Hung-Wen
Hung Wen Chang US
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20140144295 | ADAPTOR FOR WRENCH DEVICE - A driving wrench device includes an adaptor for engaging with a non-circular compartment of a wrench member, the adaptor includes a non-circular outer peripheral portion for engaging with the non-circular compartment of the wrench member, and the adaptor includes an upper portion having an upper engaging hole, and a bottom portion having a bottom engaging hole communicating with the upper engaging hole of the adaptor, the engaging holes of the adaptor include an inner diameter different from each other for engaging with the fasteners or tool members of different outer diameters. The adaptor includes an outer notch for engaging with a retaining ring of the wrench member. | 05-29-2014 |
Hung Wen Chang, Taichung TW
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20140144295 | ADAPTOR FOR WRENCH DEVICE - A driving wrench device includes an adaptor for engaging with a non-circular compartment of a wrench member, the adaptor includes a non-circular outer peripheral portion for engaging with the non-circular compartment of the wrench member, and the adaptor includes an upper portion having an upper engaging hole, and a bottom portion having a bottom engaging hole communicating with the upper engaging hole of the adaptor, the engaging holes of the adaptor include an inner diameter different from each other for engaging with the fasteners or tool members of different outer diameters. The adaptor includes an outer notch for engaging with a retaining ring of the wrench member. | 05-29-2014 |
Hung Wen Chen, Zhubei City TW
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20140300491 | SYSTEM WITH DISTRIBUTED PROCESS UNIT - The present invention provides a system with a separate computing unit, comprising: a sensing device comprising a power supply unit, a sensing unit configured to sense a user's physiological information, and a first wireless communication unit via which the physiological information that has not yet undergone the computing and processing operations is transmitted externally, the power supply unit electrically connecting and supplying power to the sensing unit and the first wireless communication unit; and a primary computing device comprising a computing unit, a display unit, and a second wireless communication unit, the second wireless communication unit receiving and transmitting the physiological information to the computing unit to undergo the computing operation and informing the user of a result of the computing operation via the display unit; wherein the sensing device transmits, via the first wireless communication unit, a wireless signal to the primary computing device according to a preset criterion. | 10-09-2014 |
20140304317 | SYSTEM WITH DISTRIBUTED PROCESS UNIT - The present invention provides a system with a separate computing unit, comprising: a primary computing device comprising a computing unit, a control interface unit via which a user enters an instruction that causes the computing unit to perform the processing operation or the computing operation to generate an instruction code, and a first wireless communication unit transmitting a first wireless signal containing the instruction code; and a remote control device comprising an instruction implementation unit, and a second wireless communication unit receiving the first wireless signal and sending the instruction code in the first wireless signal to the instruction implementation unit to implement the instruction code; wherein the operation of the instruction implementation unit of the remote control device is controlled by the instruction code. | 10-09-2014 |
Hung-Wen Chang, New Taipei City TW
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20130018231 | DIAPER HAVING A WETNESS DETECTOR, SYSTEM THEREOF AND WETNESS DETECTING METHODAANM HONG; Ruey-ShyanAACI Taoyuan CountyAACO TWAAGP HONG; Ruey-Shyan Taoyuan County TWAANM Chang; Hung-WenAACI New Taipei CityAACO TWAAGP Chang; Hung-Wen New Taipei City TWAANM Chen; Chu-HsuanAACI Hsinchu CityAACO TWAAGP Chen; Chu-Hsuan Hsinchu City TWAANM Lee; Su-JanAACI Taipei CityAACO TWAAGP Lee; Su-Jan Taipei City TWAANM Huang; Biing-ShiunAACI Taipei CityAACO TWAAGP Huang; Biing-Shiun Taipei City TWAANM Lee; Shwn-JenAACI Taipei CityAACO TWAAGP Lee; Shwn-Jen Taipei City TW - A diaper having wetness detectors, a system thereof and a wetness detecting method are adapted to detect the excreting status of an animal. The diaper includes a first set of contacts and a second set of contacts which are constituted by conductive material. The first set of contacts and the second set of contacts are respectively disposed on proximal and distal area of the diaper corresponding to the excretory organ of the animal. A detecting circuit detects the electrical property of the first set of contacts and the second set of contacts and then determines the excretion status of the animal to be a reference for a caregiver. | 01-17-2013 |
Hung-Wen Chang, Taichung City TW
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20140182421 | SOCKET SEPARABLE SPANNER - The present invention is composed of a main body, a rotary ring, a fixing member, and a spring plate. The main body includes a sleeve projecting from a top end of a driving hole and including a guide aperture extending through the driving hole. The rotary ring has a bore rotatably coupled to the sleeve to be rotatable between first and second positions. The bore has an inside surface forming a retention chamber having first and second recessed curved faces. The fixing member is movably received in the guide aperture. The spring plate is arranged between the fixing member and the retention chamber and has one side fixed to the sleeve and a curved section formed between two sides thereof. In the first position, the first recessed curved face positions the curved section. In the second position, the second recessed curved face positions the curved section. | 07-03-2014 |
Hung-Wen Chang, Hsin-Chu TW
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20130210233 | Methods for Particle Reduction in Semiconductor Processing - Methods for removing particles from a wafer for photolithography. A method is provided including providing a semiconductor wafer; attaching a polyimide layer to a backside of the semiconductor wafer; and performing an etch on an active surface of the semiconductor wafer; wherein particles that impinge on the backside during the etch are captured by the polyimide layer. In another method, includes attaching a layer of polyimide film to a backside of a semiconductor wafer; dry etching a material on an active surface of the semiconductor wafer; depositing of an additional layer of material on the active surface of the semiconductor wafer; removing the layer of polyimide film from the backside of the semiconductor wafer; patterning the layer of material using an immersion photolithography process to expose a photoresist on the active surface of the wafer; and repeating the attaching, dry etching, depositing, removing and patterning steps. | 08-15-2013 |
Hung-Wen Chen, Hsinchu County TW
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20140165082 | VIDEO PLAYBACK SYSTEM SUPPORTING GROUP-BASED BILLING MECHANISM AND RELATED COMPUTER PROGRAM PRODUCTS - A video playback system includes a content provider server, first and second video decoders, a playback control server, and first and second mobile communication devices. The first and the second mobile communication devices belong to the same accessing group. The first mobile communication device transmits a first selection message to the playback control server to request the first video decoder to playback a target video provided by the content provider server. The second mobile communication device transmits a second selection message to the playback control server to request the second video decoder to playback the same target video. The content provider server performs a billing process on the basis of the accessing group, so that the first mobile communication device and the second mobile communication device would not be repeatedly charged for the target video. | 06-12-2014 |
