin, an acid anhydride curing agent, etc., which exhibits improved dielectric properties by decreasing permittivity, dielectric tangent, etc. in a build-up type multilayer printed circuit board, and to an insulating film manufactured using the epoxy resin composition, and to a multilayer printed circuit board in which inner circuits formed of copper (Cu) are insulated by virtue of the insulating film to thus form multiple layers. | 01-16-2014 |
20140017487 | INSULATION FILM HAVING METAL LAYER - Disclosed herein is an insulation film having a metal layer, including: a carrier; a metal layer formed on the carrier; and an insulation layer formed on the metal layer. | 01-16-2014 |
20140041445 | APPARATUS FOR MEASURING DRYING RATE AND METHOD FOR MEASURING DRYING RATE USING THE SAME - There are provided an apparatus for measuring a drying rate and a method for measuring a drying rate using the same in order to measure the drying rate of a substrate material for manufacturing an electronic apparatus, the apparatus for measuring a drying rate, including a support part having a substrate seated thereon, and a marking part disposed above the substrate while being vertically and horizontally movable, and forming a marking on the substrate while being in contact with the substrate. | 02-13-2014 |
20140124434 | FILTER - A filter is disclosed. The filter in accordance with an embodiment of the present invention is installed in a conduit through which resin mixed with filler passes, and includes a plate having an area corresponding to a horizontal section of the conduit and having a plurality of openings formed therein for filtering the filler. Each of the plurality of openings includes a first opening area and the second opening area that intersect with each other and are each elongated in one direction and have a predetermined width for filtering the filler. | 05-08-2014 |
Patent application number | Description | Published |
20090015486 | CHIP ANTENNA AND MOBILE-COMMUNICATION TERMINAL HAVING THE SAME - There are provided a chip antenna and a mobile telecommunication terminal having the chip antenna. The chip antenna includes: a dielectric block having opposing top and bottom surfaces and a plurality of side surfaces connecting the top and bottom surfaces; a first conductive pattern formed on at least one of the surfaces of the dielectric block and connected to an external feeding part; a second conductive pattern formed on at least one of the surfaces of the dielectric block to connect to the first conductive pattern, and having one end connected to an external ground part; and a third conductive pattern formed on at least one of the surfaces of the dielectric block, and spaced apart from the first and second conductive patterns to be capacitively coupled to the first and second conductive patterns, respectively, the third conductive pattern having a lower end connected to the external ground part. | 01-15-2009 |
20100208920 | ELECTRONIC DEVICE MANUFACTURED BY MOLDING, METHOD AND MOLD FOR MANUFACTURING THE SAME, AND ELECTRONIC APPLICATION USING THE SAME - An electronic device manufactured by molding according to an aspect of the invention may include a board having a circuit component mounted thereon; a cable transmitting a signal from an external source to the board; a clamp securing the cable to the board; and a casing molding unit integrally molded with the board and the clamp from a resin material to define the outer appearance. | 08-19-2010 |
20100208933 | ELECTRONIC DEVICE MANUFACTURED BY MOLDING, METHOD AND MOLD FOR MANUFACTURING THE SAME, AND ELECTRONIC APPLICATION USING THE SAME - An electronic device manufactured by molding according to an aspect of the invention may include a driving unit supplying a signal upon being pressed and then returning to its original state; a board having the driving unit mounted thereon; a driving unit mold casing unit molded with the driving unit from a resin material such that the driving unit can be driven; and a casing molding unit molded to completely cover the board, together with the driving unit mold casing unit, to form the outer appearance. | 08-19-2010 |
20100271265 | ANTENNA PATTERN FRAME AND METHOD AND MOLD FOR MANUFACTURING THE SAME - An antenna pattern frame according to an aspect of the invention may include: a radiator having an antenna pattern portion transmitting and receiving a signal and a connection terminal portion allowing the signal to be transmitted to and received from a circuit board of an electronic device; a connection portion partially forming the radiator and connecting the antenna pattern portion and the connection terminal portion to be arranged in different planes; and a radiator frame manufactured by injection molding on the radiator so that the antenna pattern portion is provided on one side of the radiator frame and the connection terminal portion is provided on the other side thereof while the antenna pattern portion is embedded in the electronic device case. | 10-28-2010 |
20100271272 | ANTENNA PATTERN FRAME, METHOD AND MOLD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE - An antenna pattern frame according to an aspect of the invention may include: a radiator having an antenna pattern portion transmitting and receiving a signal; a ground portion extending from the antenna pattern portion; a connection portion connecting the antenna pattern portion and the ground portion to be arranged in different planes; and a radiator frame manufactured by injection molding on the radiator so that the antenna pattern portion may be provided on one side of the radiator frame and the connection terminal portion may be provided on the other side thereof, the radiator frame allowing the antenna pattern portion to be embedded in the electronic device case. | 10-28-2010 |
20110199269 | ANTENNA PATTERN FRAME, ELECTRONIC DEVICE PROVIDED WITH ANTENNA PATTERN FRAME AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE - There is provided an antenna pattern frame according to one embodiment of the present invention, including: a radiator frame that has an insertion groove formed on one surface of the radiator frame and is provided with a through part connected from one point of the insertion groove to an opposite surface to the one surface of the radiator frame; and a wire antenna that includes an antenna pattern part formed to be inserted into the insertion groove and an interconnection part formed to be exposed to the opposite surface by extending from the antenna pattern part and penetrating through the through part. | 08-18-2011 |
20110205127 | ANTENNA PATTERN FRAME, CASE OF ELECTRONIC DEVICE AND MOULD FOR MANUFACTURING THE SAME - There is provided an antenna pattern frame, including: a radiator that includes an antenna pattern part transmitting and receiving signals and a connection terminal part transmitting and receiving the signals to and from a circuit substrate of an electronic device; and a radiator frame that embeds the antenna pattern part in a case of the electronic device and supports the radiator, the radiator being manufactured by injection molding, wherein the radiator frame forms a guide boss inserted into a manufacturing mould for injection-molding the case of the electronic device in which the radiator is embedded. | 08-25-2011 |
20110260932 | ANTENNA PATTERN FRAME, ELECTRONIC DEVICE CASE PROVIDED WITH ANTENNA PATTERN FRAME AND ELECTRONIC DEVICE INCLUDING ELECTRONIC DEVICE CASE - There is provided an antenna pattern frame according to an exemplary embodiment of the present invention, including: a film radiator that includes a protective film supporting one surface or both surfaces of a radiator provided with an antenna pattern part; and a radiator frame that is an injection molded part to which the film radiator is fixed and embeds the antenna pattern part in the electronic device case. | 10-27-2011 |
20110278186 | CASE OF ELECTRONIC DEVICE HAVING LOW FREQUENCY ANTENNA PATTERN EMBEDDED THEREIN, MOLD THEREFOR AND METHOD OF MANUFACTURING THEREOF - There is provided an electronic device case having a low frequency antenna pattern embedded therein, the case including: a radiator frame injection molded using a polymer mixture containing a magnetic substance component so that a radiator including a low frequency antenna pattern part is formed on one surface thereof; a case frame injection molded upwardly of the radiator frame and provided with the radiator embedded between the radiator frame and the case frame; and a boundary part forming a boundary between the radiator frame and the case frame and having a groove formed inwardly of the case frame. | 11-17-2011 |
