Patent application number | Description | Published |
20100097859 | Nonvolatile memory device - A nonvolatile memory device having a three-dimensional structure includes first word line stacks in which first word lines are stacked; second word line stacks in which second word lines parallel to the first word lines are stacked; first connection lines connecting the first word lines; and second connection lines connecting the second word lines. Each of the first connection lines connects the first word lines located at a common layer, each of the second connection lines connects the second word lines located at a common layer and at least one second word line stack is disposed between a pair of the first word line stacks. | 04-22-2010 |
20100133606 | Three-dimensional semiconductor memory device - A three-dimensional semiconductor memory device includes word lines and gate interlayer insulation layers that are alternatively stacked on a semiconductor substrate while extending in a horizontal direction, a vertical channel layer that faces the word lines and extends upwardly from the semiconductor substrate, and a channel pad that extends from the vertical channel layer and is disposed on an uppermost gate interlayer insulation layer of the gate interlayer insulation layers. | 06-03-2010 |
20100171163 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICES INCLUDING SELECT GATE PATTERNS HAVING DIFFERENT WORK FUNCTION FROM CELL GATE PATTERNS - A three-dimensional semiconductor device includes a vertical channel pattern on the substrate, a plurality of cell gate patterns and a select gate pattern stacked on the substrate along the sidewall of the vertical channel pattern, a charge storage pattern between the vertical channel pattern and the cell gate pattern and a select gate pattern between the vertical channel pattern and the select gate pattern. The select gate pattern has a different work function from the cell gate pattern | 07-08-2010 |
20100213527 | Integrated Circuit Memory Devices Having Selection Transistors with Nonuniform Threshold Voltage Characteristics - Provided is a semiconductor memory device. In the semiconductor memory device, a lower selection gate controls a first channel region that is defined at a semiconductor substrate and a second channel region that is defined at the lower portion of an active pattern disposed on the semiconductor substrate. The first threshold voltage of the first channel region is different from the second threshold voltage of the second channel region. | 08-26-2010 |
20100322000 | PROGRAMMING METHODS FOR THREE-DIMENSIONAL MEMORY DEVICES HAVING MULTI-BIT PROGRAMMING, AND THREE-DIMENSIONAL MEMORY DEVICES PROGRAMMED THEREBY - In a method of multiple-bit programming of a three-dimensional memory device having arrays of memory cells that extend in horizontal and vertical directions relative to a substrate, the method comprises first programming a memory cell to be programmed to one among a first set of states. At least one neighboring memory cell that neighbors the memory cell to be programmed to one among the first set of states is then first programmed. Following the first programming of the at least one neighboring memory cell, second programming the memory cell to be programmed to one among a second set of states, wherein the second set of states has a number of states that is greater than the number of states in the first set of states. | 12-23-2010 |
20110073928 | Non-Volatile Memory Devices Having Semiconductor Barrier Patterns and Methods of Forming Such Devices - Provided are a non-volatile memory device and a method of forming the same. The non-volatile memory device includes: a tunnel insulation layer on a substrate; a floating gate on the tunnel insulation layer; a blocking insulation layer on the floating gate; a first barrier pattern, between the top of the floating gate and the blocking insulation layer, having a higher conduction band energy level than the floating gate; and a control gate on the blocking insulation layer. | 03-31-2011 |
20110073930 | NON-VOLATILE MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME - Semiconductor devices and methods of forming the same. The semiconductor devices include a tunnel insulation layer on a substrate, a floating gate on the tunnel insulation layer, a gate insulation layer on the floating gate, a low-dielectric constant (low-k) region between the top of the floating gate and the gate insulation layer, the low-k region having a lower dielectric constant than a silicon oxide, and a control gate on the gate insulation layer. | 03-31-2011 |
20110090744 | CHANNEL PRECHARGE AND PROGRAM METHODS OF A NONVOLATILE MEMORY DEVICE - A channel pre-charge method of a nonvolatile memory device including a cell string includes pre-charging a channel of the cell string according to a first word line bias condition and pre-charging the channel of the cell string according to a second word line bias condition, different than the first word line bias condition. | 04-21-2011 |