20140165117 | VIDEO PLAYBACK SYSTEM WITH MULTIPLE VIDEO DECODERS AND RELATED COMPUTER PROGRAM PRODUCTS - A video playback system with multiple video decoders includes a content provider server for providing video signals of a target video; a first video decoder; a first display for displaying video content outputted from the first video decoder; a second video decoder; a second display for displaying video content outputted from the second video decoder; a playback control server for controlling the first and the second video decoders; and a mobile communication device for transmitting selection messages to the playback control server via internet and then transmitting modification messages to the playback control server via internet. The playback control server opts to utilize the first video decoder to receive a portion of video signals of the target video according t o the selection message, and opts to utilize the second video decoder to receive subsequent video signals of the target video according to the modification message. | 06-12-2014 |
20140165122 | VIDEO PLAYBACK SYSTEM ALLOWING MULTIPLE MOBILE COMMUNICATION DEVICES TO CONTROL THE SAME VIDEO DECODER AND RELATED COMPUTER PROGRAM PRODUCTS - A video playback system includes a content provider server for providing video signals of a first and a second video; a video decoder; a display for displaying video content outputted from the video decoder; a playback control server for controlling the video decoder; a first mobile communication device for transmitting a first selection message to the playback control server via internet at a first time point; and a second mobile communication device for transmitting a second selection message to the playback control server via internet at a second time point. The playback control server utilizes the video decoder to receive video signals of the first video according to the first selection message, and utilizes the video decoder to receive video signals of the second video according to the second selection message after the second time point. | 06-12-2014 |
20140320628 | WIRELESS MULTIMEDIA COMMUNICATION DEVICE - A wireless multimedia communication device includes a shell module, a wireless module, and an energy storage module. The shell module has a waterproof function. The wireless module installed in the shell module has a mobile communication function. The energy storage module installed in the shell module for storing energy. When the wireless module is turned on, the wireless module utilizes the energy to operate. | 10-30-2014 |
20150040153 | TELEVISION BOX AND METHOD FOR CONTROLLING DISPLAY TO DISPLAY AUDIO/VIDEO INFORMATION - The present invention provides a TV box, where the TV box is connected to a display via lined connection or wireless connection, and the TV box includes a control unit, a network interface circuit and an output unit. The control unit connects to a first external server and an audio/video source via the network interface circuit, the control unit obtains a channel list from the first external server, and obtain audio/video information from the audio/video source by referring to a user inputted command and the channel list, where contents of the channel list is allowed to be edited by a user, and the control unit transmits the audio/video information to the display via the output unit. | 02-05-2015 |
Hung-Wen Chen, Hsinchu City TW
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20150117986 | MECHANISMS FOR CHRAGING GAS INTO CASSETTE POD - Embodiments of mechanisms for charging a gas into a cassette pod are provided. A method for charging a gas into a cassette pod includes loading at least one semiconductor wafer into a housing of the cassette pod after the at least one semiconductor wafer is processed by a processing apparatus. The method also includes removing the cassette pod from the processing apparatus by a transporting apparatus to a predetermined destination. The method further includes charging a gas into an enclosure in the housing of the cassette pod from a gas supply assembly disposed on the housing. | 04-30-2015 |
Hung-Wen Chen, Taipei County TW
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20100067238 | NUMERICAL DISPLAY ARCHITECTURE - A numerical display architecture includes a circuit board substrate, a light emitting element, and a reflector. The circuit board substrate includes a first surface and a second surface opposite to the first surface, and has at least one hole. The light emitting element is reversely mounted on the second surface, and a luminary source of the light emitting element is disposed in the hole through a first opening of the hole. The reflector is disposed on the first surface of the circuit board surface and partly or fully covers a second opening of the hole. | 03-18-2010 |
Hung-Wen Chen, Taipei TW
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20090116266 | PARALLELED POWER CONDITIONING SYSTEM WITH CIRCULATING CURRENT FILTER - This present invention relates to a paralleled power conditioning system with circulating current filter, comprising: an input terminal for receiving a input power; a plurality of power conditioning units; and a load. Each power conditioning unit includes: a DC/DC converter coupled to the input for receiving the input power so as to convert the input power to a DC voltage; a DC/AC inverter coupled to the DC/DC converter for converting the DC voltage to a AC voltage; and a filter coupled to the DC/AC inverter for eliminating the noise generated by the AC voltage and the circulating current among the plurality of power conditioning units so as to generate a filter voltage. The load is connected to the plurality of power conditioning units. The plurality of power conditioning units are connected in parallel to the load. | 05-07-2009 |
20090241138 | OPTICAL DISC DRIVE - An optical disc drive including a housing, a fixing part, a flexible flat cable and an electronic component is provided. The fixing part is disposed in the housing. The flexible flat cable is disposed in the housing and includes a first and a second portions. The first portion has a component-disposed region whose backside is in contact with the fixing part. The second portion has a conductive surface, and the second portion is connected with and opposite to the first portion. The component-disposed region is located between the fixing part and the conductive surface. Additionally, the first optical disc drive is disposed on the component-disposed region. | 09-24-2009 |
20120036745 | ELECTRONIC GREETING CARD INTEGRATED WITH PHYSICAL CARRIER AND GREETING CARD BROWSER - An electronic greeting card integrated with a physical carrier is disclosed and includes: a first wireless communication circuit module for wirelessly transceiving a signal associated with data or a command; a first communication software module, when executed, establishing a communication link with an electronic apparatus with a greeting card browser via the first wireless communication circuit module; a greeting card software module for editing, browsing and archiving the digital content, and storing the digital content or the status information back to the electronic greeting card; at least one flash memory for storing programming codes respectively corresponding to the software modules and storing the digital content and status information; a processor for processing the data or command from the first wireless communication circuit module; and a physical carrier for carrying the first wireless communication circuit module, the flash memory and the processor. | 02-16-2012 |
Hung-Wen Cheng, Taipei TW
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20140079042 | Radio Frequency Interference Shield - Examples provide various systems and method associated with intercepting radio frequency interference. In various examples, a wireless integrated circuit module comprises radio frequency connectors. An RF interference shield covers the RF connectors to intercept and ground interference. | 03-20-2014 |
Hung-Wen Cheng, Taipei City TW
