Patent application number | Description | Published |
20080197407 | Power Semiconductor Devices with Barrier Layer to Reduce Substrate Up-Diffusion and Methods of Manufacture - A method for controlling the thickness of an expitaxially grown semiconductor material includes providing a semiconductor substrate that is doped by dopants of a first type; forming a buffer layer atop the semiconductor substrate, the buffer layer being doped with dopants of a second type that has much less diffusivity relative to that of dopants of the first type and forming the expitaxially grown layer atop the buffer layer to a desired thickness. The buffer layer, which acts to counter an up-diffusion of the dopants of the first type from the substrate into the epitaxially grown layer, can be doped with arsenic or carbon or both arsenic and carbon. A semiconductor device includes the buffer layer to counter an up-diffusion of the dopants of the first type from the substrate into the epitaxially grown layer. | 08-21-2008 |
20080199997 | Methods of Forming Inter-poly Dielectric (IPD) Layers in Power Semiconductor Devices - A method for forming power semiconductor devices having an inter-electrode dielectric (IPD) layer inside a trench includes providing a semiconductor substrate with a trench, lining the sidewalls and bottom of the trench with a first layer of dielectric material, filling the trench with a first layer of conductive material to form a first electrode, recessing the first layer of dielectric material and the first layer of conductive material to a first depth inside the trench, forming a layer of polysilicon material on a top surface of the dielectric material and conductive material inside the trench, oxidizing the layer of polysilicon material, and forming a second electrode inside the trench atop the oxidized layer and isolated from trench sidewalls by a second dielectric layer. The oxidation step can be enhanced by either chemically or physically altering the top portion polysilicon such as by implanting impurities. | 08-21-2008 |
20120220091 | METHODS OF MAKING POWER SEMICONDUCTOR DEVICES WITH THICK BOTTOM OXIDE LAYER - A method for forming thick oxide at the bottom of a trench formed in a semiconductor substrate includes forming a conformal oxide film by a sub-atmospheric chemical vapor deposition process that fills the trench and covers a top surface of the substrate. The method also includes etching the oxide film off the top surface of the substrate and inside the trench to leave a substantially flat layer of oxide having a target thickness at the bottom of the trench. | 08-30-2012 |
Patent application number | Description | Published |
20080247222 | Spin Transfer Torque Magnetoresistive Random Access Memory and Design Methods - Systems, circuits and methods for determining read and write voltages for a given word line transistor in Spin Transfer Torque Magnetoresistive Random Access Memory (STT-MRAM) are disclosed. A first voltage can be supplied to the write operations so that the write operations occur in the saturation region of the word line transistor. A second voltage, which is less than the first voltage, can be supplied for read operations so that the read operations occur in the linear region of the word line transistor. | 10-09-2008 |
20090323404 | Write Operation for Spin Transfer Torque Magnetoresistive Random Access Memory with Reduced Bit Cell Size - Systems, circuits and methods for controlling write operations in Spin Transfer Torque Magnetoresistive Random Access Memory (STT-MRAM) are disclosed. A reduced bit cell size is achieved by arranging the source lines (SL) substantially in parallel with the word lines (WL) and substantially perpendicular to the bit lines (BL). Further, in one embodiment during a write operation, a high logic/voltage level is applied to the bit lines of unselected bit cells to prevent an invalid write operation. | 12-31-2009 |
20100061144 | Memory Device for Resistance-Based Memory Applications - In a particular embodiment, a memory device is disclosed that includes a memory cell including a resistance-based memory element coupled to an access transistor. The access transistor has a first oxide thickness to enable operation of the memory cell at an operating voltage. The memory device also includes a first amplifier configured to couple the memory cell to a supply voltage that is greater than a voltage limit to generate a data signal based on a current through the memory cell. The first amplifier includes a clamp transistor that has a second oxide thickness that is greater than the first oxide thickness. The clamp transistor is configured to prevent the operating voltage at the memory cell from exceeding the voltage limit. | 03-11-2010 |
20100157654 | Balancing A Signal Margin Of A Resistance Based Memory Circuit - A resistance based memory circuit is disclosed. The circuit includes a first transistor load of a data cell and a bit line adapted to detect a first logic state. The bit line is coupled to the first transistor load and coupled to a data cell having a magnetic tunnel junction (MTJ) structure. The bit line is adapted to detect data having a logic one value when the bit line has a first voltage value, and to detect data having a logic zero value when the bit line has a second voltage value. The circuit further includes a second transistor load of a reference cell. The second transistor load is coupled to the first transistor load, and the second transistor load has an associated reference voltage value. A characteristic of the first transistor load, such as transistor width, is adjustable to modify the first voltage value and the second voltage value without substantially changing the reference voltage value. | 06-24-2010 |