Patent application number | Description | Published |
20150098135 | WIDE ANGLE OPTICAL LENS SYSTEM - A wide angle optical lens system includes an aperture stop and an optical assembly, the optical assembly includes, in order from the object side to the image side: a first lens element with a negative refractive power; a second lens element with a positive refractive power; a third lens element with a negative refractive power; a fourth lens element with a refractive power; a fifth lens element with a positive refractive power; a sixth lens element with a negative refractive power, wherein a focal length of the wide angle optical lens system is f, a focal length of the fifth lens element is f5, a radius of curvature of an object-side surface of the third lens element is R5, a radius of curvature of an image-side surface of the third lens element is R6, the following conditions are satisfied: 1.004-09-2015 | |
20150131170 | IMAGING OPTICAL LENS ASSEMBLY - An imaging optical lens assembly includes an aperture stop and an optical assembly, the optical assembly includes, in order from the object side to the image side: a first lens element with a positive refractive power; a second lens element with a refractive power; a third lens element with a refractive power; a fourth lens element with a refractive power; a fifth lens element with a negative refractive power having an image-side surface being convex near an optical axis; wherein the image-side surface of the fifth lens element is formed with at least two inflection points, including a first inflection point and a second inflection point further away from the optical axis, a vertical distance from the first inflection point to the optical axis is Y_inf1, a vertical distance from the second inflection point to the optical axis is Y_inf2, satisfying: 1.705-14-2015 | |
Patent application number | Description | Published |
20130083275 | DISPLAY MODULE - A display module is provided, which includes a display panel and an ESD protection member. The display panel includes a rear substrate, a front substrate, a front color filter, and an electrical connection layer. The front substrate is stacked on the rear substrate and includes a manifesting area and a perimeter area surrounding the display area. The front color filter is relative to the manifesting area and is disposed on the front surface of the front substrate. The electrical connection layer is relative to the manifesting area and the perimeter area and is sandwiched between the front color filter and the front substrate. The ESD protection member, a flexible printed circuit, is connected to the electrical connection layer and is electrically grounded. | 04-04-2013 |
20140362539 | DISPLAY DEVICE - A display device comprises a display panel, a carrying member, a plurality of circuit connecting boards, a control circuit board and at least a front frame member. The carrying member carries the display panel. The circuit connecting boards are disposed adjacent to the carrying member and physically and electrically connected to the display panel. The shortest distance between the two adjacent circuit connecting boards is between 0.1 mm and 20 mm. The control circuit board is disposed adjacent to the carrying member and electrically connected to the circuit connecting boards, and electrically connected to the display panel through the circuit connecting boards. The front frame member is disposed at the outer edge of the carrying member and connected to the carrying member, and includes a turning portion and an extending portion. The thickness of the turning portion is greater than that of the extending portion. | 12-11-2014 |
Patent application number | Description | Published |
20120098003 | LIGHT EMITTING DIODE PACKAGE - An exemplary light emitting diode (LED) package includes a substrate, an LED chip mounted on the substrate, and a wire. The LED chip includes a semiconductor structure and an electrode disposed on the semiconductor structure. The wire electrically connects the electrode of the LED chip to an electrical portion of the substrate. The wire has a first joint and a second joint connected to the substrate. The wire forms a first curved portion between the electrode and the first joint and a second curved portion between the first joint and the second joint. | 04-26-2012 |
20120104438 | LIGHT EMITTING DIODE PACKAGE STRUCTURE - An LED package structure includes a substrate, a first electrical portion and a second electrical portion formed on the substrate, and an LED chip mounted on a first surface of the first electrical portion. The first and second electrical portions are electrically insulated from each other. The LED chip includes a first electrode connected with the first electrical portion and a second electrode connected with the second electrical portion through a connecting wire. The LED chip has a top surface for supporting the second electrode. The connecting wire has a highest point. A distance between the highest point and the top surface is less than a half of a distance between the first surface of the first electrical portion and the top surface of the LED chip. | 05-03-2012 |
