Patent application number | Description | Published |
20120299038 | LIGHT EMITTING DEVICE AND LIGHT EMITTING APPARATUS - A light emitting device may be provided that includes a substrate, a light emitting structure, a first electrode under the first semiconductor layer, a reflective electrode layer under the second conductive semiconductor layer, a second electrode under the reflective electrode layer, and a support member under the first semiconductor layer and the reflective electrode layer around the first and second electrodes. A first connection electrode may be provided under the first electrode. At least a part of the first connection electrode is provided in the support member. A second connection electrode may be provided under the second electrode At least a part of the second connection electrode may be provided in the support member. | 11-29-2012 |
20130020109 | Package and Manufacturing Method of the Same - Provided are a package including a first conductive layer on a patterned layer, an insulating layer on the patterned layer burying the first conductive layer, a second conductive layer on an outer surface of the insulating layer, and a third conductive layer in the insulating layer electrically connecting the first conductive layer with the second conductive layer. A substrate is formed by printing or coating a paste- or ink-type insulator and conductor on a patterned layer formed on a sapphire wafer. No void is created between the substrate and LED chip, thus enhancing attachment strength. The ceramic-containing insulator is cured at a low temperature, thereby minimizing contraction of and damage to the wafer when the ceramic is fired. Printing methods utilizing viscous paste or ink solves problems with co-planarity of substrate that occur in existing wafer-to-wafer bonding processes and renders several steps of the existing substrate manufacturing process unnecessary. | 01-24-2013 |
20130119424 | LIGHT EMITTING DEVICE AND LIGHT EMITTING APPARATUS HAVING THE SAME - A light emitting device is provided a transmissive substrate; a first pattern portion including a protrusions; a second pattern portion including a concaves having a width smaller than a width of each protrusion; a light emitting structure under the transmissive substrate and including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer; a first electrode under the first conductive semiconductor layer; a reflective electrode layer under the second conductive semiconductor layer; a second electrode under the reflective electrode layer; a first connection electrode under the first electrode; a second connection electrode under the second electrode; and an insulating support member around the first electrode and the first connection electrode and around the second electrode and the second connection electrode and including a ceramic-based thermal diffusion agent. | 05-16-2013 |
20130193464 | LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE AND LIGHT EMITTING MODULE - Disclosed are a light emitting device, a light emitting device package and a light emitting module. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer between the first and second conductive semiconductor layers; a support member under the light emitting structure; a reflective electrode layer between the second conductive semiconductor layer and the support member; and first to third connection electrodes spaced apart from each other in the support member. The second connection electrode is disposed between the first and third connection electrodes, the first and third connection electrodes are electrically connected with each other, and the support member is disposed at a peripheral portion of the first to third connection electrodes. | 08-01-2013 |
20150179884 | LIGHT EMITTING DEVICE AND LIGHT EMITTING APPARATUS HAVING THE SAME - A light emitting device is provided a transmissive substrate; a first pattern portion including a protrusions; a second pattern portion including a concaves having a width smaller than a width of each protrusion; a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer, under the transmissive substrate; a first electrode under the first conductive semiconductor layer; a reflective electrode layer under the second conductive semiconductor layer; a second electrode under the reflective electrode layer; a first connection electrode under the first electrode; a second connection electrode under the second electrode; and an insulating support member around the first electrode and the first connection electrode and around the second electrode and the second connection electrode. A transmissive resin layer is on the transmissive substrate and an insulating layer is between the insulating support member and the reflective electrode layer. | 06-25-2015 |
20150319856 | EPOXY RESIN COMPOSITION, AND PRINTED CIRCUIT BOARD USING SAME - According to one embodiment of the present invention, an epoxy resin composition comprises an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler includes boron nitride (BN). | 11-05-2015 |
Patent application number | Description | Published |
20100091092 | Image processing apparatus and method - An image processing apparatus is disclosed. A calculation unit may determine a disocclusion region of a first frame of a video. A processing unit may generate color information of the disocclusion region of the first frame using color information associated with a second frame of the video. | 04-15-2010 |
