Namioka, JP
Ichiro Namioka, Fuchu-Shi JP
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20150032246 | ENERGY-CONSUMPTION MONITORING SYSTEM FOR SUBSTRATE PROCESSING APPARATUS AND ENERGY-CONSUMPTION MONITORING METHOD FOR SUBSTRATE PROCESSING APPARATUS - An energy-consumption monitoring system for a substrate processing apparatus includes a data collection device which collects process implementation data of a process to be executed according to each recipe in a substrate processing apparatus, a memory device which stores energy consumption data that indicate relationship between an individual energy-consuming event in the process and an amount of energy consumed per unit time by the individual energy-consuming event, and a computation device which detects an occurrence of the individual energy-consuming event and virtually calculate a cumulative energy consumption based on a duration of the individual energy-consuming event and the energy consumption data of the individual energy-consuming event stored in the memory device. | 01-29-2015 |
Ichiro Namioka, Tokyo JP
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20140257546 | PROCESSING DEVICE GROUP CONTROLLER, MANUFACTURING PROCESS SYSTEM, PROCESSING DEVICE GROUP CONTROL METHOD, MANUFACTURING OPTIMIZATION SYSTEM, MANUFACTURING OPTIMIZATION DEVICE, AND MANUFACTURING OPTIMIZATION METHOD - A processing device group controller includes: a storage unit which stores an operation schedule including information of maintenance time for a plurality of processing devices for processing workpieces, with respective equipment associated with the plurality of processing devices, and a transfer plan including information of timings at which the workpieces are carried in and out of the plurality of processing devices; a detecting unit which performs a step of comparing the transfer plan and the operation schedule of each processing device, a step of specifying the last process before maintenance for each processing device, and a step of detecting the end timing of the specified process; and an instruction unit which instructs each processing device to be switched to an idle state at the end timing along with the associated equipment. | 09-11-2014 |
20140297017 | PRODUCTION PROCESSING SYSTEM, PRODUCTION EFFICIENCY IMPROVEMENT DEVICE AND PRODUCTION EFFICIENCY IMPROVEMENT METHOD - There is provided a production processing system including: a production efficiency improvement device configured to select a processing apparatus that processes workpieces in consideration of a position of each of a plurality of processing apparatuses arranged along a transfer path; and a transfer control device configured to move a transfer apparatus that transfers workpieces from a predetermined position on the transfer path to the selected processing apparatus. | 10-02-2014 |
20150084772 | SYSTEM FOR MONITORING FAILURE OF SUBSTRATE PROCESSING APPARATUS, AND METHOD FOR MONITORING FAILURE OF SUBSTRATE PROCESSING APPARATUS - Disclosed is a failure monitoring system for monitoring a failure of a substrate processing apparatus that performs a predetermined processing on a substrate to be processed, the failure monitoring system including: an alarm collecting unit configured to collects alarms issued from the substrate processing apparatus; and an analyzing unit configured to analyze the alarms collected by the alarm collecting unit and display, as an image, an alarm issuing frequency in each monitoring period on a two-dimensional space, of which one axis represents an alarm ID that specifies an alarm issuing area and another axis represents a predetermined monitor period. | 03-26-2015 |
Jun Namioka, Tokyo JP
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20130326393 | DESTINATION INPUT DEVICE, DESTINATION INPUT PROGRAM, DATA TRANSMISSION DEVICE AND DATA TRANSMISSION PROGRAM - A destination input device includes a destination group storage unit that stores at least one destination group each of which includes at least one destination identifier, a destination input unit that receives a user's input of a destination identifier of transmit data, a destination group searching unit that searches the at least one destination group stored in the destination group storage unit to find the destination group corresponding to the destination identifier received by the destination input unit, and a destination input assisting unit that presents information regarding the destination group found by the destination group searching unit to the user so as to assist the user in inputting another destination identifier. | 12-05-2013 |
Kaori Namioka, Tokyo JP