20120126265 | LED PACKAGE - An exemplary LED package includes a substrate, an electric layer formed on the substrate, an LED chip mounted on the substrate and electrically connected with the electric layer, a first fluorescent layer and a second fluorescent layer. The first fluorescent encloses the LED chip and includes first phosphorous compounds. The second fluorescent covers the first fluorescent layer and includes second phosphorous compounds different from the first phosphorous compounds. The second fluorescent layer is detachably mounted at an outside of the first fluorescent layer. | 05-24-2012 |
20120153326 | LIGHT EMITTING DIODE PACKAGE - An exemplary light emitting diode (LED) package includes a substrate, an electrical member formed on the substrate, an LED chip mounted on the substrate and electrically connected to the electrical member, and a heat-dissipating member formed on the electrical member. The heat-dissipating member helps the LED chip to dissipate heat generated thereby when the LED chip is in operation. | 06-21-2012 |
20120161179 | LIGHT EMITTING DIODE PACKAGE - An LED package includes a base, an LED die arranged on the base, an encapsulation sealing the LED die, and a light wavelength converting layer arranged on a light path of the LED die. The light wavelength converting layer includes a plurality of first areas comprising red fluorescent powder, a plurality of second areas comprising green fluorescent powder and a plurality of third areas comprising blue fluorescent powder. The first, second and third areas are aligned along a first direction and a second direction perpendicular to the first direction. Each two neighboring areas on the first direction have different colors. Each two neighboring areas on the second direction also have different colors. | 06-28-2012 |
20120175656 | LIGHT EMITTING DIODE PACKAGE - A light emitting diode package includes a base, a chip mounted on the base, and an encapsulant layer encapsulating the chip. The encapsulant layer includes a light exit face for light generated generated by the chip transmitting through. A plurality of microstructures are formed on the light exit face. Distribution of the microstructures has the following characters: a density of the microstructures is inversely proportional to a light intensity of the light at the light exit face; and a size of the microstructures is inversely proportional to the light intensity of the light at the light exit face. | 07-12-2012 |
20120235193 | LED PACKAGE - An LED package comprises a substrate, a reflector, a light-absorbing layer, an encapsulation layer and an LED chip. The light-absorbing layer is located around the reflector and is able to absorb any light which penetrates through the reflector. Therefore, any vignetting or halation of light from the LED package is prevented. Moreover, the LED package can be constructed on a very small scale with no reduction in its color rendering properties. | 09-20-2012 |
20120326175 | LED PACKAGE AND METHOD FOR MAKING THE SAME - An LED package includes a substrate with two opposite lateral bulging portions, an LED die, an electrode structure, and a reflective layer. The substrate includes a first substrate and a second substrate stacked together; the first substrate and the second substrate are transparent; and the substrate includes an emitting surface for emitting light of the LED package. The electrode structure is sandwiched between the first substrate and the second substrate. The LED die is mounted in the substrate and electrically connected to the electrode structure. The reflective layer is formed on an outer surface of the substrate except the emitting surface and the bulging portions. The disclosure also provides a method for manufacturing such an LED package. | 12-27-2012 |
20130062642 | LED PACKAGE DEVICE - An LED package device comprises a substrate, a first electrode, a second electrode, a reflector, an encapsulation layer and an LED die. The substrate includes a top surface and a bottom surface opposite to the top surface, wherein the first and the second electrodes are located on the top surface of the substrate. A sum of the areas of the first and the second electrodes on the top surface is smaller than ¼-⅔ the area of the top surface. Therefore, an increased contacting area between the reflector and the substrate is formed to enhance the tightness of the LED package device. | 03-14-2013 |
Patent application number | Description | Published |
20130026520 | LIGHT-EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - An LED package includes a substrate, an LED chip arranged on the substrate, and a light transmission layer arranged on a light output path of the LED chip. The substrate includes a first electrode and a second electrode separated and electrically insulated from the first electrode. The LED chip is electrically connected to the first electrode and the second electrode of the substrate. The light transmission layer comprises two parallel transparent plates and a fluorescent layer sandwiched between the two transparent plates. The LED package further includes a transparent encapsulation layer sealing the LED chip therein, and in one embodiment, the light transmission layer is located on the encapsulation layer and in another embodiment, the encapsulation layer also seals the light transmission layer therein. A method for manufacturing the LED package is also provided. | 01-31-2013 |