20100128034 | Apparatus and method for processing three dimensional image on multi-layer display - An apparatus and method of processing three-dimensional (3D) images on a multi-layer display may generate virtual depth information based on original depth information, and display 3D images having various depth values using the generated virtual depth information. Also, the apparatus and method may appropriately provide color information to each of a plurality of display layers, thereby preventing an original image from being damaged. | 05-27-2010 |
20100134493 | Apparatus and method for compensating for crosstalk between views in three dimensional (3D) display apparatus - Provided are a method and apparatus for compensating for a crosstalk between views in a three-dimensional (3D) display apparatus. The method and the apparatus may pre-set a crosstalk weight matrix through an actual measurement by considering a characteristic of a display. The crosstalk weight matrix may offset an effect that each of multiple views affects other different views. Also, when multi-view input signals are received, the method may generate luminance-compensated multi-view input signals by multiplying the crosstalk weight matrix and a luminance matrix that includes a luminance of each of the multi-view input signals, and may output the luminance compensated multi-view input signals as input signals of the display. | 06-03-2010 |
20100315488 | Conversion device and method converting a two dimensional image to a three dimensional image - Disclosed is an image conversion device and method converting a two-dimensional (2D) image into a three-dimensional (3D) image. The image conversion device may selectively adjust illumination within the 2D image, generate a disparity map for the illumination adjusted image, and selectively adjust a depth value of the disparity map based on edge discrimination. | 12-16-2010 |
20100316284 | Three-dimensional image generation apparatus and method using region extension of object in depth map - A three-dimensional (3D) image generation apparatus and method using a region extension of an object in a depth map is provided. The 3D image generation apparatus may include a discontinuity preservation smoothing filtering unit to apply a discontinuity preservation smoothing filter preserving discontinuity of a boundary or a shape of a depth image, a boundary preservation filtering unit to apply a max filter to a depth image for increasing a depth value of an object, and a rendering unit to render a two-dimensional (2D) color image and the filtered depth image and to generate a 3D image. | 12-16-2010 |
20130182945 | IMAGE PROCESSING METHOD AND APPARATUS FOR GENERATING DISPARITY VALUE - A method and apparatus for processing an image is provided. The image processing apparatus may adjust or generate a disparity of a pixel, by assigning similar disparities to two pixels that are adjacent to each other and have similar pixels. The image processing apparatus may generate a final disparity map that may minimize energy, based on an image and an initial disparity map, under a predetermined constraint. A soft constraint or a hard constraint may be used as the constraint. | 07-18-2013 |
20140368612 | IMAGE PROCESSING APPARATUS AND METHOD - An image processing apparatus is disclosed. A calculation unit may determine a disocclusion region of a first frame of a video. A processing unit may generate color information of the disocclusion region of the first frame using color information associated with a second frame of the video. | 12-18-2014 |
Patent application number | Description | Published |
20130248583 | REFLOW INSPECTION SYSTEM AND CONTROL METHOD THEREOF - Disclosed herein is a reflow inspection system. The reflow inspection system according to an embodiment of the present invention includes an oven, a stage on which a reflow inspection target is placed inside the oven, and which includes a temperature detecting sensor for detecting a temperature of the reflow inspection target formed on one side thereof; a light source unit formed on one side of the oven and irradiating the reflow inspection target with light, an imaging unit sucking smoke generated in the reflow inspection target, and obtaining image information of the reflow inspection target to thereby transmit the obtained image information to the outside, an image processing unit processing the image information obtained in the imaging unit, and a control unit connected to the stage, the temperature detecting sensor, and the image processing unit to perform control of a reflow inspection process. | 09-26-2013 |
20130251887 | NANO-PATTERNING APPARATUS, SYSTEM HAVING THE SAME, AND CONTROL METHOD THEREOF - Disclosed herein is a nano-patterning system including a nano-patterning apparatus. The nano-patterning apparatus includes: a holder unit including a transfer unit and an insulating unit; a tip unit inserted into the holder unit, downwardly protruded, and having a flow channel; a flow path having one end connected to the flow channel through one side of the transfer unit or the insulating unit and extending to the outside to serve as a movement path allowing a nano-patterning material to move therealong; a pressing unit pressing the nano-patterning material at one side of the flow path; and a storage unit connected to the other end of the flow path and storing the nano-patterning material. | 09-26-2013 |
