Patent application number | Description | Published |
20130075890 | INTEGRATED CIRCUIT AND METHOD OF MAKING - Integrated circuits and methods of fabricating integrated circuits are disclosed herein. One embodiment of an integrated circuit includes a die having a side, wherein a conductive stud extends substantially normal relative to the side. A dielectric layer having a first side and a second side is located proximate the side of the die so that the first side of the dielectric layer is adjacent the side of the die. The conductive stud extends into the first side of the dielectric layer. A first via extends between the conductive stud and the second side of the dielectric layer. A conductive layer having a first side and a second side is located adjacent the second side of the dielectric layer, wherein the first side of the conductive layer is located adjacent the second side of the dielectric layer. At least a portion of the conductive layer is electrically connected to the first via. | 03-28-2013 |
20130075894 | INTEGRATED CIRCUIT AND METHOD OF MAKING - Integrated circuits and methods of fabricating integrated circuits are disclosed herein. One embodiment of an integrated circuit includes a die having a side, wherein a conductive stud extends from the side. A dielectric layer having a first side and a second side is located proximate the side of the die so that the first side of the dielectric layer is adjacent the side of the die. The conductive stud extends into the first side of the dielectric layer. A conductive layer having a first side and a second side is located adjacent the second side of the dielectric layer, wherein the first side of the conductive layer is located adjacent the second side of the dielectric layer. A conductive adhesive connects the conductive stud to the first side of the conductive layer. | 03-28-2013 |
20130075928 | INTEGRATED CIRCUIT AND METHOD OF MAKING - Circuits and methods of fabricating circuits are disclosed herein. An embodiment of the circuit includes a die having a side, wherein a connection point is located on the side. A dielectric layer having a first side, a second side, and at least one via extending between the first side and the second side, is located proximate the side of the die. The via is electrically connected to the connection point. A conductive layer is located adjacent the second side of the first dielectric layer, wherein at least a portion of the conductive layer is electrically connected to the via. | 03-28-2013 |
20130277816 | PLASTIC-PACKAGED SEMICONDUCTOR DEVICE HAVING WIRES WITH POLYMERIZED INSULATOR SKIN - The assembly of a chip ( | 10-24-2013 |
20130277825 | Method for Preventing Corrosion of Copper-Aluminum Intermetallic Compounds - The packaging of an electric contact including a semiconductor chip ( | 10-24-2013 |
20150037938 | PACKAGING A SEMICONDUCTOR DEVICE HAVING WIRES WITH POLYMERIZED INSULATOR SKIN - A chip is attached to a substrate with wires spanning from the chip to the substrate is loaded in a heated cavity of a mold. The wire surfaces are coated with an adsorbed layer of molecules of a heterocyclic compound. A pressure chamber of the mold is loaded with a solid pellet of a packaging material including a polymerizable resin. The chamber is connected to the cavity. The vapor of resin molecules is allowed to spread from the chamber to the assembly inside the cavity during the time interval needed to heat the solid pellet for rendering it semi-liquid and to pressurize it through runners before filling the mold cavity, wherein the resin molecules arriving in the cavity are cross-linked by the adsorbed heterocyclic compound molecules into an electrically insulating at least one monolayer of polymeric structures on the wire surfaces. | 02-05-2015 |
20150111344 | METHOD OF FABRICATING A CIRCUIT - Methods of fabricating integrated circuits are disclosed herein. In one embodiment of a method. A die having a side is provided. A conductive stud is connected to the side of the die, wherein the conductive stud has a first end that is connected to the die and an opposite second end. The die is encapsulated said die except for the side. A first dielectric layer is affixed to the side of the die. The first dielectric layer has a first side and a second side. The first side of the first dielectric layer is affixed to the side of the die. The conductive stud enters the first side of the first dielectric layer. A conductive layer is affixed to the second side of the first dielectric layer. The second side of the conductive stud is affixed to the conductive layer using a conductive adhesive. | 04-23-2015 |
20150357238 | METHOD OF MAKING INTEGRATED CIRCUIT - Methods of fabricating integrated circuits are disclosed herein. A die having a side is provided. A conductive stud extends from the side in a direction that is substantially normal to the side. A first dielectric layer is affixed to the side of the die. The first dielectric layer has a first side and a second side. The first side of the first dielectric layer is affixed to the side of the die. The conductive stud pierces the first side of the first dielectric layer. A first via is formed through the first dielectric layer between the conductive stud and the second side. The first via is electrically connected to the conductive stud. | 12-10-2015 |
