Patent application number | Description | Published |
20110102967 | IMPLANTABLE CO-FIRED ELECTRICAL FEEDTHROUGHS - A multilayered feedthrough for an implantable medical device includes a substrate having a first edge, a second edge, and a substrate length. A plurality of traces is formed on the substrate and extends along the substrate length. The plurality of traces extends to the first and second edges of the substrate. An insulator layer is formed on the substrate and the plurality of traces. A ground plane layer is formed on the insulator layer. | 05-05-2011 |
20130032378 | HERMETIC FEEDTHROUGH - A hermetic feedthrough for an implantable medical device includes a sheet having a hole, where the sheet includes a ceramic comprising alumina. The feedthrough also includes a second material substantially filling the hole, where the second material includes a platinum powder mixture and an alumina additive. The platinum powder mixture includes a first platinum powder having a median particle size of between approximately 3 and 10 micrometers and a second platinum powder that is coarser than the first platinum powder and has a median particle size of between approximately 5 and 20 micrometers. The platinum powder mixture includes between approximately 50 and 80 percent by weight of the first platinum powder and between approximately 20 and 50 percent by weight of the second platinum powder. The first and second materials have a co-fired bond therebetween that hermetically seals the hole. | 02-07-2013 |
20130032382 | HERMETIC FEEDTHROUGH - A feedthrough includes a sheet having a hole, where the sheet includes a first material that is a ceramic comprising alumina. The feedthrough further includes a second material substantially filling the hole. The second material is different than the first material and includes platinum and an additive that includes alumina. The first and second materials have a co-fired bond therebetween that hermetically seals the hole. | 02-07-2013 |
20130032391 | FEEDTHROUGH CONFIGURED FOR INTERCONNECT - A hermetic feedthrough for an implantable medical device includes an insulator, a conduit integrated with the insulator, and a pad coupled to an exterior surface of the insulator. The insulator includes a first material and the conduit includes a second material that is electrically conductive. The pad is configured to receive a lead coupled thereto. Further, the pad is electrically conductive and coupled to the conduit. The pad includes a first layer and a second layer overlaying at least a portion of the first layer. | 02-07-2013 |
20130032392 | INSULATOR FOR A FEEDTHROUGH - A hermetic feedthrough for an implantable medical device includes an insulator, a conduit configured to conduct electricity through the insulator, and a ferrule coupled to the insulator. The insulator is formed from a ceramic material and the conduit and insulator have a co-fired bond therebetween, which hermetically seals the conduit with the insulator. The insulator is elongate and has opposing ends that include flat surfaces and the ferrule includes a frame for receiving the insulator. | 02-07-2013 |
20130035732 | ELECTRICAL LEADS FOR A FEEDTHROUGH - A lead frame for attaching leads to a hermetic feedthrough includes a cross-member and a plurality of leads. Each of the leads has an elongate body extending from the cross-member in a direction substantially parallel with one another, and each lead includes at least one of a notch on an end thereof opposite to the cross-member or a hole proximate to the end. | 02-07-2013 |
20140151114 | INSULATOR FOR A FEEDTHROUGH - A hermetic feedthrough for an implantable medical device includes an insulator body and a ferrule. The insulator body includes ceramic material and one or more electrically conductive conduits extending through the insulator body. The insulator is disposed in an opening of the ferrule. The insulator body includes a plurality of substantially flat surfaces that each include a plurality of edges. A rounded corner extends between adjacent edges of any two adjacent substantially flat surfaces. Each corner between any two adjacent substantially flat surfaces that face toward the ferrule has an average radius that is less than approximately 25% of a length of the corresponding edges. | 06-05-2014 |
20140305694 | INSULATOR FOR A FEEDTHROUGH - A hermetic feedthrough for an implantable medical device includes an insulator, a conduit configured to conduct electricity through the insulator, and a ferrule coupled to the insulator. The insulator is formed from a ceramic material and the conduit and insulator have a co-fired bond therebetween, which hermetically seals the conduit with the insulator. The insulator is elongate and has opposing ends that include flat surfaces and the ferrule includes a frame for receiving the insulator. | 10-16-2014 |
Patent application number | Description | Published |
20100109958 | High Dielectric Substrate Antenna For Implantable Miniaturized Wireless Communications and Method for Forming the Same - An antenna structure for an implantable medical device (IMD) is provided including a lower dielectric biocompatible antenna portion positioned on a body side of the structure and a high dielectric portion including at least one dielectric substrate having a high dielectric constant positioned on a device side of the structure. The biocompatible antenna portion is derived from an antenna layer, a biocompatible surface layer, and at least one layer of biocompatible dielectric material (e.g., high temperature cofire ceramic (HTCC) material) that provides a matching gradient between the antenna and the surrounding environment. The high dielectric portion may include at least one layer of low temperature cofire ceramic (LTCC) material. The high dielectric portion may be bonded to the biocompatible antenna portion or cofired with the biocompatible antenna portion to form a single bilayer monolithic antenna structure having a lower dielectric HTCC biocompatible antenna portion and a high dielectric LTCC portion. | 05-06-2010 |