20110279002 | CASE OF ELECTRONIC DEVICE HAVING ANTENNA PATTERN EMBEDDED THEREIN, AND MOLD THEREFOR AND METHOD OF MANUFACTURING THEREOF - There is provided a case of an electronic device having an antenna pattern embedded therein, the case including: a radiator frame injection molded so that a radiator including an antenna pattern part formed of a metal sheet is exposed on one surface thereof; a case frame injection molded upward of the radiator frame, such that the radiator is embedded between the radiator frame and the case frame; and a boundary part forming a boundary between the radiator frame and the case frame and having a groove formed inward of the case frame. | 11-17-2011 |
20110279333 | CASE OF ELECTRONIC DEVICE HAVING ANTENNA PATTERN FRAME EMBEDDED THEREIN, MOLD THEREFOR AND METHOD OF MANUFACTURING THEREOF - There is provided a case of an electronic device having an antenna pattern embedded therein, the case including: a radiator frame injection molded so that a radiator including an antenna pattern part and formed on a film is formed on one surface thereof; a case frame injection molded upwardly of the radiator frame and provided with the radiator embedded between the radiator frame and the case frame; and a boundary part forming a boundary between the radiator frame and the case frame and having a groove formed inwardly of the case frame. | 11-17-2011 |
20120032858 | ELECTRONIC DEVICE HAVING ANTENNA PATTERN EMBEDDED IN CASE AND METHOD FOR MANUFACTURING THE SAME - An electronic device having an antenna pattern embedded in a case and a method for manufacturing the same are provided. The electronic device includes: a radiator embedded within a case and having an antenna pattern part for transmitting and receiving a signal; a smart card having a matching unit for matching a signal between a main board separated from the case and the radiator and a connection pad formed on one surface thereof to electrically connect the radiator and the matching unit; and a coupling member having one end portion coupled to the radiator so as to be embedded within the case and the other end portion protruded from a lower surface of the case so as to be elastically in contact with the connection pad to allow the radiator and the matching unit to be electrically coupled. | 02-09-2012 |
20120242158 | WIRELESS POWER TRANSMITTER AND WIRELESS POWER TRANSCEIVER - Disclosed are a wireless power transmitter capable of transmitting power wirelessly according to an impedance of an output side and a wireless power transceiver. There are provided a wireless power transmitter and a wireless power transceiver including: a wireless power transmitting unit converting input power into a preset transmission power and transmitting the converted input power wirelessly; and a controlling unit controlling a transmission of the transmission power according to a level of output impedance of the transmission power output from the wireless power transmitting unit. | 09-27-2012 |
20140205708 | ANTENNA PATTERN FRAME, CASE OF ELECTRONIC DEVICE AND MOULD FOR MANUFACTURING THE SAME - There is provided an antenna pattern frame, including: a radiator that includes an antenna pattern part transmitting and receiving signals and a connection terminal part transmitting and receiving the signals to and from a circuit substrate of an electronic device; and a radiator frame that embeds the antenna pattern part in a case of the electronic device and supports the radiator, the radiator being manufactured by injection molding, wherein the radiator frame forms a guide boss inserted into a manufacturing mould for injection-molding the case of the electronic device in which the radiator is embedded. | 07-24-2014 |
20140313085 | ANTENNA PATTERN FRAME AND METHOD AND MOLD FOR MANUFACTURING THE SAME - An antenna pattern frame according to an aspect of the invention may include: a radiator having an antenna pattern portion transmitting and receiving a signal and a connection terminal portion allowing the signal to be transmitted to and received from a circuit board of an electronic device; a connection portion partially forming the radiator and connecting the antenna pattern portion and the connection terminal portion to be arranged in different planes; and a radiator frame manufactured by injection molding on the radiator so that the antenna pattern portion is provided on one side of the radiator frame and the connection terminal portion is provided on the other side thereof while the antenna pattern portion is embedded in the electronic device case. | 10-23-2014 |
20150070223 | ANTENNA PATTERN FRAME, METHOD AND MOLD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE - An antenna pattern frame according to an aspect of the invention may include: a radiator having an antenna pattern portion transmitting and receiving a signal; a ground portion extending from the antenna pattern portion; a connection portion connecting the antenna pattern portion and the ground portion to be arranged in different planes; and a radiator frame manufactured by injection molding on the radiator so that the antenna pattern portion may be provided on one side of the radiator frame and the connection terminal portion may be provided on the other side thereof, the radiator frame allowing the antenna pattern portion to be embedded in the electronic device case. | 03-12-2015 |
Patent application number | Description | Published |
20110261823 | METHOD AND SYSTEM FOR MULTIPLEXING DATA STREAMING IN AUDIO/VIDEO NETWORKS - A method and system for communication in high speed audio/video networks. In one embodiment, communication between AV devices comprises establishing an AV path stream for AV data streaming between a source AV device and a destination AV device. Each AV device includes one or more I/O ports for connecting the AV device to another AV device via a communication link including multiple communication lanes. Asynchronous and isochronous AV data are multiplexed for transmission via one or more fixed length data cells, each data cell capable of carrying one or more of: asynchronous data symbols and isochronous data symbols. Isochronous data is mapped onto isochronous symbols in one or more data cells, Asynchronous symbols are mapped onto one or more data cells. One or more data cells are transmitted from a physical layer the source AV device to the destination AV device via one or more communication lanes. | 10-27-2011 |
20110265137 | METHOD AND SYSTEM FOR ISOCHRONOUS DATA STREAM MANAGEMENT IN HIGH SPEED AUDIO/VIDEO NETWORKS - A method and system for isochronous data stream management in high speed audio/video networks. One implementation comprises isochronous communication management between audio/video (AV) devices by maintaining forwarding information for forwarding data between AV devices, wherein each AV device includes multiple I/O ports for connecting the AV device to another AV device via a communication link including multiple communication lanes. The forwarding information is utilized to communicate AV path set-up request and response control messages between a source AV device and a destination AV device via said communication link, and allocating isochronous communication resources for AV data streaming, for establishing AV path streams for bi-directional isochronous AV data streaming between the source and destination AV devices. | 10-27-2011 |
20110265139 | METHOD AND SYSTEM FOR ISOCHRONOUS COMMUNICATION IN AUDIO/VIDEO NETWORKS - Method and system for isochronous communication between audio/video (AV) devices. One implementation comprises establishing isochronous connection between a source AV device and a destination AV device. Each AV device includes multiple I/O ports for connecting the AV device to another AV device via a communication link comprising multiple communication lanes. The isochronous connection is established by determining end-to-end temporal and spatial lane availability between the source AV device and the destination AV device to support a target date rate. Communication resources are allocated on the available lanes based on the target date rate for isochronous communication between the source AV device and the destination AV device. | 10-27-2011 |
20120151537 | METHOD AND SYSTEM FOR ASYNCHRONOUS AND ISOCHRONOUS DATA TRANSMISSION IN A HIGH SPEED VIDEO NETWORK - A method and system for communication between audio/video (AV) devices. In one embodiment communication between AV devices includes establishing an AV path stream for AV data streaming between a source AV device and a destination AV device, wherein each AV device includes one or more I/O ports for connecting the AV device to another AV device via a communication link including multiple communication lanes. Asynchronous and isochronous AV data is multiplexed for transmission via one or more fixed length data cells, each data cell capable of carrying one or more of: an asynchronous data symbol and an isochronous data symbol. Multiplexing includes selectively mapping asynchronous data onto isochronous symbols for transmission during a video blanking period. One or more data cells are transmitted from a physical layer of the source AV device to the destination AV device, via one or more communication lanes. | 06-14-2012 |
