Patent application number | Description | Published |
20080238553 | POWER AMPLIFYING DEVICE HAVING LINEARIZER - There is provided a power amplifying device having a linearizer in which a bias circuit has an initial impedance set when initially operated, then the impedance is varied according to a level of an input signal and the input signal is amplified in a broad range from a low level region to a high level region, thereby improving linearity of an output signal. The power amplifying device including: an amplifying unit receiving a bias power source and amplifying an input signal; a bias unit varying the bias power source according to a set impedance to provide to the amplifying unit; and an impedance setting unit setting the impedance of the bias unit in response to a preset control voltage when the bias unit is initially operated and re-setting the impedance of the bias unit according to a level of the input signal of the amplifying unit after initial operation of the bias unit. | 10-02-2008 |
20080303120 | Semiconductor chip package - A semiconductor chip package includes a main board; a ceramic substrate having a cavity within which at least one chip is electrically mounted, the cavity being placed at a lower portion of the ceramic substrate facing the main board; and a conductive shielding layer provided with a predetermined thickness on the outside of the ceramic substrate. The ceramic substrate includes: at least one first ground line electrically connecting the conductive shielding layer with the main board; at least one second ground line electrically connecting the conductive shielding layer with the chip; and at least one signal line electrically connecting the chip with the main board. Thus, manufacturing costs are lowered because of the reduced number of components being used, miniaturization in device design can be achieved because of the small volume of the package, and the ground performance can be improved. | 12-11-2008 |
20090184779 | WIRELESS COMMUNICATION MODULE - A wireless communication module includes a laminated substrate where a plurality of dielectric sheets are laminated, a band pass filter, a balun circuit, and first and second matching circuits. The band pass filter is formed in the laminated substrate. The balun circuit is formed in the laminated substrate, and includes an unbalanced element having one end connected to the band pass filter. The first and second matching circuits are formed in the laminated substrate, and each of them is connected to one end of each of balanced elements of the balun circuit. Herein, at least one of the band pass filter, the balun circuit, the first matching circuit, and the second matching circuit is formed between the dielectric sheets of the laminated substrate using a distributed element. | 07-23-2009 |
20100020499 | ELECTRONIC CHIP MODULE - Provided is an electron chip module having a heat sink that can increase heat dissipation efficiency. A bottom surface of a module circuit board and an upper surface of a heat sink are in direct contact with each other by using a metal wire, such that heat generated during the operation of a heat-generating device chip mounted onto the module circuit board can be effectively dissipated to the outside. | 01-28-2010 |
20100053908 | Electric device module - There is provided an electric device module including: a housing; a board member fixed to one inner side of the housing and including a plurality of connecting terminals; at least one board adhered to another inner side of the housing by a predetermined adhesive and including a plurality of terminals electrically connected to the plurality of connecting terminals; and a guider guiding a mounting position of the board. In the electric device module, a circuit board is prevented from changing in adhering position due to fluidity of an adhesive but can be adhered at a precise position. Also, an extra amount of the adhesive is prevented from flowing outside the circuit board to thereby enhance accuracy and reliability in terms of terminal connection. | 03-04-2010 |
20100055393 | MULTILAYER CERAMIC SUBSTRATE - There is provided a multilayer ceramic substrate including a conductive via of a dual-layer structure capable of preventing loss in electrical conductivity and signal. The multilayer ceramic substrate includes: a plurality of dielectric layers; and a circuit pattern part formed on at least a portion of the dielectric layers, the circuit pattern part including at least one conductive via and conductive pattern, wherein the at least one conductive via comprises an outer peripheral portion and an inner peripheral portion, the outer peripheral portion formed along an inner wall of a via hole extending through the dielectric layers and formed of a first conductive material containing a metal, and the inner peripheral portion filled in the outer peripheral portion and formed of a second conductive material having a shrinkage initiation temperature higher than a shrinkage initiation temperature of the first conductive material. | 03-04-2010 |
