Patent application number | Description | Published |
20120058216 | Method For Forming An Anodized Layer, Method For Manufacturing A Mold, and Mold - An anodized layer formation method of at least one example embodiment of the present invention includes the steps of: (a) providing an aluminum base which has a machined surface; (b) forming, in the surface of the aluminum base, a minute uneven structure which has a smaller average neighboring distance than an average neighboring distance of a plurality of minute recessed portions that an intended porous alumina layer has; and (c) after step (b), anodizing the surface of the aluminum base, thereby forming a porous alumina layer which has the plurality of minute recessed portions. According to at least one embodiment the present invention, a porous alumina layer which has uniformly-distributed minute recessed portions can be formed over a machined surface of an aluminum base. | 03-08-2012 |
20130037412 | METHOD FOR FORMING ANODIZED LAYER - An anodized layer formation method includes: (a) providing an aluminum base or an aluminum film deposited on a support; anodization step (b) in which a forming voltage is increased to a predetermined first voltage level under a predetermined condition with a surface of the aluminum base or a surface of the aluminum film being kept in contact with an electrolytic solution, and thereafter, the forming voltage is maintained at the first voltage level for a predetermined period of time, whereby a porous alumina layer which has a minute recessed portion is formed; and etching step (c) in which, after step (b), the porous alumina layer is brought into contact with an etching solution, whereby the minute recessed portion is enlarged and a lateral surface of the minute recessed portion is sloped. | 02-14-2013 |
Patent application number | Description | Published |
20090043014 | RUBBER COMPOSITION FOR TIRE AND ITS PRODUCING METHOD - A rubber composition for tire, which combines low heat build-up properties and breakage property in high level, reduces fuel consumption of a tire, and has excellent durability and good processability is provided. The rubber composition for tire is obtained by kneading a diene rubber component, sulfur and a pyrithione metal salt to obtain a rubber mixture, and adding and kneading a vulcanization accelerator in a post-mixing step using the rubber mixture. The pyrithione metal salt can use a compound represented by the following formula (1): | 02-12-2009 |
20090062455 | Rubber Composition For Tire And Its Producing Method - A rubber composition for tire, which combines low heat build-up properties and breakage property, reduces fuel consumption of a tire, and has excellent good processability is provided. The rubber composition for tire is obtained by blending sulfur and caprolactam disulfide with a diene rubber component to obtain a pre-mixture which does not contain a reinforcing filler and a vulcanization accelerator, and blending and mixing a reinforcing filler and a vulcanization accelerator with the pre-mixture in a post-mixing step. | 03-05-2009 |
20150031795 | METHOD FOR PRODUCING RUBBER COMPOSITION - After step (I) of kneading a diene rubber and a carbon black to be mixed with each other, and then discharging the resultant mixture containing the diene rubber and the carbon black from an internal mixer, step (II) of kneading the mixture again in the internal mixer to crush a re-aggregate of the carbon black in the mixture, and step (III) of charging the dihydrazide compound into the internal mixer, and kneading the mixture and the dihydrazide compound to be mixed with each other are carried out. The period of step (II) for the kneading is 15 seconds or longer, and the rotating speed of the stirring rotor of the internal mixer is 35 rpm or more. The period of step (III) for the kneading is 40 seconds or longer, and the rotating speed of the stirring rotor of the internal mixer is from 15 to 25 rpm. | 01-29-2015 |
Patent application number | Description | Published |
20100208250 | Producing method of wired circuit board - A producing method of a wired circuit board includes the steps of applying light from above the wired circuit board toward the wired circuit board, and sensing pattern reflected light which is the light reflected by a conductive pattern, table reflected light which is the light reflected by a support table via an insulating layer exposed from the conductive pattern, and foreign-matter reflected light which is the light reflected by a foreign matter present on the insulating layer to inspect the conductive pattern and the foreign matter based on a contrast therebetween. A reflectance of the table reflected light is in a range of 30 to 70%, and a reflectance of the foreign-matter reflected light is in a range of not more than 10%. | 08-19-2010 |
20100263206 | Producing method of wired circuit board - A producing method of a wired circuit board includes the steps of preparing the wired circuit board, placing the wired circuit board on a support table, and applying light from above the wired circuit board toward the wired circuit board, and sensing pattern reflected light, table reflected light and foreign-matter reflected light to inspect the conductive pattern and the foreign matter based on a contrast therebetween. In the step of inspecting the conductive pattern and the foreign matter, a reflectance of the table reflected light is in a range of 25 to 55%, and a reflectance of the foreign-matter reflected light is in a range of not more than 10%. | 10-21-2010 |