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20090321750 | SURFACE MOUNT DEVICE - The disclosed subject matter is directed to a reliable surface mount device using a ceramic package, and includes LED devices that are simply composed and incorporate the use of the surface mount device. The surface mount device can include a ceramic package, a semiconductor optical chip mounted in the package, two soldering pads electrically connected to the chip electrodes and at least one dummy soldering pad located on either side of the soldering pads. Thermal fatigue located at or in the soldering connections connecting the chip electrodes to a mounting board can be reduced because the distance between the soldering pads can be reduced. The dummy soldering pad that is electrically insulated can allow the device to maintain a desirable location with poise during the reflow soldering process that occurs during manufacture, and can also reduce shear stress present at the soldering connections. Thus, the surface mount device and the LED device using the disclosed structure can maintain a high reliability even under harsh environmental conditions. | 12-31-2009 |
20110101407 | SEMICONDUCTOR LIGHT-EMITING DEVICE AND METHOD - A semiconductor light-emitting device can include a submount on which a semiconductor light-emitting element is mounted. The device can have a high light utilization efficiency with high reliability and can achieve a reduction in manufacturing cost as well as a decrease in size. The submount can have a reverse trapezoidal cross section having an upper surface that is larger than a bottom surface of the semiconductor light-emitting element. An adhesive can be used to fix the submount to the base board such that, when the submount is observed from above the semiconductor light-emitting element, the adhesive is not seen from above. In this state, the semiconductor light-emitting element can be connected to the base board via a bonding wire. | 05-05-2011 |
20110284897 | SEMICONDUCTOR LIGHT EMITTING DEVICE - The device includes a first ceramic layer; a second ceramic layer on the first ceramic layer and having a light emitting element mounting area; a reflective layer so formed on a surface of the second ceramic layer that the reflective layer covers at least the mounting area; a protective layer which covers the reflective layer; a semiconductor light emitting element mounted on the protective layer positioned above the element mounting area; and at least one heat dissipation via passing through the first ceramic layer. The heat dissipation via is disposed in a position that does not overlap with the element mounting area in a direction in which the ceramic layers are stacked. | 11-24-2011 |
20120085481 | METHOD FOR MANUFACTURING CERAMIC MULTI-LAYERED INTERCONNECTION SUBSTRATE - A ceramic multi-layered interconnection substrate can be manufactured by using a stack including a plurality of ceramic layers with division grooves in the uppermost layer, at least one intermediate layer, and the lowermost layer. The substrate can be manufactured by forming division grooves in respective green sheets other than the uppermost and lowermost ones at adjacent package boundaries, pressing them to be stacked, forming division grooves in the uppermost and lowermost sheets at the adjacent package boundaries, firing them to be ceramic layers, and breaking the ceramic layers along the division grooves to separate individual packages, thus preventing failure and preventing the generation of burrs, chips, and the like. | 04-12-2012 |
Makoto Namioka, Tokyo JP
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20080230515 | Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof - The present invention provides a method of forming a circuit pattern on an integrally bonded member, the method not requiring a correction step of a laminate film or a resist film which has been necessary at the time of wet treatment of the integrally bonded member. After a circuit pattern forming metal plate is bonded on a part of a ceramic substrate so as to expose an outer peripheral edge portion of the ceramic substrate in an integrally bonded member, the integrally bonded member is set on a treating apparatus while being covered with a masking member having a window portion from which the circuit pattern forming metal plate of the integrally bonded member is exposed. Further, the integrally bonded member is pressed with an appropriate pressure from a base plate side so that a boundary surface between a portion surrounding the window portion in the masking member and an exposed surface of the ceramic substrate which is exposed in a metal-ceramic bonded member has a state not allowing a liquid to pass therethrough. Thereafter, a treatment solution for wet treatment is injected from an injection pipe to be in contact with the circuit pattern forming metal plate. | 09-25-2008 |
Miyoko Namioka, Yokohama-Shi JP
