Patent application number | Description | Published |
20100148284 | MEMS DEVICE HAVING A MOVABLE ELECTRODE - A microelectromechanical system (MEMS) device includes a semiconductor substrate, a MEMS including a fixed electrode and a movable electrode formed on the semiconductor substrate through an insulating layer, and a well formed in the semiconductor substrate below the fixed electrode. The well is one of an n-type well and a p-type well. The p-type well applies a positive voltage to the fixed electrode while the n-type well applies a negative voltage to the fixed electrode. | 06-17-2010 |
20100178717 | METHOD OF MANUFACTURING MEMS DEVICE - A method of manufacturing an MEMS device includes: forming a covering structure having an MEMS structure and a hollow portion, which is located on a periphery of the MEMS structure and is opened to an outside, on a substrate; and performing surface etching for the MEMS structure in a gas phase by supplying an etching gas to the periphery of the MEMS structure from the outside. | 07-15-2010 |
20110031564 | MEMS DEVICE AND FABRICATION METHOD THEREOF - A micro electro mechanical system (MEMS) device includes: a fixed electrode made of silicon and provided above a semiconductor substrate; a movable electrode made of silicon and arranged in a mechanically movable manner by having a gap from the semiconductor substrate; and a wiring layered part that is provided around the movable electrode, covers a portion of the fixed electrode and includes wiring. One of the fixed electrode and the movable electrode is implanted with an impurity ion and at least a part of the portion of the fixed electrode covered by the wiring layered part is silicidized. | 02-10-2011 |
20110095383 | MEMS DEVICE HAVING A MOVABLE ELECTRODE - A microelectromechanical system (MEMS) device includes a semiconductor substrate, a MEMS including a fixed electrode and a movable electrode formed on the semiconductor substrate through an insulating layer, and a well formed in the semiconductor substrate below the fixed electrode. The well is one of an n-type well and a p-type well. The p-type well applies a positive voltage to the fixed electrode while the n-type well applies a negative voltage to the fixed electrode. | 04-28-2011 |
20110148537 | MEMS OSCILLATOR AND METHOD OF MANUFACTURING THEREOF - An oscillator includes: a plurality of MEMS vibrators formed on a substrate; and an oscillator configuration circuit connected to the plurality of MEMS vibrators, wherein the plurality of MEMS vibrators each have a beam structure, and the respective beam structures are different, whereby their resonant frequencies are different. | 06-23-2011 |
20110221536 | MEMS DEVICE AND OSCILLATOR - A MEMS device includes a substrate, a cavity formed above the substrate, a first vibrator contained in the cavity, and a second vibrator contained in the cavity and having a natural frequency different from that of the first vibrator. The first vibrator and the second vibrator are preferably arranged along a long side of the cavity having a rectangular shape in plan view. | 09-15-2011 |
20110241136 | MEMS DEVICE - A MEMS device includes a substrate, an insulating layer section formed above the substrate and having a cavity, a functional element contained in the cavity, and a fuse element contained in the cavity and electrically connected with the functional element. It is preferable that the fuse element is spaced apart from the substrate. | 10-06-2011 |
20110254110 | MEMS DEVICE HAVING A MOVABLE ELECTRODE - A microelectromechanical system (MEMS) device includes a semiconductor substrate, a MEMS including a fixed electrode and a movable electrode formed on the semiconductor substrate through an insulating layer, and a well formed in the semiconductor substrate below the fixed electrode. The well is one of an n-type well and a p-type well. The p-type well applies a positive voltage to the fixed electrode while the n-type well applies a negative voltage to the fixed electrode. | 10-20-2011 |
20110306153 | METHOD OF MANUFACTURING MEMS DEVICE - A method of manufacturing an MEMS device includes: forming a covering structure having an MEMS structure and a hollow portion, which is located on a periphery of the MEMS structure and is opened to an outside, on a substrate; and performing surface etching for the MEMS structure in a gas phase by supplying an etching gas to the periphery of the MEMS structure from the outside. | 12-15-2011 |