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20090014575 | DUAL ROLL-UP WIRE REEL DEVICE WITH RESILIENT POSITIONING - A dual roll-up wife reel device features simultaneous, bi-directional wire roll-up/withdrawal. The wire reel device has a resilient positioning function that effects multi-staged positioning and allows a wire to be wound up and stored in the wire reel device in an organized and managed manner, which ensures optimum and dynamic adjustment of the wire in respect of length control and length management. The wire reel device includes a roll-up disk forming a slide groove having a primary section that selectively accommodate a positioning sphere to set hie device in a secured condition and a bypass section extending from the primary section to allow the positioning sphere to move therein for setting the device in a bypassing released condition. | 01-15-2009 |
20110061982 | IMPROVED STRUCTURE OF SINGLE-PULL COMPOSITE WIRE REEL - A wire reel includes a slide disk that defined centrally an internal cavity for accommodating a coil spring and an upper cavity that receives a rotation-supporting wire in a regular wound condition and also forms a circumferential cavity separated from the internal cavity and receiving a primary wire to wind therearound. A circuit board is arranged and retained between the internal cavity and the upper cavity to electrically and mechanically connect opposing inner ends of the two wires. A housing composed of mated top and bottom covers defines an interior space to rotatably receive the slide disk. The rotation-supporting wire is fixed to an underside of the top cover and is thus fixed with respect to the rotation of the slide disk. A positioning mechanism is provided between the housing and the slide disk for providing a positioning engagement therebetween for each full turn of the slide disk. | 03-17-2011 |
Hung-Wen Chien, Taoyuan City TW
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20130054473 | Secure Payment Method, Mobile Device and Secure Payment System - The invention discloses a secure payment method, a mobile device and a secure payment system. The secure payment method including steps of: transmitting an encrypted payment request packet from a payment service provider to a mobile device; receiving the encrypted payment request packet by a first operating system running within a normal domain of the mobile device; bypassing the encrypted payment request packet to a second operating system running within a secured domain on the mobile device; decrypting payment request data from the encrypted payment request packet under the secured domain; generating payment response data according to the payment request data under the secured domain; encrypting the payment response data into an encrypted payment response packet under the secured domain; bypassing the encrypted payment response packet to the first operating system under the normal domain; and, transmitting the encrypted payment response packet to the payment service provider. | 02-28-2013 |
Hung-Wen Hsu, Hsin-Chu TW
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20120261781 | SIDEWALL FOR BACKSIDE ILLUMINATED IMAGE SENSOR METAL GRID AND METHOD OF MANUFACTURING SAME - The present disclosure provides an image sensor device and a method for manufacturing the image sensor device. An exemplary image sensor device includes a substrate having a front surface and a back surface; a plurality of sensor elements disposed at the front surface of the substrate, each of the plurality of sensor elements being operable to sense radiation projected towards the back surface of the substrate; a radiation-shielding feature disposed over the back surface of the substrate and horizontally disposed between each of the plurality of sensor elements; a dielectric feature disposed between the back surface of the substrate and the radiation-shielding feature; and a metal layer disposed along sidewalls of the dielectric feature. | 10-18-2012 |
Hung-Wen Hsu, Taipei TW
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20090021903 | Notebook computer and module of electronic device combinable with the same - A notebook computer includes a housing, a CPU, a memory, a display, a storage device, a detachable battery pack and a keyboard module. The notebook computer is characterized in that the housing includes a predefined space and a connection interface disposed in the predefined space. The connection interface is electrically connected to the CPU. The notebook computer includes a plurality of electronic device modules. Each electronic device module includes a casing portion and a main body portion, and the main body portion includes a transmission interface. The size of each electronic device module may correspond to the size of the predefined space. Each electronic device module may be secured in the predefined space for combination with the housing, and the transmission interface is electrically connected to the connection interface for power or data transmission. The plurality of electronic device modules are capable of combining individually with the housing for replacing different functions. | 01-22-2009 |
Hung-Wen Hsu, Tainan City TW
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20140065756 | Sidewall for Backside Illuminated Image Sensor Metal Grid and Method of Manufacturing Same - The present disclosure provides an image sensor device and a method for manufacturing the image sensor device. An exemplary image sensor device includes a substrate having a front surface and a back surface; a plurality of sensor elements disposed at the front surface of the substrate, each of the plurality of sensor elements being operable to sense radiation projected towards the back surface of the substrate; a radiation-shielding feature disposed over the back surface of the substrate and horizontally disposed between each of the plurality of sensor elements; a dielectric feature disposed between the back surface of the substrate and the radiation-shielding feature; and a metal layer disposed along sidewalls of the dielectric feature. | 03-06-2014 |
20150069619 | 3DIC Interconnect Apparatus and Method - An interconnect apparatus and a method of forming the interconnect apparatus is provided. Two substrates, such as wafers, dies, or a wafer and a die, are bonded together. A first mask is used to form a first opening extending partially to an interconnect formed on the first wafer. A dielectric liner is formed, and then another etch process is performed using the same mask. The etch process continues to expose interconnects formed on the first substrate and the second substrate. The opening is filled with a conductive material to form a conductive plug. | 03-12-2015 |
20150076646 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A backside illumination semiconductor image sensing device includes a semiconductor substrate. The semiconductor substrate includes a radiation sensitive diode and a peripheral region. The peripheral region is proximal to a sidewall of the backside illumination semiconductor image sensing device. The backside illumination semiconductor image sensing device further includes a first anti reflective coating (ARC) on a backside of the semiconductor substrate and a dielectric layer on the first anti reflective coating. Additionally, a radiation shielding layer is disposed on the dielectric layer. Moreover, the backside illumination semiconductor image sensing device has a photon blocking layer on the sidewall of the of the backside illumination semiconductor image sensing device. The at least a portion of a sidewall of the radiation shielding layer is not covered by the photon blocking layer and the photon blocking layer is configured to block photons penetrating into the semiconductor substrate. | 03-19-2015 |
Hung-Wen Huang, Hsinchu TW
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20080305568 | Method for promoting light emission efficiency of LED using nanorods structure - Method for the light emitting diode (LED) having the nanorods-like structure is provided. The LED employs the nanorods are subsequently formed in a longitudinal direction by the etching method and the PEC method. In addition, the plurality of the nanorods is arranged in an array so that provide the LED having much greater brightness and higher light emission efficiency than the conventional LED. | 12-11-2008 |