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20090049157 | CONTENTS SALES METHOD AND CYBER MALL SYSTEM USING SUCH METHOD AND STORAGE MEDIUM STORING THEREIN ITS CONTENTS SALES PROGRAM - A cyber mall system has a contents sales apparatus for selling digital contents, a contents purchasing apparatus, and a network for connecting these components. When digital contents are registered into the contents sales apparatus, digital contents personal using conditions are generated on the basis of digital contents using conditions and are provided to a customer. If the digital contents are again purchased after the delivery of the digital contents fails, as long as the digital contents personal using conditions provided at the time of purchase are valid, the digital contents are again delivered without again collecting a digital contents value. | 02-19-2009 |
Naotaka Namioka, Osaka JP
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20110211301 | ELECTRONIC DEVICE AND WALL HANGING STRUCTURE OF ELECTRONIC DEVICE - A wall hanging structure of an electronic device according to the present invention includes: a wall hanging bracket disposed on a rear surface of a chassis; a main body fastening screw screwed from the rear surface of the chassis into a rear surface of a main body unit; a bracket fastening screw screwed from a rear surface of the wall hanging bracket into the rear surface of the chassis; and a coupling member which extends inside the chassis between the main body fastening screw and the bracket fastening screw and which couples both fastening screws to each other. | 09-01-2011 |
20110211302 | FLAT PANEL DISPLAY DEVICE - In a flat panel display device according to the present invention, a stand is made up of a base part and a supporting column part erected on the base part, and the stand is fastened to a device main body in a state where a front surface of the supporting column part of the stand opposes a rear surface of the device main body. An approximately horizontal receiving surface for receiving a bottom surface of the device main body is formed more forward than the front surface on the supporting column part of the stand. | 09-01-2011 |
Seigo Namioka, Kawasaki-Shi JP
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20150145009 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF - In order to achieve high-speed operation of an eDRAM, the eDRAM includes: a selection MISFET having a gate electrode that serves as a word line, a source region, and a drain region; a source plug electrode coupled to the source region; and a drain plug electrode coupled to the drain region DR | 05-28-2015 |
Shinichi Namioka, Tokyo JP
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20150158137 | GRINDING APPARATUS - A grinding apparatus for grinding a wafer stored in a cassette is composed of a container for storing the wafer and a lid for enclosing the container. The grinding apparatus includes a cassette table for placing the cassette thereon, a lid removing unit for removing the lid from the cassette placed on the cassette table and leaving only the container on the cassette table, a chuck table for holding the wafer under suction, a chuck table moving unit for moving the chuck table to a grinding area, a grinding unit provided in the grinding area, the grinding unit having a grinding wheel for grinding the wafer held on the chuck table, a grinding water supplying unit for supplying a grinding water to abrasive members of the grinding wheel, and a waste water collecting unit for collecting a waste water generated in grinding the wafer by operating the grinding unit. | 06-11-2015 |
Toshiyuki Namioka, Tokyo JP
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20080239146 | VIDEO SIGNAL INTERPOLATION APPARATUS AND METHOD THEREOF - According to one embodiment, a video signal interpolation apparatus has: a correlation calculating unit calculating correlation calculation values by correlating each of a plurality of peripheral pixels with another plurality of peripheral pixels existing in a periphery of an object interpolation pixel; a sub-pixel estimation unit estimating a position of sub-pixel having an equivalent luminance value to that of the respective peripheral pixel based on the plurality of correlation calculation values calculated for each of the plurality of peripheral pixels; and a weighted average calculating unit calculating a weighted average of a pixel value in accordance with distances between each of the sub-pixel and the object interpolation pixel to determine a pixel value of the object interpolation pixel. | 10-02-2008 |
