Patent application number | Description | Published |
20080238804 | MULTI-BAND HIGHLY ISOLATED PLANAR ANTENNAS INTEGRATED WITH FRONT-END MODULES FOR MOBILE APPLICATIONS - An embodiment of the present invention provides an apparatus, comprising a multi-band highly isolated planar antenna directly integrated with a front-end module (FEM). | 10-02-2008 |
20080297429 | CMOS IC and high-gain antenna integration for point-to-point wireless communication - A point-to-point radio communications device, with an integrated antenna-IC module, includes highly-directional antenna elements and silicon CMOS-based ICs in plastic packaging material. The high-gain horn-type antenna includes two sections made of molded plastic and covered in a metallic coating. When combined, the two sections form an aperture and an opening on a face. The face of the antenna element can be mounted directly to an integrated circuit with an antenna coupling element, such that the aperture forms a horn-IC module. The module can be completely enclosed in a plastic-packaging environment using low-cost approach. The antenna-IC module can be manufactured as an integral part of a case for a point-to-point wireless electronic device such as a mobile video phone or a set-top box with tens of gigabits of video downloading capability. | 12-04-2008 |
20090231225 | Wireless antenna array system architecture and methods to achieve 3D beam coverage - Embodiments of wireless antenna array systems to achieve three-dimensional beam coverage are described herein. Other embodiments may be described and claimed. | 09-17-2009 |
20090303147 | SECTORIZED, MILLIMETER-WAVE ANTENNA ARRAYS WITH OPTIMIZABLE BEAM COVERAGE FOR WIRELESS NETWORK APPLICATIONS - Planar, sectorized, millimeter-wave antenna arrays may include one or more of housings of dielectric material, such as split-blocks of a plastic material, having metallized plastic horns and waveguides formed, etched, and/or cut therein, waveguide-to-planar-transmission-line transition devices and planar structures embedded therein, and one or more integrated circuits coupled thereto. | 12-10-2009 |
20090322643 | Integrated high performance package systems for mm-wave array applications - Embodiments of integrated high performance package systems for millimeter-wave array applications are described herein. Other embodiments may be described and claimed. | 12-31-2009 |
20100164783 | Platform Integrated Phased Array Transmit/Receive Module - Disclosed are integration approaches for mm-wave planar phased array type architectures using multilayer substrate technologies. For instance, an apparatus may include a plurality of substrate layers, an integrated circuit, and a connector module. The plurality of substrate layers includes a first substrate layer having one or more phased array elements. The integrated circuit exchange one or more radio frequency (RF) signals (e.g., mm-wave signals) with the one or more phased array elements. The connector module exchange further signals with the integrated circuit that correspond to the one or more RF signals. For example, these further signals may be baseband or intermediate frequency (IF) signals. | 07-01-2010 |
20100167666 | Integrated Array Transmit/Receive Module - Disclosed are integration approaches for mm-wave array type architectures using multilayer substrate technologies. For instance, an apparatus may include a first substrate layer, a second substrate layer, and a third substrate layer. The first substrate layer has a first plurality of array elements, and the second substrate layer has a second plurality of array elements. The third substrate layer has an integrated circuit to exchange one or more radio frequency (RF) signals with the first and second pluralities of array elements. The first and second substrate layers are separated by approximately a half wavelength (λ/2) corresponding to the one or more RF signals. | 07-01-2010 |
20100214186 | CMOS IC AND HIGH-GAIN ANTENNA INTEGRATION FOR POINT-TO-POINT WIRELESS COMMUNICATION - A point-to-point radio communications device, with an integrated antenna-IC module, includes highly-directional antenna elements and silicon CMOS-based ICs in plastic packaging material. The high-gain horn-type antenna includes two sections made of molded plastic and covered in a metallic coating. When combined, the two sections form an aperture and an opening on a face. The face of the antenna element can be mounted directly to an integrated circuit with an antenna coupling element, such that the aperture forms a horn-IC module. The module can be completely enclosed in a plastic-packaging environment using low-cost approach. The antenna-IC module can be manufactured as an integral part of a case for a point-to-point wireless electronic device such as a mobile video phone or a set-top box with tens of gigabits of video downloading capability. | 08-26-2010 |