20130292457 | SOLDER SHEET AND SMOLDERING METHOD USING THE SAME - Disclosed herein are a solder sheet and a soldering method using the same. The solder sheet includes: a plurality of solder rods arranged to have a uniform height h and an area density N; and a support having an adhesive formed on one surface thereof and supporting the plurality of solder rods such that one end of each of the plurality of solder rods is attached to be perpendicular to the surface on which the adhesive is formed. Solder bumps can be formed on soldering portions of the substrate by using the solder sheet through a single process without a mask, and thus, the process can be simplified, costs can be reduced, and a defect rate can be lowered, thereby enhancing reliability. | 11-07-2013 |
20130334290 | SOLDER PASTE DROPLET EJECTION APPARATUS, PATTERNING SYSTEM HAVING THE SAME, AND CONTROL METHOD THEREOF - Disclosed herein is a solder paste droplet ejection apparatus including: a nozzle cap forming an appearance and including a heating electric wire provided inside thereof; a nozzle unit formed inside the nozzle cap, spaced apart from the nozzle cap, and surrounded by the nozzle cap; an ejection probe formed inside the nozzle unit, spaced apart from the nozzle unit, and surrounded by the nozzle unit; and a transfer unit formed in a top portion of the nozzle cap and used for a minute movement, wherein a solder paste supplied in a space between the nozzle unit and the ejection probe is ejected in a droplet shape along the ejection probe. | 12-19-2013 |
Patent application number | Description | Published |
20100096691 | SEMICONDUCTOR DEVICE HAVING VERTICALLY ALIGNED PILLAR STRUCTURES THAT HAVE FLAT SIDE SURFACES AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device having vertically aligned transistors made from pillar structures that have flat side surfaces is presented. The semiconductor device includes a semiconductor substrate, spacers, and gates. The semiconductor substrate has lo pillar structures that have flat side surfaces. The spacers are on sidewalls only on the upper portions of the pillar structures. The gates surround lower portions of the pillar structures. | 04-22-2010 |
20110184042 | RNA Aptamer Specifically Binding to Carcinoembryonic Antigen and Use thereof - Provided are RNA aptamer specifically binding to cancer metastasis-inducing domain of CEA (Carcinoembryonic antigen), a composition for prevention and/or inhibition and/or diagnosis of cancer metastasis containing the same as an active ingredient, and a method of prevention and/or inhibition and/or diagnosis of cancer metastasis using the same. | 07-28-2011 |
20120299783 | ANTENNA STRUCTURE - An antenna structure includes: a substrate; a ground layer disposed on a first surface of the substrate; a patch antenna unit which is disposed on a second surface of the substrate opposite to the first surface of the substrate, and is configured to receive a signal to be radiated; and a three-dimensional (3D) antenna unit which comprises a shorting leg that is shorted with the patch antenna unit, and is configured to radiate the signal received by the patch antenna unit. | 11-29-2012 |
20140125526 | MULTIBAND ANTENNA AND ELECTRONIC APPARATUS HAVING THE SAME - A multiband antenna apparatus and an electronic apparatus having the multiband antenna apparatus are provided. The multiband antenna apparatus includes: a low frequency antenna which transmits and receives at least one low frequency band signal; and a high frequency antenna which transmits and receives at least one high frequency band signal, wherein the low frequency antenna includes a single wing part which emits an electric wave. | 05-08-2014 |
20140125529 | ANTENNA DEVICE AND ELECTRONIC APPLIANCE HAVING THE SAME - An antenna device which is built into an electronic appliance having a metal cover provided with a radio wave passer is provided. The electronic apparatus includes an antenna portion arranged adjacent to the radio wave passer so as to be capable of transmitting and receiving radio waves through the radio wave passer. A reflecting portion which reflects the radio waves radiated from the antenna portion is located on an opposite side of the antenna portion, so that the antenna portion is between the reflecting portion and the radio wave passer. | 05-08-2014 |
20140125541 | END FIRE ANTENNA APPARATUS AND ELECTRONIC APPARATUS HAVING THE SAME - An end fire antenna apparatus built in an electronic apparatus includes a printed circuit board (PCB), at least one main antenna built in the PCB and configured to radiate a radio wave, and a ground plate disposed on a side surface of the PCB, the ground plate being electrically isolated from the at least one main antenna. The at least one main antenna has a pillar shape uniformly extending along a thickness direction of the PCB. | 05-08-2014 |
20140235698 | RNA Aptamer Specifically Binding to Carcinoembryonic Antigen and Use thereof - Provided are RNA aptamer specifically binding to cancer metastasis-inducing domain of CEA (Carcinoembryonic antigen), a composition for prevention and/or inhibition and/or diagnosis of cancer metastasis containing the same as an active ingredient, and a method of prevention and/or inhibition and/or diagnosis of cancer metastasis using the same. | 08-21-2014 |
