Patent application number | Description | Published |
20130040674 | Method of Beacon Synchronization For Base Stations - The present invention discloses a method of beacon synchronization for base stations, which comprises the following steps: receiving or transmitting a beacon by a first base station or a second base station; scanning at least one channel by the second base station to search for a channel of the first base station; calculating a time difference between the beacon sent by the first base station and the beacon sent by the second base station; and adjusting a time of transmitting the beacon sent by the second base station to synchronize the beacon sent by the second base station with the beacon sent by the first base station. Wherein, a wireless signal of the second base station is interfered by the first base station. | 02-14-2013 |
20140007071 | FIRMWARE OVERWRITING METHOD IN PAIRED USE WIRELESS MICROPHONE AND RECEIVER | 01-02-2014 |
20140046596 | DRINKING WATER REMINDING SYSTEM AND REMINDING METHOD THEREOF - Disclosed is a drinking water reminding system and the reminding method thereof. The water intake of user is measured by the operation of a reminder of the drinking water reminding system, and a collector of the drinking water reminding system is provided for adjusting the daily drinking water demand of user according to environmental parameters or the physiological parameters of user. The drinking water reminding system reminds the user to drink water if the drinking water reminding system determines that the user has taken insufficient water according to predetermined conditions and measurement results, drinking water reminding system. | 02-13-2014 |
20140136380 | Cloud Management Method of Electronic Devices - A cloud management method of electronic devices is disclosed herein. The method comprises collecting at least one first information from a electronic device by an information collector comprising a safe power switch; calculating a temporary safe interruption value by the information collector via analyzing a predetermined number of times of a working current or voltage of the electronic device, or calculating a safe interruption value by a local server or a first server; and writing back the temporary safe interruption value or the safe interruption value to the safe power switch. Preferably, a power supply of the electronic device is cut off by the safe power switch in response to the working current or voltage surpassing the temporary safe interruption value or the safe interruption value. | 05-15-2014 |
20150143353 | FIRMWARE OVERWRITING METHOD IN PAIRED USE WIRELESS MICROPHONE AND RECEIVER - A firmware overwriting method for paired use wireless microphone and receiver is disclosed. The firmware update method comprises building a wireless connection between the at least one wireless microphone and the at least one receiver; and executing the determining program by the receiver processing module to determine if the installed wireless microphone matching backup firmware is the same as the wireless microphone firmware. If yes, the overwriting program is not executed. If no, the receiver processing module sends a command to the wireless microphone processing module to download the installed wireless microphone matching backup firmware from the receiver storage module, and the overwriting program is executed by the wireless microphone processing module to overwrite the wireless microphone firmware with the installed wireless microphone matching backup firmware. | 05-21-2015 |
Patent application number | Description | Published |
20100110191 | BIDIRECTIONAL WIRELESS TRANSMISSION AND COMMUNICATION SYSTEM - A bidirectional wireless transmission and communication system is disclosed, including a base station, a wireless microphone and an external control device. A bidirectional wireless transmission and communication may be performed between the wireless microphone and the base station. The external control device is connected to the wireless microphone wirelessly or via a cable for controlling the wireless microphone via at least one push button on the external control device. The external control device is also provided with at least one light-emitting element to show the function operating state of the wireless microphone. The wireless microphone is internally provided with a global positioning system and a G-sensor for locating the coordinates of the wireless microphone under different situations. When the wireless microphone is located beyond the wireless communication range, the wireless microphone emits a high-power pulsed radio frequency signal for the base station to locate the position of the wireless microphone. | 05-06-2010 |
20100112939 | BIDIRECTIONAL WIRELESS MICROPHONE SYSTEM WITH AUTOMATIC LOGIN FUNCTION - A bidirectional wireless microphone system with an automatic login function comprises at least one wireless microphone, a base station and a data processing unit. The wireless microphone and the base station are able to wirelessly communicate with and transmit data, such as a sound signal, coordinate position or image, to each other. The data processing unit is connected to the base station to store and process the data transmitted between the wireless microphone and the base station. While the wireless microphone completes a process of registration to the base station by engaging a first registration contact on the wireless microphone with a corresponding second registration contact on the base station, a process of logging in to the data processing unit, which can be, for example, a computer or an application program, is completed at the same time to thereby simplify the registration and login process and save operating time. | 05-06-2010 |
