Patent application number | Description | Published |
20080227235 | Sensor Component And Method For Producing A Sensor Component - A device for detecting a measured quantity has a sensor chip for detecting the measured quantity, a supply for providing a power supply, and an injection-molded enclosure for accommodating the sensor chip and the supply, the injection-molded enclosure including integrated conductive traces providing an electrical connection between the sensor chip and the supply. | 09-18-2008 |
20100301434 | MEMS Devices and Methods of Manufacture Thereof - Micro-electromechanical system (MEMS) devices and methods of manufacture thereof are disclosed. In one embodiment, a MEMS device includes a first semiconductive material and at least one trench disposed in the first semiconductive material, the at least one trench having a sidewall. An insulating material layer is disposed over an upper portion of the sidewall of the at least one trench in the first semiconductive material and over a portion of a top surface of the first semiconductive material proximate the sidewall. A second semiconductive material or a conductive material is disposed within the at least one trench and at least over the insulating material layer disposed over the portion of the top surface of the first semiconductive material proximate the sidewall. | 12-02-2010 |
20120164774 | Methods of Manufacture MEMS Devices - Micro-electromechanical system (MEMS) devices and methods of manufacture thereof are disclosed. In one embodiment, a MEMS device includes a first semiconductive material and at least one trench disposed in the first semiconductive material, the at least one trench having a sidewall. An insulating material layer is disposed over an upper portion of the sidewall of the at least one trench in the first semiconductive material and over a portion of a top surface of the first semiconductive material proximate the sidewall. A second semiconductive material or a conductive material is disposed within the at least one trench and at least over the insulating material layer disposed over the portion of the top surface of the first semiconductive material proximate the sidewall. | 06-28-2012 |
Patent application number | Description | Published |
20080211639 | DOMESTIC APPLIANCE ARRANGEMENT - Domestic appliance arrangement having a domestic appliance, which can communicate in accordance with a domestic appliance communication protocol, and an interface coupling device which is coupled to the domestic appliance. The interface coupling device includes a first interface, which provides communication in accordance with the domestic appliance communication protocol, a second interface, which provides communication in accordance with a semantic communication protocol, and a protocol conversion unit for mapping data encoded in accordance with the domestic appliance communication protocol onto data which encoded in accordance with the semantic communication protocol and/or for mapping data encoded in accordance with the semantic communication protocol onto data encoded in accordance with the domestic appliance communication protocol. The semantic communication protocol can be used to detect a domestic appliance connected to the interface coupling device and to semantically describe properties of the domestic appliance connected to the interface coupling device. | 09-04-2008 |
20090084181 | INTEGRALLY FABRICATED MICROMACHINE AND LOGIC ELEMENTS - Embodiments of the invention are related to micromachine structures. In one embodiment, a micromachine structure comprises a first electrode, a second electrode, and a sensing element. The sensing element is mechanically movable and is disposed intermediate the first and second electrodes and adapted to oscillate between the first and second electrodes. Further, the sensing element comprises a FinFET structure having a height and a width, the height being greater than the width. | 04-02-2009 |
20090218912 | Bulk Acoustic Wave Device with a Semiconductor Layer - A bulk acoustic wave device includes a first electrode, a second electrode, a piezoelectric layer arranged between the first and second electrodes and a semiconductor layer arranged between the first and second electrodes. The semiconductor layer is electrically isolated from the first electrode. | 09-03-2009 |
20120061777 | INTEGRALLY FABRICATED MICROMACHINE AND LOGIC ELEMENTS - Embodiments relate to micromachine structures. In one embodiment, a micromachine structure includes a first electrode, a second electrode, and a sensing element. The sensing element is mechanically movable and is disposed intermediate the first and second electrodes and adapted to oscillate between the first and second electrodes. Further, the sensing element includes a FinFET structure having a height and a width, the height being greater than the width. | 03-15-2012 |