20110014878 | WIRELESS ANTENNA ARRAY SYSTEM ARCHITECTURE AND METHODS TO ACHIEVE 3D BEAM COVERAGE - Embodiments of wireless antenna array systems to achieve three-dimensional beam coverage are described herein. Other embodiments may be described and claimed. | 01-20-2011 |
20110147920 | APPARATUS AND METHOD FOR EMBEDDING COMPONENTS IN SMALL-FORM-FACTOR, SYSTEM-ON-PACKAGES - According to various aspects of the present disclosure, an apparatus is disclosed that includes a small form factor mobile platform including a system-on-package architecture, the system-on-package architecture arranged as a stack of layers including: a first layer having a first conformable material; a second layer having a second conformable material; a third layer having a third material; and one or more electronic components embedded within the stack of layers, wherein the first conformable material, the second conformable material, or both are configured to allow high frequency signal routing. | 06-23-2011 |
20140152518 | DUAL-BAND FOLDED META-INSPIRED ANTENNA WITH USER EQUIPMENT EMBEDDED WIDEBAND CHARACTERISTICS - Embodiments of a folded meta-inspired antenna for dual-band operation and user equipment for dual-band operation in a wireless network are generally described herein. In some embodiments, the folded meta-inspired antenna may include first and second conductive layers disposed on opposite sides of a substrate to provide a wideband distributed structure comprising a plurality of high-Q resonances resulting from, at least in part, metamaterial-based loading. Conductive material on the first side of the substrate is arranged around a central longitudinal slot coupled with a plurality of perpendicular slots. For dual-band operation, the folded meta-inspired antenna may operate as a folded monopole at a higher frequency band and operate as a slot-type radiator at a lower frequency band. The plurality of resonances may cause the folded meta-inspired antenna to achieve broader bandwidth at both lower and higher frequency bands. | 06-05-2014 |
20140242927 | UNIVERSAL IO CONNECTOR AND INTERFACE CAPABLE OF BOTH WIRED AND WIRELESS OPERATION - Systems and methods of interconnecting devices may include a connector assembly having a substrate, a set of input/output (IO) contacts, an antenna structure and transceiver logic. In one example, the transceiver logic may process one or more IO signals associated with the antenna structure and process one or more IO signals associated with the set of IO contacts. | 08-28-2014 |
20140342679 | APPARATUS AND METHOD FOR EMBEDDING COMPONENTS IN SMALL-FORM-FACTOR, SYSTEM-ON-PACKAGES - According to various aspects of the present disclosure, devices and methods are disclosed that include communication platform including a small form factor platform having a system-on-package architecture. The system-on-package architecture may be arranged as a stack of layers including: a first layer of the stack of layers having a first conformable material; a second layer of the stack of layers having a second conformable material; a third layer of the stack of layers having a third material, wherein the first conformable material and the second conformable material are more flexible than the third material; and one or more electronic components embedded within the stack of layers, wherein the one or more electronic components are configured to process a received wireless signal. | 11-20-2014 |
20150086084 | SYSTEMS AND METHODS FOR MAPPING - Systems and methods to generate maps or models of structures are disclosed. Features of the structure to be mapped may be determined for the purposes of generating the map or model based at least in part on images associated with the structure, sensor measurements associated with the structure, and phase data of communications signals that interact with the structure. The mapping or modeling processes may be performed at a mapping server that receives images, sensor data, and/or communications signal phase information from one or more user devices, such as mobile devices. The mapping servers may perform a simultaneous localization and mapping (SLAM) process and may enhance the generated maps using sensor and/or communications phase data to map one or more hidden features of the structure. | 03-26-2015 |