20110103154 | LOCAL SELF-BOOSTING METHOD OF FLASH MEMORY DEVICE AND PROGRAM METHOD USING THE SAME - Provided is a local self-boosting method of a flash memory device including at least one string having memory cells respectively connected to wordlines. The local self-boosting method includes forming a potential well at a channel of the string and forming potential walls at the potential well to be disposed at both sides of a channel of a selected one of the memory cells. The channel of the selected memory cell is locally limited by the potential walls and boosted when a program voltage is applied to the selected memory cell. | 05-05-2011 |
20110115010 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE - Provided is a three-dimensional semiconductor memory device. The three-dimensional semiconductor memory device includes a substrate that has a cell array region including a pair of sub-cell regions and a strapping region interposed between the pair of sub-cell regions. A Plurality of sub-gates are sequentially stacked on the substrate in each of the sub-cell regions, and interconnections are electrically connected to extensions of the stacked sub-gates, respectively, which extend into the strapping region. Each of the interconnections is electrically connected to the extensions of the sub-gate which are disposed in the pair of the sub-cell regions, respectively, and which are located at the same level. | 05-19-2011 |
20110116322 | CHARGE RECYCLING MEMORY SYSTEM AND A CHARGE RECYCLING METHOD THEREOF - A memory system, including a nonvolatile memory device, a charge recycler configured to discharge charges from the nonvolatile memory device and recycle the discharged charges, and a controller configured to control the nonvolatile memory device and the charge recycler, wherein the controller controls the charge recycler to recycle the discharged charges, wherein during the recycling the charge recycler charges the charges discharged from the nonvolatile memory device. | 05-19-2011 |
20110169068 | NON-VOLATILE MEMORY DEVICES HAVING A FLOATING GATE CAP BETWEEN A FLOATING GATE AND A GATE INSULATING LAYER - Provided are nonvolatile memory devices and a method of forming the same. A tunnel insulating pattern is provided on a substrate, and a floating gate is provided on the tunnel insulating pattern. A floating gate cap having a charge trap site is provided on the floating gate, and a gate dielectric pattern is provided on the floating gate cap. A control gate is provided on the gate dielectric pattern. | 07-14-2011 |
20110199829 | Nonvolatile Memory Device, Programming Method Thereof And Memory System Including The Same - Provided is a programming method of a nonvolatile memory device. The nonvolatile memory device includes a substrate and a plurality of memory cells which are stacked in the direction perpendicular to the substrate. The programming method applies a first voltage to a selected bit line connected to at least two memory strings in same column including a memory cell of the plurality of memory cell to be programmed, applies a second voltage to an unselected bit line connected to at least two memory strings in same column including a memory cell of the plurality of memory cell to be program-prohibited, applies a third voltage to a selected string selection line connected to at least two memory strings in same row, applies a fourth voltage to an unselected string selection line connected to at least two memory strings in same row, and applies a program operation voltage to a plurality of word lines, each word line connected to each corresponding memory cell in the memory string, wherein the first to third voltages are positive voltages. | 08-18-2011 |
20110233648 | Three-Dimensional Semiconductor Memory Devices And Methods Of Fabricating The Same - Three-dimensional semiconductor memory devices and methods of fabricating the same. The three-dimensional semiconductor devices include an electrode structure with sequentially-stacked electrodes disposed on a substrate, semiconductor patterns penetrating the electrode structure, and memory elements including a first pattern and a second pattern interposed between the semiconductor patterns and the electrode structure, the first pattern vertically extending to cross the electrodes and the second pattern horizontally extending to cross the semiconductor patterns. | 09-29-2011 |
20110286266 | MEMORY SEMICONDUCTOR DEVICE AND METHOD OF OPERATING THE SAME - In a read step or a program (write) verification step of a semiconductor memory device, read voltages different from one another are applied to a pair of word lines respectively disposed on both sides of a selected word line to suppress the enlargement of program distribution. | 11-24-2011 |