20140285378 | ANTENNA, USER TERMINAL APPARATUS, AND METHOD OF CONTROLLING ANTENNA - An antenna is provided. The antenna includes a first radiator, a second radiator, a current feeder configured to supply power to at least one of the first radiator and the second radiator, and an adjuster configured to adjust transceiving directions of electromagnetic waves transmitted and received to and from the first radiator and the second radiator to be perpendicular to each other. | 09-25-2014 |
20140292601 | PLANAR ANTENNA APPARATUS AND METHOD - A planar antenna apparatus is provided. The apparatus includes a first radiation unit configured to transmit a signal, a first feed unit configured to feed a current to the first radiation unit and apply the signal to be transmitted to the first radiation unit, a first Radio Frequency (RF) ground to which a plurality of antenna elements are grounded; and a via that connects the first radiation unit to the first RF ground, wherein all of the first radiation unit, the first feed unit, the first RF ground, and the via are disposed on a first plane, and wherein a capacitance value between the first radiation unit and the first feed unit and an inductance value determined by a length and a width of the radiation unit are set as values that cause a resonant frequency in a specific frequency band to be a preset value. | 10-02-2014 |
20140313096 | ANTENNA AND EMISSION FILTER - An antenna and emission filter are provided. The antenna includes a substrate; an emitter on a substrate wherein the emitter is configured to emit electromagnetic signals; a feeding portion connected to the emitter; and an emission filter comprising a plurality of emission filter cells formed on the substrate in order to filter a surface wave caused by the emitter, wherein each of the plurality of emission filter cells comprises an inductor pattern portion electrically connected with an adjacent emission filter cell to form an inductor; and a capacitor pattern portion distanced from the adjacent emission cell to form a capacitor. | 10-23-2014 |
20140340576 | DIGITAL CAMERA - A digital camera is capable of performing wireless communication with an external device. The digital camera includes a camera body and a lens barrel assembly mounted to the camera body and comprising a plurality of barrels for accommodating a plurality of photographing lenses, wherein at least one of the plurality of barrels is used as an antenna barrel configured as an antenna for the wireless communication, wherein the antenna barrel is formed from a metal material and comprises at least one slit filled with a dielectric material, so that the antenna barrel emits radio waves to perform the antenna function, and wherein an outer casing of the camera body, which surrounds an outer surface of the antenna barrel, is formed from a metal material so as to operate as a ground of the antenna barrel. | 11-20-2014 |
20150035715 | ANTENNA DEVICE AND ELECTRONIC APPARATUS HAVING THE SAME - An antenna device is provided. The antenna device may include a conductive radiator pattern formed on one surface of a dielectric substrate, an artificial magnetic conductor layer including at least one unit cell formed on the other surface of the dielectric substrate, and a shorting pin connected to the unit cell. The artificial magnetic conductor layer may be configured to form an induction current of the same phase with regard to a signal current flowing through the conductive radiator pattern. | 02-05-2015 |
20150102939 | WEARABLE BODY SENSOR AND SYSTEM INCLUDING THE SAME - A body sensor, a system including the body sensor and a method of transmitting a biosignal are provided. A wearable body sensor includes a conductive electrode configured to conduct a biosignal from a body, a main board comprising a radio frequency (RF) communication circuit to generate an RF signal based on the biosignal, and an antenna disposed on the RF communication circuit to radiate the RF signal. | 04-16-2015 |
Patent application number | Description | Published |
20140346550 | CURABLE COMPOSITION - Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability, workability, and adhesive property, and having no whitening and surface stickiness. The curable composition has excellent thermal resistance at a high temperature, gas barrierability, and crack resistance, and thus, when applied to a semiconductor device, may stably maintain performance of the device at a high temperature for a long time. | 11-27-2014 |
20140346556 | CURABLE COMPOSITION - Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability, workability, and adhesive property, and having no whitening and surface stickiness. The curable composition has excellent thermal resistance and crack resistance, and low gas permeability, and thus provides a device having excellent initial performance when being applied to a semiconductor device and maintaining stable performance when being used at a high temperature for a long time. | 11-27-2014 |
20140350195 | CURABLE COMPOSITION - Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability and workability, no whitening and surface stickiness, and an excellent adhesive property. Since the curable composition has excellent thermal resistance, gas barrier-ability, and crack resistance, even when a semiconductor device to which the composition is applied is used at a high temperature for a long time, performance of the device may be stably maintained. | 11-27-2014 |
Patent application number | Description | Published |