20120314597 | ENHANCED STREAM RESERVATION PROTOCOL FOR AUDIO VIDEO NETWORKS - An enhanced stream reservation protocol comprising a Talker device sending a Stream Reservation Protocol (SRP) Talker Advertise message for streaming data to a Listener device, receiving the Talker Advertise message and checking bandwidth availability on an output port thereof for the streaming. In case of insufficient communication bandwidth, sending a failure message that includes information about available bandwidth from the Talker device to the Listener device. A protocol for communication in a bridged network, comprising a Talker device sending an SRP Talker Advertise message for streaming data to a Listener device. The Talker Advertise message includes communication path information from the Talker device to the Listener device. A communication path from the Talker device to the Listener device is selected based on said path metrics, for streaming data between the Talker device and the Listener device. | 12-13-2012 |
20120314713 | METHOD AND SYSTEM FOR PROXY ENTITY REPRESENTATION IN AUDIO/VIDEO NETWORKS - Communication in an AV network includes a Talker device initiating communication with a Listener device via a proxy device for data streaming. The proxy device participates in one or more of: content discovery, connection establishment, AV selection and AV streaming between the Talker device initiating communication with a Listener device. | 12-13-2012 |
Patent application number | Description | Published |
20110122517 | Camera module and lens driving device - There is provided a camera module. The camera module includes: a lens barrel including at least one lens; a housing receiving the lens barrel and having an opening in one surface thereof; an actuator driving the lens barrel through the opening; and a preload control part receiving the actuator therein and forming one surface of the housing by being coupled to the opening such that preload generated from the lens barrel and the actuator is controlled. | 05-26-2011 |
20130321937 | CAMERA MODULE - Disclosed herein is a camera module in which a movement of a magnet is controlled by only magnetic force between the magnet and a yoke without a spring for controlling the movement of the magnet which operates up and down. The camera module includes: a lens module; and a main frame supporting the lens module and allowing the lens module to be driven in an optical axis direction, wherein the lens module includes: a lens assembly including a plurality of lenses; and a magnet fixed to one side of the lens module, and the main frame includes: a coil facing the magnet, fixed to one side within the main frame, and generating an electric field as power is applied thereto; and a yoke disposed to face the magnet with the main frame and the coil interposed therebetween and controlling driving of the lens module by attraction with the magnet. | 12-05-2013 |
20140098434 | LENS ACTUATOR - There is provided a lens actuator, including: a lens barrel in which at least one lens is provided on an optical axis; a magnetic part provided on one surface of the lens barrel; and a printed circuit board in which a coil pattern part generating electromagnetic force is provided, the printed circuit board having one surface facing the magnetic part, wherein magnetic material is provided on the other surface of the printed circuit board. | 04-10-2014 |
20150015770 | CAMERA MODULE - There is provided a camera module including: a lens barrel having one or more lenses positioned along an optical axis; and a housing having the lens barrel therein, wherein the housing includes a first through hole into which the lens barrel is inserted and a second through hole having a diameter larger than that of the first through hole. | 01-15-2015 |
Patent application number | Description | Published |
20110216027 | Haptic feedback device and electronic device - Disclosed are a haptic feedback device and an electronic device. The haptic feedback device includes: a haptic device to which contact pressure is applied; an actuator provided in the haptic device and excited according to a change in the contact pressure of the haptic device to generate vibrations; and a controller controlling the actuator to vibrate at a pre-set resonance frequency in a pre-set first operation mode and vibrate at a driving frequency different from the resonance frequency in a second operation mode set to be different from the first operation mode. | 09-08-2011 |
20110260843 | Haptic feedback device and electronic device - There is provided a lightweight, slim and compact haptic feedback device due to an actuator module constituted of a piezoelectric element and a vibration plate, and an electronic device having the same. The haptic feedback device includes a haptic device receiving contact pressure applied thereto, and an actuator module being in contact with a lower surface of the haptic device and excited according to variations in contact pressure with the haptic device to thereby generate vibrations. | 10-27-2011 |
20110260995 | Actuator module, haptic feedback device and electronic device - There is provided an actuator module, a haptic feedback device, and an electronic device having the same. The haptic feedback device includes a haptic device receiving a user contact applied thereto, and an actuator module generating vibrations according to the user contact applied to the haptic device. | 10-27-2011 |
20120026103 | Vibration generator and electronic device including the same - Disclosed are a vibration generator, which can increase the vibration force of a vibration plate by additionally applying the mass of a mass body to the vibration plate, and an electronic device including the same. The vibration generator includes at least one piezoelectric element mounted inside the case and subjected to compression and expansion in response to input power, a vibration plate including a body elongated in a preset lengthwise direction and having the at least one piezoelectric element mounted thereon, and generating vibrations by the compression and expansion of the at least one piezoelectric element, and at least one mass part adding a preset magnitude of mass to the vibration plate. | 02-02-2012 |
20130293048 | HYDRODYNAMIC BEARING APPARATUS AND SPINDLE MOTOR HAVING THE SAME - There is provided a hydrodynamic bearing apparatus, including: a shaft; and a sleeve rotatably supporting the shaft; wherein at least one of an outer circumferential surface of the shaft and an inner circumferential surface of the sleeve is provided with upper and lower dynamic pressure grooves having a herringbone-shaped pattern provided therein so as to generate fluid dynamic pressure at the time of rotation of the shaft, and at least one of the upper and lower dynamic pressure grooves is formed such that a width of a pattern portion disposed in an upper portion thereof is different from that of a pattern portion disposed in a lower portion thereof, based on a center line. | 11-07-2013 |
20140177095 | SPINDLE MOTOR AND HARD DISK DRIVE INCLUDING THE SAME - There is provided a spindle motor, including: a shaft having a fixing groove formed in a lower portion thereof; a lower thrust member including a fixing part inserted into the fixing groove, a disk part extending from the fixing part in an outer radial direction, and an extension part extending from the disk part in an axial direction; a base member coupled to the extension part; a rotating member forming a bearing clearance with the shaft and rotatably provided with respect to the shaft; a first sealing part provided between an upper surface of the extension part and the rotating member; and a second sealing part provided between an inner circumferential surface of the base member and an outer circumferential surface of the rotating member. | 06-26-2014 |
Patent application number | Description | Published |
20090074034 | DIRECT SEQUENCE SPREAD SPECTRUM TRANSCEIVER - A direct sequence spread spectrum (DSSS) transceiver including a DSSS transmitter and a DSSS receiver, wherein the DSSS transmitter includes: an integral code mapping unit mapping source bit data in one of 2 | 03-19-2009 |
20090083571 | SYSTEM ON CHIP WITH LOW POWER MODE AND METHOD OF DRIVING THE SAME - There are provided a system on chip (SoC) with a low power mode and a method of driving the SoC, the SoC including: a power part supplying a main clock signal and controlling analog and digital power supply at a normal mode and supplying a sub clock signal and turning analog power off at a low power mode; a radio frequency (RF) part generating the main clock signal at the normal mode and stopping operation at the low power mode, under the control of the power part; and a control part operating according to the main clock signal at the normal mode and operating according to the sub clock signal, under to the control of the power part. | 03-26-2009 |
