Patent application number | Description | Published |
20140076198 | EPOXY RESIN COMPOSITION FOR INSULATION, INSULATING FILM, PREPREG, AND PRINTED CIRCUIT BOARD - Disclosed herein are an epoxy resin composition for insulation, and an insulating film, a prepreg, and a printed circuit board, manufactured using the same, the epoxy resin composition including: a chitin nanoparticle or a chitin nanofiber; a liquid crystal oligomer or a soluble liquid crystal thermosetting oligomer; an epoxy resin; and an inorganic filler, so that the epoxy resin composition, the insulating film, and the prepreg can have a low coefficient of thermal expansion, a high glass transition temperature, and high rigidity. | 03-20-2014 |
20140154479 | RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPREG AND PRINTED CIRCUIT BOARD - Disclosed herein is a resin composition for a printed circuit board, including: a liquid crystalline oligomer; an epoxy resin; and an inorganic filler which is a reaction product of silica, silane having a vinyl group and an alkoxy group, and vinyl or hydroxyl terminated silicone oil. The resin composition has a low thermal expansion coefficient, excellent heat resistance and a high glass transition temperature. | 06-05-2014 |
20150027763 | INORGANIC FILLER, AND INSULATING RESIN COMPOSITION, INSULATING FILM, PREPREG AND PRINTED CIRCUIT BOARD INCLUDING THE SAME - An inorganic filler has a negative coefficient of thermal expansion, and a shell thereon that decreases diffusion of ions contained in the inorganic filler to outside of the shell and organic filler. | 01-29-2015 |
20150057393 | INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRODUCTS MANUFACTURED BY USING THE SAME - Disclosed herein are an insulating resin composition for a printed circuit board and products manufactured by using the same, and more particularly, an insulating resin composition for a printed circuit board including a 4-functional naphthalene-based epoxy resin and having improved coefficient of thermal expansion and glass transition temperature properties, and a prepreg and a printed circuit board as products manufactured by using the same. | 02-26-2015 |
20150147542 | RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD COMPRISING THE SAME - A resin composition for a printed circuit board and a printed circuit board formed of the same. The resin composition for a printed circuit board may have: a liquid crystal oligomer including a structural unit of the Chemical Formula 1 and a structural unit of the Chemical Formula 2 and including a functional group of the Chemical Formula E on at least one end; and an ether-type naphthalene-based epoxy resin of Chemical Formula N. According to an exemplary embodiment, even though a printed circuit board becomes light, thin, and miniaturized, electric, thermal, and mechanical stability of the printed circuit board may be secured. | 05-28-2015 |
Patent application number | Description | Published |
20120113564 | Lithium ion capacitor and method of fabricating the same - There are provided a lithium ion capacitor and a method of fabricating the same. The lithium ion capacitor includes: a first electrode made of a first electrode material including activated carbon, a water-soluble metal oxide, and a water based binder; and a second electrode disposed to be faced to the first electrode, having a separating film therebetween and made of a second electrode material capable of reversibly containing lithium ions. Therefore, the lithium ion capacitor having improved energy density and output density may be provided, and the fabricating method thereof having environmentally-friendly characteristics and a competitive pricing may be provided. | 05-10-2012 |
20130058009 | METAL CURRENT COLLECTOR, METHOD FOR PREPARING THE SAME, AND ELECTROCHEMICAL CAPACITORS WITH SAME - The present invention relates to a metal current collector including a metal substrate having grooves on a surface thereof, a carbon buffer layer formed on the metal substrate, and a conductive layer formed on the carbon buffer layer, a method for preparing the same, and electrochemical capacitors comprising the same. According to the present invention, a metal current collector including a metal substrate having grooves on a surface thereof, a carbon buffer layer formed on the metal substrate, and a conductive layer formed on the carbon buffer layer has a large surface area and low electrical resistance. This metal current collector can be effectively used in electrochemical capacitors with high capacity and high output characteristics by improving contact characteristics with an active material layer. | 03-07-2013 |
