Patent application number | Description | Published |
20100145390 | Systems, Devices and Methods for Stabilization of the Spinal Column - A system for stabilization of the spinal column, including an elongate support member extending along an axis and a plurality of anchor members configured for anchoring to respective vertebrae. A first of the anchor members is engaged to the support member in a manner that substantially prevents axial movement of the support member relative to the first anchor member, and a second of the anchor members is engaged to the support member in a manner that allows substantially unconstrained axial movement of the support member relative to the second anchor member. In a further embodiment, a third of the anchor members is engaged to the support member in a manner that also allows substantially unconstrained axial movement of the support member relative to the third anchor member, with the second and third anchor members positioned on opposite sides of the first anchor member. | 06-10-2010 |
20100198270 | Multi-Axial Bone Screw Assembly - A bottom-loading multi-axial bone anchor apparatus is disclosed. The apparatus includes a receiver member, a crown member, a bone anchor and a retaining member. The receiver member defines an upper opening and a lower opening, which may form part of the same opening, a channel, and a groove. The crown member and bone anchor are loaded into the lower opening of the receiver member, and the retaining member fits around the bone anchor and into the groove in the receiver member. The bone anchor is capable of multi-axial positioning with respect to the receiver member. An elongated member is placed in the channel of the receiver member, contacting the crown member, and a compression member is applied via the upper opening. The compression member presses down on the elongated member, which presses down on the crown member and locks the bone anchor between the crown member and the retaining member. | 08-05-2010 |
20110071577 | Multi-Axial Bone Screw Assembly - A bottom-loading multi-axial bone anchor apparatus is disclosed. The apparatus includes a receiver member, a crown member, a bone anchor and a retaining member. The receiver member defines an upper opening and a lower opening, which may form part of the same opening, a channel, and a groove. The crown member and bone anchor are loaded into the lower opening of the receiver member, and the retaining member fits around the bone anchor and into the groove in the receiver member. The bone anchor is capable of multi-axial positioning with respect to the receiver member. An elongated member is placed in the channel of the receiver member, contacting the crown member, and a compression member is applied via the upper opening. The compression member presses down on the elongated member, which presses down on the crown member and locks the bone anchor between the crown member and the retaining member. | 03-24-2011 |
20110282388 | Multi Axial Cross Link Connector System for Spinal Implants - This invention relates to interconnection assemblies for use with spinal fixation systems to treat spinal defects. The interconnection assemblies can include various spinal rod connecting members and interconnecting elements to secure the spinal rod connecting members to each other in variable orientations and lengths. The interconnection assemblies can be adjusted to minimize interference with the spinal column, bony processes, and associated neural, muscular, and ligament components of the spine all the while exhibiting a low profile. The interconnecting elements and related components can be provided as a completely assembled unit that does not inadvertently become disassembled prior to or during implantation. | 11-17-2011 |
20130110163 | ATTACHMENT MECHANISM FOR MATERIAL AND BONE | 05-02-2013 |
20130110173 | ATTACHMENT MECHANISM FOR MATERIAL AND BONE | 05-02-2013 |
20130190824 | SPINAL CORRECTION SYSTEM AND METHOD - A fusionless correction system comprises a longitudinal element extending between a first end and second end. At least one fixation element is disposed with the longitudinal element and is configured for disposal in bone. A lock is disposed with the at least one fixation element and includes at least one bone penetrating projection. The lock is movable relative to the at least one fixation element between a first non-engaging configuration and a second engaging configuration such that the at least one bone penetrating projection extends beyond an outer surface of the at least one fixation element. Methods of use are disclosed. | 07-25-2013 |
20140257396 | SPINAL CORRECTION SYSTEM AND METHOD - A spinal correction system comprises a first member configured for attachment to a first portion of vertebral tissue and a second member is configured for attachment to a second portion of the vertebral tissue spaced from the first portion. A third member has a non-flexible configuration relative to the first and second members and is configured for attachment to an apical portion of the vertebral tissue and along at least a portion of at least two vertebrae. The third member extends between a first end connected to the first member at a first transition configured for attachment to the first vertebral tissue and a second end connected to the second member at a second transition configured for attachment to the vertebral tissue. Methods of use are disclosed. | 09-11-2014 |
20160095630 | SPINAL CORRECTION SYSTEM AND METHOD - A spinal correction system comprises a first member configured for attachment to a first portion of vertebral tissue and a second member is configured for attachment to a second portion of the vertebral tissue spaced from the first portion. A third member has a non-flexible configuration relative to the first and second members and is configured for attachment to an apical portion of the vertebral tissue and along at least a portion of at least two vertebrae. The third member extends between a first end connected to the first member at a first transition configured for attachment to the first vertebral tissue and a second end connected to the second member at a second transition configured for attachment to the vertebral tissue. Methods of use are disclosed. | 04-07-2016 |