20150091192 | SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE FILM - A semiconductor device connected by an anisotropic conductive film including a first insulation layer, a conductive layer, and a second insulation layer one above another, wherein the conductive layer has an expansion length of 20% or less in a width direction thereof, and the second insulation layer has an expansion length of 50% or more in a width direction thereof, the expansion length is calculated according to Equation 1, below, after glass substrates are placed on upper and lower sides of the anisotropic conductive film respectively, followed by compression at 110° C. to 200° C. for 3 to 7 seconds under a load of 1 MPa to 7 MPa per unit area of a sample, | 04-02-2015 |
20150123292 | SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE FILM - Provided is a semiconductor device, including an anisotropic conductive film connecting the semiconductor device, the anisotropic conductive film having a maximum stress of 0.4 kgf/mm | 05-07-2015 |
20150318257 | SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE FILM - A semiconductor device connected by an anisotropic conductive film. The anisotropic conductive film includes a composition for an anisotropic conductive film including a first epoxy resin having an exothermic peak temperature of about 80° C. to about 110° C. and a second epoxy resin having an exothermic peak temperature of 120° C. to 200° C., as measured by differential scanning calorimetry (DSC). The first epoxy resin and the second epoxy resin are present in combined amount of about 30 wt % to about 50 wt % based on a total weight of the composition in terms of solid content. The second epoxy resin is present in an amount of about 60 to about 90 parts by weight based on 100 parts by weight of the first and second epoxy resins. | 11-05-2015 |
Patent application number | Description | Published |
20080226975 | Lithium Secondary Battery Having Partitioned Electrolyte - A lithium metal battery is provided. Electrolytes of the lithium metal battery are divided between an anode and a cathode into a plurality of regions not to contact with each other, thereby limiting movement paths of lithium ions. In this way, the lithium metal battery inhibits growth of dendrite and improves energy density. Also, the lithium metal battery that has a partition wall structure reduces leakage even when liquid electrolytes are used and actively copes with pressure applied to the battery. | 09-18-2008 |
20090016687 | Optical fiber having waterproof function and method for manufacturing the same - An optical cable having a waterproof function includes an optical fiber unit having at least one optical fiber, a tube surrounding the optical fiber unit, and a watertight material layer formed by coating a mixture of watertight material and binder to an inner wall of the tube. This optical cable allows easier fabrication and more convenient use. | 01-15-2009 |
20100176084 | SQUEEZE FOR SCREEN PRINTER - Disclosed is a squeeze for a screen printer. The present invention provides a squeeze for a screen printer, which coats a printed circuit board with an adhesive paste while moving parallel over a metal mask on the printed circuit board, the printed circuit board being open through an opening of the metal mask, the squeeze including a solvent storage unit for storing solvents; and solvent discharging holes for discharging the solvents, stored in the solvent storage unit, to an adhesive paste. Accordingly, the squeeze for a screen printer of the present invention may be useful to prevent a dog ear phenomenon, namely that an adhesive paste layer is asymmetrically formed in an indented manner, by controlling a viscosity of an adhesive paste by discharging a solvent onto an adhesive paste layer that comes in contact with the squeeze when the adhesive paste layer is formed in the printed circuit board. | 07-15-2010 |
Patent application number | Description | Published |
20080225497 | Semiconductor integrated circuit and semiconductor package module having the same - A semiconductor integrated circuit includes a first clock pin controller that receives a mirror function signal and a test mode signal to generate a first input buffer control signal in response to the mirror function signal in a normal mode. A second clock pin controller receives the mirror function signal and the test mode signal to generate a second input buffer control signal, which is an inverted signal of the first input buffer control signal, in response to the mirror function signal in the normal mode. An input buffer unit generates output signals of first and second pins in response to the first input buffer control signal and the second input buffer control signal, respectively. | 09-18-2008 |
20090043647 | Metthod to activate electronic payment means in mobile terminal and activity server thereof - The present invention relates to an electronic payment means activating method and an activating server thereof. In the electronic payment means activating method, a usage approval of the inactive electronic payment means is requested by using first identification information of the inactive electronic payment means and personal user information of the user terminal, the first identification information is authenticated to determine usage approval of the active electronic payment means, a class of a user is detected by using the personal user information, a first parameter value corresponding to the detected class of the user and a usage approval message are provided to the user terminal, the first parameter value is established in the user terminal, the electronic payment means is activated, and a fare according to the first parameter value is paid by the electronic payment means. | 02-12-2009 |