20110305083 | NONVOLATILE MEMORY DEVICE - A nonvolatile memory device having a three-dimensional structure includes first word line stacks in which first word lines are stacked; second word line stacks in which second word lines parallel to the first word lines are stacked; first connection lines connecting the first word lines; and second connection lines connecting the second word lines. Each of the first connection lines connects the first word lines located at a common layer, each of the second connection lines connects the second word lines located at a common layer and at least one second word line stack is disposed between a pair of the first word line stacks. | 12-15-2011 |
20120003800 | Methods of Forming Nonvolatile Memory Devices Having Vertically Integrated Nonvolatile Memory Cell Sub-Strings Therein and Nonvolatile Memory Devices Formed Thereby - Methods of forming nonvolatile memory devices according to embodiments of the invention include techniques to form highly integrated vertical stacks of nonvolatile memory cells. These vertical stacks of memory cells can utilize dummy memory cells to compensate for process artifacts that would otherwise yield relatively poor functioning memory cell strings when relatively large numbers of memory cells are stacked vertically on a semiconductor substrate using a plurality of vertical sub-strings electrically connected in series. | 01-05-2012 |
20120327715 | NONVOLATILE MEMORY DEVICES HAVING VERTICALLY INTEGRATED NONVOLATILE MEMORY CELL SUB-STRINGS THEREIN - Methods of forming nonvolatile memory devices according to embodiments of the invention include techniques to form highly integrated vertical stacks of nonvolatile memory cells. These vertical stacks of memory cells can utilize dummy memory cells to compensate for process artifacts that would otherwise yield relatively poor functioning memory cell strings when relatively large numbers of memory cells are stacked vertically on a semiconductor substrate using a plurality of vertical sub-strings electrically connected in series. | 12-27-2012 |
20130075807 | SEMICONDUCTOR MEMORY DEVICES HAVING SELECTION TRANSISTORS WITH NONUNIFORM THRESHOLD VOLTAGE CHARACTERISTICS - Provided is a semiconductor memory device. In the semiconductor memory device, a lower selection gate controls a first channel region that is defined at a semiconductor substrate and a second channel region that is defined at the lower portion of an active pattern disposed on the semiconductor substrate. The first threshold voltage of the first channel region is different from the second threshold voltage of the second channel region. | 03-28-2013 |
20130171806 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE - Provided is a three-dimensional semiconductor memory device. The three-dimensional semiconductor memory device includes a substrate that has a cell array region including a pair of sub-cell regions and a strapping region interposed between the pair of sub-cell regions. A Plurality of sub-gates are sequentially stacked on the substrate in each of the sub-cell regions, and interconnections are electrically connected to extensions of the stacked sub-gates, respectively, which extend into the strapping region. Each of the interconnections is electrically connected to the extensions of the sub-gate which are disposed in the pair of the sub-cell regions, respectively, and which are located at the same level. | 07-04-2013 |
20130248983 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE - A three-dimensional semiconductor memory device includes word lines and gate interlayer insulation layers that are alternatively stacked on a semiconductor substrate while extending in a horizontal direction, a vertical channel layer that faces the word lines and extends upwardly from the semiconductor substrate, and a channel pad that extends from the vertical channel layer and is disposed on an uppermost gate interlayer insulation layer of the gate interlayer insulation layers. | 09-26-2013 |
20130322172 | PROGRAMMING METHODS FOR THREE-DIMENSIONAL MEMORY DEVICES HAVING MULTI-BIT PROGRAMMING, AND THREE-DIMENSIONAL MEMORY DEVICES PROGRAMMED THEREBY - In a method of multiple-bit programming of a three-dimensional memory device having arrays of memory cells that extend in horizontal and vertical directions relative to a substrate, the method comprises first programming a memory cell to be programmed to one among a first set of states. At least one neighboring memory cell that neighbors the memory cell to be programmed to one among the first set of states is then first programmed. Following the first programming of the at least one neighboring memory cell, second programming the memory cell to be programmed to one among a second set of states, wherein the second set of states has a number of states that is greater than the number of states in the first set of states. | 12-05-2013 |