20130161671 | LIGHT EMITTING DIODE WITH SIDEWISE LIGHT OUTPUT STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A light emitting diode (LED) includes a substrate, an electrode structure positioned on the substrate, an LED component electrically connected to the electrode structure, and a lens structure positioned on the substrate and covering the LED component. The lens structure includes a rugged structure adjacent to the substrate; the roughness of the rugged structure decreases gradually along a direction from a center of the lens structure center toward a peripheral edge thereof. The present disclosure also provides a method for manufacturing the LED light source. | 06-27-2013 |
20130283609 | METHOD FOR MANUFACTURING SUPPORTING BOARDS OF LIGHT EMITTING DIODE MODULES - A method for manufacturing supporting boards of light emitting diode modules comprises the following steps: providing a substrate which defines a plurality of through holes and receiving holes therein; providing an engaging plate which includes a plurality of electrode structures and brackets connecting the electrode structures with a connecting frame, each of the electrode structures forming a receiving cavity and an inserting part; providing a shaping roller assembly whereon the substrate and the engaging plate are wound, stacking the substrate and the engaging plate together, rotating the shaping roller assembly to make the shaping roller assembly press the stacked substrate and engaging plate, such that the through holes of the substrate are received in the receiving cavities of the engaging plate and the inserting parts of the electrode structures are inserted into the receiving holes of the substrate, whereby the supporting boards are formed. | 10-31-2013 |
20140183587 | LIGHT EMITTING DIODE PACKAGE - An LED package includes a substrate, an LED chip arranged on the substrate, and a light transmission layer arranged on a light output path of the LED chip. The substrate includes a first electrode and a second electrode separated and electrically insulated from the first electrode. The LED chip is electrically connected to the first electrode and the second electrode of the substrate. The light transmission layer comprises two parallel transparent plates and a fluorescent layer sandwiched between the two transparent plates. The LED package further includes an encapsulation layer sealing the LED chip therein. The light transmission layer is directly located on a top surface of each LED chip, and the encapsulation layer seals the light transmission layer therein. | 07-03-2014 |
Patent application number | Description | Published |
20090172199 | METHOD AND SYSTEM FOR CALIBRATING RESPONSE OF POINTER WITH RESPECT TO MOUSE - Disclosed is a method for calibrating response of a pointer of a remote computer with respect to a mouse of a client computer. The method of the present invention includes steps: (a) showing the pointer of the remote computer in a screen of a display of the client computer; (b) directing the pointer to move in a predetermined distance by shifting the mouse; (c) calculating a relation between a shift of the mouse and the predetermined distance; and (d) synchronizing the mouse with the pointer according to the relation. The system thereof according to the present invention includes a KVM switch and a calibration mechanism. The KVM switch shows the pointer in the screen of the display. The calibration mechanism calculates a relation between a shift of the mouse and a predetermined distance and then, synchronizes the mouse with the pointer according to the relation. | 07-02-2009 |
20130054794 | SYSTEM AND METHOD FOR RECORDING AND MONITORING USER INTERACTIONS WITH A SERVER - A system includes multiple KVM switches, multiple user consoles and a recording system connected via a network. Each KVM switch facilitates interactions between user consoles and selected servers connected its server ports. The KVM switch transmits keyboard, mouse and video data exchanged between user consoles and servers, and administrative data, to the recording system. The recording system records the keyboard, mouse, video and administrative data, and detects trigger events based on such data. Trigger events include predefined keywords, mouse operations, video images, user IDs and server IDs, or combinations thereof. When a trigger event is detected, the recording system automatically transmits monitoring information to an administrative console via the network. The monitoring information may include combined video data containing information about keyboard and mouse actions superimposed on desktop images. The administrative console may also request specific recorded data for review. The recording system may employ a master-slave configuration. | 02-28-2013 |
Patent application number | Description | Published |