20090102866 | LIGHTING CONTROL APPARATUS USING DIGITAL SIGMA-DELTA MODULATION - There is provided a lighting control apparatus using digital sigma-delta modulation, the apparatus including: a control part supplying a brightness control signal; a sigma-delta modulation part generating a carry signal according to the brightness control signal of the control part and a predetermined threshold signal by using a sigma-delta modulation method; and a lighting driving part generating a driving current according to the carry signal of the sigma-delta modulation part and supplying the generated driving current to a lighting part. | 04-23-2009 |
20090168937 | RF RECEIVER HAVING TIMING OFFSET RECOVERY FUNCTION AND TIMING OFFSET RECOVERY METHOD USING THEREOF - There is provided an RF receiver recovering timing offset by shifting timing slots in response to timing offset occurring when a signal is sampled. An RF receiver having timing offset recovery function according to an aspect of the invention includes: a preprocessing unit sampling and digitalizing an analog received signal; a differential operation unit delaying the digitalized received signal from the preprocessing unit for predetermined periods of time and differentiating the delayed signals; a correlation unit correlating the differentiated received signals from the differential operation unit with a plurality of predetermined PN code sequences and sequentially outputting correlation values; a setting unit sequentially storing the correlation values from the correlation unit, detecting a maximum value among the stored correlation values, and shifting a plurality of determination slots by a difference between a storage location of the detected maximum value and a reference storage location; and a demodulation value estimation unit estimating as a demodulation value of the received signal, a symbol of a PN code sequence corresponding to the maximum value from the shifted determination slots. | 07-02-2009 |
20130135910 | POWER FACTOR CORRECTION APPARATUS, DC/DC CONVERTER, AND POWER SUPPLYING APPARATUS - There are provided a power factor correction apparatus, a direct current/direct current (DC/DC) converter, and a power supplying apparatus, capable of preventing unstable feedback control due to a ripple component by controlling power switching based on a median value between a maximum value and a minimum value of a voltage level of the output power that is received as feedback. The power factor correction apparatus includes a power factor corrector switching input power and correcting a power factor thereof; and a controller detecting a voltage level of power factor-corrected power and controlling the switching of the power factor corrector, based on a median value between a maximum value and a minimum value of the voltage level of the power factor-corrected power detected for a predetermined period of time. | 05-30-2013 |
20130163289 | POWER SWITCHING DRIVING APPARATUS, AND POWER FACTOR CORRECTION DEVICE AND POWER SUPPLY DEVICE HAVING THE SAME - There are provided a power switching driving apparatus able to reduce a circuit area and increase a driving speed, and a power factor correction device and a power supply device having the same. The power switching driving apparatus includes: a first driving unit providing a switching signal in response to a control signal from the outside; a second driving unit including first and second NMOS FETs cascode-connected between an operational power source terminal supplying pre-set operation power and a ground, and performing switching complimentarily in response to the switching signal to provide a switching control signal controlling power switching; a current supply unit supplying a current for driving the second driving unit; and a voltage maintaining unit maintaining a voltage for driving the second driving unit. | 06-27-2013 |
Patent application number | Description | Published |
20100132175 | ELECTROACTIVE SOLID-STATE ACTUATOR AND METHOD OF MANUFACTURING THE SAME - The present invention provides an electroactive solid-state actuator, including a solid polymer electrolyte film having first and second main surfaces facing each other, and first and second conductive polymer layers infiltrated into the first and second main surfaces of the solid polymer electrolyte film. Further, a method of manufacturing the electroactive solid-state actuator is provided, the method including preparing a solid polymer film having first and second main surfaces facing each other, infiltrating a monomer of a conductive polymer into the first and second main surfaces of the solid polymer film, followed by polymerization, to form first and second conductive polymer layers, and immersing the solid polymer film into an ionic liquid or liquid electrolyte to be converted to an electrically conductive polymer. | 06-03-2010 |
20110129607 | Substitutional electroless gold plating solution and method for forming gold plating layer using the same - There is provided a substitutional electroless gold plating solution and a method for forming a gold plating layer using the same. The substitutional electroless gold plating solution includes an organic solvent, and an organic acid-based gold salt dissociated from the organic solvent to generate gold ions. The substitutional electroless gold plating solution can form a gold plating layer having a uniform thickness and enhance bonding strength with a base metal. Further, the substitutional electroless gold plating solution can form a gold plating layer using various printing methods. | 06-02-2011 |
20110151117 | Organic metal complexes for forming metal thin layer, ink including the same and method for forming metal thin layer using the same - There is provided organic metal complexes for forming a metal thin layer, ink including the same, and a method for forming a metal thin layer using the same: wherein the organic metal complexes for forming a metal thin layer include Ag, and a ligand represented by the specific general formula; the organic metal complexes have an excellent stability and solubility toward a solvent; and the ink for forming a metal thin layer comprising the organic metal complexes is easy to form a metal thin layer of, and could be applied on the substrate consisting of material having low thermal stability because the ink can be decomposed at a low temperature. | 06-23-2011 |
20110236646 | Ink composition, metal thin film prepared using the same and method of preparing the same - There are provided an ink composition, a metal thin film prepared using the same, and a method of preparing the same. The ink composition according to the present invention includes: gold-containing complex compound represented by the following Formula 1 (L and L′ are at least one selected from a group consisting of diolefin and derivatives thereof, and X is at least one selected from a group consisting of chlorine (Cl), bromine (Br), and iodine (I), where m=an integer of 1˜10, n=an integer of 1˜10, o=an integer of 0˜10, and p=an integer of 0˜10); and a solvent dispersing the gold-containing complex compound. | 09-29-2011 |
20130161571 | COPPER ORGANIC METAL, METHOD FOR PREPARING COPPER ORGANIC METAL AND COPPER PASTE - Disclosed herein are a copper organic metal, a method for preparing a copper organic metal and a copper paste. The copper organic metal is constituted to combine a copper atom, [R—CO | 06-27-2013 |
20130164553 | COPPER POWDER, COPPER PASTE AND METHOD FOR PREPARING COPPER POWDER - Disclosed herein are copper powder, a copper paste and a method for preparing a copper powder. The copper powder is provided with a cuprous oxide film having a loose structure on a surface of the copper powder, thereby preventing the copper particles from being naturally oxidized, making it possible to being subjected to a low temperature firing process and having improved conductivity. | 06-27-2013 |
20130280158 | METHOD OF PRODUCING COPPER PRECURSOR AND COPPER PRECURSOR PRODUCED BY USING THE SAME - There is provided a method of producing a copper precursor and a copper precursor produced by using the same. The method of producing a copper precursor includes: preparing an aqueous solution including a copper salt or a hydrate thereof; preparing a mixture by mixing urea (CO(NH | 10-24-2013 |