20100113086 | WIRELESS MICROPHONE SYSTEM AND METHOD OF SIGNAL SYNCHRONIZATION THEREOF - The present invention discloses a wireless microphone system and a method of signal synchronization thereof, which comprises the following steps: receiving or transmitting a first channel wireless signal to at least one first wireless microphone through a first base station; receiving or transmitting a second channel wireless signal to at least one second wireless microphone through a second base station; and controlling a slave base station through a master base station, such that the first and the second channel wireless signals are synchronously received or transmitted. When any one of the base stations is not received a beacon for a duration of time, the base stations automatically switch to be the master base station and start to transmit the beacon. When other base stations receive the beacon, they switch back to be the slave base stations and use the received beacon as the basis of synchronization time correction. | 05-06-2010 |
20110058693 | WIRELESS MICROPHONE DEVICE - The present invention provides a wireless microphone device which comprises a casing, an antenna element and a transceiver. A concave recession is formed on a side surface of the casing. One end of the antenna element is disposed on a bottom surface of the concave recession, and the other end of the antenna element is extending upwardly with an oblique angle relative to the side surface. The transceiver is disposed inside the casing, and transmits or receives a microphone signal by the antenna element. Consequently, according to the present invention, the wireless microphone with the obliquely disposed antenna element can avoid the radio wave from being blocked or absorbed by a user's body, and thereby the efficiency of the antenna element receiving or transmitting the radio wave would not be reduced. | 03-10-2011 |
20120302277 | BIDIRECTIONAL MICROPHONE SYSTEM - A bidirectional microphone system is disclosed, including a base station, a wireless microphone and an external control device. A bidirectional wireless communication may be performed between the wireless microphone and the base station. The external control device is connected to the wireless microphone for controlling the wireless microphone via at least one push button on the external control device. The external control device is also provided with light-emitting elements to show the function or status of the wireless microphone. The wireless microphone is provided with a global positioning system or a G-sensor for locating the coordinates of the wireless microphone under different situations. When the wireless microphone is in an emergency and located beyond the wireless communication range, the wireless microphone emits a high-power pulsed radio frequency signal for antenna of the base station to locate the position of the wireless microphone. | 11-29-2012 |
Patent application number | Description | Published |
20110156854 | Spiral Inductor Device - A spiral inductor device is provided. The spiral inductor device includes a first spiral conductive trace with multiple turns and a second spiral conductive trace with multiple turns adjacent thereto, disposed on an insulating layer over a substrate, wherein the outermost turn and the innermost turn of the first spiral conductive trace have a first end and a second end, respectively, the outermost turn and the innermost turn of the second spiral conductive trace have a third end and a fourth end, respectively, and the second and fourth ends are connected to ground. A non-continuous spiral conductive trace with a single turn is disposed on the insulating layer, parallel and adjacent to the outermost turn of the first spiral conductive trace, wherein the non-continuous spiral conductive trace is connected to the ground and at least a portion thereof is disposed between the first and the second spiral conductive traces. | 06-30-2011 |
20110249380 | CABLE ASSEMBLY AND ELECTRONIC DEVICE - An electronic device including an electronic unit and a cable assembly is provided. The cable assembly includes a first connector module, a second connector module, and a cable connecting between the first and the second connector modules. The first connector module detachably connected to the electronic device includes a serial advanced technology attachment (SATA) connector and a connector with at least four terminals. | 10-13-2011 |
20120243184 | DIFFERENTIAL SIGNAL PAIR TRANSMISSION STRUCTURE, WIRING BOARD AND ELECTRONIC MODULE - A differential signal pair transmission structure adapted to a wiring board and including a first signal path and a second signal path is provided. The first signal path includes a first upper trace, a first lower trace and a first conductive through via. The second signal path includes a second upper trace, a second lower trace and a second conductive through via. A portion of the first signal path and a portion of the second signal path overlaps in the normal projection onto the upper or lower surface of the wiring board. Normal projections of the first and the second signal path projecting onto the upper surface of the wiring board are substantially symmetric with respect to a line which is perpendicular to a segment connecting normal projections of axes of the first and the second through via onto the upper surface and passes through the midpoint of the segment. | 09-27-2012 |