20120250945 | METHOD FOR ANALYZING OBJECT MOTION IN MULTI FRAMES - A method for analyzing object motion in multi frames adapted to an image capturing device is provided. Firstly, a plurality set of first sum of absolute difference (SAD) are obtained according to noise of the image capturing device under a plurality of light settings. Next, two frames are captured under a picturing light setting of the light settings. Then, a plurality of second SAD between the two frames are calculated. Afterwards, a plurality of object block within vein tracking of the object are found. Next, a local motion vector of each object block is respectively calculated according to the second SAD. Then, a first reliability of each object block is respectively calculated according to the second SAD and the set of the first SAD corresponding to the picturing light setting. Afterwards, the local motion vectors are estimated according to the first reliability to obtain a global motion vector. | 10-04-2012 |
20120275710 | METHOD OF MULTI-FRAME IMAGE NOISE REDUCTION - A method of multi-frame image noise reduction suitable for an image-capturing device includes following steps: obtaining a current frame and multiple reference frames; defining a mask and a target point in the mask; judging whether the target point pixel of the current frame is on an edge according to an edge map of the frame; when the pixel is on the edge, using the pixels in the reference frames on the edge to calculate a replacement result; when the target point pixel is not on the edge, using the pixels in the reference frames surrounding the target point to calculate a replacement result; after that, generating a pixel corresponding to the position of the target point in an output image according to the replacement result; further, moving the mask and going back to judge whether the pixel of the target point of the current frame is on the edge. | 11-01-2012 |
20120301025 | METHOD FOR GENERATING ALL-IN-FOCUS IMAGE - A method for generating an all-in-focus image is provided. In the method, a plurality of frames including one source frame and several reference frames captured at different focus lengths are obtained. After performing a motion compensation procedure on the frames, for each pixel position belonging to an edge, a characteristic similarity between the source frame and each reference frame is calculated respectively to accordingly select a plurality of qualified reference frames among the reference frames. The method further includes determining a first type color space component of the pixel position within an all-in-focus image by an edge sharpness corresponding to the pixel position within each of the source frame and the qualified reference frames, and determining a second type color space component of the pixel position within the all-in-focus image by an color brightness corresponding to the pixel position within each of the source frame and the qualified reference frames. | 11-29-2012 |
20130136171 | Video Signal Encoder/Decoder with 3D Noise Reduction Function and Control Method Thereof - A video signal encoder/decoder with a 3D noise reduction function and a method thereof. The encoder comprises a storage module, a motion estimation module, a motion compensation module, a first noise reduction module and a coding module. The storage module stores at least one reference image. The motion estimation module receives a first image from an image input end and estimates a motion vector in accordance with the first image and the reference image. The motion compensation module produces motion compensation according to the reference image and the motion vector. The first noise reduction module produces a first noise reduction value with a temporal sequence association according to the first image and the motion compensation. The coding module produces coding data according to the motion compensation and the first noise reduction value. | 05-30-2013 |
20130230258 | IMAGE SHARPNESS PROCESSING APPARATUS AND IMAGE SHARPNESS PROCESSING METHOD - The present invention discloses an image sharpness processing apparatus and an image sharpness processing method thereof. The apparatus comprises an image capturing module and a processing module. The image capturing module captures an image having a plurality of pixels. The processing module gains a characteristic value corresponding to each pixel by analyzing each pixel in the image. The processing module calculates a first sharpening compensation value and a second sharpening compensation value of each pixel by using a first sharpening algorithm and a second sharpening algorithm respectively, and determines a weight value of the first sharpening algorithm and the second sharpening algorithm by the characteristic value. The processing module calculates a third sharpening compensation value according to the first sharpening compensation value and the second sharpening compensation value, so as to adjust the sharpness of the image. | 09-05-2013 |
20130235193 | License Plate Image-Pickup Device and Image White Balance Adjustment Method Thereof - A license plate image-pickup device and an image white balance adjustment method thereof applicable to vehicles. The license plate image-pickup device comprises an image-sensing module, a recognition module, a data base and a processing module. The image-sensing module senses a scene to produce an image. | 09-12-2013 |