20140023779 | CONDUCTIVE COPPER PASTE COMPOSITION AND METHOD OF FORMING METAL THIN FILM USING THE SAME - There are provided a conductive copper paste composition and a method of forming a metal thin film using the same, wherein the conductive copper paste composition includes a back bone chain particle formed of copper (Cu) or a copper alloy containing copper (Cu); and an organic copper compound, have excellent electrical characteristics even at the time of low-temperature heat treatment process and suppress an increase in a viscosity depending on the time. | 01-23-2014 |
Patent application number | Description | Published |
20090289856 | FILM TYPE ANTENNA AND MOBILE COMMUNICATION TERMINAL - There is provided a film type antenna including: a carrier film; a conductive pattern provided on one surface of the carrier film; and a conductive buffer layer provided on one surface of the conductive pattern. | 11-26-2009 |
20090322624 | FILM TYPE ANTENNA AND MOBILE COMMUNICATION TERMINAL HAVING THE SAME - There are provided a film type antenna and a mobile communication terminal having the same. A film type antenna according to an aspect of the invention may include: a first carrier film having a conductive pattern on at least one surface thereof; an adhesion strengthening layer provided on the first carrier film; and a second carrier film laminated on the adhesion strengthening layer. | 12-31-2009 |
20110032153 | ANTENNA PATTERN FRAME, METHOD AND MOLD FOR MANUFACTURING THE SAME, ELECTRONIC DEVICE CASE HAVING ANTENNA PATTERN FRAME EMBEDDED THEREIN, AND METHOD FOR MANUFACTURING THE SAME - An antenna pattern frame includes an antenna radiator receiving an external signal and transmitting the received external signal to an electronic device, a radiator frame having the antenna radiator on a surface thereof, and a guide boss protruding from the radiator frame and preventing the radiator frame from moving vertically in a mold for manufacturing an electronic device case having an inner space having a shape corresponding to that of an electronic device case. | 02-10-2011 |
20110068984 | ANTENNA PATTERN FRAME, METHOD AND MOLD FOR MANUFACTURING THE SAME, METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE CASE, AND ELECTRONIC DEVICE - An antenna pattern frame includes: a radiator having an antenna pattern part for receiving an external signal; a radiator frame having the radiator injection-molded to have the antenna pattern part formed thereon and including the antenna pattern part buried at an inner side of an electronic device; and an over-mold part injection-molded together with the radiator frame and over-molded to be formed on the antenna pattern part in order to prevent the antenna pattern part from becoming separated from the radiator frame. | 03-24-2011 |
20140132454 | ANTENNA PATTERN FRAME, METHOD AND MOLD FOR MANUFACTURING THE SAME, ELECTRONIC DEVICE CASE HAVING ANTENNA PATTERN FRAME EMBEDDED THEREIN, AND METHOD FOR MANUFACTURING THE SAME - An antenna pattern frame includes an antenna radiator receiving an external signal and transmitting the received external signal to an electronic device, a radiator frame having the antenna radiator on a surface thereof, and a guide boss protruding from the radiator frame and preventing the radiator frame from moving vertically in a mold for manufacturing an electronic device case having an inner space having a shape corresponding to that of an electronic device case. | 05-15-2014 |
Patent application number | Description | Published |
20110141657 | CONDUCTIVE PASTE COMPOUND FOR EXTERNAL ELECTRODE, MULTILAYER CERAMIC CAPACITOR INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF - Provided are a conductive paste for an external electrode, a multilayer ceramic capacitor including the same, and a manufacturing method thereof. The conductive paste compound for an external electrode includes a first powder and a second powder. The first powder includes copper and has a mean grain size of 3 μm or less, and the second powder has a lower diffusion speed and a higher melting point than the copper and has a mean grain size of 180 nm or less. | 06-16-2011 |
20120154977 | CONDUCTIVE PASTE COMPOSITION FOR TERMINATION ELECTRODE, MULTILAYER CERAMIC CAPACITOR INCLUDING THE SAME AND METHOD OF MANUFACTURING THEREOF - There are provided a conductive paste composition for a termination electrode, a multilayer ceramic capacitor having the same, and a method thereof. The conductive paste composition for a termination electrode includes a conductive metal powder and a glass frit represented by the following Formula: aSiO | 06-21-2012 |
20120162856 | CONDUCTIVE PASTE COMPOSITION FOR TERMINATION ELECTRODE AND MULTILAYER CERAMIC CAPACITOR INCLUDING THE SAME AND MANUFACTURING METHOD THEREOF - There are provided a conductive paste composition for a termination electrode, and a multilayer ceramic capacitor including the same and a manufacturing method thereof. The conductive paste composition includes 100 parts by weight of conductive metal powder and 0.1 to 10 parts by weight of ceramic powder having an average particle size of 50 to 500 nm. The conductive paste composition described above may achieve a high firing density even in the case that it is used in the manufacturing of a thin film, and inhibit the occurrence of blisters, a delamination failure of the termination electrode during calcination of the electrode, thereby producing a compact and thin film. | 06-28-2012 |
20120295122 | MULTILAYERED CERAMIC ELECTRONIC COMPONENT - There is provided a multilayered ceramic electronic component having a reduced thickness and exhibiting hermetic sealing. In multilayered ceramic electronic component, an external electrode includes two layers, that is, first and second layers, and the first and second layers contain glass with different compositions, respectively. Therefore, the multilayered ceramic electronic component having high reliability, such as strong adhesion between the external electrode and the internal electrode, prevention of glass exudation, or the like, may be obtained. | 11-22-2012 |
20130120898 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There are provided a multilayer ceramic electronic component and a method of manufacturing the same. The multilayer ceramic electronic component includes: a ceramic body including a dielectric layer; first and second internal electrodes disposed within the ceramic body to face each other, while having the dielectric layer interposed therebetween; and first external electrodes electrically connected to first and second internal electrodes and second external electrodes formed on the first external electrodes, wherein the first and second external electrodes include a conductive metal and a glass, and when the second external electrodes are divided into three equal parts in a thickness direction, an area of the glass in central parts thereof with respect to an area of the central parts is 30 to 80%. Therefore, sealing properties of a chip is improved, whereby a multilayer ceramic electronic component having improved reliability may be implemented. | 05-16-2013 |
20130135788 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF - There are provided a multilayer ceramic electronic component comprising: a ceramic main body including a dielectric layer and having first and second main faces, third and fourth side faces opposed in a length direction, and fifth and sixth faces opposed in a width direction; first and second internal electrodes; and one or more first external electrodes formed on the fifth face and one or more second external electrodes formed on the sixth face, wherein the first and second external electrodes have an average thickness ranging from 3 μm to 30 μm, and when at least one of the first and second external electrodes is divided into three equal parts in a thickness direction, an area of glass in central area portions thereof is 35% to 80% of the total areas of the central area portions. | 05-30-2013 |
20130148261 | CONDUCTIVE PASTE FOR EXTERNAL ELECTRODE, MULTILAYER CERAMIC ELECTRONIC COMPONENT USING THE SAME, AND METHOD OF MANUFACTURING THE SAME - There are provided a conductive paste for an external electrode, a multilayer ceramic electronic component using the same, and a method of manufacturing the same. More particularly, there are provided a conductive paste for an external electrode including: a conductive metal powder; and a spherical glass frit having an average particle size of 0.05 to 3.0 μm, a multilayer ceramic electronic component using the same, and a method of manufacturing the same. According to the present invention, a spherical glass frit having fine particles may be applied at the time of preparing the conductive paste for an external electrode, thereby realizing external electrodes having excellent compactness at a low temperature and suppressing the occurrence of cracks, and thus, a multilayer ceramic electronic component having excellent reliability can be implemented. | 06-13-2013 |