20120126262 | ETCHING GROWTH LAYERS OF LIGHT EMITTING DEVICES TO REDUCE LEAKAGE CURRENT - The present disclosure relates to methods for fabricating LEDs by patterning and etching an n-doped epitaxial layer to form regions of roughened surface of the n-doped layer and mesa structures adjacent to the roughened surface regions before depositing an active layer and the rest of the epitaxial layers on the mesa structures. The method includes growing epitaxial layers of an LED including an un-doped layer and an n-doped layer on a wafer of growth substrate. The method also includes patterning the n-doped layer to form a first region of the n-doped layer and a mesa region of the n-doped layer adjacent to the first region. The method further includes etching the first region of the n-doped layer to create a roughened surface. The method further includes growing additional epitaxial layers of the LED including an active layer and a p-doped layer on the mesa region of the n-doped layer. | 05-24-2012 |
Hung-Wen Huang, Taipei TW
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20090020772 | LIGHT-EMITTING DEVICE AND METHOD FOR MAKING THE SAME - A light-emitting device is capable of emitting a light having a wavelength ranging from 300 to 550 nm, and includes: a substrate; a p-type semiconductor layer disposed on the substrate; an active layer disposed on the p-type semiconductor layer; a n-type semiconductor layer disposed on the active layer and having a waveguide-disposing surface; and a waveguide structure formed on the waveguide-disposing surface of the n-type semiconductor layer and having a plurality of spaced apart nanorods extending from the waveguide-disposing surface. | 01-22-2009 |
20150077911 | TECHNIQUES FOR INDICATING AND CHANGING NETWORK COMMUNICATION SETTINGS OF A COMPUTER HOST - A technique for setting network communications for a computer host having multiple network interface controllers (NICs) includes performing network communication for a baseboard management controller (BMC) using a first NIC. In response to actuation of a switch of a network connector jack that is associated with the first NIC, a switching signal is sent from the switch to the BMC. In response to receipt of the switching signal at the BMC, network communication for the BMC is performed using a second NIC. | 03-19-2015 |
Hung-Wen Huang, Hsinchu City TW
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20120012871 | LIGHT EMITTING DEVICE - The present disclosure relates to methods for performing wafer-level measurement and wafer-level binning of LED devices. The present disclosure also relates to methods for reducing thermal resistance of LED devices. The methods include growing epitaxial layers consisting of an n-doped layer, an active layer, and a p-doped layer on a wafer of a growth substrate. The method further includes forming p-contact and n-contact to the p-doped layer and the n-doped layer, respectively. The method further includes performing a wafer-level measurement of the LED by supplying power to the LED through the n-contact and the p-contact. The method further includes dicing the wafer to generate diced LED dies, bonding the diced LED dies to a chip substrate, and removing the growth substrate from the diced LED dies. | 01-19-2012 |
20120032212 | METHOD OF LIGHT EMITTING DIODE SIDEWALL PASSIVATION - A Light-Emitting Diode (LED) includes a light-emitting structure having a passivation layer disposed on vertical sidewalls across a first doped layer, an active layer, and a second doped layer that completely covers at least the sidewalls of the active layer. The passivation layer is formed by plasma bombardment or ion implantation of the light-emitting structure. It protects the sidewalls during subsequent processing steps and prevents current leakage around the active layer. | 02-09-2012 |
20120064642 | METHOD TO REMOVE SAPPHIRE SUBSTRATE - A Light-Emitting Diode (LED) is formed on a sapphire substrate that is removed from the LED by grinding and then etching the sapphire substrate. The sapphire substrate is ground first to a first specified thickness using a single abrasive or multiple abrasives. The remaining sapphire substrate is removed by dry etching or wet etching. | 03-15-2012 |
20120104409 | FORMING LIGHT-EMITTING DIODES USING SEED PARTICLES - A seed layer for growing a group III-V semiconductor structure is embedded in a dielectric material on a carrier substrate. After the group III-V semiconductor structure is grown, the dielectric material is removed by wet etch to detach the carrier substrate. The group III-V semiconductor structure includes a thick gallium nitride layer of at least 100 microns or a light-emitting structure. | 05-03-2012 |
20120129282 | WAFER LEVEL CONFORMAL COATING FOR LED DEVICES - Provided is a method of fabricating a light-emitting diode (LED) device. The method includes providing a wafer. The wafer has light-emitting diode (LED) devices formed thereon. The method includes immersing the wafer into a polymer solution that has a surface tension lower than that of acetic acid. The polymer solution contains a liquid polymer and phosphor particles. The method includes lifting the wafer out of the polymer solution at a substantially constant speed. The method includes drying the wafer. The above processes form a conformal coating layer at least partially around the LED devices. The coating layer includes the phosphor particles. The coating layer also has a substantially uniform thickness. | 05-24-2012 |
20130095581 | THICK WINDOW LAYER LED MANUFACTURE - A LED die and method for bonding, dicing, and forming the LED die are disclosed. In an example, the method includes forming a LED wafer, wherein the LED wafer includes a substrate and a plurality of epitaxial layers disposed over the substrate, wherein the plurality of epitaxial layers are configured to form a LED; bonding the LED wafer to a base-board to form a LED pair; and after bonding, dicing the LED pair, wherein the dicing includes simultaneously dicing the LED wafer and the base-board, thereby forming LED dies. | 04-18-2013 |
20130140592 | LIGHT EMITTING DIODE WITH IMPROVED LIGHT EXTRACTION EFFICIENCY AND METHODS OF MANUFACTURING SAME - A light emitting diode structure and methods of manufacturing the same are disclosed. In an example, a light emitting diode structure includes a crystalline substrate having a thickness that is greater than or equal to about 250 μm, wherein the crystalline substrate has a first roughened surface and a second roughened surface, the second roughened surface being opposite the first roughened surface; a plurality of epitaxy layers disposed over the first roughened surface, the plurality of epitaxy layers being configured as a light emitting diode; and another substrate bonded to the crystalline substrate such that the plurality of epitaxy layers are disposed between the another substrate and the first roughened surface of the crystalline substrate. | 06-06-2013 |
20130187122 | PHOTONIC DEVICE HAVING EMBEDDED NANO-SCALE STRUCTURES - The present disclosure involves a method of fabricating a lighting apparatus. The method includes forming a first III-V group compound layer over a substrate. The first III-V group compound layer has a first type of conductivity. A multiple quantum well (MQW) layer is formed over the first III-V group compound layer. A second III-V group compound layer is then formed over the MQW layer. The second III-V group compound layer has a second type of conductivity different from the first type of conductivity. Thereafter, a plurality of conductive components is formed over the second III-V group compound layer. A light-reflective layer is then formed over the second III-V group compound layer and over the conductive components. The conductive components each have better adhesive and electrical conduction properties than the light-reflective layer. | 07-25-2013 |
20140021483 | Forming Light-Emitting Diodes Using Seed Particles - A seed layer for growing a group | 01-23-2014 |
20150108424 | Method to Remove Sapphire Substrate - A Light-Emitting Diode (LED) is formed on a sapphire substrate that is removed from the LED by grinding and then etching the sapphire substrate. The sapphire substrate is ground first to a first specified thickness using a single abrasive or multiple abrasives. The remaining sapphire substrate is removed by dry etching or wet etching. | 04-23-2015 |
Hung-Wen Huang, Kaohsiung City TW