20120104519 | MEMS DEVICE HAVING A MOVABLE ELECTRODE - A microelectromechanical system (MEMS) device includes a semiconductor substrate, a MEMS including a fixed electrode and a movable electrode formed on the semiconductor substrate through an insulating layer, and a well formed in the semiconductor substrate below the fixed electrode. The well is one of an n-type well and a p-type well. The p-type well applies a positive voltage to the fixed electrode while the n-type well applies a negative voltage to the fixed electrode. | 05-03-2012 |
20120104593 | ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE - An electronic device according to the invention includes: a substrate; an MEMS structure formed above the substrate; and a covering structure defining a cavity in which the MEMS structure is arranged, wherein the covering structure has a first covering layer covering from above the cavity and having a through-hole in communication with the cavity and a second covering layer formed above the first covering layer and closing the through-hole, the first covering layer has a first region located above at least the MEMS structure and a second region located around the first region, the first covering layer is thinner in the first region than in the second region, and a distance between the substrate and the first covering layer in the first region is longer than a distance between the substrate and the first covering layer in the second region. | 05-03-2012 |
20120256692 | OSCILLATOR - An oscillator includes: a substrate; a reference oscillation circuit including a first MEMS oscillator disposed above the substrate, the reference oscillation circuit outputting a first oscillation signal; at least one voltage-controlled oscillation circuit including a second MEMS oscillator disposed above the substrate, the oscillation frequency of the at least one voltage-controlled oscillation circuit being controlled based on a control signal, the at least one voltage-controlled oscillation circuit outputting a second oscillation signal; a frequency division circuit dividing the frequency of the second oscillation signal and outputting a frequency division signal; and a phase-comparison circuit outputting the control signal based on a phase difference between the frequency division signal and the first oscillation signal, wherein the first MEMS oscillator and the second MEMS oscillator each have a first electrode and a second electrode, the second electrode has a movable part disposed so as to face the first electrode. | 10-11-2012 |
20130027146 | MEMS VIBRATOR AND OSCILLATOR - A MEMS vibrator includes: a substrate; a first electrode disposed above the substrate; and a second electrode disposed in a state where at least one portion of the second electrode has a space between the first electrode and the second electrode, and having a beam portion capable of vibrating, in the thickness direction of the substrate, with electrostatic force and a supporting portion supporting one edge of the beam portion and disposed above the substrate, wherein a supporting side face of the supporting portion supporting the one edge has a bending portion which bends in plan view from the thickness direction of the substrate, and the one edge is supported by the supporting side face including the bending portion. | 01-31-2013 |
20140102217 | SENSOR, ELECTRONIC APPARATUS, ROBOT, AND MOBILE OBJECT - A sensor includes a flexible wafer substrate and an oscillator provided on a principal surface of the wafer substrate, and the oscillator deforms when an external force is applied to the wafer substrate. | 04-17-2014 |
20140103778 | VIBRATOR, MANUFACTURING METHOD OF VIBRATOR, ELECTRONIC APPARATUS, AND MOBILE UNIT - A MEMS vibrator includes a wafer substrate, a fixed lower electrode (first electrode) disposed on a principal surface of the wafer substrate, a support member whose one end is fixed to the wafer substrate, and a movable upper electrode (second electrode) joined to the other end of the support member and having a region overlapping the fixed lower electrode with a gap. The support member has a reinforcing region where the thickness of the support member in a thickness direction of the wafer substrate is larger than the thickness of the movable upper electrode in the thickness direction of the wafer substrate. | 04-17-2014 |
20140145551 | VIBRATOR, MANUFACTURING METHOD OF VIBRATOR, ELECTRONIC APPARATUS, AND MOVING OBJECT - A vibrator includes: a vibrating portion; a support portion extended from the vibrating portion; and a fixing portion disposed at the support portion, wherein the support portion includes a first beam portion extending in a first direction from the vibrating portion and a second beam portion extending in a second direction intersecting the first direction. | 05-29-2014 |