20110058347 | Suspension board assembly sheet with circuits and method for manufacturing the same - An assembly sheet includes a plurality of suspension boards and a frame member that integrally supports the suspension boards. On a surface of the frame member, a plurality of identification marks for identifying respective positions of the suspension boards in automatic optical inspection are provided corresponding to the suspension boards. | 03-10-2011 |
20120033395 | PRINTED CIRCUIT BOARD ASSEMBLY SHEET AND METHOD FOR MANUFACTURING THE SAME - A dummy trace portion is provided in a region between at least a suspension board with circuit on one end side and a support frame of a suspension board assembly sheet with circuits. A base insulating layer is formed on a support substrate in the dummy trace portion. A plurality of conductor traces are formed on the base insulating layer, and a cover insulating layer is formed on the base insulating layer to cover each conductor trace. At least one of the base insulating layer and the cover insulating layer in the dummy trace portion has a groove. | 02-09-2012 |
20120069538 | PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD ASSEMBLY SHEET AND METHOD OF MANUFACTURING THE SAME - A determination mark formation portion is provided in each suspension board. In the determination mark formation portion, a recess having a given depth is provided in a base insulating layer. An outer peripheral portion is formed on the base insulating layer to surround the recess. A plating layer is formed on the outer peripheral portion. A circular hole is formed on a support substrate. The hole of the support substrate and the recess of the base insulating layer overlap each other. | 03-22-2012 |
20130247371 | METHOD FOR MANUFACTURING A SUSPENSION BOARD ASSEMBLY SHEET WITH CIRCUITS - An assembly sheet includes a plurality of suspension boards and a frame member that integrally supports the suspension boards. On a surface of the frame member, a plurality of identification marks for identifying respective positions of the suspension boards in automatic optical inspection are provided corresponding to the suspension boards. | 09-26-2013 |
20140101934 | METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD ASSEMBLY SHEET - A dummy trace portion is provided in a region between at least a suspension board with circuit on one end side and a support frame of a suspension board assembly sheet with circuits. A base insulating layer is formed on a support substrate in the dummy trace portion. A plurality of conductor traces are formed on the base insulating layer, and a cover insulating layer is formed on the base insulating layer to cover each conductor trace. At least one of the base insulating layer and the cover insulating layer in the dummy trace portion has a groove. | 04-17-2014 |
20140126169 | SUSPENSION BOARD ASSEMBLY SHEET WITH CIRCUITS AND METHOD FOR MANUFACTURING THE SAME - A plurality of suspension boards and an inspection substrate are integrally supported by a support frame. In each suspension board, a line is formed on a conductive first support substrate via a first insulating layer. The first support substrate and the line are electrically connected by a first via in the first insulating layer. In the inspection substrate, a conductor layer is formed on a conductive second support substrate with a second insulating layer sandwiched therebetween. The second support substrate and the conductor layer are electrically connected by a second via in the second insulating layer. The first via and the second via have the same configuration. | 05-08-2014 |
20140153373 | SUSPENSION BOARD WITH CIRCUIT - A suspension board with circuit is for mounting thereon a slider/light source unit provided with a slider on which a magnetic head is mounted, and a light source device including a main body, and a light source provided to protrude from the main body. The suspension board with circuit includes a receiving portion formed therein to be capable of receiving the light source, and a guide surface for guiding the light source to the receiving portion when the slider/light source unit is mounted. | 06-05-2014 |
20140345920 | SUSPENSION BOARD WITH CIRCUIT AND METHOD OF MANUFACTURING THE SAME - Heat-assisted wiring traces and a conductive support substrate are respectively formed on first and second surfaces of an insulating layer. Further, connection terminals electrically insulated from the support substrate and electrically respectively connected to the heat-assisted wiring traces are formed on the second surface of the insulating layer. Each connection terminal has an element connection portion, a pattern connection portion and a spread blocking portion. When a circuit element is connected to the element connection portion of the connection terminal by solder, spreading of a molten solder applied to the element connection portion to the pattern connection portion is blocked by the spread blocking portion. | 11-27-2014 |