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20140187863 | Endoscope Controlling Device - An endoscope controlling device includes a rigid tube mounted to an end face of a base and in communication with a compartment in the base. A positioning groove is formed in an inner periphery of the base and includes a bottom wall having a slot. A linear displacement control module includes a control member and a movable board. The control member is aligned with a through-hole in a periphery of the base. The control member controls longitudinal movement of the movable board in the compartment along a longitudinal axis of the base via a driving gear. An optical element receiving drum is mounted to the movable board. A rotational movement control module is mounted around the optical element receiving drum and received in the positioning groove of the base. A portion of the rotational movement control module is extended through the slot and exposed outside of the base. | 07-03-2014 |
Hung-Wen Lee, Taipei City TW
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20110163650 | LAMP TOOL HAVING LIGHT SHIELDING EFFECT - The present invention relates to a lamp tool having light shielding effect, comprises: a lamp housing, in a spherical shape, an inner end and/or an outer end thereof is processed with an etching treatment by a chemical agent so an irregular concave-convex shape is formed on the surface thereof, so that the lamp housing is provided with more projection angles for diffusing lights so as to increase the brightness, and a longitudinal hemisphere of the lamp housing is coated with a metal layer for refracting lights, and the rough surface is served to diffuse lights; an illumination portion disposed in the lamp housing for illumination; and a lamp head connected to the lamp housing and coupled to the illumination portion for being inserted into a lamp seat so the required power is able to be obtained for illumination. So light is able to be diffused by the rough surface and to be refracted by the metal layer. | 07-07-2011 |
20110164420 | DIFFUSION STRUCTURE FOR ILLUMINATION LIGHT SOURCE - The present invention relates to a diffusion structure for illumination light source, comprises: a substrate installed with at least one light emitting diode; a heat dissipating base, the periphery thereof is installed with at least one heat dissipating fin; a lamp head; a lower cover installed with at least one heat dissipating hole; and an upper cover, one end thereof is processed with an etching treatment by a chemical agent so the surface thereof is formed to an irregular concave-convex shape thus the lamp head is provided with more projection angles so as to increase the brightness. With the rough surface of the upper cover, lights emitted by the light emitting diode is able to be diffused, and the heat dissipating fin is disposed in the lower cover so that air can be introduced into the lower cover through the heat dissipating hole for generating convection so as to process heat dissipation to the heat dissipating fin, and users are prevented from being hurt by touching the heat dissipating fin. | 07-07-2011 |
20110199001 | LED ILLUMINATION DEVICE - The present invention relates to a LED illumination device, capable of being combined with a fluorescent lamp, comprises a connector; a substrate capable of being clamped on a lamp tube; a plurality of light emitting diodes; a driving member; and a rectifying and stabilizing member. With the mentioned structure of the LED illumination device, the LED illumination device is able to be directly fastened on the lamp tube of existed fluorescent lamp, for providing LED illumination and lowering replacement cost and increasing replacement convenience. | 08-18-2011 |
20120256008 | PATTERNED MARKER FOR ENCODING - A patterned marker for encoding comprises an inner pattern and an outer pattern. The inner pattern is divided into a plurality of first areas. The outer pattern is disposed around the inner pattern and divided into a plurality of second areas. At least one of the first areas is different from at least one of the second areas in color. The patterned marker has encoding function. | 10-11-2012 |
20120277635 | BODY MOTION STAFF, PRODUCING MODULE, IMAGE PROCESSING MODULE AND MOTION REPLICATION MODULE - A body motion staff is an image constructed by encoding the member motion information which is obtained from the plural motion images taken over the motion of a multi-member body by a three-dimensional motion capturing apparatus. The member includes a link or a joint of the multi-member body. | 11-01-2012 |
20120307021 | DUAL-MODE OPTICAL MEASUREMENT APPARATUS AND SYSTEM - A dual-mode 3D optical measurement apparatus is applied to scan at least one object or capture the motion of at least one object. The optical measurement apparatus includes a light-projection unit, a plurality of marker units, and an image-capturing unit. The light-projection unit projects light on the object. The marker units are disposed at the object. When the dual-mode 3D optical measurement apparatus executes a static scan mode, the light-projection unit projects light on the surface of the static object, and then the image-capturing unit captures a plurality of static images of the object. When the dual-mode 3D optical measurement apparatus executes a motion capture mode, the image-capturing unit captures a plurality of motion images of the marker units. In addition, a dual-mode 3D optical measurement system is also disclosed. | 12-06-2012 |
20130069936 | FEATURE-BASED DATA STRUCTURE FOR DIGITAL MANIKIN - A feature-based data structure of a digital manikin for describing the exterior features of a body comprises a plurality of feature points of the body, a plurality of girth lines, and a plurality of meridian lines. The girth lines pass through the feature points. Each of the meridian lines is formed by connecting the corresponding feature points respectively out of the girth lines. The girth lines of an arm of the body include an arm-hole girth, an elbow girth, and a palm base girth. The arm-hole girth passes through the shoulder end point, the front arm pit, and the rear arm pit. The elbow girth passes through the concave and convex points on the elbow girth. The palm base girth means the location where the size variation of the cross-sectional profile from the fore arm to the palm is the largest. | 03-21-2013 |
Hung-Wen Lee, Changhua TW
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20130321933 | IMAGING LENS APPARATUS - An imaging lens apparatus comprises two lenses with refractive function, from the object side to the image side: a first lens which is a positive meniscus lens with a convex object-side surface, an aperture; and a second lens which is a negative meniscus lens with a concave object-side lens. Both surfaces of said first and second lens are aspheric, and the imaging lens apparatus satisfy the following equations: 1.3512-05-2013 | |
Hung-Wen Lee, Changhua Hsien TW
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20130335836 | IMAGING LENS APPARATUS - An imaging lens apparatus comprises four lenses with refractive power by which lead the light from the object side to the image side: a first lens with a convex object-side surface and positive refractive power, at least one surface of the first lens is aspheric; an aperture stop set next to the first lens; a second lens which is a biconcave lens with negative refractive power, at least one surface of the second lens is aspheric; a third lens which is a positive meniscus lens with a concave object-side surface, both side of the third lens are aspheric; and a fourth lens which is a negative meniscus lens with a convex object-side surface, both side of the fourth lens are aspheric with at least one inflection point; and the imaging lens apparatus satisfy the conditions below: |1/slope_S8|>0.9; −0.2 12-19-2013 | |
Hung-Wen Lee, Chu Pei City TW
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20090213620 | Lamp with Shunt Compression Spring - A lamp with shunt compressing spring has a socket, two electrodes, a shunt compression spring, an insulating casing, a sliding lid, a bulb holder and a bulb. The shunt compression spring is mounted in the socket and has two electric contacting ends contacting selectively and respectively with the electrodes. The insulating casing covers the shunt compression spring and has a first and a second through openings respectively exposing the electric contacting ends of the shunt compression spring. The sliding lid connects movably to the insulating casing, corresponds to the first through opening of the insulating casing and exposes the corresponding electric contacting end of the shunt compression spring. The bulb holder has a protrusion pressing the sliding lid to compress the shunt compression spring and keep the electric contacting end of the shunt compression spring exposing through the sliding lid from contacting with the corresponding electrode. | 08-27-2009 |