20130334593 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES AND METHODS OF FABRICATING THE SAME - Three-dimensional semiconductor memory devices and methods of fabricating the same. The three-dimensional semiconductor devices include an electrode structure with sequentially-stacked electrodes disposed on a substrate, semiconductor patterns penetrating the electrode structure, and memory elements including a first pattern and a second pattern interposed between the semiconductor patterns and the electrode structure, the first pattern vertically extending to cross the electrodes and the second pattern horizontally extending to cross the semiconductor patterns. | 12-19-2013 |
20140016408 | NONVOLATILE MEMORY DEVICES HAVING VERTICALLY INTEGRATED NONVOLATILE MEMORY CELL SUB-STRINGS THEREIN - Nonvolatile memory devices according to embodiments of the invention include highly integrated vertical stacks of nonvolatile memory cells. These vertical stacks of memory cells can utilize dummy memory cells to compensate for process artifacts that would otherwise yield relatively poor functioning memory cell strings when relatively large numbers of memory cells are stacked vertically on a semiconductor substrate using a plurality of vertical sub-strings electrically connected in series. | 01-16-2014 |
20140029344 | NONVOLATILE MEMORY DEVICE, PROGRAMMING METHOD THEREOF AND MEMORY SYSTEM INCLUDING THE SAME - Provided is a programming method of a nonvolatile memory device. The nonvolatile memory device includes a substrate and a plurality of memory cells which are stacked in the direction perpendicular to the substrate. The programming method applies a first voltage to a selected bit line connected to at least two memory strings in same column including a memory cell of the plurality of memory cell to be programmed, applies a second voltage to an unselected bit line connected to at least two memory strings in same column including a memory cell of the plurality of memory cell to be program-prohibited, applies a third voltage to a selected string selection line connected to at least two memory strings in same row, applies a fourth voltage to an unselected string selection line connected to at least two memory strings in same row, and applies a program operation voltage to a plurality of word lines, each word line connected to each corresponding memory cell in the memory string, wherein the first to third voltages are positive voltages. | 01-30-2014 |
20140061757 | SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME - A semiconductor device includes a semiconductor substrate having a plurality of active regions defined by a trench. A gate electrode crosses the plurality of active regions. A plurality of charge storing cells is disposed between the gate electrode and each of the plurality of active regions. A porous insulating layer is disposed between the gate electrode and the plurality of charge storing cells. The porous insulating layer includes a portion extended over the trench. An air gap is disposed between the extended portion of the porous insulating layer and a bottom surface of the trench. | 03-06-2014 |
20140124846 | SEMICONDUCTOR MEMORY DEVICES HAVING SELECTION TRANSISTORS WITH NONUNIFORM THRESHOLD VOLTAGE CHARACTERISTICS - Provided is a semiconductor memory device. In the semiconductor memory device, a lower selection gate controls a first channel region that is defined at a semiconductor substrate and a second channel region that is defined at the lower portion of an active pattern disposed on the semiconductor substrate. The first threshold voltage of the first channel region is different from the second threshold voltage of the second channel region. | 05-08-2014 |
20140133223 | MEMORY SEMICONDUCTOR DEVICE AND METHOD OF OPERATING THE SAME - In a read step or a program (write) verification step of a semiconductor memory device, read voltages different from one another are applied to a pair of word lines respectively disposed on both sides of a selected word line to suppress the enlargement of program distribution. | 05-15-2014 |
20150060992 | SEMICONDUCTOR DEVICE, SYSTEMS AND METHODS OF MANUFACTURE - A semiconductor memory device includes a stack of word lines and insulating patterns. Cell pillars extend vertically through the stack of word lines and insulating patterns with memory cells being formed at the junctions of the cell pillars and the word lines. A ratio of the thickness of the word lines to the thickness of immediately neighboring insulating patterns is different at different locations along one or more of the cell pillars. Related methods of manufacturing and systems are also disclosed. | 03-05-2015 |