20130194724 | ELECTRODE, METHOD FOR FABRICATING THE SAME, AND ELECTROCHEMICAL CAPACITOR INCLUDING THE SAME - Disclosed herein are an electrode, a method for fabricating the same, and an electrochemical capacitor including the same, the electrode including an electrode current collector; a plurality of first active material layers made of a complex of graphene and carbon nanotubes (CNT) above the electrode current collector; and a plurality of second active material layers made of carbon nanofibers (CNF), each of the second active material layers being interposed between the first active material layers. According to the present invention, an electrochemical device having high capacitance and output can be provided by using materials such as graphene, carbon nanotubes (CNT), and carbon nanofibers (CNF), which have excellent specific surface area and electric conductivity, as an electrode active material, and thereby to fabricate an electrode having a multilayer structure. | 08-01-2013 |
Patent application number | Description | Published |
20110061912 | Printed circuit board and manufacturing method thereof - Provided are a printed circuit board (PCB), and a manufacturing method thereof. The PCB includes a stacked structure including second and third insulation layers with a first insulation layer interposed therebetween, and a conductive via having first to fourth conductive vias. A second-layer circuit pattern and a third-layer circuit pattern are buried in the first insulation layer, a first-layer circuit pattern is formed on the second insulation layer, and a fourth-layer circuit pattern is formed on the third insulation layer. A first conductive via connects the first-layer circuit pattern and the second-layer circuit pattern, a second conductive via connects the first-layer circuit pattern and the third-layer circuit pattern, a third conductive via connects the second-layer circuit pattern and the fourth-layer circuit pattern, and a fourth conductive via connects the third-layer circuit pattern and the fourth-layer circuit pattern. | 03-17-2011 |
20110067233 | Method of fabricating printed circuit board - A method of fabricating a printed circuit board, the method including: providing an insulating base body having a first surface on which a first circuit pattern is formed, and a second surface opposite to the first surface; pressing the first surface of the insulating base body onto at least one surface of an insulating layer such that the first circuit pattern is embedded in the insulating layer; forming a resist having a desired pattern on the second surface of the insulating base body; forming a trench by performing a plasma treatment on the second surface of the insulating base body on which the resist is formed; and forming a second circuit pattern by filling the trench with a conductive material. Accordingly, the conductive patterns can be formed using a simple process, thereby enhancing a process rate and productivity. | 03-24-2011 |
20140202748 | PRINTED CIRCUIT BOARD HAVING METAL BUMPS - A printed circuit board includes an upper circuit layer including a circuit pattern embedded in an upper part of an insulating layer, the circuit pattern being made of electroconductive metal; and a metal bump formed on the circuit pattern and the insulating layer | 07-24-2014 |
Patent application number | Description | Published |
20110063368 | Multi inkjet head package, inkjet recording apparatus using the same, and method of aligning the same in inkjet recording apparatus - There is provided a multi inkjet head package. The multi inkjet head package may include: a plurality of inkjet head assemblies each having a head plate in which an inkjet head discharging ink is housed; a rack in which the head plate is housed so as to expose the inkjet head; and a preliminary fixation portion that is installed on the rack and allows the head plate to be preliminarily fixed to the rack. | 03-17-2011 |
20130134813 | SPINDLE MOTOR - There is provided a spindle motor including: a sleeve rotatably supporting a shaft; a thrust plate fixedly installed on the shaft to be disposed above the sleeve; a cap member fixedly installed on the sleeve and forming a liquid-vapor interface between a lubricating fluid and surrounding air together with the thrust plate; and a buffering member installed on a lower surface of the cap member. | 05-30-2013 |
20140118859 | SPINDLE MOTOR AND HARD DISK DRIVE INCLUDING THE SAME - There are provided a spindle motor and a hard disk drive including the same. The spindle motor includes a shaft fixedly installed on a base member and including an upper thrust member, a sleeve rotatably supported by the shaft, a hub extended from the sleeve in an outer diameter direction, and a sealing cap mounted on the hub, wherein the upper thrust member and the sleeve or the hub include a liquid-vapor interface formed therebetween, wherein a gap between facing surfaces of the sealing cap and the upper thrust member in the axial direction is narrow enough to form a labyrinth seal, and wherein the sealing cap includes a curved part curved so that a gap between the sealing cap and the upper thrust member at a portion of the sealing cap facing the upper thrust member in the axial direction is varied in a radial direction. | 05-01-2014 |