20120112824 | FILTER CIRCUIT AND INTEGRATED CIRCUIT INCLUDING THE SAME - A filter circuit includes a plurality of shifting units configured to each store an initial value, receive at least one input signal, and shift the stored value to a next shifting unit in sequence from among the shifting units in response to at least one input signal, and an initial value setting unit configured to set the initial stored values of the shifting units to different sets of initial stored values in response to different filter setting signals, respectively, wherein the different filter setting signals represent respectively different criteria for filtering the at least one input signal, wherein the initially stored values have a first logic value or a second logic value, wherein the filter circuit is configured to activate an output signal when the first logic value is shifted to a selected shifting unit among the plurality of shifting units. | 05-10-2012 |
20140003168 | SEMICONDUCTOR INTEGRATED CIRCUIT | 01-02-2014 |
20140167293 | INTEGRATED CIRCUIT WITH BUMP CONNECTION SCHEME - An integrated circuit includes first and second bump pads spaced from each other with a first space, configured to receive differential signals for a normal operation, and at least one redundant bump pad spaced from the first bump pad with a second space smaller than the first space, configured to receive a signal for a repair to the differential signals. | 06-19-2014 |
20140291855 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR SYSTEM INCLUDING THE SAME - A semiconductor device includes a plurality of semiconductor chips in a stack structure and a through-silicon via suitable for passing through the chips and transfer a signal from or to one or more of the chips. Each of the chips includes a buffering block disposed in path of the through-silicon via, and suitable for buffering the signal, an internal circuit, and a delay compensation block suitable for applying delay corresponding to the buffering blocks of the chips to the signal, wherein the delay compensation blocks of the chips compensates for delay difference of the signal transferred to and from the internal circuit of the chip, due to operations of the buffering block, based on stack information for distinguishing the chips. | 10-02-2014 |
20140328130 | INTEGRATED CIRCUIT WITH BUMP CONNECTION SCHEME - An integrated circuit includes first and second bump pads spaced from each other with a first space, configured to receive differential signals for a normal operation, and at least one redundant bump pad spaced from the first bump pad with a second space smaller than the first space, configured to receive a signal for a repair to the differential signals. | 11-06-2014 |
20150110229 | SIGNAL RECEIVING METHOD AND ELECTRONIC DEVICE - An electronic device including a first transceiver configured to process a first carrier, a second transceiver configured to process a second carrier, a switch, a baseband processor configured to process a first baseband signal and a second baseband signal, which are processed respectively by the first transceiver and the second transceiver, an antenna connected through the switch in association with some of a plurality of reception paths with respect to the first carrier, and a reception path configured to provide the second transceiver with the first carrier received via the antenna connected through the switch to the second transceiver. | 04-23-2015 |
20150187403 | MEMORY DEVICE AND MEMORY SYSTEM INCLUDING THE SAME - A memory device may include a plurality of memory banks, a row control signal input unit suitable for receiving a plurality of row control signals, a column control signal input unit suitable for receiving a plurality of column control signals, a row control unit suitable for selecting a memory bank and a row in response to the row control signals, and controlling a row operation for the selected row, and a column control unit suitable for selecting a memory bank and column in response to the column control signals, and controlling a column operation for the selected column. | 07-02-2015 |
Patent application number | Description | Published |
20090246966 | Method of fine patterning semiconductor device - For integrated circuit fabrication, at least one spacer support structure is formed in a first area over a semiconductor substrate, and a mask material is deposited on exposed surfaces of the spacer support structure and on a second area over the semiconductor substrate. A masking structure is formed on a portion of the mask material in the second area, and the mask material is patterned to form spacers on sidewalls of the spacer support structure and to form a mask pattern under the masking structure. The spacer support structure and the masking structure are comprised of respective high carbon content materials that have been spin-coated and have substantially a same etch selectivity. | 10-01-2009 |
