Patent application number | Description | Published |
20100036009 | PROCESS FOR PRODUCING MICROPOROUS POLYMERIC OBJECT, AND MICROPOROUS POLYMERIC OBJECT AND SEPARATION MEMBRANE - A process for producing a microporous polymeric object to improve the degree of freedom for its various properties, compared to conventional processes, includes: mixing a block copolymer made of three or more kinds of segments with a polymer, wherein one or more of the segments are made of monomer units having a first functional group forming ionic and/or hydrogen bond, the segments constitute a co-continuous structure having mutually-independent and continuous regions due to a phase separation based on incompatibility between the segments, and the polymer has, at other than polymer chain terminals, a second functional group forming such bond with the first functional group, thereby allowing the segments to associate with the polymer at many points; forming a co-continuous structure including a region composed of the polymer and the segments due to the phase separation; and removing the polymer from the region by weakening the bond between the functional groups. | 02-11-2010 |
20100120985 | PROCESS FOR PRODUCING POLYMERIC OBJECT HAVING MICROPHASE-SEPARATED STRUCTURE AND POLYMERIC OBJECT HAVING MICROPHASE-SEPARATED STRUCTURE - A process for producing a polymeric object having a microphase-separated structure that can improve the degree of freedom for the structure to be formed is provided. A block copolymer composed of two or more segments and having a first segment composed of a monomer unit having a first functional group capable of forming an ionic bond and/or a hydrogen bond and a second segment incompatible with the first segment, and a polymer having, at other than the terminals of its polymer chain, a second functional group capable of forming an ionic bond and/or a hydrogen bond with the first functional group are mixed. Then, allowing the first segment to be associated with the polymer at many points by an ionic bond and/or a hydrogen bond, the mixture of the copolymer and the polymer is microphase separated. As a result, a polymeric object is formed including a region including the first segment and the polymer that have been associated with each other, and a region including the second segment. | 05-13-2010 |
20100126935 | METHOD OF MEMBRANE SEPARATION AND MEMBRANE SEPARATION APPARATUS - A method of membrane separation and membrane separation apparatus, with which not only a supply liquid can be evaluated but also the problems, such as scale, occurring on reverse osmosis membrane can be monitored in a highly straightforward fashion. There is provided a membrane separation apparatus equipped with reverse osmosis membrane module ( | 05-27-2010 |
20110165449 | BATTERY SEPARATOR AND METHOD FOR PRODUCING THE SAME, AND LITHIUM ION SECONDARY BATTERY AND METHOD OF PRODUCING THE SAME - A battery separator ( | 07-07-2011 |
20120252912 | PROCESS FOR PRODUCING MICROPOROUS POLYMERIC OBJECT, AND MICROPOROUS POLYMERIC OBJECT AND SEPARATION MEMBRANE - A process for producing a microporous polymeric object to improve the degree of freedom for its various properties, compared to conventional processes, includes: mixing a block copolymer made of three or more kinds of segments with a polymer, wherein one or more of the segments are made of monomer units having a first functional group forming ionic and/or hydrogen bond, the segments constitute a co-continuous structure having mutually-independent and continuous regions due to a phase separation based on incompatibility between the segments, and the polymer has, at other than polymer chain terminals, a second functional group forming such bond with the first functional group, thereby allowing the segments to associate with the polymer at many points; forming a co-continuous structure including a region composed of the polymer and the segments due to the phase separation; and removing the polymer from the region by weakening the bond between the functional groups. | 10-04-2012 |
20130037482 | COMPOSITE SEPARATION MEMBRANE AND SEPARATION MEMBRANE ELEMENT USING THE SAME - The present invention provides a composite separation membrane with improved separation performance, particularly with an increased permeation flux. The composite separation membrane of the present invention includes a porous support ( | 02-14-2013 |
20140165837 | METHOD FOR MANUFACTURING CARBON DIOXIDE SEPARATION MEMBRANE, AND CARBON DIOXIDE SEPARATION MEMBRANE - The present invention provides a carbon dioxide separation membrane having a grafted chain into which a substituent having high selective affinity for carbon dioxide is introduced and thus having high carbon dioxide separation capability. The present invention is a method for producing a carbon dioxide separation membrane. This method includes the steps of: (1) irradiating a polymer film with radiation; (2) forming, in the irradiated polymer film, a grafted chain containing a repeating unit of a monomer having a substituent capable of forming a salt with a fluoride ion; and (3) subjecting the substituent capable of forming a salt with a fluoride ion to treatment with a fluoride salt so as to form a salt with a fluoride ion in the substituent. | 06-19-2014 |