20140177095 | SPINDLE MOTOR AND HARD DISK DRIVE INCLUDING THE SAME - There is provided a spindle motor, including: a shaft having a fixing groove formed in a lower portion thereof; a lower thrust member including a fixing part inserted into the fixing groove, a disk part extending from the fixing part in an outer radial direction, and an extension part extending from the disk part in an axial direction; a base member coupled to the extension part; a rotating member forming a bearing clearance with the shaft and rotatably provided with respect to the shaft; a first sealing part provided between an upper surface of the extension part and the rotating member; and a second sealing part provided between an inner circumferential surface of the base member and an outer circumferential surface of the rotating member. | 06-26-2014 |
Patent application number | Description | Published |
20080218700 | BAR-TYPE DISPLAY DEVICE USING DIFFRACTIVE LIGHT MODULATOR - Disclosed herein is a display device using a diffractive light modulator. The display device includes a light source unit, a light condensing unit, an illumination unit, a diffractive light modulator, a light path adjustment unit, and a projection unit. The light path adjustment unit causes the linear light to enter the diffractive light modulator, and emits the diffracted light along a line extending from an incident light path. | 09-11-2008 |
20080218837 | APPARATUS FOR CALIBRATING DISPLACEMENT OF REFLECTIVE PARTS IN DIFFRACTIVE OPTICAL MODULATOR - Disclosed herein is an apparatus for calibrating the displacement of reflective parts in a diffractive optical modulator. The apparatus includes a diffractive optical modulator, a light intensity measurement unit, a projection unit, and display electronics. The light intensity measurement unit is disposed near one side of the diffractive optical modulator and measures and outputs the intensity of incident linear diffracted light having a predetermined diffraction order. | 09-11-2008 |
20120274236 | HARBOR LIGHTING CONTROL APPARATUS - A harbor lighting control apparatus is provided, which includes a plurality of slaves to perform on control or off control, and dimming control with respect to a light emitting diode (LED) array light source mounted to a lighthouse when an on control signal or off control signal, and a dimming control signal are received, and to transmit a result of the control as acknowledge signals, and a master to transmit the on control signal or off control signal and the dimming control signal to all of the plurality of slaves by a broadcast scheme, to transmit the on control signal or off control signal and the dimming control signal to an individual slave by a unicast scheme, and to recognize operational states of the plurality of slaves by receiving the acknowledge signals from the plurality of slaves. Accordingly, stable and reliably control of the harbor lighting is enabled. | 11-01-2012 |
20120306378 | LIGHTING CONTROL APPARATUS - Disclosed is a lighting control apparatus. According to one embodiment of the present invention, a lighting system control be easily configured, maintained, and repaired since additional light and block control of the lighting can be provided with ease by wireless control of the lighting through wireless communication. In addition, the present invention can control individual lamps by storing a control signal corresponding to an address for each lamp in a gateway according to a predetermined scenario. | 12-06-2012 |
Patent application number | Description | Published |
20140003013 | POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME | 01-02-2014 |
20140117525 | POWER MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a power module package including: a base substrate; a metal layer including a circuit pattern and a connection pad formed on the base substrate; a semiconductor device including a plurality of electrodes mounted on the circuit pattern of the metal layer; and a plurality of lead frames formed on the connection pad of the metal layer and respectively connected to the plurality of electrodes of the semiconductor device. | 05-01-2014 |
20140167242 | POWER MODULE PACKAGE - Disclosed herein is a power module package including: a first module configured of a first substrate having one surface and the other surface, a first semiconductor chip mounted on one surface of the first substrate, and a first sealing member formed to cover the first semiconductor chip mounted on one surface of the first substrate from both sides in a thickness direction of the first substrate and expose the other surface of the first substrate; and a case enclosing the first module. | 06-19-2014 |
20140175631 | SEMICONDUCTOR MODULE HAVING SLIDING CASE AND MANUFACTURING METHOD THEREOF - There is provided a semiconductor module capable of being easily manufactured and a manufacturing method thereof, the semiconductor module including a module substrate on which at least one electronic element is mounted, at least one external connection terminal fastened to the module substrate, and a case formed by coupling a first case and a second case, wherein the first case and the second case accommodate the module substrate at both ends of the module substrate and are coupled to each other. | 06-26-2014 |