20100155959 | Semiconductor Devices Having Narrow Conductive Line Patterns and Related Methods of Forming Such Semiconductor Devices - Semiconductor devices and methods of forming semiconductor devices are provided in which a plurality of patterns are simultaneously formed to have different widths and the pattern densities of some regions are increased using double patterning. The semiconductor device includes a plurality of conductive lines each including a first line portion and a second line portion, where the first line portion extends on a substrate in a first direction, the second line portion extends from one end of the first line portion in a second direction, and the first direction is different from the second direction; a plurality of contact pads each of which is connected with a respective conductive line of the plurality of conductive lines via the second line portion of the corresponding conductive line; and a plurality of dummy conductive lines each including a first dummy portion extending from a respective contact pad of the plurality of contact pads, in parallel with the corresponding second line portion in the second direction. | 06-24-2010 |
20100248492 | Method of forming patterns of semiconductor device - A method of forming fine patterns of a semiconductor device by using carbon (C)-containing films includes forming an etching target film on a substrate including first and second regions; forming a plurality of first C-containing film patterns on the etching target film in the first region; forming a buffer layer which covers top and side surfaces of the plurality of first C-containing film patterns; forming a second C-containing film; removing the second C-containing film in the second region; exposing the plurality of first C-containing film patterns by removing a portion of the buffer layer in the first and second regions; and etching the etching target film by using the plurality of first C-containing film patterns, and portions of the second C-containing film which remain in the first region, as an etching mask. | 09-30-2010 |
20110183505 | METHODS OF FORMING FINE PATTERNS IN INTEGRATED CIRCUIT DEVICES AND METHODS OF MANUFACTURING INTEGRATED CIRCUIT DEVICES INCLUDING THE SAME - A method of fabricating an integrated circuit device includes forming first and second preliminary mask structures on a hard mask layer in respective first and second regions of the substrate. Spacers are formed on opposing sidewalls of the first and second preliminary mask structures, and the first preliminary mask structure is selectively removed from between the spacers in the first region. The hard mask layer is etched using the spacers and the second preliminary mask structure as a mask to define a first mask pattern including the opposing sidewall spacers with a void therebetween in the first region and a second mask pattern including the opposing sidewall spacers and the second preliminary mask structure therebetween in the second region. An insulation layer is patterned using the first and second mask patterns as respective masks to define a first trench in the first region and a second trench in the second region having a greater width than the first trench, and first and second conductive patterns are formed in the first and second trenches. | 07-28-2011 |
20120080723 | FABRICATING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATED USING THE SAME METHOD - A fabricating method of a semiconductor device includes providing a substrate having a first region and a second region, forming a plurality of first gates in the first region of the substrate, such that the first gates are spaced apart from each other at a first pitch, forming a plurality of second gates in the second region of the substrate, such that the second gates are spaced apart from each other at a second pitch different from the first pitch, implanting an etch rate adjusting dopant into the second region to form implanted regions, while blocking the first region, forming a first trench by etching the first region between the plurality of first gates, and forming a second trench by etching the second region between the plurality of second gates. | 04-05-2012 |
20130040452 | Methods of Forming Semiconductor Devices Having Narrow Conductive Line Patterns - Semiconductor devices and methods of forming semiconductor devices are provided in which a plurality of patterns are simultaneously formed to have different widths and the pattern densities of some regions are increased using double patterning. The semiconductor device includes a plurality of conductive lines each including a first line portion and a second line portion, where the first line portion extends on a substrate in a first direction, the second line portion extends from one end of the first line portion in a second direction, and the first direction is different from the second direction; a plurality of contact pads each of which is connected with a respective conductive line of the plurality of conductive lines via the second line portion of the corresponding conductive line; and a plurality of dummy conductive lines each including a first dummy portion extending from a respective contact pad of the plurality of contact pads, in parallel with the corresponding second line portion in the second direction. | 02-14-2013 |