20130242130 | White Balance Method and Apparatus Thereof - An entered image is divided into a plurality of windows and it is determined, on a per-window basis, whether the image data within an applicable window is indicative of the color white, based upon the position of each window in the image and the continuity to its surrounding divided windows. A white balance method is performed based upon data of a window determined to be indicative of the color white. The present invention conducts a white balance process through the addition of determining the light source type weight and calculating the continuity of each divided window and its surrounding divided windows. In order the white balance process to accurately obtain the colors of an entered image even under the conditions of specific scenes with distinctive colors. | 09-19-2013 |
20140193080 | METHOD OF IMAGE DENOISING AND METHOD OF GENERATING MOTION VECTOR DATA STRUCTURE THEREOF - The present invention discloses a method of image denoising and method of generating motion vector data structure thereof. The method comprises: providing an image sequential capturing module to capture and to receive the plurality of images; generating a global motion vector based on the plurality of images in accordance with a first algorithm; reducing each image as reduced images; dividing each of the first reduced images into a plurality of first areas and generating a first local motion vector based on each of the first areas in accordance with a second algorithm, and via the similar way for generating a second local motion vector; finally, obtaining motion vector data in the plurality of images according to the global motion vector, each of the first local motion vectors and each of the second local motion vectors. | 07-10-2014 |
20140219578 | IMAGE PROCESSING METHOD - An image processing method is provided and includes the following steps. A source image arranged in a Bayer pattern is captured. A first-order image process is performed on the source image to produce a first image in YCbCr format. A second-order image process is performed on the source image to produce a second image in YCbCr format. Then, a noise-reducing process is performed on the first image in YCbCr format to produce a noise-reduced image. A blending operation is performed on luminance image of the noise-reduced image and luminance image of the second image in YCbCr format, and thereafter a chrominance image is combined with the blended image to produce a processed image. A noise reducing degree of the noise-reduced image is higher than that of the second image in YCbCr format. | 08-07-2014 |
20140292637 | METHOD FOR ADJUSTING HEAD-MOUNTED DISPLAY ADAPTIVELY AND HEAD-MOUNTED DISPLAY - A method for adjusting head mounted display adaptively and a head mounted display are provided. The method includes the following steps. Eye state parameters of a user wearing the head-mounted display are sensed by using a first sensing unit, and whether the user's eyes are discomfort or not is determined according to the eye state parameters. If yes, environmental parameters of the user's location are sensed by using a second sensing unit. The eyes state parameters and the environmental parameters are analyzed synthetically, such that the projection display setting of the head-mounted display could be adjusted adaptively. | 10-02-2014 |
Patent application number | Description | Published |
20130159986 | MANUFACTURING SYSTEM AND FIRMWARE BURNING METHOD - A firmware burning method applied in a target device, which includes a storage unit, a target circuit, and a peripheral controller, connected to the storage circuit via a first communication link, is provided. The method include steps of: providing a test fixture having a first node, a second node, and a switch circuit connected across the first and second nodes, the first and second nodes being respectively coupled to the storage circuit and the target circuit; determining whether firmware of the target circuit satisfies a condition; if not, providing a second communication link between the target circuit and the storage circuit via the first and second nodes by turning on the switch circuit, and switching the peripheral controller to a disabled state; and updating the firmware of the target circuit according to to-be-burned firmware stored in the storage circuit via the second communication link. | 06-20-2013 |
20140183956 | AC BACKUP POWER SYSTEM - An AC backup power system controls a power supply to selectively connect to a primary AC power source or a backup AC power source through a switching module. The switching module is controlled by a monitoring module. The monitoring module has a power monitoring unit, a first circuit switch, a second circuit switch, and a first processor. When the power monitoring unit detects an interruption of primary AC current, the first circuit switch that is normally closed is immediately turned off. The first processor then drives the switching module to connect to the backup AC power source. Once the backup AC power source reaches the zero-crossing point, the second circuit switch is turned on so that the backup AC power source provides power to the power supply. The power supply receives power at the zero-crossing point to avoid problems of sparks and coke deposition. | 07-03-2014 |