Hung-Wen Lee, Taichung TW
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20140313594 | WIDE-ANGLE IMAGING LENS ASSEMBLY WITH FIVE LENSES - An imaging lens assembly comprises a fixing diaphragm and an optical set including five lenses. An arranging order from an object side to an image side is: a first lens; the fixing diaphragm; a second lens; a third lens; a fourth lens; and a fifth lens. At least one surface of the five lenses is aspheric. By the concatenation between the lenses and the adapted curvature radius, thickness/interval, refractivity, and Abbe numbers, the assembly attains a big diaphragm with wide-angle, a shorter height, and a better optical aberration. | 10-23-2014 |
Hung-Wen Lee, Taichung City TW
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20150109686 | IMAGING LENS ASSEMBLY - An imaging lens assembly includes first, second, third and fourth optical lens elements that are arranged sequentially from an object side to an image side along an optical axis and that respectively have negative, positive, positive and negative refractive powers, and a fixed aperture stop that is disposed between the first and second optical lens elements. The fourth optical lens element has object-side surface and an image-side surface that has at least an inflection point. The imaging lens assembly satisfies the optical condition of 1.804-23-2015 | |
20150205073 | FIVE-PIECE LENS SET FOR CAPTURING IMAGES - The invention discloses a five-piece lens set for capturing images. The lens set comprises a five-piece optical lens. In order from an object side toward an image side, the five-piece optical lens comprises a first lens element with positive refractive power having a convex image-side surface; a second lens element having a convex object-side surface, and at least one of both surfaces thereof being aspheric; a third lens element with positive refractive power having a concave image-side surface, and having one inflection point that is located away from the optical axis; a fourth lens element with positive refractive power, and at least one of both surfaces thereof being aspheric; a fifth lens element having a convex object-side surface and having two inflection points not closed to an optical axis on the object-side surface. The five-piece lens set further comprises an aperture stop and an image-plane. | 07-23-2015 |
Hung-Wen Lee, Cerritos, CA US
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20100200527 | LUG WRENCH MERCHANDIZING DISPLAY RACK - A merchandising rack for displaying a plurality of four-way lug wrenches is described, comprising, a plurality of ribs connected to each other; a plurality of upward support elements, for restraining a four-way lug wrench from moving downwardly and laterally; and a plurality of downward support elements, for restraining a first arm of the wrench from moving upwardly, laterally, and from moving away from the rack; and a plurality of stubs positioned to restrain the wrench from rotating about an axis extending along the first arm of the wrench. | 08-12-2010 |
Hung-Wen Lin, Taichung City TW
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20140148280 | JOINTED BAT - A jointed bat includes a barrel, a handle, and a glue. The barrel is tubular and has one end fixedly connected to a top cap and the other end having a tapered first joint portion. An opening is formed at the end of the first joint portion. The handle is tubular and has one end fixedly connected to a knob and the other end having a tapered resilient second joint portion. At least a relief slit is formed at an end of the second joint portion. A dam protrudes from the second joint portion and abuts against an inner wall of the first joint portion. The second joint portion penetrates the opening to fit inside the first joint portion. The glue is filled between and fixedly connected between the first and second joint portions. Therefore, requirements for precision in production of the barrel and the handle are reduced. | 05-29-2014 |
Hung-Wen Lin, Taichung TW
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20120140453 | DRIVING SHAFT MECHANISM FOR RATCHET WRENCH - A driving shaft mechanism for a ratchet wrench is disclosed. The driving shaft mechanism is built as a spindle assembly of the ratchet wrench and has a lighting device for offering direct lighting to an operating area of the ratchet wrench. The spindle assembly prevents the lighting from being accidentally turned off when a user operates the ratchet wrench by virtue of screwing or unscrewing motions between a spindle cap and a containing part so as to allow the spindle cap to movably press on or depart from a switch controlling a switching circuit electrically connected with a lamp, and further to create a close circuit or an open circuit of the switching circuit, thus turning on or off the lamp. | 06-07-2012 |
Hung-Wen Lin, Taoyuan County TW
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20140160641 | ELECTRONIC APPARATUS - An electronic apparatus including a housing, a touch-sensing module and a controller is provided. The touch-sensing module is embedded in the housing and includes a plurality of conductive sheets and an insulation material. The insulation material is combined with and electrically insulated from the conductive sheets. The controller is connected to the touch-sensing module, so as to identify the touch-sensing event occurring at the conductive sheets. | 06-12-2014 |
20150130974 | CAMERA ASSEMBLY AND ELECTRONIC DEVICE - A camera assembly, including at least one holder, at least one camera module, and a buffer material, is provided. The holder includes at least one accommodating recess. The camera module is disposed in the accommodating recess, and a gap exists between the camera module and a sidewall of the accommodating recess. The buffer material is filled in the gap to position the camera module in the accommodating recess of the holder. Further, an electronic device including a housing and the camera assembly aforementioned is provided. | 05-14-2015 |
20150138434 | ELECTRONIC DEVICE - An electronic device including a housing, a support member, and a camera module is provided. The housing has a bump. The bump extends toward the outside of the electronic device and correspondingly forms a recess on the inside of the housing. The support member includes a chassis and a holder. The chassis is disposed inside the housing. The holder includes a body, an accommodation recess located on the body and facing the recess, and a skirt extending outwardly from a side of the accommodation recess. The holder is supported against the chassis through the skirt. The camera module is disposed inside the accommodation recess, and a portion of the camera module protrudes outside the accommodation recess, wherein the protruding portion is located in the recess, and the support member is located outside the recess, such that a sidewall of the recess faces and surrounds the camera module. | 05-21-2015 |
20150200063 | SWITCH STRUCTURE AND ELECTRONIC DEVICE USING THE SAME - A switch structure and an electronic device using the same are provided. The electronic device has a casing, and the switch structure is disposed at an inner side of the key portion of the casing. The switch structure includes an elastic member, a force transmission member and a strain sensor. The elastic member is connected to the casing. The force transmission member is located inside the casing. The strain sensor is disposed on the elastic member, and the strain sensor and the force transmission member are disposed are two opposite sides of the elastic member respectively. The elastic member is configured to be deformed by the force transmission member when an external force is applied to an outside of the key portion. | 07-16-2015 |
Hung-Wen Lin, Taoyuan City TW