20140184018 | VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, MOVING OBJECT, AND METHOD OF MANUFACTURING VIBRATOR - An MEMS vibrator includes a substrate, a fixation section disposed above a principal surface of the substrate, a support section extending from the fixation section, and a vibrating body (an upper electrode) separated from the substrate and supported by the support section in a node part of a vibration, and the vibrating body is a 2n-fold rotationally symmetric body having 2n beams radially extending from a node part of a vibration, wherein n is a natural number. | 07-03-2014 |
20140312734 | VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, MOVING OBJECT, AND METHOD OF MANUFACTURING VIBRATOR - A MEMS vibrator includes a substrate, a lower electrode provided on a main surface of the substrate, a fixed portion provided on the main surface, and an upper electrode which is separated from the substrate and is supported by the fixed portion. The upper electrode is a vibrating body having a region overlapping the lower electrode when the substrate is seen in plan view, and includes a weight portion in a region provided with an antinode portion of vibration of the upper electrode as the vibrating body. | 10-23-2014 |
Patent application number | Description | Published |
20100109815 | MEMS RESONATOR AND MANUFACTURING METHOD OF THE SAME - A method is for manufacturing a microelectromechanical system resonator having a semiconductor device and a microelectromechanical system structure unit formed on a substrate. The method includes: forming a lower electrode of an oxide-nitride-oxide capacitor unit included in the semiconductor device using a first silicon layer; forming, using a second silicon layer, a substructure of the microelectromechanical system structure unit and an upper electrode of the oxide-nitride-oxide capacitor unit included in the semiconductor device; and forming, using a third silicon layer, a superstructure of the microelectromechanical system structure unit and a gate electrode of a complementary metal oxide semiconductor circuit unit included in the semiconductor device. | 05-06-2010 |
20100140734 | Electronic Device and Method for Manufacturing Thereof - An electronic device, including a substrate, a functional structure constituting a functional element formed on the substrate, and a cover structure forming a cavity portion in which the functional structure is disposed, is disclosed. In the electronic device, the cover structure includes a laminated structure of an interlayer insulating film and a wiring layer, the laminated structure being formed on the substrate in such a way that it surrounds the cavity portion, and the cover structure has an upside cover portion covering the cavity portion from above, the upside cover portion being formed with part of the wiring layer that is disposed above the functional structure. | 06-10-2010 |
20110089521 | Electronic Device and Method For Manufacturing Thereof - An electronic device, including a substrate, a functional structure constituting a functional element formed on the substrate, and a cover structure forming a cavity portion in which the functional structure is disposed, is disclosed. In the electronic device, the cover structure includes a laminated structure of an interlayer insulating film and a wiring layer, the laminated structure being formed on the substrate in such a way that it surrounds the cavity portion, and the cover structure has an upside cover portion covering the cavity portion from above, the upside cover portion being formed with part of the wiring layer that is disposed above the functional structure. | 04-21-2011 |
20110121908 | Mems Resonator and Manufacturing Method of the Same - A resonator with a microeletromechanical system structure has a transistor with a gate electrode, a capacitor with an upper and lower electrode, a substrate, a first and second structure of the microelectromechanical system structure, a first silicon layer of the first structure and the upper electrode formed above the substrate, a second silicon layer of the second structure and the gate electrode unit formed above the substrate, and an insulating film formed above the capacitor and the transistor, the insulating film having an opening for placement of the second structure. | 05-26-2011 |
20120012950 | FUNCTIONAL DEVICE AND MANUFACTURING METHOD THEREOF - A functional device includes: a substrate; a functional structure formed on the substrate; a cavity in which the functional structure is disposed; and a cover which covers the cavity, wherein the cover includes a bumpy structure including rib shaped portions, or groove shaped portions, which cross a covering range covering at least the cavity. | 01-19-2012 |