Patent application number | Description | Published |
20090311474 | ADHESIVE SHEET FOR WATER JET LASER DICING - An object of the present invention is to provide an adhesive sheet which, through improvement in the permeability of liquids originating in a liquid stream during water jet laser dicing, allows chips, IC components, or the like to be detached, prevents machining precision from being compromised such as by chipping or the scattering of chips and the like, and allows extremely thin semiconductor wafers or materials to be processed. The adhesive sheet for water jet laser dicing of the present invention comprises an adhesive layer laminated on a base film, the base film made of mesh fiber. | 12-17-2009 |
20090314417 | METHOD OF GRINDING BACK SIDE OF SEMICONDUCTOR WAFER AND ADHESIVE SHEET FOR USE IN THE METHOD OF GRINDING BACK SIDE OF SEMICONDUCTOR WAFER - The present invention provides a method of grinding a back side of a semiconductor wafer, which includes applying an adhesive sheet including a substrate and an adhesive layer formed on one side of the substrate to a front side of a semiconductor wafer to provisionally fix the semiconductor wafer to the adhesive sheet, followed by grinding the back side of the semiconductor wafer, in which the adhesive layer contains 100 parts by weight of a base polymer for radiation-curable adhesives, 0.02 to 10 parts by weight of a phosphoric ester compound having an alkyl group having 10 or more carbon atoms, and more than 10 parts by weight but 200 parts by weight or less of at least one polyfunctional acrylate oligomer and/or monomer having one or more carbon-carbon double bonds, the polyfunctional acrylate oligomer and/or monomer having a weight-average molecular weight per carbon-carbon double bond of 250 to 6,500. | 12-24-2009 |
20100028662 | ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR SUBSTRATES - An object of the present invention is to provide a stable adhesive sheet in which the disappearance of the laser-printings prevents almost entirely, without leaving adhesive residue whatsoever during the cut of the substrate. An adhesive sheet for processing semiconductor substrates comprises a UV rays- and/or radiation-transmittable base film and an adhesive layer that undergoes a polymerization curing reaction by means of UV rays and/or radiation, wherein the adhesive layer has a thickness of 7 to 15 μm. | 02-04-2010 |
20100230036 | SUBSTRATE-LESS PRESSURE-SENSITIVE ADHESIVE SHEET FOR PROTECTION OF SEMICONDUCTOR WAFER, METHOD FOR GRINDING BACK SIDE OF SEMICONDUCTOR WAFER USING PRESSURE-SENSITIVE ADHESIVE SHEET, AND METHOD FOR PRODUCING PRESSURE-SENSITIVE ADHESIVE SHEET - The present invention provides a substrate-less pressure-sensitive adhesive sheet for protection of semiconductor wafer, which is to be stuck to a front surface of a semiconductor wafer in grinding a back surface of the semiconductor wafer, the pressure-sensitive adhesive sheet consisting of a pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer is formed of a UV-curable pressure-sensitive adhesive containing a polymer composed mainly of an acrylic monomer polymerizable compound, the pressure-sensitive adhesive force of a surface of the pressure-sensitive adhesive layer to be stuck to the front surface of the semiconductor wafer is larger than the pressure-sensitive adhesive force of the opposite surface thereof, and the pressure-sensitive adhesive layer has an initial elastic modulus of from 0.01 MPa to 500 MPa. | 09-16-2010 |
20110300709 | METHOD OF SEMICONDUCTOR WAFER BACK PROCESSING, METHOD OF SUBSTRATE BACK PROCESSING, AND RADIATION-CURABLE PRESSURE-SENSITIVE ADHESIVE SHEET - The present invention relates to a method of semiconductor wafer back processing, which includes applying a radiation-curable pressure-sensitive adhesive sheet comprising a base film and a pressure-sensitive adhesive layer disposed on one side of the base film to a front side of a semiconductor wafer, the front side of the semiconductor wafer having recesses and protrusions; grinding the back side of the semiconductor wafer in such a state that the radiation-curable pressure-sensitive adhesive sheet is adherent to the front side of the semiconductor; and irradiating the pressure-sensitive adhesive sheet with a radiation to thereby cure the pressure-sensitive adhesive layer, followed by subjecting said ground back side of the semiconductor wafer to a surface treatment; and a radiation-curable pressure-sensitive adhesive sheet for use in the method of semiconductor wafer back processing. | 12-08-2011 |