20100109966 | Multi-Layer Miniature Antenna For Implantable Medical Devices and Method for Forming the Same - An antenna for an implantable medical device (IMD) is provided including a monolithic structure derived from a plurality of discrete dielectric layers having an antenna embedded within the monolithic structure. Superstrate dielectric layers formed above the antenna may provide improved matching gradient with the surrounding environment to mitigate energy reflection effects. A outermost biocompatible layer is positioned over the superstrates as an interface with the surrounding environment. A shielding layer is positioned under the antenna to provide electromagnetic shielding for the IMD circuitry. Substrate dielectric layers formed below the antenna may possess higher dielectric values to allow the distance between the antenna and ground shielding layer to be minimized. An electromagnetic bandgap layer may be positioned between the antenna and the shielding layer. The dielectric layers may comprise layers of ceramic material that can be co-fired together with the antenna to form a hermetically sealed monolithic antenna structure. | 05-06-2010 |
20100114245 | Antenna for Implantable Medical Devices Formed on Extension of RF Circuit Substrate and Method for Forming the Same - An antenna for an implantable medical device (IMD) is provided that is formed on the same substrate as the telemetry circuitry for the IMD. The telemetry circuitry is formed on a portion of the substrate within the interior of a housing for the IMD, while at least one antenna is formed on an exterior portion of the substrate on the exterior of the housing to allow for far field telemetry. At least one electrical interconnect is formed on the substrate for connecting the antenna to the telemetry circuitry, where the electrical interconnect may comprise a controlled impedance line to minimize loss. A conformally-shaped hermetic cover, such as a ceramic material, may be formed in a desired shape around the exterior portion of the substrate and antenna and cofired together to form a monolithic structure encasing the antenna and exterior portion of the substrate. | 05-06-2010 |
20100114246 | Co-Fired Multi-Layer Antenna for Implantable Medical Devices and Method for Forming the Same - An antenna for an implantable medical device (IMD) is provided including a monolithic structure derived from a plurality of discrete dielectric layers having an antenna embedded within the plurality of dielectric layers. The antenna includes antenna portions formed within different layers of the monolithic structure with at least one conductive via formed to extend through the dielectric layers in order to provide a conductive pathway between the portions of the antenna formed on different layers, such that an antenna is formed that extends between different vertical layers. The dielectric layers may comprise layers of ceramic material that can be co-fired together with the antenna to form a hermetically sealed monolithic antenna structure. The antenna embedded within the monolithic structure can be arranged to have a substantially spiral, helical, fractal, meandering or planer serpentine spiral shape. | 05-06-2010 |
20100168817 | Phased Array Cofire Antenna Structure and Method for Forming the Same - An antenna structure for an implantable medical device (IMD) is provided that includes an antenna embedded within a structure derived from a plurality of discrete dielectric layers. An array of electrodes are connected to the antenna structure and arranged for applying a bias across selected segments of the dielectric layers for altering the performance characteristics of the antenna. The bias applied by the array of electrodes can be selected to provide desired impedance matching between the antenna and the surrounding environment of the implant location to mitigate energy reflection effects at the transition from the antenna structure to the surrounding environment, to provide beam steering functionality for the antenna, or to alter the gain of the signals received by the antenna. IMD is configured to monitor received signal characteristics (e.g., RSSI, EVM or bit error rate) and alter material properties of the dielectric material through biasing to control antenna performance. | 07-01-2010 |
20100168818 | External RF Telemetry Module for Implantable Medical Devices - An implantable medical device (“IMD”) is provided having an antenna and an RF telemetry module for far field telemetry communications arranged on an exterior of the IMD housing, such that telemetry signal processing may be performed on the exterior of the housing. One or more feedthrough conductive paths extend through the housing to communicatively couple the RF module to circuitry within the housing. In this manner RF module is arranged entirely external to the housing, such that only power and/or low frequency data bit signals are required to be passed through the feedthrough conductive path. This allows the feedthrough conductive path to be filtered to prevent undesired interference signals (e.g., electromagnetic interference (EMI) signals) from entering the housing through the feedthrough conductive path coupled to the RF module. In some embodiments, the antenna and RF module are formed in an integrated assembly attachable to an exterior portion of the housing. | 07-01-2010 |
20110029036 | Co-Fired Electrical Feedthroughs for Implantable Medical Devices Having a Shielded RF Conductive Path and Impedance Matching - A co-fired electrical feedthrough for an implantable medical device (IMD) is provided having a shielded radio frequency (RF) conductive path. The feedthrough includes a monolithic structure derived from one or more layers of dielectric material and a conductive pathway extending through the monolithic structure for communicating RF signals into and from the IMD. An internal shield is formed to extend through at least one of the layers of dielectric material so as to surround the conductive pathway (e.g., in a coaxial relationship) and shield the RF conductive pathway from undesirable signals. This shielding of the RF conductive pathway prevents destructive EMI signals from entering into the IMD through the RF conductive pathway. In some embodiments, a monolithic structure containing embedded impedance matching elements is electrically connected to at least one conductive pathway in the feedthrough to perform impedance matching and/or filtering of the conductive pathway to other circuitry. | 02-03-2011 |
20120165902 | MULTI-ELECTRODE IMPLANTABLE SYSTEMS AND ASSEMBLIES THEREOF - Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi-electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected. | 06-28-2012 |
20130325086 | MULTI-ELECTRODE IMPLANTABLE SYSTEMS AND ASSEMBLIES THEREFOR - Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi-electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected. | 12-05-2013 |