Patent application number | Description | Published |
20120238073 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma. | 09-20-2012 |
20130065378 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma. | 03-14-2013 |
20130230968 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma. | 09-05-2013 |
20130230969 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma. | 09-05-2013 |
20130230970 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma. | 09-05-2013 |
20130230971 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma processing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; loading a work piece onto the work piece support, the work piece having a support film, a frame and the substrate; providing a cover ring above the work piece, the cover ring having at least one perforated region, and at least one non-perforated region; generating a plasma using the plasma source; and processing the work piece using the generated plasma. | 09-05-2013 |
20130230972 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma. | 09-05-2013 |
20130230973 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma dicing a substrate, the method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing a work piece onto the work piece support, said work piece having a support film, a frame and the substrate; loading the work piece onto the work piece support; applying a tensional force to the support film; clamping the work piece to the work piece support; generating a plasma using the plasma source; and etching the work piece using the generated plasma. | 09-05-2013 |
20130230974 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma. | 09-05-2013 |
20130344683 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma processing a substrate, the method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; loading a work piece onto the work piece support, the work piece having a support film, a frame and the substrate; providing at least two cutting regions on the substrate, the cutting regions being positioned between all adjacent device structures on the substrate; generating a plasma using the plasma source; and processing the work piece using the generated plasma. | 12-26-2013 |
20140154869 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma processing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; loading a work piece onto the work piece support, the work piece having a support film, a frame and the substrate; providing a cover ring above the work piece, the cover ring having at least one perforated region, and at least one non-perforated region; generating a plasma using the plasma source; and processing the work piece using the generated plasma. | 06-05-2014 |
20140235034 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma. | 08-21-2014 |
20150255297 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma. | 09-10-2015 |
20150255347 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma. | 09-10-2015 |
20150270121 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma. | 09-24-2015 |
20150371878 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma. | 12-24-2015 |
20160111332 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma. | 04-21-2016 |
Patent application number | Description | Published |
20120304368 | Strap - The present invention provides a strap for securing a garment/article (e.g. swimming goggles) to a wearer's/user's body. The strap comprises a first portion comprising a tensioner end including a tensioner having an attachment portion. The attachment portion is for attachment to the tensioner end. The strap further comprises a second portion having indicia provided along at least a part of its length. In use, the second portion passes through the tensioner and the tensioner frame defines a window in which at least one of the indicia on the second portion is visible. | 12-06-2012 |
20140090142 | Sports Garment - The present invention aims to reduce form drag and provides a sports garment having a chest-covering portion ( | 04-03-2014 |
20140096301 | Sports Garment - The present invention provides a garment ( | 04-10-2014 |
20140096313 | Strap - The present invention provides a strap for securing a garment or article (e.g. swimming goggles) to a wearer's/user's body. The strap comprises a first portion ( | 04-10-2014 |
20140109281 | Swimming Cap - The present invention provides a swimming cap ( | 04-24-2014 |
20140115760 | Goggles - The present invention relates to goggles, preferably extra-orbital goggles, having an outer surface defined by a pair of lens portions each having an upper and a lower peripheral wall. The upper and lower peripheral walls extend to an upper and lower peripheral edge respectively which, in use, are in contact with the wearers face. The outer surface defined by the upper peripheral walls is convex. This contributes to a goggle outer surface which is a smooth curve. | 05-01-2014 |
20150305655 | Activity Monitors - An activity monitor that is worn by a user for monitoring water-based activities. The activity monitor includes at least one motion sensor, a water sensor, a memory, and a processor. The processor is operable to run an algorithm to calculate activity data based on an output from the motion sensor and to save the activity data to the memory. The processor can be triggered to operate to calculate the activity data and to save it to memory by an output from the water sensor to indicate that the monitor is immersed in water. | 10-29-2015 |