20140057427 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - Example embodiments relate to a method for manufacturing a semiconductor device, wherein a metal gate electrode therein may be formed without a void in a lower portion of the metal gate electrode. The method may include providing a substrate, forming a dummy gate electrode on the substrate, forming a gate spacer on the substrate to be contiguous to the dummy gate electrode, forming a first recess by simultaneously removing a portion of the dummy gate electrode and a portion of the gate spacer, the first recess having an upper end wider than a lower end, forming a second recess by removing the dummy gate electrode remaining after forming the first recess, and forming a metal gate electrode by depositing a metal to fill the first and second recesses. | 02-27-2014 |
20140110757 | FABRICATING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATED USING THE SAME METHOD - A fabricating method of a semiconductor device includes providing a substrate having a first region and a second region, forming a plurality of first gates in the first region of the substrate, such that the first gates are spaced apart from each other at a first pitch, forming a plurality of second gates in the second region of the substrate, such that the second gates are spaced apart from each other at a second pitch different from the first pitch, implanting an etch rate adjusting dopant into the second region to form implanted regions, while blocking the first region, forming a first trench by etching the first region between the plurality of first gates, and forming a second trench by etching the second region between the plurality of second gates. | 04-24-2014 |
20140273432 | FABRICATING METHOD OF SEMICONDUCTOR DEVICE - A semiconductor device is fabricated by forming a lower conductor in a first interlayer dielectric film. A second interlayer dielectric film is formed on the lower conductor and the first interlayer dielectric film. A first hard mask pattern is formed on the second interlayer dielectric film. The first mask pattern has a first opening extending in a first direction. A planarization layer is formed on the first hard mask pattern. A mask pattern is formed on the planarization layer. The mask pattern has a second opening extending in a second direction perpendicular to the first direction. The lower conductor is positioned under an region where the first opening and the second opening overlap. A via hole and a trench connected to the via hole is formed using the first hard mask pattern and the mask pattern. The via hole exposes an upper surface of the lower conductor. | 09-18-2014 |
20150129856 | ORGANIC LIGHT EMITTING DISPLAY PANEL AND ORGANIC LIGHT EMITTING DISPLAY DEVICE INCLUDING THE SAME - Discussed is an organic light emitting display panel. The organic light emitting display panel includes a plurality of unit pixels which each include first to third sub-pixels having different colors. The plurality of unit pixels, which each include first to third driving transistors respectively connected to the first to third sub-pixels, a first contact hole that connects the first sub-pixel to the first driving transistor, a second contact hole that connects the second sub-pixel to the second driving transistor, and a third contact hole that connects the third sub-pixel to the third driving transistor, are arranged in a matrix type. | 05-14-2015 |
20150137261 | SEMICONDUCTOR DEVICE - A fabricating method of a semiconductor device includes providing a substrate having a first region and a second region, forming a plurality of first gates in the first region of the substrate, such that the first gates are spaced apart from each other at a first pitch, forming a plurality of second gates in the second region of the substrate, such that the second gates are spaced apart from each other at a second pitch different from the first pitch, implanting an etch rate adjusting dopant into the second region to form implanted regions, while blocking the first region, forming a first trench by etching the first region between the plurality of first gates, and forming a second trench by etching the second region between the plurality of second gates. | 05-21-2015 |
20150138180 | ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE - An organic light emitting diode display device includes a display panel including a plurality of pixels; a data driver supplying a data signal to the plurality of pixels; a gate driver supplying a plurality of scan signals and a plurality of emission signals to the plurality of pixels, the gate driver including a plurality of stages, at least one of the plurality of stages having a first circuit block generating one of the plurality of scan signals and a second circuit block generating one of the plurality of emission signals using one of the plurality of scan signals; and a timing controller supplying a plurality of control signals to the data driver and the gate driver. | 05-21-2015 |
20150185958 | TOUCH SENSING SYSTEM AND METHOD FOR PROVIDING PROXIMITY SENSING FUNCTION USING TOUCH SCREEN PANEL - Provided is a touch sensing system and method for providing a proximity sensing function using a touch screen panel. The touch sensing system may include at least one storage unit including at least one program, a touch screen configured to detect a touch of an object, and at least one processor configured to activate a proximity sensing function on the touch screen according to a control of the at least one program, to detect proximity of the object based on sensing information of a proximity sensing area predetermined on a partial area of the touch screen, and to process a predetermined operation in response to detecting the proximity of the object. | 07-02-2015 |