Yun-Lung
Yun-Lung Chen, Taipei Hsien TW
Patent application number | Description | Published |
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20080239646 | BEZEL MOUNTING ASSEMBLY - A bezel mounting assembly includes a chassis ( | 10-02-2008 |
20100172082 | ENCLOSURE FOR ELECTRONIC DEVICE - An enclosure for electronic device, includes a chassis and a cover. The chassis defines an opening. The chassis includes a drive bracket mounted therein. The drive bracket includes a side plate facing the opening. A through hole is defined in the side plate. A rotating member is pivotally mounted on the side plate. The rotating member includes a positioning pin. A data storage device is received in the drive bracket. The data storage device defines a locking hole in alignment with the through hole of the side plate. The cover is mounted on the chassis to cover the opening of the chassis. The cover abuts the rotating member so that the positioning pin is inserted in the through hole and the locking hole to secure the data storage device in the drive bracket of the chassis. | 07-08-2010 |
20110012484 | COMPUTER ENCLOSURE WITH SHIELDING COVER - A computer enclosure includes a rear panel and shielding cover. The rear panel defines a through opening therein. The through opening includes a first edge and a second edge opposite to the first edge. The shielding cover is capable of covering the through opening, and includes a base body, a resilient portion, and first and second flanges located on opposite edges. A clip is located on the first flange. The resilient portion connects the second flange and the base body. A positioning tab is located on the resilient portion. The first edge of the through opening is engageable between the clip and the first flange. The second edge of the through opening is engageable between the tab and the second flange; the resilient portion is resiliently deformable to disengage the second edge of the through opening from between the second flange and the tab. | 01-20-2011 |
Yun-Lung Ho, Miaoli County TW
Patent application number | Description | Published |
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20130068995 | SILICA HAVING METAL IONS ABSORBED THEREON AND FABRICATING METHOD THEREOF - A silica having metal ions absorbed thereon and a fabricating method thereof are provided. The silica having metal ions absorbed thereon is a silica having metal ions absorbed thereon and being modified with persulfate salt. The method includes following steps. A solution is provided, and the solution includes silica and persulfate salt therein. The solution is heated to react the silica with the persulfate salt, so as to obtain silica modified with persulfate salt. Metal ion source is added in the solution, the metal ion source dissociates metal ions, and the silica modified with persulfate salt absorbs the metal ions to obtain the silica having metal ions absorbed thereon. | 03-21-2013 |
Yun-Lung Ho, Miaoli City TW
Patent application number | Description | Published |
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20150129795 | CHEMICAL MECHANICAL POLISHING METHOD USING SLURRY COMPOSITION CONTAINING N-OXIDE COMPOUND - The present disclosure relates to a chemical mechanical polishing (CMP) slurry composition that provides for a high metal to dielectric material selectivity along with a low rate of metal recess formation. In some embodiments, the disclosed slurry composition has an oxidant and an etching inhibitor. The oxidant has a compound with one or more oxygen molecules. The etching inhibitor has a nitrogen-oxide compound. The etching inhibitor reduces the rate of metal and dielectric material (e.g., oxide) removal, but does so in a manner that reduces the rate of dielectric material removal by a larger amount, so as to provide the slurry composition with a high metal (e.g., germanium) to dielectric material removal selectivity and with a low rate of metal recess formation. | 05-14-2015 |
Yun-Lung Huang, Hsinchu City TW
Patent application number | Description | Published |
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20100176515 | CONTACT PAD SUPPORTING STRUCTURE AND INTEGRATED CIRCUIT - The invention provides a contact pad supporting structure. The contact pad supporting structure includes an underlying first conductive plate and an overlying second conductive plate, wherein the first and second conductive plates are separated by a first dielectric layer. A plurality of circular ring-shaped via plug groups comprising a plurality of circular ring-shaped via plugs is through the first dielectric layer, electrically connecting to the first and second conductive plates. All of the circular ring-shaped via plugs of each of the circular ring-shaped via plug groups are disorderly arranged. | 07-15-2010 |