20080239151 | VIDEO SIGNAL PROCESSING APPARATUS, VIDEO DISPLAY APPARATUS AND VIDEO SIGNAL PROCESSING METHOD - According to one embodiment, a video signal processing apparatus has a scaling processing unit configured to perform scaling processing on a video signal, an expansion processing unit configured to perform expansion processing on a video signal, and a switching unit configured to switch whether the scaling processing unit uses a video signal after being expanded by the expansion processing unit or uses the video signal before being expanded by the expansion processing unit according to a resolution of the video signal inputted to the expansion processing unit. | 10-02-2008 |
Toshiyuki Namioka, Saitama JP
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20100165205 | VIDEO SIGNAL SHARPENING APPARATUS, IMAGE PROCESSING APPARATUS, AND VIDEO SIGNAL SHARPENING METHOD - According to one embodiment, a video signal sharpening apparatus includes a video signal sharpening module and a sharpening parameter controller. The video signal sharpening module performs a sharpening process on a decoded video signal based on a sharpening parameter. In the sharpening process, the video signal sharpening module estimates an original pixel value from the decoded video signal and increases the pixels to obtain a high-resolution video signal. The decoded video signal is obtained by a decoder decoding an encoded video signal. The sharpening parameter controller determines the amount of variation in noise and detail component that varies by an I-frame period in a group of pictures (GOP) period of the decoded video signal, and controls the sharpening parameter for the video signal sharpening module. | 07-01-2010 |
20110050739 | IMAGE PROCESSOR AND IMAGE PROCESSING METHOD - According to one embodiment, an image processor includes: a luminance calculator configured to calculate a luminance of an illumination light based on an image signal, the illumination light illuminating a display screen displaying the image signal; a gradation corrector configured to correct a first gradation of the image signal to a second gradation, based on the luminance; a parameter determining module configured to determine a parameter of gradation smoothing process to be performed on an amplitude of the image signal based on the luminance; and a processing module configured to perform the gradation smoothing process on the image signal with the second gradation, by using the parameter. | 03-03-2011 |
Toshiyuki Namioka, Tokorozawa-Shi JP
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20090079866 | Video Signal Oblique Interpolating Apparatus and Method - A data interpolation apparatus at intermediate pixels between upper and lower pixels. An upper oblique correlation is calculated between data of an immediate upper pixel and a corresponding lower pixel positioned downward in a maximum correlation direction with respect to the immediate upper pixel. A lower oblique correlation is similarly calculated between data of an immediate lower pixel and a corresponding upper pixel. An interpolation signal is obtained by mixing an oblique pixel sum and a vertical pixel sum, while changing mixing ratio based on a comparison of a vertical correlation, and the upper and lower oblique correlation. When the interpolation signal is constituted without the vertical pixel sum, an interpolation signal with respect to intermediate pixels immediate upward/downward of the corresponding lower/upper pixel is generated by excluding a vertical sum that includes data of the corresponding upper and/or lower pixels. | 03-26-2009 |
20110075028 | COLOR DIFFERENCE SIGNAL FORMAT CONVERSION DEVICE AND METHOD - According to one embodiment, an IP converter converts an interlaced color difference signal, in which the number of pixels in a vertical direction of a color difference signal is half that of a luminance signal, into a progressive color difference signal. A diagonal correlation detector detects a diagonal correlation of the progressive color difference signal, and obtains a correlative direction detected signal. A controller outputs a field selection signal to determine whether the progressive color difference signal is a signal in a top or bottom field. And a pixel generator changes a ratio between pixels of an n | 03-31-2011 |
Toshiyuki Namioka, Kumagaya Saitama JP
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20160118019 | IMAGE PROCESSING DEVICE AND IMAGE PROCESSING METHOD - An image processing device has a communication module which performs information communication with a color gamut information providing device for providing color gamut information concerning a color gamut of video data of a received broadcast program, a controller which acquires the color gamut information of the video data from the color gamut information providing device through the communication module, and an image quality corrector which restores the color gamut of the video data of the broadcast program, based on the color gamut information acquired by the controller. | 04-28-2016 |