20130182368 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF - There is provided a multilayer ceramic electronic component including: a ceramic main body; a plurality of internal electrodes; and external electrodes formed on outer surfaces of the ceramic main body and electrically connected to the internal electrodes, wherein an average thickness of the external electrodes is 10 μm or less, and when a thickness of the external electrodes in a central portion of the ceramic main body in a thickness direction is Tc and a thickness of the external electrodes at a point spaced apart from a central portion of a capacitance formation region in a thickness direction by a distance equal to 25% of a thickness (S) of the capacitance formation region is T | 07-18-2013 |
20130182369 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF - A multilayer ceramic electronic component includes: a ceramic main body; a plurality of internal electrodes laminated within the ceramic main body; and external electrodes formed on outer surfaces of the ceramic main body and electrically connected to the internal electrodes, wherein an average thickness of the external electrodes is 10 μm or less, and when a thickness of the external electrodes in a central portion of the ceramic main body in a width direction is Tc and a thickness of the external electrodes at a lateral edge of a printed surface region of the internal electrodes is T | 07-18-2013 |
20140002949 | MULTILAYER CERAMIC ELECTRONIC COMPONENT | 01-02-2014 |
20140002950 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME | 01-02-2014 |
20140233148 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component, including: a ceramic body having internal electrodes formed therein; external electrodes formed on external surfaces of the ceramic body and connected to the internal electrodes; and buffer layers formed on contact surfaces between the internal electrodes and the external electrodes, among external surfaces of the ceramic body, in an interior direction of the ceramic body, wherein when a thickness of the internal electrode is denoted by Te, a number of laminated internal electrodes is denoted by N, a thickness of the buffer layer is denoted by t, and a width of a margin of the ceramic body in a length direction of the ceramic body is denoted by L, Te≦0.6 μm, N>200, and 3 μm≦t08-21-2014 | |
20140233149 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component including a ceramic body having internal electrodes formed therein, external electrodes formed on external surfaces of the ceramic body and connected to the internal electrodes, and a buffer layer formed on surfaces of contact between the internal electrodes and the external electrodes among external surfaces of the ceramic body, in an interior direction of the ceramic body, wherein when a thickness of the external electrode is denoted by T, a thickness of the buffer layer is denoted by t, a thickness of an active region is denoted by T | 08-21-2014 |
20150014900 | COMPOSITE CONDUCTIVE POWDER, CONDUCTIVE PASTE FOR EXTERNAL ELECTRODE INCLUDING THE SAME, AND MANUFACTURING METHOD OF MULTILAYER CERAMIC CAPACITOR - There is provided a composite conductive powder including a conductive particle, and a coating layer formed on a surface of the conductive particle and including glass, wherein when a thickness of the coating layer in a portion A in which the coating layer is the thickest, on the surface of the conductive particle is defined as a, and a thickness of the coating layer in a portion B forming an angle of 90° with respect to the portion A on the surface of the conductive particle, based on a center of the conductive particle is defined as b, 0.1≦b/a≦0.7 is satisfied. | 01-15-2015 |
20150068794 | MULTILAYER CERAMIC CAPACITOR, MANUFACTURING METHOD THEREOF AND BOARD FOR MOUNTING THE SAME THEREON - There is provided a multilayer ceramic capacitor including: a ceramic body including dielectric layers and internal electrodes; electrode layers connected to the internal electrodes; and a conductive resin layer formed on the electrode layers and including a first conductor, a second conductor having a fiber shape, and a base resin. | 03-12-2015 |
Patent application number | Description | Published |
20100065877 | SEMICONDUCTOR LIGHT-EMITTING DEVICE WITH IMPROVED LIGHT EXTRACTION EFFICIENCY - The present invention provides a semiconductor light-emitting device. The light-emitting device comprises a first conductive clad layer, an active layer, and a second conductive clad layer sequentially formed on a substrate. In the light-emitting device, the substrate has one or more side patterns formed on an upper surface thereof while being joined to one or more edges of the upper surface. The side patterns consist of protrusions or depressions so as to scatter or diffract light to an upper portion or a lower portion of the light-emitting device. | 03-18-2010 |
20100112742 | Nitride semiconductor device and method for making same - A method of forming a nitride semiconductor device is disclosed. An n-type GaN layer is formed on a substrate. A self assembled nitride semiconductor quantum dot layer is formed on the n-type GaN layer by growing In | 05-06-2010 |
20100276725 | NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE - The invention relates to a high-output nitride light emitting device. The light emitting device includes a first conductivity type nitride semiconductor layer, an active layer and a second conductivity type nitride semiconductor layer deposited in their order on a substrate. The light emitting device also includes first and second insulation layers formed in different upper surface portions of the nitride semiconductor light emitting device, and first and second bonding pads formed respectively on the first and second insulation layers. The light emitting device further includes first and second extension electrodes extended from the first and second bonding pads and coupled respectively to the first and second conductivity semiconductor layers. The electrode arrangement according to the present invention prevents direct coupling between the bonding pads and the light emitting device, thus allowing a symmetrical structure that can achieve more uniform current spreading using only the extension electrodes. | 11-04-2010 |
20110037086 | NITRIDE BASED SEMICONDUCTOR LIGHT-EMITTING DEVICE - Disclosed herein is a nitride-based semiconductor light-emitting device. The nitride-based semiconductor light-emitting device comprises an n-type clad layer made of n-type Al | 02-17-2011 |
20120043557 | SEMICONDUCTOR LIGHT-EMITTING DEVICE WITH IMPROVED LIGHT EXTRACTION EFFICIENCY - The present invention provides a semiconductor light-emitting device. The light-emitting device comprises a first conductive clad layer, an active layer, and a second conductive clad layer sequentially formed on a substrate. In the light-emitting device, the substrate has one or more side patterns formed on an upper surface thereof while being joined to one or more edges of the upper surface. The side patterns consist of protrusions or depressions so as to scatter or diffract light to an upper portion or a lower portion of the light-emitting device. | 02-23-2012 |
20130214250 | NITRIDE BASED SEMICONDUCTOR LIGHT-EMITTING DEVICE - Disclosed herein is a nitride-based semiconductor light-emitting device. The nitride-based semiconductor light-emitting device comprises an n-type clad layer made of n-type Al | 08-22-2013 |
Patent application number | Description | Published |
20110127940 | Motor - There is provided a motor. The motor may include a rotor case including a driving magnet formed on an inner circumferential surface thereof and providing a driving force by interacting with a coil of a stator, a low-speed control magnet formed on an outer circumferential surface of the rotor case and generating a frequency allowing for low-speed rotation enabling label printing as the rotor case rotates at a low speed; and a sensing part sensing an analog signal generated from the low-speed control magnet. | 06-02-2011 |
20110197212 | Encoder sensor, motor provided with encoder sensor and optical disk driving device equipped with motor - There is provided an encoder sensor according to an exemplary embodiment of the present invention. The encoder sensor may include: a light emitting unit and a light receiving part disposed at a distance in a readable range of an encoding mark of a disk; a receiving part receiving the light emitting unit and the light emitting unit; and a lead frame extending into an opposite direction of the disk from the receiving part and electrically connected to a printed circuit board. | 08-11-2011 |