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20150212558 | ELECTRONIC DEVICE - An electronic device including a case having a space, a circuit board disposed in the space, a heat source disposed on the circuit board and a vapor chamber disposed at a side of the circuit board and adjacent to the heat source is provided. The vapor chamber includes an upper sheet, a bottom sheet assembled with the upper sheet to form a chamber, and a working fluid disposed in the chamber. | 07-30-2015 |
Hung-Wen Lu, Pingjhen City TW
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20080315966 | OSCILLATOR - An oscillation circuit induces a first inverter, a second inverter, a first inductive load, a second inductive load and a capacitive load. A first inverter and a second inverter receive a first signal and a second signal, and invert the first and the second signal to output a first inverted signal and a second inverted signal respectively. An output end of the first inverter is electrically connected to a first inductive load, and an output end of the second inverter is electrically connected to a second inductive load. Further, a capacitive load is electrically connected to the output end of the first inverter and the output end of the second inverter, so as to receive the first and the second inverted signal respectively. The capacitance of the capacitive load changes with a control signal. | 12-25-2008 |
20090167399 | SIGNAL DELAY CIRCUIT - A signal delay circuit including a capacitive load element is described. The capacitive load element has a first input end, a second input end, and a third input end. The first input end receives a first signal, the second input end receives a second signal inverted to the first signal, and the third input end receives a control signal. The capacitance of the capacitive load element changes with the control signal. | 07-02-2009 |
Hung-Wen Su, Jhubei TW
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20090017624 | Nodule Defect Reduction in Electroless Plating - An electroless plating method and the apparatus for performing the same are provided. The method includes providing a plating solution; contacting a front surface of the wafer with the plating solution; and incurring a plating reaction substantially simultaneously on an entirety of the front surface of the wafer. The step of incurring a plating reaction substantially simultaneously includes lift-dispense electroless plating and face-down immersion. | 01-15-2009 |
Hung-Wen Su, Jhubei City TW
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20120319278 | GAP FILLING METHOD FOR DUAL DAMASCENE PROCESS - The present disclosure provides a method of fabricating a semiconductor device. The method includes forming a patterned dielectric layer having a plurality of first openings. The method includes forming a conductive liner layer over the patterned dielectric layer, the conductive liner layer partially filling the first openings. The method includes forming a trench mask layer over portions of the conductive liner layer outside the first openings, thereby forming a plurality of second openings, a subset of which are formed over the first openings. The method includes depositing a conductive material in the first openings to form a plurality of vias and in the second openings to form a plurality of metal lines. The method includes removing the trench mask layer. | 12-20-2012 |
20130127055 | MECHANISMS OF FORMING DAMASCENE INTERCONNECT STRUCTURES - The mechanisms of forming an interconnect structures described above involves using a reflowed conductive layer. The reflowed conductive layer is thicker in smaller openings than in wider openings. The mechanisms may further involve forming a metal cap layer over the reflow conductive layer, in some embodiments. The interconnect structures formed by the mechanisms described have better electrical and reliability performance. | 05-23-2013 |
20140035143 | METHOD OF REDUCING CONTACT RESISTANCE OF A METAL - A structure for an integrated circuit with reduced contact resistance is disclosed. The structure includes a substrate, a cap layer deposited on the substrate, a dielectric layer deposited on the cap layer, and a trench embedded in the dielectric layer. The trench includes an atomic layer deposition (ALD) TaN or a chemical vapor deposition (CVD) TaN deposited on a side wall of the trench, a physical vapor deposition (PVD) Ta or a combination of the PVD Ta and a PVD TaN deposited on the ALD TaN or CVD TaN, and a Cu deposited on the PVD Ta or the combination of the PVD Ta and the PVD TaN deposited on the ALD TaN or the CVD TaN. The structure further includes a via integrated into the trench at bottom of the filled trench. | 02-06-2014 |
20140203437 | Method Of Semiconductor Integrated Circuit Fabrication - A method of fabricating a semiconductor integrated circuit (IC) is disclosed. The method includes providing a substrate. A patterned adhesion layer is formed on the substrate. A metal layer is deposited on the patterned adhesion layer. An elevated temperature thermal process is applied to agglomerate the metal layer to form a self-forming-metal-feature (SFMF) and a dielectric layer is deposited between SFMFs. | 07-24-2014 |
20140251814 | Electro-Plating and Apparatus for Performing the Same - A method of plating a metal layer on a work piece includes exposing a surface of the work piece to a plating solution, and supplying a first voltage at a negative end of a power supply source to an edge portion of the work piece. A second voltage is supplied to an inner portion of the work piece, wherein the inner portion is closer to a center of the work piece than the edge portion. A positive end of the power supply source is connected to a metal plate, wherein the metal plate and the work piece are spaced apart from each other by, and are in contact with, the plating solution. | 09-11-2014 |
20140262797 | Electro Chemical Plating Process - The present disclosure relates to an electro-chemical plating (ECP) process which utilizes a dummy electrode as a cathode to perform plating for sustained idle times to mitigate additive dissociation. The dummy electrode also allows for localized plating function to improve product gapfill, and decrease wafer non-uniformity. A wide range of electroplating recipes may be applied with this strategy, comprising current plating up to approximately 200 Amps, localized plating with a resolution of approximately 1 mm, and reverse plating to remove material from the dummy electrode accumulated during the dummy plating process and replenish ionic material within the electroplating solution. | 09-18-2014 |
20140262800 | Electroplating Chemical Leveler - Presented herein is a method of processing a device, comprising providing an electroplating bath having a leveler, the leveler having a total nitrogen-to-total carbon (TN/TOC) ratio of about 15% or less, bringing a substrate into contact with the electroplating bath, the substrate having a recess formed therein and electroplating the substrate to create a feature substantially free of voids in the substrate recess. Electroplating the substrate is performed for a time period about as long as an electrical response peak of the leveler, and optionally for at least 30 seconds. The leveler may optionally have at least one ingredient free of nitrogen and having a leveling functionality. One ingredient may be a benzene ring free of nitrogen. The leveler TN/TOC ratio is between about 3% and about 15%. | 09-18-2014 |
20140264475 | MEMS DEVICE STRUCTURE WITH A CAPPING STRUCTURE - An integrated circuit device includes a dielectric layer disposed over a semiconductor substrate, the dielectric layer having a sacrificial cavity formed therein, a membrane layer formed onto the dielectric layer, and a capping structure formed on the membrane layer such that a second cavity is formed, the second cavity being connected to the sacrificial cavity though a via formed into the membrane layer. | 09-18-2014 |
20140264864 | INTEGRATED CIRCUIT STRUCTURE AND FORMATION - One or more integrated circuit structures and techniques for forming such integrated circuit structures are provided. The integrated circuit structures comprise a conductive structure that is formed within a trench in a dielectric layer on a substrate. The conductive structure is formed over a barrier layer formed within the trench, or the conductive structure is formed over a liner formed over the barrier layer. At least some of the dielectric layer, the barrier layer, the liner and the conductive structure are removed, for example, by chemical mechanical polishing, such that a step height exists between a top surface of the substrate and a top surface of the dielectric layer. Removing these layers in this manner removes areas where undesired interlayer peeling is likely to occur. A conductive cap is formed on the conductive structure. | 09-18-2014 |