20120107573 | PRESSURE-SENSITIVE ADHESIVE TAPE FOR BATTERY - The present invention relates to a pressure-sensitive adhesive tape for a battery, containing: a substrate; and a pressure-sensitive adhesive layer laminated on at least one surface of the substrate, in which the pressure-sensitive adhesive layer contains a rubber component in the content of 70 wt % or more, and the rubber component has a weight average molecular weight of 300,000 to 5,000,000, and in which the pressure-sensitive adhesive layer is laminated at an inner portion of 0.5 mm or more from both edges of the substrate, with a thickness of 1 to 25 μm. | 05-03-2012 |
Patent application number | Description | Published |
20140084177 | RADIATION DETECTOR - The radiation detector includes: a housing defining an enclosed space filled with a radiation detection gas; first and second electrodes opposing each other across the enclosed space; insulating materials covering surfaces of the first and second electrodes facing the enclosed space; and a voltage source for applying a voltage to the first and second electrodes, whereby a radiation sensor is formed. The radiation sensor is configured so that: in a radiation detection period, a predetermined voltage is applied between the first and second electrodes, and an electric charge is accumulated on the insulating materials by ions and/or electrons generated by ionization of the gas by incident radiation; and in a radiation measurement time, an electric discharge is caused by applying a reverse bias voltage from that applied to the first and second electrodes in the radiation detection period, and a firing voltage is measured. | 03-27-2014 |
20150214509 | METHOD FOR PRODUCING EL DISPLAY DEVICE AND TRANSFER SUBSTRATE USED IN PRODUCING EL DISPLAY DEVICE - A method for manufacturing an EL display device, in which forming of light-emitting layers includes: preparing transfer substrates, each transfer substrate having a supporting substrate on which a transfer layer including at least red, green, or blue light-emitting material is formed; and performing a transfer process that includes transferring the corresponding transfer layer onto a transfer-target substrate of the EL display device by using the corresponding transfer substrate, each transfer substrate has barrier walls on the supporting substrate thereof, the barrier walls defining openings corresponding to a pixel pattern, and the transfer layer is formed by applying organic material ink to between the barrier walls by an inkjet method, the organic material ink containing the light-emitting material, and the top surface of each of the barrier walls has a protrusion that comes into contact with a corresponding one of banks of the EL display device. | 07-30-2015 |
20150221870 | METHOD FOR PRODUCING EL DISPLAY DEVICE, TRANSFER SUBSTRATE USED IN PRODUCTION OF EL DISPLAY DEVICE, AND METHOD FOR PRODUCING TRANSFER SUBSTRATE USED IN PRODUCTION OF EL DISPLAY DEVICE - A method for manufacturing an EL display device, the EL display device including: a light-emitter emitting light of at least red, green, and blue colors; and a thin-film transistor array device controlling light-emission of the light-emitter, the light-emitter including at least red, green, and blue light-emitting layers arranged within regions partitioned by banks, and being sealed with a sealing layer, the method including: preparing at least three types of transfer substrates corresponding to red, green, and blue colors, each transfer substrate having a supporting substrate on which a transfer layer including at least red, green, or blue light-emitting material is formed by an inkjet method; and when forming the light-emitting layers, repeatedly performing a transfer process that includes transferring the transfer layer onto a transfer-target substrate of the EL display device by using the transfer substrate. | 08-06-2015 |
20150249232 | METHOD FOR PRODUCING EL DISPLAY DEVICE - A method including: forming a thin-film transistor array device that constitutes a pixel circuit; forming light-emitting layers; and after forming a light-emitter by forming the light-emitting layers, sealing the light-emitter entirely. The forming of the light-emitting layers includes: preparing transfer substrates, each transfer substrate having a supporting substrate on which a transfer layer including at least one of red, green, and blue light-emitting materials is formed; and transferring the corresponding transfer layer onto a transfer-target substrate of an EL display device by using the corresponding transfer substrate, and the forming of the light-emitting layers, the sealing, and the forming of the transfer layer of each transfer substrate are performed within an isolation atmosphere for preventing exposure to the air. | 09-03-2015 |