20110239235 | Motor and optical disk driving device having motor - Disclosed is a motor including a rotor body mounted on a shaft and a chucking mechanism body mounted on a rotor hub, which are coupled with an increased coupling force by changing a coupling structure of the rotor hub of the rotor body and the chucking mechanism body mounted on the rotor hub. The motor includes: a sleeve rotatably supporting a shaft; a rotor body having a rotor hub mounted on the shaft; and a chucking mechanism body having a boss with a through hole in which the rotor hub is insertedly coupled and a space part formed within the boss and providing an elastic force when the rotor hub is coupled. Because a force of restitution resulting from an elastic deformation of the boss provided in the chucking mechanism body can be increased through the space part, namely, because a pressing force applied to the rotor hub of the rotor body can be increased by the boss, the coupling force between the rotor hub of the rotor body and the boss of the chucking mechanism body can be increased and, in addition, the coupling force between the rotor hub of the rotor body and the boss of the chucking mechanism body can be further increased by the release preventing unit. | 09-29-2011 |
20110265108 | Disk chucking apparatus, motor and disk driving device equipped with motor - There is provided a disk chucking apparatus according to an exemplary embodiment of the present invention, including: a centering case fixed on the inner peripheral surface of a disk; and a claw formed in the centering case and including a contact unit which rotates in a horizontal direction at the time of mounting the disk and is introduced into the centering case to elastically support the inner peripheral surface of the disk. | 10-27-2011 |
20120017228 | Motor and disk drive device having the same - There is provided a motor including: a rotor case having a chucking device, on which a disk is mounted, press-fitted and coupled thereto; and disk support members mounted on an upper surface of the rotor case to support a bottom surface of the disk, and having each of flow path portions therebetween allowing for airflow in a space between the disk and the rotor case, wherein a push portion is disposed in at least one of the rotor case and the disk support members to accelerate the airflow through the flow path portions when the rotor case rotates. | 01-19-2012 |
20120019094 | STATOR CORE AND MOTOR DEVICE INCLUDING THE SAME - Disclosed is a stator core including a core back fixedly inserted onto an outer surface of a stationary member, a plurality of teeth protruding from the core back in an outer diameter direction, wherein a coil is wound around the plurality of teeth so as to allow magnetic flux from a magnet to flow to the teeth, front end portions defining outer edges of the teeth, respectively, and body portions defining a length of the teeth and having a width increasing from the core back toward the front end portions, respectively. | 01-26-2012 |
20120023513 | Motor and optical disc drive using the same - There is provided a motor having an improved coupling structure between a circuit board and a base plate, and an optical disc drive using the same. The motor includes: a base plate; and a circuit board coupled to a surface of the base plate and having insulating layers formed on both surfaces thereof, wherein the insulating layers formed on both surfaces of the circuit board have different thicknesses. In particular, an insulating layer formed on one surface of the circuit board attached to the base plate may be thicker than an insulating layer formed on the other surface thereof. | 01-26-2012 |
20130239131 | MOTOR HAVING A DISK SUPPORT MEMBER AND A DISK DRIVE DEVICE HAVING THE SAME - A motor including: a rotor case having a chucking device, on which a disk is mounted, press-fitted and coupled thereto; disk support members mounted on an upper surface of the rotor case to support a bottom surface of the disk, and having each of flow path portions therebetween allowing for airflow in a space between the disk and the rotor case; and a push portion disposed in at least one of the rotor case and the disk support members to accelerate the airflow through the flow path portions when the rotor case rotates. | 09-12-2013 |
20140035429 | STATOR CORE AND MOTOR DEVICE INCLUDING THE SAME - Disclosed is a stator core including a core back fixedly inserted onto an outer surface of a stationary member, a plurality of teeth protruding from the core back in an outer diameter direction, wherein a coil is wound around the plurality of teeth so as to allow magnetic flux from a magnet to flow to the teeth, front end portions defining outer edges of the teeth, respectively, and body portions defining a length of the teeth and having a width increasing from the core back toward the front end portions, respectively. | 02-06-2014 |
20140082642 | OPTICAL DISC DRIVING DEVICE - There is provided an optical disc driving device including: a sleeve holder fixed to a base member; a sleeve fixed to the sleeve holder; a shaft rotating while being inserted into the sleeve; a rotor hub fixed to the shaft and rotating together with the shaft; a chucking mechanism fixed to the rotor hub and having a disc mounted thereon; and an upper case forming an internal space, together with the base member, wherein the shaft is protruded upwardly from the chucking mechanism. | 03-20-2014 |
20140285921 | SPINDLE MOTOR AND RECORDING DISK DRIVING DEVICE INCLUDING THE SAME - There is provided a spindle motor including: a stator core fixedly installed on a stator; a driving magnet having a center thereof disposed to coincide with that of the stator core in an axial direction; and a rotor hub including a hub body having a disk shape, a magnet mounting part extended from an edge of the hub body in a downward axial direction and having the driving magnet installed on an inner peripheral surface thereof, and a disk supporting part extended from the magnet mounting part in a radial direction, wherein the stator includes a base member, and a pulling magnet is installed on at least one of a lower surface of the disk supporting part and an upper surface of the base member disposed to face the lower surface of the disk supporting part. | 09-25-2014 |
Patent application number | Description | Published |
20080237622 | Light emitting device and package having the same - There is provided a light emitting device that can minimize reflection or absorption of emitted light, maximize luminous efficiency with the maximum light emitting area, enable uniform current spreading with a small area electrode, and enable mass production at low cost with high reliability and high quality. A light emitting device according to an aspect of the invention includes a light emitting lamination including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer, and a conductive substrate at one surface thereof. Here, the light emitting device includes a barrier unit separating the light emitting lamination into a plurality of light emitting regions, a first electrode structure, and a second electrode structure. The first electrode structure includes a bonding unit, contact holes, and a wiring unit connecting the bonding unit to the contact holes. | 10-02-2008 |
20100193828 | LIGHT EMITTING DEVICE AND PACKAGE HAVING THE SAME - There is provided a light emitting device that can minimize reflection or absorption of emitted light, maximize luminous efficiency with the maximum light emitting area, enable uniform current spreading with a small area electrode, and enable mass production at low cost with high reliability and high quality. A light emitting device according to an aspect of the invention includes a light emitting lamination including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer, and a conductive substrate at one surface thereof. Here, the light emitting device includes a barrier unit separating the light emitting lamination into a plurality of light emitting regions, a first electrode structure, and a second electrode structure. The first electrode structure includes a bonding unit, contact holes, and a wiring unit connecting the bonding unit to the contact holes. | 08-05-2010 |
20100200867 | VERTICAL STRUCTURE LED DEVICE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a vertical structure light emitting diode device, the method including: sequentially forming a first conductivity type III-V group compound semiconductor layer, an active layer, and a second conductivity type III-V group compound semiconductor layer on a substrate for growth; bonding a conductive substrate to the second conductivity type III-V group compound semiconductor layer; removing the substrate for growth from the first conductivity type III-V group compound semiconductor layer; and forming an electrode on an exposed portion of the first conductive III-V group compound semiconductor layer due to the removing the substrate for growth, wherein the bonding a conductive substrate comprises partially heating a metal bonding layer by applying microwaves to a bonding interface while bringing the metal bonding layer into contact with the bonding interface. | 08-12-2010 |