20160064630 | FLIP CHIP LED PACKAGE - A flip chip light emitting diode (LED) package includes an LED die having a first substrate, a p-type region and an n-type region including an active layer in between, a metal contact on the p-type region (anode contact) and a metal contact on the n-type region (cathode contact). A package substrate or lead frame includes a dielectric material that has a first metal through via (first metal post) and second metal through via (second metal post) spaced apart from one another and embedded in the dielectric material. A first metal pad is on a bottom side of the first metal post and a second metal pad is on a bottom side of the second metal post. An interconnect metal paste or metal ink residual (metal residual) is between the anode contact and first metal post and between the cathode contact and the second metal post. | 03-03-2016 |
20160093558 | PACKAGED DEVICE WITH ADDITIVE SUBSTRATE SURFACE MODIFICATION - A method of lead frame surface modification includes providing at least one pre-fabricated metal lead frame or package substrate (substrate) unit including a base metal having a die pad and a plurality of contact regions surrounding the die pad. An ink including a material that is a solid or a precursor for a solid that forms a solid upon a curing step or a sintering step that removes a liquid carrier is additively deposited including onto at least one of (i) a region of the die pad and (ii) at one region of at least a first of the contact regions (first contact region). The ink is sintered or cured to remove the liquid carrier so that a substantially solid ink residue remains. | 03-31-2016 |
Patent application number | Description | Published |
20140251629 | Expandable Ball Seat for Hydraulically Actuating Tools - A downhole tool has a housing, a mandrel, a seat, and a piston. The housing defines a first bore, and the mandrel is movably disposed in the first bore and defines a second bore. The mandrel has first and second mandrel sections or upper and lower cones, and the first mandrel section defines a cross-port communicating the second bore with an annular space between the mandrel and the housing. The seat is disposed in the first bore of the housing between the first and second mandrel sections. The seat is movable to a constricted state in the first bore to catch a dropped ball and is movable to an expanded state in the first bore to pass a dropped ball. The piston is disposed in the annular space and at least temporality supports the seat in its constricted state. | 09-11-2014 |
20140262325 | Resettable Ball Seat for Hydraulically Actuating Tools - A downhole tool has a housing, mandrel, and ball seat. The housing defines a first bore, and the mandrel defines a second bore. The mandrel is disposed in the first bore of the housing and defines an annular space with the housing. The ball seat is rotatably disposed in the second bore of the mandrel and defines an interior passage with a seat profile. First and second pistons are disposed in the annular space on opposing sides of the ball seat. These first and second pistons are movable along an axis of the tool in the annular space in opposing directions and are adapted to rotate the ball seat. Additionally, first and second biasing members are disposed in the annular space and bias the first and second pistons toward one another to reset the ball seat in the absence of pressure. | 09-18-2014 |
20160024872 | Revolving Ball Seat for Hydraulically Actuating Tools - A downhole tool has a housing, a piston, and a seat and is for use with a deployed plug or ball and applied fluid pressure. The housing defines a bore, and the piston is disposed in the bore of the housing and is biased to move from a first position to a second position. The seat is also disposed in the bore of the housing and is operably connected to the piston. The seat rotates from a first orientation for engaging the deployed plug to a second orientation for passing the deployed plug in response to movement of the piston from the first position near the seat to the second position away from the seat. | 01-28-2016 |
Patent application number | Description | Published |
20130156711 | TOPICAL SKIN CARE FORMULATION - Disclosed is a topical skin care composition, and method for its use, that includes 55 to 65% by weight of water, 15 to 20% by weight of a combination of 3,3,5-Trimethylcyclohexyl 2-hydroxybenzoate (homosalate), 1-(4-Methoxyphenyl)-3-(4-tert-butylphenyl)propane-1,3 -dione (avobenzone), 2-ethylhexyl 2-hydroxybenzoate (octisalate), and 2-ethylhexyl 2-cyano-3,3-diphenyl-2-propenoate (octocrylene), 3 to 4% by weight of distearlydimonium chloride, and 1 to 3% by weight of a combination of euterpe oleracea fruit extract, punica granatum sterols, caprooyl tetrapeptide-3, tocopherol or tocopherol acetate, and niacinamide, wherein the composition has a sun protection factor of at least 15 or about 15 to 20. | 06-20-2013 |
20140120143 | KIT FOR PERSONALIZING THE COLOR OF A TOPICAL SKIN COMPOSITION - Disclosed is a kit for preparing a colored topical skin composition, the kit comprising a first composition comprising an aqueous continuous phase comprising at least 50% by weight of water and a discontinuous phase comprising titanium dioxide or zinc oxide or a combination thereof in an amount sufficient to impart a white color appearance to the first composition, wherein the titanium dioxide or zinc oxide is suspended within the aqueous continuous phase, and wherein the color of the first composition is white and a second composition in the form of a water-dissolvable film, wherein the film has a color other than white, wherein the second composition is capable of dissolving within the first composition and imparting a color other than white to the first composition when the first and second compositions are mixed together. | 05-01-2014 |