20100102430 | SEMICONDUCTOR MULTI-CHIP PACKAGE - A semiconductor multichip package includes a substrate having a top surface on which a bonding pad is formed, and a bottom surface opposing the top surface, on which an external connection terminal electrically connected with the bonding pad is formed, a first semiconductor chip mounted on a region of the top surface of the substrate excluding the bonding pad, a ceramic spacer disposed on a top surface of the first semiconductor chip and including a passive device therein, and at least one second semiconductor chip disposed on a top surface of the ceramic spacer. The ceramic spacer includes an interlayer circuit for an electrical connection between the first and second semiconductor chips, and the passive device is electrically connected to at least one of the first and second semiconductor chips. Accordingly, a package with a more compact structure can be realized. | 04-29-2010 |
20100105171 | SEMICONDUCTOR CHIP, METHOD OF MANUFACTURING THE SEMICONDUCTOR CHIP AND SEMICONDUCTOR CHIP PACKAGE - In a semiconductor chip, a body has a top surface where a pattern is formed, an underside surface opposing the top surface and a plurality of side surfaces. A plurality of electrode pads are formed on the top surface of the body to connect to an external terminal. A shielding conductive film is formed on the surfaces excluding the top surface of the body where the pattern is formed. A conductive via is extended through the body to connect one of the electrode pads with the conductive film. | 04-29-2010 |
20100171200 | SEMICONDUCTOR CHIP PACKAGE - A semiconductor chip package includes a main board; a ceramic substrate having a cavity within which at least one chip is electrically mounted, the cavity being placed at a lower portion of the ceramic substrate facing the main board; and a conductive shielding layer provided with a predetermined thickness on the outside of the ceramic substrate. The ceramic substrate includes: at least one first ground line electrically connecting the conductive shielding layer with the main board; at least one second ground line electrically connecting the conductive shielding layer with the chip; and at least one signal line electrically connecting the chip with the main board. Thus, manufacturing costs are lowered because of the reduced number of components being used, miniaturization in device design can be achieved because of the small volume of the package, and the ground performance can be improved. | 07-08-2010 |
20110063066 | SPACE TRANSFORMER FOR PROBE CARD AND METHOD OF REPAIRING SPACE TRANSFORMER - A space transformer for a probe card includes: a multilayered circuit board having first and second faces which face each other and a plurality of side faces connecting the first and second faces; a plurality of channels including a first pad formed on the first face and receiving an electrical signal applied from the exterior, a second pad formed on the second face, to which a probe is connected, and a through wiring penetrating the multilayered circuit board and connecting the first and second pads; and side wirings formed on the side faces and connecting first and second pads of a damaged channel among a plurality of channels. When a portion of channels transferring an electrical signal to probes is damaged, the space transformer can repair the damaged channel by means of the side wirings. | 03-17-2011 |
20120007781 | ANTENNA MODULE - There is provided an antenna module. The antenna module according to the present invention may include a patch antenna resonator formed on a surface of a dielectric substrate; and a surface wave-radiation resonator disposed to be separated from the patch antenna resonator, and formed to surround the patch antenna resonator so that signals from the patch antenna resonator are radiated. In this instance, the signals may flow on the surface of the dielectric substrate. | 01-12-2012 |
20120028018 | LTCC COMPOSITION, LTCC SUBSTRATE COMPRISING THE SAME AND METHOD OF MANUFACTURING THE SAME - There is provided a Low Temperature Co-fired Ceramic (LTCC) composition, an LTCC substrate comprising the same, and a method of manufacturing the same. The LTCC composition includes 20 to 70 parts by weight of ceramic powder; and 30 to 80 parts by weight of glass component for low-temperature sintering, wherein the ceramic powder has plate-shaped ceramic powder particles and globular ceramic powder particles, and the ceramic powder has a content ratio of the globular ceramic powder particles with respect to the plate-shaped ceramic powder particles in a range of 0 to 1. | 02-02-2012 |
20120037610 | CERAMIC FIRING FURNACE - A ceramic firing furnace is provided. A uniform gas atmosphere is formed in the ceramic firing furnace to thus minimize a defective ceramic substrate when the ceramic substrate is fired. The ceramic firing furnace includes: a case having an internal space in which a shaped body is disposed; a heating element disposed in the interior of the case and radiating heat; and a plurality of air supply units fastened through the case such that the plurality of air supply units are rotatable by an external force, and supplying a gas to the internal space of the case. | 02-16-2012 |