20140264866 | CHEMICAL DIRECT PATTERN PLATING INTERCONNECT METALLIZATION AND METAL STRUCTURE PRODUCED BY THE SAME - A semiconductor structure with an improved metal structure is described. The semiconductor structure can include a substrate having an upper surface, an interconnect layer over the upper surface, and an additional structure deposited over the interconnect layer. The interconnect layer can include a patterned seed layer over the substrate, at least two metal lines over the seed layer, and a dielectric material between adjacent metal lines. A barrier layer can be deposited over the at least two metal lines. Methods of making the semiconductor structures are also described. | 09-18-2014 |
20140264867 | METHOD OF FORMING HYBRID DIFFUSION BARRIER LAYER AND SEMICONDUCTOR DEVICE THEREOF - In a method of fabricating a semiconductor device, an opening is formed inside a dielectric layer above a semiconductor substrate. The opening has a wall. At least one diffusion barrier material is then formed over the wall of the opening by at least two alternating steps, which are selected from the group consisting of a process of physical vapor deposition (PVD) and a process of atomic layer deposition (ALD). A liner layer is formed over the at least one diffusion barrier material. | 09-18-2014 |
20140264920 | Metal Cap Apparatus and Method - Presented herein is a method for electrolessly forming a metal cap in a via opening, comprising bringing a via into contact with metal solution, the via disposed in an opening in a substrate, and forming a metal cap in the opening and in contact with the via, the metal cap formed by an electroless chemical reaction. A metal solution may be applied to the via to form the metal cap. The metal solution may comprises at least cobalt and the cap may comprise at least cobalt, and may optionally further comprise tungsten, and wherein the forming the cap comprises forming the cap to further comprise at least tungsten. The metal solution may further comprise at least hypophosphite or dimethlyaminoborane. | 09-18-2014 |
20140273470 | Stress-Controlled Formation of Tin Hard Mask - Disclosed is a method to form a titanium nitride (TiN) hard mask in the Damascene process of forming interconnects during the fabrication of a semiconductor device, while the type and magnitude of stress carried by the TiN hard mask is controlled. The TiN hard mask is formed in a multi-layered structure where each sub-layer is formed successively by repeating a cycle of processes comprising TiN and chlorine PECVD deposition, and N | 09-18-2014 |
20140277681 | SYSTEMS AND METHODS OF COMPENSATING FOR FILLING MATERIAL LOSSES IN ELECTROPLATING PROCESSES - A computer-implemented system and method of compensating for filling material losses in a semiconductor process. The computer-implemented method includes determining using a computer a pattern density difference between a first circuit pattern above a semiconductor substrate and a second circuit pattern adjacent to the first pattern. A dummy pattern is inserted between the first pattern and the second pattern so as to compensate for an estimated loss of filling material induced during electrochemical plating by the pattern density difference exceeding a threshold pattern density difference. | 09-18-2014 |
20150108649 | METHOD OF FORMING HYBRID DIFFUSION BARRIER LAYER AND SEMICONDUCTOR DEVICE THEREOF - In a method of fabricating a semiconductor device, an opening is formed inside a dielectric layer above a semiconductor substrate. The opening has a wall. At least one diffusion barrier material is then formed over the wall of the opening by at least two alternating steps, which are selected from the group consisting of a process of physical vapor deposition (PVD) and a process of atomic layer deposition (ALD). A liner layer is formed over the at least one diffusion barrier material. | 04-23-2015 |
20150187579 | STRESS-CONTROLLED FORMATION OF TiN HARD MASK - A method to form a titanium nitride (TiN) hard mask in the Damascene process of forming interconnects during the fabrication of a semiconductor device, while the type and magnitude of stress carried by the TiN hard mask is controlled. The TiN hard mask is formed in a multi-layered structure where each sub-layer is formed successively by repeating a cycle of processes comprising TiN and chlorine PECVD deposition, and N | 07-02-2015 |
Hung-Wen Tsai, Taichung City TW
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20140273402 | METHOD FOR CUTTING WAFER - A method for cutting wafers includes following steps. A silicon wafer is provided. A metal layer is formed on a top side of the silicon wafer. A bump layer is formed on the metal layer. A backside grinding tape is attached on the bump layer. A bottom side of the silicon wafer is half cut to form a cutting race. The bottom side of the silicon wafer is ground, so that a thickness of the silicon wafer is a predetermined thickness and only partial cutting race remains. The backside grinding tape is removed. A dicing tape is attached on the bottom side of the silicon wafer. The metal layer is cut by a laser. The metal layer is communicated with the cutting race. The manufacturing cost is reduced without crumbling or cracking. The chippings on the top or bottom side of the silicon wafer can be removed. | 09-18-2014 |
Hung-Wen Yang, Hsinchu City TW
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20090262688 | RATE ADAPTATION METHODS FOR WIRELESS COMMUNICATION APPARATUS, AND WIRELESS COMMUNICATION APPARATUS FOR PERFORMING WIRELESS COMMUNICATION WITH RATE ADAPTATION - A rate adaptation method for a wireless communication apparatus includes: determining whether to use a first mode or a second mode according to at least one estimation value, where the first mode and the second mode correspond to different values of an overall data rate of the wireless communication apparatus. A wireless communication apparatus for performing wireless communication with rate adaptation includes: a processing circuit; and a wireless receiver and a wireless transmitter, both coupled to the processing circuit. The processing circuit determines at least one estimation value regarding communication quality of the wireless communication apparatus, and further determines whether to use a first mode or a second mode according to the estimation value, where the first mode and the second mode correspond to different values of an overall data rate of the wireless communication apparatus. | 10-22-2009 |
Hung-Wen Yu, Chung-Ho City TW
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20100103675 | LED LAMP HAVING A LOCKING DEVICE - A LED lamp having a locking device includes a lamp housing, a heat-sink, a locking device and a LED light-emitting module. The lamp housing has a cylinder. The heat-sink is formed with an annular wall. The locking device comprises a first thread formed at an outer periphery of the cylinder, a hook extending from one end of the cylinder, a second thread formed in the inner wall of the annular wall and threadedly connected with the first thread, and a groove defined on the annular wall and locked with the hook. The LED light-emitting module is placed in the heat-sink and connected to an end of the heat-sink away from the lamp housing. By the above arrangement, a secure and firm connection between the lamp housing and the heat-sink can be achieved. | 04-29-2010 |
Hung-Wen Yu, Taipei TW
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20080294646 | DATA DISTRIBUTING AND ACCESSING METHOD AND SYSTEM - A data distributing and accessing method for sharing a file via a network system includes steps of: dividing the file into a plurality of blocks; distributing the blocks in a plurality of data hosts interconnected via the network system; one of the data hosts receiving a file-reading request from a user host and issuing collecting requests to other data hosts to collect the blocks from the data hosts; and transferring the collected blocks from the data hosts to the user host to be combined into the file. | 11-27-2008 |