20130037849 | VERTICAL STRUCTURE LED DEVICE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a vertical structure light emitting diode device, the method including: sequentially forming a first conductivity type III-V group compound semiconductor layer, an active layer, and a second conductivity type III-V group compound semiconductor layer on a substrate for growth; bonding a conductive substrate to the second conductivity type III-V group compound semiconductor layer; removing the substrate for growth from the first conductivity type III-V group compound semiconductor layer; and forming an electrode on an exposed portion of the first conductive III-V group compound semiconductor layer due to the removing the substrate for growth, wherein the bonding a conductive substrate comprises partially heating a metal bonding layer by applying microwaves to a bonding interface while bringing the metal bonding layer into contact with the bonding interface. | 02-14-2013 |
Patent application number | Description | Published |
20110148995 | Inkjet print head, inkjet print head assembly and method of manufacturing inkjet print head assembly - There is provided an inkjet print head including: a head plate having nozzles arranged in a length direction, in which each of the nozzles ejects ink therethrough from a side surface of the head plate; an ink inlet provided in the lower portion of the head plate and drawing ink therethrough; a pressure chamber storing the ink drawn in through the ink inlet and communicating with the nozzle; and a piezoelectric element supplying the pressure chamber with driving force in a direction perpendicular to a direction of the ink ejected through the nozzle communicating with the pressure chamber and disposed on the pressure chamber having a membrane interposed therebetween. | 06-23-2011 |
20110273514 | Inkjet print head and method of manufacturing the same - Disclosed are an inkjet print head and a method of manufacturing the same. An inkjet print head according to an aspect of the invention may include: an inkjet board having an ink passage therein; a cutting portion provided outside the ink passage of the inkjet board and having a cutting surface created by separation into head chip units of the inkjet board; and an auxiliary cutting portion provided from one surface of the cutting portion inwardly in a thickness direction of the inkjet board, and assisting the separation into head chip units of the inkjet board. | 11-10-2011 |
20110279551 | Inkjet print head and inkjet printer including the same - There is provided an inkjet print head that includes: an inkjet head plate with a plurality of head cells including ink passages where introduced ink is ejected through a nozzle by passing through a pressure chamber; and a piezoelectric actuator formed on the top of the inkjet head plate and formed at a position corresponding to the pressure chamber, wherein the area of at least one of the pressure chamber and the piezoelectric actuator is changed to make ejection characteristics of the ink ejected from the plurality of head cells uniform. | 11-17-2011 |
20120019596 | Inkjet print head and method for manufacturing the same - An inkjet print head and a method for manufacturing the same are provided. The inkjet print head includes: an upper board having a pressure chamber; and a lower board including an upper silicon layer, an insulating layer, and a lower silicon layer, wherein the lower board includes a projection formed of the upper silicon layer and protruded into the interior of the pressure chamber in order to reduce the space of the pressure chamber, and a lower surface of the upper board and an upper surface of the lower silicon layer are fixed. | 01-26-2012 |
20130135395 | SILICON SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND INKJET PRINT HEAD - There is provided a silicon substrate including: a first connection part connected to a manifold and having a first width of a first size; a second connection part connected to a pressure chamber and having a second width of a second size; and a restrictor part connecting the first connection part to the second connection part and having a third width of a third size smaller than the first size or the second size, wherein a boundary part connecting the restrictor part to the first connection part or the restrictor part to the second connection part is formed to be curved. | 05-30-2013 |
20130135396 | INKJET PRINT HEAD - There is provided an inkjet print head, including: a first substrate in which a first restrictor and a pressure chamber are formed; and a second substrate in which a manifold, a second restrictor, and a nozzle are formed, wherein the first restrictor is connected to the manifold and the second restrictor, and the second restrictor is connected to the first restrictor and the pressure chamber. | 05-30-2013 |
20130135399 | PIEZOELECTRIC ACTUATOR, INKJET HEAD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME - There are provided a piezoelectric actuator, an inkjet head assembly, and a method of manufacturing the same. The piezoelectric actuator includes: upper and lower electrodes providing driving voltage; and a piezoelectric substance formed between the upper and lower electrodes through solidifying a liquid piezoelectric substance, and providing driving force to ink in each of a plurality of pressure chambers provided in an inkjet head, wherein the piezoelectric substance includes a plurality of branch portions individually provided on an upper portion of each of the plurality of pressure chambers and a large area portion integrally provided while being connected to each of the plurality of branch portions at one ends of the plurality of branch portions. | 05-30-2013 |
20130169723 | INKJET PRINT HEAD - There is provided an inkjet print head including: an ink discharge unit including nozzles, pressure chambers, restrictors, manifolds, and actuators; an ink supply unit including an ink tank supplying ink to the manifolds and circuit boards delivering control signals to the actuators; and a connection unit electrically connecting the circuit boards and the actuators, wherein the ink supply unit is formed integrally with the ink discharge unit. | 07-04-2013 |
20130342610 | PIEZOELECTRIC ACTUATOR, INKJET HEAD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME - There are provided a piezoelectric actuator, an inkjet head assembly, and a method of manufacturing the same. The piezoelectric actuator includes upper and lower electrodes providing a driving voltage; and a piezoelectric body provided between the upper and lower electrodes and providing driving force to ink within each of a plurality of pressure chambers provided in an inkjet head, wherein the piezoelectric body includes branch portions separately provided on an upper portion of each of the plurality of pressure chambers and a large area portion connected to one end of each of the plurality of branch portions and integrally formed, and a connective electrode pattern is provided on a portion of each of the upper electrodes corresponding to the large area portion. | 12-26-2013 |
20140152747 | INKJET PRINT HEAD - There is provided an inkjet print head having a stable filter structure. The inkjet print head includes a vibration substrate including a first filter formed therein; and a channel forming substrate including a second filter and a pressure chamber formed therein, the second filter being connected to the first filter. | 06-05-2014 |
20140176645 | PIEZOELECTRIC ACTUATOR, INKJET PRINT HEAD ASSEMBLY, AND METHOD OF MANUFACTURING THE PIEZOELECTRIC ACTUATOR AND THE INKJET PRINT HEAD ASSEMBLY - A piezoelectric actuator includes upper and lower electrodes providing driving voltages and a piezoelectric film formed between the upper and lower electrodes and providing a driving force to ink in a plurality of pressure chambers formed on an inkjet print head, respectively. The piezoelectric film may include a plurality of basin parts individually formed on respective tops of the plurality of pressure chambers and a large-area part connected to the plurality of basin parts, respectively, at one ends of the plurality of basin parts and formed as a single body. The large-area part may include an etching groove formed on an extended line of a basin line partitioning the basin parts. | 06-26-2014 |
20140320568 | INKJET PRINT HEAD - There is provided an inkjet print head including a substrate member including an ink channel, a piezoelectric actuator formed on the substrate member, and a coating member formed on the piezoelectric actuator and including a photosensitive material. | 10-30-2014 |