20130012067 | LEAD ARRANGEMENT, ELECTRIC CONNECTOR AND ELECTRIC ASSEMBLY - A lead arrangement is suitable for an electric connector. The lead arrangement includes a first lead lane that includes a pair of first differential signal leads, a pair of second differential signal leads and a first ground lead between the two pairs of differential signal leads. Each of the first differential signal leads, the second differential signal leads and the ground lead has a surface mounting segment adapted for being soldered onto a surface pad of a circuit board. The pair of first differential signal leads is a pair of transmitting differential signal leads T | 01-10-2013 |
20130129283 | ACTIVE OPTICAL CABLE AND ELECTRONIC DEVICE USING THE SAME - An active optical cable has a connector containing an electrical-to-optical and optical-to-electrical (EO/OE) conversion processing chip. The EO/OE conversion processing chip has a TXin+ pin and a TXin− pin to be coupled to a TX+ terminal and a TX− terminal of an USB connector of an apparatus. The pair of pins TXin+ and TXin−, for a differential transmission signal, are provided base on a common mode impedance structure, to charge capacitors carried by the TX+ and TX− terminals and, according to the charging status of the capacitors, it is determined whether the active optical cable is connected to the apparatus. | 05-23-2013 |
20140210044 | SEMICONDUCTOR DEVICE HAVING INDUCTOR - A semiconductor device including a first insulating layer and a second insulating layer sequentially disposed on a substrate is disclosed. A first conductive line and a second conductive line are disposed in the first insulating layer, and each of the first and second conductive lines has a first end and a second end, wherein the second ends of the first and second conductive lines are coupled to each other. A first winding portion and a second winding portion are disposed in the second insulating layer, and each of the first and second winding portions includes a third conductive line and a fourth conductive line arranged from the inside to the outside. Each of the third and fourth conductive lines has a first end and a second end, wherein the first and second conductive lines overlap at least a portion of the third conductive lines. | 07-31-2014 |
20140307376 | TRANSMITTAL SYSTEM AND CONNECTION DEVICE - A transmittal system including an extension device, a connection device, and an impedance device is disclosed. The extension device includes a first connection port and is coupled to a peripheral device. The connection device includes a second connection port and a third connection port. The second connection port is coupled to the first connection port. The third connection port is coupled to an electronic device. The impedance device connects at least one of the first, the second and the third connection ports to ground. | 10-16-2014 |
Patent application number | Description | Published |
20100130003 | Method of Forming Through-Silicon Vias - A method of forming a semiconductor device having a through-silicon via (TSV) is provided. A semiconductor device is provided having a first dielectric layer formed thereon. One or more dielectric layers are formed over the first dielectric layer, such that each of the dielectric layers have a stacking structure, wherein the stacking structures in the one or more dielectric layers are vertically aligned. The stacking structures may be, for example, metal rings. The stacking structures are then removed to form a first recess. A second recess is formed by extending the first recess into the substrate. The second recess is filled with a conductive material to form the TSV. | 05-27-2010 |
20100133696 | Isolation Structure for Protecting Dielectric Layers from Degradation - An integrated circuit structure includes a semiconductor substrate; and an interconnect structure overlying the semiconductor substrate. A solid metal ring is formed in the interconnect structure, with substantially no active circuit being inside the solid metal ring. The integrated circuit structure further includes a through-silicon via (TSV) having a portion encircled by the solid metal ring. The TSV extends through the interconnect structure into the semiconductor substrate. | 06-03-2010 |
20100187670 | On-Chip Heat Spreader - A three dimensional (3D) stacked chip structure with chips having on-chip heat spreader and method of forming are described. A 3D stacked chip structure comprises a first die having a first substrate with a dielectric layer formed on a front surface. One or more bonding pads and a heat spreader may be simultaneously formed in the dielectric layer. The first die is bonded with corresponding bond pads on a surface of a second die to form a stacked chip structure. Heat generated in the stacked chip structure may be diffused to the edges of the stacked chip structure through the heat spreader. | 07-29-2010 |
20100187671 | Forming Seal Ring in an Integrated Circuit Die - The formation of a seal ring in a semiconductor integrated circuit (IC) die is described. Through-silicon vias (TSVs) are typically formed in a semiconductor IC die to facilitate the formation of a three dimensional (3D) stacking die structure. The TSVs may be utilized to provide electrical connections between components in different dies of the 3D stacking die structure. A seal ring is formed in the inter-metal dielectric (IMD) layers of an IC die, enclosing an active circuit region. The real ring is formed prior to the formation of the TSVs, preventing moistures or other undesired chemical agents from diffusing into the active circuit region during the subsequent processes of forming TSVs. | 07-29-2010 |
20120112322 | Seal Ring in an Integrated Circuit Die - The formation of a seal ring in a semiconductor integrated circuit (IC) die is described. Through-silicon vias (TSVs) are typically formed in a semiconductor IC die to facilitate the formation of a three dimensional (3D) stacking die structure. The TSVs may be utilized to provide electrical connections between components in different dies of the 3D stacking die structure. A seal ring is formed in the inter-metal dielectric (IMD) layers of an IC die, enclosing an active circuit region. The real ring is formed prior to the formation of the TSVs, preventing moistures or other undesired chemical agents from diffusing into the active circuit region during the subsequent processes of forming TSVs. | 05-10-2012 |
20130078765 | On-Chip Heat Spreader - A three dimensional (3D) stacked chip structure with chips having on-chip heat spreader and method of forming are described. A 3D stacked chip structure comprises a first die having a first substrate with a dielectric layer formed on a front surface. One or more bonding pads and a heat spreader may be simultaneously formed in the dielectric layer. The first die is bonded with corresponding bond pads on a surface of a second die to form a stacked chip structure. Heat generated in the stacked chip structure may be diffused to the edges of the stacked chip structure through the heat spreader. | 03-28-2013 |
20140054761 | On-Chip Heat Spreader - A three dimensional (3D) stacked chip structure with chips having on-chip heat spreader and method of forming are described. A 3D stacked chip structure comprises a first die having a first substrate with a dielectric layer formed on a front surface. One or more bonding pads and a heat spreader may be simultaneously formed in the dielectric layer. The first die is bonded with corresponding bond pads on a surface of a second die to form a stacked chip structure. Heat generated in the stacked chip structure may be diffused to the edges of the stacked chip structure through the heat spreader. | 02-27-2014 |
Patent application number | Description | Published |
20130277093 | SUBSTRATE STRUCTURE - A substrate structure for carrying plural heat generating elements is provided. The substrate structure includes a board, a patterned metal layer and plural heat dissipating channels. The board has an upper surface. The patterned metal layer is disposed on the board and includes a first electrode, a second electrode, plural first pads and plural second pads. The first pads and the second pads are alternatively disposed on the upper surface in parallel. Parts of the first (second) pads are electrically connected to the first (second) electrode. The other parts of first pads and the other parts of second pads are electrically connected to each other. Each first pad and the adjacent second pad define a device bonding area. The heat generating elements are respectively disposed in the device bonding areas. There are multiple trenches between the two adjacent device bonding areas. The heat dissipating channels are disposed in the trenches. | 10-24-2013 |
20130285083 | LIGHT EMITTING MODULE - A light emitting module including a substrate, a plurality of first light emitting diode (LED) chips and a plurality of second LED chips is provided. The substrate has a cross-shaped central region and a peripheral region surrounding the cross-shaped central region. The first LED chips are disposed on the substrate and at least located in the cross-shaped central region. The second LED chips are disposed on the substrate and at least located in the peripheral region. A size of each second LED chip is smaller than a size of each first LED chip. The number of the first LED chips located in the peripheral region is smaller than that in the cross-shaped central region. The number of the second LED chips located in the cross-shaped central region is smaller than that in the peripheral region. | 10-31-2013 |
20140167077 | LIGHT SOURCE MODULE - A light source module includes a substrate, at least two light emitting diode (LED) chips and at least one dummy chip. The LED chips are disposed on the substrate. The dummy chip is disposed on the substrate and located between the LED chips. The LED chips, the dummy chip and the substrate are electrically connected to one another. The dummy chip is used to redirect a lateral light emitted from the LED chips. | 06-19-2014 |
20140185270 | LIGHTING STRUCTURE AND ILLUMINATING DEVICE - A lighting structure includes a substrate, a light emitting diode, a cover unit, and a hollow column. The substrate has a top surface and a rear surface opposite to the top surface. The light emitting diode is disposed on the top surface and is electrically connected to the substrate. The cover unit is disposed on and cooperates with the substrate to define a receiving space in which the light emitting diode is disposed. The hollow column is connected to the rear surface of the substrate and extends in a vertical direction away from the rear surface. The cover unit and the hollow column respectively have a height in the vertical direction, and the height of the hollow column is 2 times to 10 times the height of the cover unit. | 07-03-2014 |
20140252400 | LIGHT EMITTING DEVICE - A light emitting device including a carrier, a substrate, at least one electrode pair, at least one light emitting diode (LED) and at least one positioning element is provided. The substrate is disposed on the carrier and has a body portion and at least one bending portion. The bending portion connects to the body portion. The bending portion is not coplanar with the body portion. The electrode pair is located on the body portion of the substrate. The LED is disposed on the body portion of the substrate and electrically connected to the electrode pair. The positioning element is disposed on the bending portion of the substrate for fixing the substrate on the carrier. | 09-11-2014 |
20140346543 | LIGHT-EMITTING DEVICE - A light-emitting device of the invention includes a base, at least one light-emitting element, a wavelength transferring cover and a heat-conducting structure. The light-emitting element is disposed on the base and electrically connected to the base. The wavelength transferring cover is disposed on the base and covers the light-emitting element. The heat-conducting structure is disposed on the base and directly contacts the wavelength transferring cover. | 11-27-2014 |
Patent application number | Description | Published |
20090189298 | Bonding pad structure and debug method thereof - The bonding pad structure includes a main bonding pad and a blank path. The blank path crosses through the main bonding pad for dividing the main bonding pad into a first sub-bonding pad and a second sub-bonding pad. The bonding pad structure may further include a solder covered on the blank path and the main bonding pad selectively. The main bonding pad is regarded as a closed circuit when the solder is covered on the blank path and the main bonding pad. The main bonding pad is regarded as a open circuit when the solder is not covered on the blank path and the main bonding pad. A debug method with the bonding pad structure is also disclosed. | 07-30-2009 |
20090189637 | Machine for programming on-board chipsets - The present invention discloses a machine for programming on-board chipsets, wherein the on-board chipsets means that some chipsets are mounted on a circuit board, and the circuit board has a plurality of input pads electrically connected to each chipset individually. The machine comprises a platform, a number of programming modules and an IC programming burner in which the platform faces a surface of the circuit board having the input pads, the programming modules disposed movably on the platform separately extends a number of output pins outwardly so that for connecting electrically an input pad as contacting the input pad, and the IC programming burner electrically connected to each of the programming modules separately distributes a set of programming codes into each programming module when the output pins electrically connect to the input pads. | 07-30-2009 |
20100049903 | RECORDING SYSTEM AND DATA RECORDING METHOD - A recording method for writing data into an electrically erasable programmable read-only memory is disclosed, in which the memory has already been electrically connected to a controller through a logic device. The method sets the logic devices for the first time to disconnect the memory from the controller, and set the logic devices for the second time to write setting data required by the controller into the memory. After that, the method reads out the setting data stored in the memory to confirm the writing of the setting data, and connects the memory to the controller again. | 02-25-2010 |
20100301886 | TEST BOARD - A test board is provided. The test board includes a power connecting interface, diode modules, a power module a detecting module, and a processor. The power connecting interface includes power pins, wherein each of the power pins is electrically connected to a motherboard power socket to receive a power signal. Each of the diode modules is electrically connected to one of the power pins and includes at least one diode. The power module is electrically connected to the diode modules to receive the power signal through each of the diode modules. The detection module is electrically connected to points between the diode modules and the power connecting interface to generate a detection result according to the voltage between each diode module and the power connecting interface. The processor is used to determine the connecting state between the power pin and the corresponding motherboard power socket according to the detection result. | 12-02-2010 |
20120137114 | METHOD AND CIRCUIT FOR RESETTING REGISTER - A method for reset a register includes the following step: a computer starts to be booted and perform a booting procedure. Wherein, the computer includes at least one register. Power is supplied to the at least one register. Determine if the computer is booted successfully. If it is determined that the computer fails to be booted, the at least one register is kept to be grounded for a predetermined period of time to reset the at least one register. After the at least one register is grounded, power is supplied to the at least one register again, and the computer is rebooted. | 05-31-2012 |
20140139105 | CONTROL DEVICE AND LIGHT SOURCE DEVICE - A control device adapted to control a first light-emitting diode and a second light-emitting diode, includes a first logic operation unit receiving a first enable signal and a second enable signal to generate a first logic signal, a second logic operation unit receiving the first and second enable signals to generate a second logic signal, a first adjustment unit generating a first adjustment signal according to the first logic signal, a second adjustment unit generating a second adjustment signal according to the second logic signal, a first control unit outputting a first control signal to the first light-emitting diode according to the first enable signal and the first adjustment signal, and a second control unit outputting a second control signal to the second light-emitting diode according to the second enable signal and the second adjustment signal. The first logic signal and the second logic signal are complementary. | 05-22-2014 |